JP2019145722A - 加工装置 - Google Patents
加工装置 Download PDFInfo
- Publication number
- JP2019145722A JP2019145722A JP2018030297A JP2018030297A JP2019145722A JP 2019145722 A JP2019145722 A JP 2019145722A JP 2018030297 A JP2018030297 A JP 2018030297A JP 2018030297 A JP2018030297 A JP 2018030297A JP 2019145722 A JP2019145722 A JP 2019145722A
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- JP
- Japan
- Prior art keywords
- groove
- processing
- machining
- cutting
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- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000012545 processing Methods 0.000 title claims abstract description 62
- 238000012937 correction Methods 0.000 claims abstract description 65
- 238000003384 imaging method Methods 0.000 claims abstract description 27
- 238000005520 cutting process Methods 0.000 claims description 123
- 238000003754 machining Methods 0.000 claims description 69
- 238000013459 approach Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000001678 irradiating effect Effects 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000004397 blinking Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
- Machine Tool Sensing Apparatuses (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
4:ストリート
12:切削装置(加工装置)
14:保持手段
16:切削手段(加工手段)
18:撮像手段
20:表示手段
34:切削ブレード
36:顕微鏡
38:画像表示部
42:加工溝補正ボタン
46:Y軸作動部
48:可動線
50:可動線作動部
54:切削溝(加工溝)
L:基準線
Claims (4)
- 複数のデバイスがストリートによって区画され表面に形成されたウエーハを個々のデバイスに分割する加工溝を形成する加工装置であって、
ウエーハを保持する保持手段と、該保持手段に保持されたウエーハのストリートに加工溝を形成する加工手段と、該保持手段と該加工手段とをX軸方向に相対的に加工送りするX軸送り手段と、該保持手段と該加工手段とをX軸方向に直交するY軸方向に相対的に割り出し送りするY軸送り手段と、該保持手段に保持されたウエーハを撮像しストリートおよび加工溝を検出する基準線を備えた顕微鏡を有する撮像手段と、表示手段と、を少なくとも備え、
該表示手段には、該撮像手段が撮像した画像を表示する画像表示部と、加工溝と該基準線とのズレ量を補正値として記憶するための加工溝補正ボタンと、該Y軸送り手段を作動するY軸作動部と、該基準線を挟み線対称を保ち該基準線に接近および離反する一対の可動線と、該一対の可動線を作動する可動線作動部と、が表示され、
該画像表示部に加工溝が表示されていない場合を含み加工溝が該基準線から外れている場合に該加工溝補正ボタンをタッチするとエラーが報知される加工装置。 - 該一対の可動線の間隔が、加工溝の幅と認識される間隔に設定されていない場合に該加工溝補正ボタンをタッチするとエラーが報知される請求項1記載の加工装置。
- 該画像表示部に表示された加工溝の位置を該Y軸作動部を作動して該基準線まで移動すると共に該可動線作動部を作動して該一対の可動線を加工溝の幅に一致させた場合に該加工溝補正ボタンにタッチすると加工溝の移動距離が加工溝の補正値として記憶される請求項1記載の加工装置。
- 該加工手段は、切削ブレードを回転可能に備えた切削手段であり、該加工溝は切削溝である請求項1記載の加工装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018030297A JP7013276B2 (ja) | 2018-02-23 | 2018-02-23 | 加工装置 |
KR1020190006643A KR102594218B1 (ko) | 2018-02-23 | 2019-01-18 | 가공 장치 |
CN201910125516.1A CN110190009B (zh) | 2018-02-23 | 2019-02-20 | 加工装置 |
TW108105556A TWI785207B (zh) | 2018-02-23 | 2019-02-20 | 加工裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018030297A JP7013276B2 (ja) | 2018-02-23 | 2018-02-23 | 加工装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019145722A true JP2019145722A (ja) | 2019-08-29 |
JP7013276B2 JP7013276B2 (ja) | 2022-01-31 |
Family
ID=67713605
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018030297A Active JP7013276B2 (ja) | 2018-02-23 | 2018-02-23 | 加工装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7013276B2 (ja) |
KR (1) | KR102594218B1 (ja) |
CN (1) | CN110190009B (ja) |
TW (1) | TWI785207B (ja) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11260763A (ja) * | 1998-03-16 | 1999-09-24 | Tokyo Seimitsu Co Ltd | ダイシングマシンの溝切制御方法及び装置 |
JP2001332515A (ja) * | 2000-05-22 | 2001-11-30 | Disco Abrasive Syst Ltd | 回転ブレードの位置検出装置 |
JP2012146831A (ja) * | 2011-01-13 | 2012-08-02 | Disco Abrasive Syst Ltd | 加工位置調製方法及び加工装置 |
JP2017038028A (ja) * | 2015-08-14 | 2017-02-16 | 株式会社ディスコ | 切削ブレードの位置ずれ検出方法 |
JP2017135265A (ja) * | 2016-01-28 | 2017-08-03 | 株式会社ディスコ | パッケージウェーハの加工方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002331383A (ja) * | 2001-05-08 | 2002-11-19 | Koike Sanso Kogyo Co Ltd | 切断監視装置 |
JP4879012B2 (ja) * | 2006-12-28 | 2012-02-15 | 株式会社ディスコ | 切削ブレードの先端形状検査方法 |
JP5220439B2 (ja) * | 2008-02-28 | 2013-06-26 | 株式会社ディスコ | 板状物の切削方法 |
JP5389580B2 (ja) * | 2009-09-17 | 2014-01-15 | 株式会社ディスコ | 切削装置 |
JP5686545B2 (ja) * | 2010-07-26 | 2015-03-18 | 株式会社ディスコ | 切削方法 |
JP6013166B2 (ja) | 2012-12-11 | 2016-10-25 | 株式会社ディスコ | 切削装置 |
JP6430836B2 (ja) * | 2015-01-16 | 2018-11-28 | 株式会社ディスコ | ウエーハの加工方法 |
JP6553940B2 (ja) * | 2015-05-15 | 2019-07-31 | 株式会社ディスコ | レーザー加工装置 |
JP6478801B2 (ja) * | 2015-05-19 | 2019-03-06 | 株式会社ディスコ | ウエーハの加工方法 |
JP6608694B2 (ja) * | 2015-12-25 | 2019-11-20 | 株式会社ディスコ | ウエーハの加工方法 |
JP6600254B2 (ja) * | 2015-12-28 | 2019-10-30 | 株式会社ディスコ | ウェーハの加工方法 |
JP6600267B2 (ja) * | 2016-03-15 | 2019-10-30 | 株式会社ディスコ | 被加工物の切削方法 |
-
2018
- 2018-02-23 JP JP2018030297A patent/JP7013276B2/ja active Active
-
2019
- 2019-01-18 KR KR1020190006643A patent/KR102594218B1/ko active IP Right Grant
- 2019-02-20 CN CN201910125516.1A patent/CN110190009B/zh active Active
- 2019-02-20 TW TW108105556A patent/TWI785207B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11260763A (ja) * | 1998-03-16 | 1999-09-24 | Tokyo Seimitsu Co Ltd | ダイシングマシンの溝切制御方法及び装置 |
JP2001332515A (ja) * | 2000-05-22 | 2001-11-30 | Disco Abrasive Syst Ltd | 回転ブレードの位置検出装置 |
JP2012146831A (ja) * | 2011-01-13 | 2012-08-02 | Disco Abrasive Syst Ltd | 加工位置調製方法及び加工装置 |
JP2017038028A (ja) * | 2015-08-14 | 2017-02-16 | 株式会社ディスコ | 切削ブレードの位置ずれ検出方法 |
JP2017135265A (ja) * | 2016-01-28 | 2017-08-03 | 株式会社ディスコ | パッケージウェーハの加工方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20190101871A (ko) | 2019-09-02 |
KR102594218B1 (ko) | 2023-10-25 |
CN110190009B (zh) | 2023-08-18 |
JP7013276B2 (ja) | 2022-01-31 |
TWI785207B (zh) | 2022-12-01 |
CN110190009A (zh) | 2019-08-30 |
TW201937580A (zh) | 2019-09-16 |
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