JP2019106503A - 基板および面状照明装置 - Google Patents
基板および面状照明装置 Download PDFInfo
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- JP2019106503A JP2019106503A JP2017239451A JP2017239451A JP2019106503A JP 2019106503 A JP2019106503 A JP 2019106503A JP 2017239451 A JP2017239451 A JP 2017239451A JP 2017239451 A JP2017239451 A JP 2017239451A JP 2019106503 A JP2019106503 A JP 2019106503A
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- 229910000679 solder Inorganic materials 0.000 claims abstract description 20
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- 238000005286 illumination Methods 0.000 description 19
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- 229910052751 metal Inorganic materials 0.000 description 1
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- 230000003287 optical effect Effects 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
- H01L33/24—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate of the light emitting region, e.g. non-planar junction
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0033—Means for improving the coupling-out of light from the light guide
- G02B6/005—Means for improving the coupling-out of light from the light guide provided by one optical element, or plurality thereof, placed on the light output side of the light guide
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0083—Details of electrical connections of light sources to drivers, circuit boards, or the like
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
- G02B6/0086—Positioning aspects
- G02B6/0091—Positioning aspects of the light source relative to the light guide
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
- G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
- G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
- G02B6/0068—Arrangements of plural sources, e.g. multi-colour light sources
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Planar Illumination Modules (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (10)
- 発光面以外のいずれかの面に複数の端子を有する光源の前記端子それぞれに半田を介して接合され、前記端子の形状に合わせて切り欠かれた切欠部を有する複数のランド部、
を備える、基板。 - 前記ランド部は、
前記発光面と交差する前記面である前記光源の底面に設けられた前記端子と接合される第1ランド部および第2ランド部を有し、
前記第1ランド部は、
前記発光面側から切り欠かれた前記切欠部を有し、
前記第2ランド部は、
前記光源の前記発光面および前記底面と交差する側面側から切り欠かれた前記切欠部を有する、
請求項1に記載の基板。 - 前記第1ランド部の前記切欠部は、
前記発光面から遠い側の端部である先端の長さが前記発光面に近い側の端部である基端の長さより短い、
請求項2に記載の基板。 - 前記複数のランド部は、
前記基板の長手方向に沿って配列され、前記第2ランド部が前記第1ランド部に挟まれる、
請求項2または3に記載の基板。 - 前記ランド部は、
前記切欠部が前記端子の周縁に至る、
請求項1〜4のいずれか1つに記載の基板。 - 前記ランド部は、
前記光源によって領域全体が覆われる、
請求項1〜5のいずれか1つに記載の基板。 - 発光面以外のいずれかの面に複数の端子を有する光源の前記端子それぞれに接合され、前記光源の実装位置を規制する方向がそれぞれ異なる複数のランド部、
を備える、基板。 - 前記ランド部は、
前記基板の短手方向への前記実装位置を規制する第1ランド部と、
前記基板の長手方向への前記実装位置を規制する第2ランド部と、
を備える、請求項7に記載の基板。 - 前記複数の端子は、
前記面に設けられた凹部の周面に設けられる
請求項1〜8のいずれか1つに記載の基板。 - 請求項1〜9のいずれか1つに記載の基板と、
前記基板に接合される光源と、
前記光源から発せられる光が側面から入射し、当該側面と交差する主面である出射面から前記光を出射する導光板と、
を備える、面状照明装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017239451A JP6755233B2 (ja) | 2017-12-14 | 2017-12-14 | 基板および面状照明装置 |
US16/188,617 US11152541B2 (en) | 2017-12-14 | 2018-11-13 | Substrate and planar illumination device |
CN201822096215.4U CN209232816U (zh) | 2017-12-14 | 2018-12-13 | 基板以及面状照明装置 |
CN201811523690.3A CN109980076B (zh) | 2017-12-14 | 2018-12-13 | 基板以及面状照明装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017239451A JP6755233B2 (ja) | 2017-12-14 | 2017-12-14 | 基板および面状照明装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019106503A true JP2019106503A (ja) | 2019-06-27 |
JP6755233B2 JP6755233B2 (ja) | 2020-09-16 |
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JP2017239451A Active JP6755233B2 (ja) | 2017-12-14 | 2017-12-14 | 基板および面状照明装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US11152541B2 (ja) |
JP (1) | JP6755233B2 (ja) |
CN (2) | CN209232816U (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6755233B2 (ja) * | 2017-12-14 | 2020-09-16 | ミネベアミツミ株式会社 | 基板および面状照明装置 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
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JP3507251B2 (ja) * | 1995-09-01 | 2004-03-15 | キヤノン株式会社 | 光センサicパッケージおよびその組立方法 |
US7381995B2 (en) * | 2005-03-16 | 2008-06-03 | Industrial Technology Research Institute | Lighting device with flipped side-structure of LEDs |
US7456493B2 (en) * | 2005-04-15 | 2008-11-25 | Alps Electric Co., Ltd. | Structure for mounting semiconductor part in which bump and land portion are hardly detached from each other and method of manufacturing mounting substrate used therein |
KR101535064B1 (ko) * | 2008-01-17 | 2015-07-09 | 삼성디스플레이 주식회사 | 표시 장치용 광원 모듈 및 이를 포함하는 표시 장치 |
KR102037866B1 (ko) | 2013-02-05 | 2019-10-29 | 삼성전자주식회사 | 전자장치 |
JP6578735B2 (ja) * | 2014-05-21 | 2019-09-25 | 日亜化学工業株式会社 | 半導体装置の実装構造、バックライト装置及び実装基板 |
US9961770B2 (en) * | 2014-07-22 | 2018-05-01 | Cree, Inc. | Solder pads, methods, and systems for circuitry components |
JP6298163B2 (ja) * | 2014-07-29 | 2018-03-20 | 京セラ株式会社 | 配線基板、電子装置および電子モジュール |
JP6319026B2 (ja) | 2014-09-29 | 2018-05-09 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
JP6366557B2 (ja) * | 2015-09-30 | 2018-08-01 | ミネベアミツミ株式会社 | 面状照明装置 |
JP6384508B2 (ja) | 2016-04-06 | 2018-09-05 | 日亜化学工業株式会社 | 発光装置 |
JP6755233B2 (ja) * | 2017-12-14 | 2020-09-16 | ミネベアミツミ株式会社 | 基板および面状照明装置 |
-
2017
- 2017-12-14 JP JP2017239451A patent/JP6755233B2/ja active Active
-
2018
- 2018-11-13 US US16/188,617 patent/US11152541B2/en active Active
- 2018-12-13 CN CN201822096215.4U patent/CN209232816U/zh active Active
- 2018-12-13 CN CN201811523690.3A patent/CN109980076B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
US20190189847A1 (en) | 2019-06-20 |
JP6755233B2 (ja) | 2020-09-16 |
CN109980076A (zh) | 2019-07-05 |
CN209232816U (zh) | 2019-08-09 |
US11152541B2 (en) | 2021-10-19 |
CN109980076B (zh) | 2022-07-05 |
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