JP2019102789A - コイル部品 - Google Patents
コイル部品 Download PDFInfo
- Publication number
- JP2019102789A JP2019102789A JP2018131180A JP2018131180A JP2019102789A JP 2019102789 A JP2019102789 A JP 2019102789A JP 2018131180 A JP2018131180 A JP 2018131180A JP 2018131180 A JP2018131180 A JP 2018131180A JP 2019102789 A JP2019102789 A JP 2019102789A
- Authority
- JP
- Japan
- Prior art keywords
- support member
- coil component
- coil
- component according
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011521 glass Substances 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 10
- 239000000696 magnetic material Substances 0.000 claims description 9
- 238000007747 plating Methods 0.000 claims description 9
- 239000004020 conductor Substances 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims description 2
- 229910052750 molybdenum Inorganic materials 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 229910052721 tungsten Inorganic materials 0.000 claims description 2
- 239000004593 Epoxy Substances 0.000 claims 1
- 239000000126 substance Substances 0.000 abstract description 7
- 239000000758 substrate Substances 0.000 description 13
- 239000003822 epoxy resin Substances 0.000 description 7
- 229920000647 polyepoxide Polymers 0.000 description 7
- 239000011888 foil Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000006249 magnetic particle Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000005407 aluminoborosilicate glass Substances 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/06—Mounting, supporting or suspending transformers, reactors or choke coils not being of the signal type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/30—Fastening or clamping coils, windings, or parts thereof together; Fastening or mounting coils or windings on core, casing, or other support
- H01F27/306—Fastening or mounting coils or windings on core, casing or other support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
- H01F27/255—Magnetic cores made from particles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
- H01F2017/002—Details of via holes for interconnecting the layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F2017/048—Fixed inductances of the signal type with magnetic core with encapsulating core, e.g. made of resin and magnetic powder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
- H01F2027/2809—Printed windings on stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/32—Insulating of coils, windings, or parts thereof
- H01F27/324—Insulation between coil and core, between different winding sections, around the coil; Other insulation structures
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
- Coils Of Transformers For General Uses (AREA)
Abstract
Description
図1は本発明の一例によるコイル部品100の概略的な斜視図であり、図2は図1のI−I'線に沿って切断した断面図であり、図3は図2のA領域を拡大した拡大図である。
1 本体
21、22 第1及び第2外部電極
11 磁性物質
12 支持部材
13 コイル
14 絶縁層
Claims (18)
- 磁性物質で充填された貫通孔、及び伝導性物質で充填されたビアホールを含み、絶縁物質を含む支持部材と、前記支持部材の一面上に形成される第1コイル、及び前記一面と向かい合う他面上に形成される第2コイルを含むコイルと、前記支持部材及び前記コイルを封止する磁性物質と、を含む本体と、
前記本体の外部面上に配置され、前記コイルと連結される外部電極と、を含むコイル部品であって、
前記第1コイル及び前記第2コイルはそれぞれ、前記支持部材と接する第1シードパターン及び第2シードパターンを含み、前記第1シードパターンの厚さは、前記第2シードパターンの厚さに比べてより薄く、
前記支持部材は、前記一面を有する第1支持部材と、前記他面を有する第2支持部材と、を含む、コイル部品。 - 前記第1支持部材の反り特性が、前記第2支持部材の反り特性に比べてより大きい、請求項1に記載のコイル部品。
- 前記第1支持部材の熱膨張係数(CTE)が、前記第2支持部材の熱膨張係数(CTE)に比べてより大きい、請求項1または2に記載のコイル部品。
- 前記第1支持部材はガラスを含み、前記第2支持部材は前記ガラスを含まない、請求項1から3のいずれか一項に記載のコイル部品。
- 前記ガラスは、前記支持部材の中央を基準として前記一面に近く配置される、請求項4に記載のコイル部品。
- 前記ガラスは、前記支持部材の一面または他面に平行に配置される、請求項4または5に記載のコイル部品。
- 前記第1支持部材の厚さが、前記第2支持部材の厚さと同一である、請求項4から6のいずれか一項に記載のコイル部品。
- 前記ガラスはE−ガラスを含む、請求項4から7のいずれか一項に記載のコイル部品。
- 前記ガラスは、NE−ガラス、D−ガラス、T−ガラス、S−ガラスのうち1つ以上を含む、請求項4から7のいずれか一項に記載のコイル部品。
- 前記第1シードパターンの厚さが2μm以上5μm以下である、請求項1から9のいずれか一項に記載のコイル部品。
- 前記第2シードパターンの厚さが12μm以上18μm以下である、請求項1から10のいずれか一項に記載のコイル部品。
- 前記支持部材の総厚さが35μm以上65μm以下である、請求項1から11のいずれか一項に記載のコイル部品。
- 前記第1シードパターン上には第1基本層及び第1めっき層が配置され、前記第2シードパターン上には第2基本層及び第2めっき層が配置される、請求項1から12のいずれか一項に記載のコイル部品。
- 前記第1基本層は、前記支持部材のビアホールの側面及び下面を囲むように配置される、請求項13に記載のコイル部品。
- 前記第1めっき層が前記ビアホールの内部を充填する、請求項13または14に記載のコイル部品。
- 前記第1及び第2めっき層は、Mo、Al、Ti、Ni、及びWのうち1つ以上を含む、請求項13から15のいずれか一項に記載のコイル部品。
- 前記第1基本層は、前記第2シードパターンと接する、請求項13から16のいずれか一項に記載のコイル部品。
- 前記第1及び第2支持部材はエポキシを含む、請求項1から17のいずれか一項に記載のコイル部品。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2017-0167357 | 2017-12-07 | ||
KR1020170167357A KR102502340B1 (ko) | 2017-12-07 | 2017-12-07 | 코일 부품 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP6521549B1 JP6521549B1 (ja) | 2019-05-29 |
JP2019102789A true JP2019102789A (ja) | 2019-06-24 |
Family
ID=66655638
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018131180A Active JP6521549B1 (ja) | 2017-12-07 | 2018-07-11 | コイル部品 |
Country Status (3)
Country | Link |
---|---|
US (1) | US10796840B2 (ja) |
JP (1) | JP6521549B1 (ja) |
KR (1) | KR102502340B1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7472490B2 (ja) * | 2019-12-24 | 2024-04-23 | Tdk株式会社 | コイル装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59151411U (ja) * | 1983-03-30 | 1984-10-11 | 東芝ライテック株式会社 | 高周波プリントコイルトランス |
JP2001189215A (ja) * | 1999-12-28 | 2001-07-10 | Tdk Corp | 平面コイルおよびトランス |
US20130120952A1 (en) * | 2011-11-10 | 2013-05-16 | Samsung Electronics Co., Ltd. | Substrate and electronic device including the substrate |
US20150170823A1 (en) * | 2013-12-18 | 2015-06-18 | Samsung Electro-Mechanics Co., Ltd. | Chip electronic component and manufacturing method thereof |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR19990066108A (ko) | 1998-01-21 | 1999-08-16 | 구자홍 | 박막 인덕터 및 그 제조방법 |
KR100744994B1 (ko) | 2006-01-25 | 2007-08-02 | 삼성전기주식회사 | 다층 인쇄회로기판 및 그 제조방법 |
KR101397488B1 (ko) * | 2012-07-04 | 2014-05-20 | 티디케이가부시기가이샤 | 코일 부품 및 그의 제조 방법 |
KR101420525B1 (ko) * | 2012-11-23 | 2014-07-16 | 삼성전기주식회사 | 적층형 인덕터 및 이의 제조방법 |
KR101451503B1 (ko) * | 2013-03-25 | 2014-10-15 | 삼성전기주식회사 | 인덕터 및 그 제조 방법 |
JP6312997B2 (ja) * | 2013-07-31 | 2018-04-18 | 新光電気工業株式会社 | コイル基板及びその製造方法、インダクタ |
KR101973410B1 (ko) * | 2013-08-14 | 2019-09-02 | 삼성전기주식회사 | 박막 인덕터용 코일 유닛, 박막 인덕터용 코일 유닛의 제조방법, 박막 인덕터 및 박막 인덕터의 제조방법 |
JP6132027B2 (ja) * | 2013-10-15 | 2017-05-24 | 株式会社村田製作所 | 積層型インダクタ素子の製造方法、および積層型インダクタ素子 |
JP6381432B2 (ja) * | 2014-05-22 | 2018-08-29 | 新光電気工業株式会社 | インダクタ、コイル基板及びコイル基板の製造方法 |
KR102185067B1 (ko) * | 2014-09-24 | 2020-12-01 | 삼성전기주식회사 | 박막 인덕터용 코일 유닛, 박막 인덕터용 코일 유닛의 제조방법, 박막 인덕터 및 박막 인덕터의 제조방법 |
KR101652848B1 (ko) * | 2015-01-27 | 2016-08-31 | 삼성전기주식회사 | 코일 부품 및 이의 제조 방법 |
JP6398857B2 (ja) * | 2015-04-27 | 2018-10-03 | 株式会社村田製作所 | 電子部品及びその製造方法 |
KR102333081B1 (ko) | 2015-06-18 | 2021-12-01 | 삼성전기주식회사 | 인쇄회로기판 |
JP6477427B2 (ja) | 2015-11-04 | 2019-03-06 | 株式会社村田製作所 | コイル部品 |
-
2017
- 2017-12-07 KR KR1020170167357A patent/KR102502340B1/ko active IP Right Grant
-
2018
- 2018-07-05 US US16/027,947 patent/US10796840B2/en active Active
- 2018-07-11 JP JP2018131180A patent/JP6521549B1/ja active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59151411U (ja) * | 1983-03-30 | 1984-10-11 | 東芝ライテック株式会社 | 高周波プリントコイルトランス |
JP2001189215A (ja) * | 1999-12-28 | 2001-07-10 | Tdk Corp | 平面コイルおよびトランス |
US20130120952A1 (en) * | 2011-11-10 | 2013-05-16 | Samsung Electronics Co., Ltd. | Substrate and electronic device including the substrate |
US20150170823A1 (en) * | 2013-12-18 | 2015-06-18 | Samsung Electro-Mechanics Co., Ltd. | Chip electronic component and manufacturing method thereof |
Also Published As
Publication number | Publication date |
---|---|
US20190180905A1 (en) | 2019-06-13 |
US10796840B2 (en) | 2020-10-06 |
JP6521549B1 (ja) | 2019-05-29 |
KR20190067429A (ko) | 2019-06-17 |
KR102502340B1 (ko) | 2023-02-22 |
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