JP2019102727A - 基板搬入出装置、基板処理装置及び基板搬送容器の除電方法 - Google Patents
基板搬入出装置、基板処理装置及び基板搬送容器の除電方法 Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
- H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67396—Closed carriers characterised by the presence of antistatic elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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Abstract
Description
本発明の実施形態に係る基板搬入出装置を備える基板処理装置について説明する。本発明の実施形態に係る基板搬入出装置は、種々の基板処理装置に適用できるが、理解の容易のために、基板処理装置の一例として縦型熱処理装置を用いた場合を例に挙げて説明する。
次に、図6から図11を参照して、制御部100が基板処理装置1の各部を制御してキャリア40の内面を除電する方法の一例について説明する。図6は、キャリア40の除電方法の一例を示すフローチャートである。図7から図11は、キャリア40の除電方法の一例を示す工程図である。
10 筐体
11 隔壁
12 搬送口
22 処理容器
27 ウエハ搬送機構
40 キャリア
43 取り出し口
44 開口縁部
50 開閉ドア
60 蓋体開閉機構
70 ガス供給機構
71 ガス供給管
72 吐出口
73 ガス供給ライン
74 ガス供給源
75 イオナイザ
77 電位計
100 制御部
S10 キャリア搬送領域
S20 ウエハ搬送領域
W ウエハ
Claims (10)
- 基板搬送領域と容器搬送領域とを区画する隔壁と、
前記隔壁に形成された搬送口と、
前記搬送口の開口縁部に取り出し口の開口縁部を密着させた基板収納容器の内部に、前記搬送口の開口縁部からイオン化されたガスを吹き付けるガス供給機構と、
を有する、
基板搬入出装置。 - 前記ガス供給機構は、
前記隔壁に形成され、前記ガスを吐出する吐出口を有するガス供給管と、
前記ガス供給管と連通し、前記ガス供給管に前記ガスを供給するガス供給ラインと、
前記ガス供給ラインに介設され、前記ガス供給ラインを流れる前記ガスをイオン化するイオン化装置と、
を有する、
請求項1に記載の基板搬入出装置。 - 前記基板収納容器の内面の電位を検出する電位計と、
前記電位計により検出される前記基板収納容器の内面の電位に基づいて、前記イオン化装置の動作を制御する制御部と、
を有する、
請求項2に記載の基板搬入出装置。 - 前記搬送口を開閉する開閉ドアを有し、
前記電位計は前記開閉ドアに取り付けられている、
請求項3に記載の基板搬入出装置。 - 請求項1乃至4のいずれか一項に記載の基板搬入出装置と、
前記基板搬送領域内に設けられ、基板を搬送する搬送機構と、
前記基板搬送領域内に設けられた処理容器と、
を有する、
基板処理装置。 - 基板搬送領域と容器搬送領域とを区画する隔壁に形成された搬送口の開口縁部に、基板収納容器の取り出し口の開口縁部を密着させる工程と、
前記基板収納容器の内部に、前記搬送口の開口縁部からイオン化されたガスを吹き付ける工程と、
を有する、
基板収納容器の除電方法。 - 前記基板収納容器の内部に、前記搬送口の開口縁部からイオン化されたガスを吹き付ける工程の前に、前記搬送口を開閉する開閉ドアにより前記搬送口を塞ぐ工程を有する、
請求項6に記載の基板収納容器の除電方法。 - 前記基板収納容器の内部に、前記搬送口の開口縁部からイオン化されたガスを吹き付ける工程は、前記基板収納容器の前記取り出し口を塞ぐ蓋体が取り外された状態で行われる、
請求項6又は7に記載の基板収納容器の除電方法。 - 前記基板収納容器の内部に、前記搬送口の開口縁部からイオン化されたガスを吹き付ける工程は、前記基板収納容器の内部に基板が収納されていない状態で行われる、
請求項6乃至8のいずれか一項に記載の基板収納容器の除電方法。 - 前記基板収納容器の内部に、前記搬送口の開口縁部からイオン化されたガスを吹き付ける工程の後に、前記基板収納容器の前記取り出し口を蓋体により塞ぐ工程を有する、
請求項6乃至9のいずれか一項に記載の基板収納容器の除電方法。
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JP2017234476A JP6948927B2 (ja) | 2017-12-06 | 2017-12-06 | 基板搬入出装置、基板処理装置及び基板搬送容器の除電方法 |
KR1020180155025A KR102462916B1 (ko) | 2017-12-06 | 2018-12-05 | 기판 반출입 장치, 기판 처리 장치 및 기판 반송 용기의 제전 방법 |
CN201811489876.1A CN110010535B (zh) | 2017-12-06 | 2018-12-06 | 基板搬入搬出装置、处理装置和基板搬送容器的除电方法 |
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KR102409487B1 (ko) | 2022-04-19 | 2022-06-15 | 주식회사 위드텍 | 반도체 웨이퍼 풉용 로드포트의 분석가스 공급을 위한 제어장치 및 그 제어방법 |
Citations (4)
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JP2006351868A (ja) * | 2005-06-16 | 2006-12-28 | Tokyo Electron Ltd | 処理システム及び処理方法 |
JP2010165741A (ja) * | 2009-01-13 | 2010-07-29 | Hitachi High-Tech Control Systems Corp | ミニエンバイロメント基板搬送装置、ロードポートおよび搬送容器内基板の除電方法 |
JP2014053417A (ja) * | 2012-09-06 | 2014-03-20 | Tokyo Electron Ltd | 蓋体開閉装置及びこれを用いた熱処理装置、並びに蓋体開閉方法 |
JP2014207306A (ja) * | 2013-04-12 | 2014-10-30 | 東京エレクトロン株式会社 | 収納容器内の雰囲気管理方法 |
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JP4790326B2 (ja) * | 2005-06-16 | 2011-10-12 | 東京エレクトロン株式会社 | 処理システム及び処理方法 |
JP2012204645A (ja) | 2011-03-25 | 2012-10-22 | Tokyo Electron Ltd | 蓋体開閉装置 |
JP2014116441A (ja) | 2012-12-10 | 2014-06-26 | Hitachi High-Tech Manufacturing & Service Corp | 半導体ウェーハ処理装置及び除電システム |
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JP2006351868A (ja) * | 2005-06-16 | 2006-12-28 | Tokyo Electron Ltd | 処理システム及び処理方法 |
JP2010165741A (ja) * | 2009-01-13 | 2010-07-29 | Hitachi High-Tech Control Systems Corp | ミニエンバイロメント基板搬送装置、ロードポートおよび搬送容器内基板の除電方法 |
JP2014053417A (ja) * | 2012-09-06 | 2014-03-20 | Tokyo Electron Ltd | 蓋体開閉装置及びこれを用いた熱処理装置、並びに蓋体開閉方法 |
JP2014207306A (ja) * | 2013-04-12 | 2014-10-30 | 東京エレクトロン株式会社 | 収納容器内の雰囲気管理方法 |
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KR102462916B1 (ko) | 2022-11-03 |
KR20190067106A (ko) | 2019-06-14 |
CN110010535B (zh) | 2024-03-26 |
JP6948927B2 (ja) | 2021-10-13 |
CN110010535A (zh) | 2019-07-12 |
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