JP2019090101A - 多孔質吸液芯及びその製造方法 - Google Patents
多孔質吸液芯及びその製造方法 Download PDFInfo
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- JP2019090101A JP2019090101A JP2018109100A JP2018109100A JP2019090101A JP 2019090101 A JP2019090101 A JP 2019090101A JP 2018109100 A JP2018109100 A JP 2018109100A JP 2018109100 A JP2018109100 A JP 2018109100A JP 2019090101 A JP2019090101 A JP 2019090101A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 239000007788 liquid Substances 0.000 title abstract description 9
- 238000004070 electrodeposition Methods 0.000 claims abstract description 80
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims abstract description 44
- 229910000365 copper sulfate Inorganic materials 0.000 claims abstract description 25
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims abstract description 25
- 239000000758 substrate Substances 0.000 claims abstract description 22
- 239000003792 electrolyte Substances 0.000 claims abstract description 10
- 238000005406 washing Methods 0.000 claims abstract description 6
- 239000002184 metal Substances 0.000 claims abstract description 4
- 229910052751 metal Inorganic materials 0.000 claims abstract description 4
- 239000011259 mixed solution Substances 0.000 claims abstract description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims abstract description 3
- 230000003213 activating effect Effects 0.000 claims abstract description 3
- 150000007514 bases Chemical class 0.000 claims abstract description 3
- 239000004094 surface-active agent Substances 0.000 claims abstract description 3
- 230000002745 absorbent Effects 0.000 claims description 32
- 239000002250 absorbent Substances 0.000 claims description 32
- 239000008151 electrolyte solution Substances 0.000 claims description 27
- 238000000034 method Methods 0.000 claims description 11
- 239000011148 porous material Substances 0.000 claims description 5
- 239000007864 aqueous solution Substances 0.000 claims description 4
- 239000000243 solution Substances 0.000 abstract description 8
- 230000008901 benefit Effects 0.000 abstract description 2
- 238000002791 soaking Methods 0.000 abstract description 2
- 230000035515 penetration Effects 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000008367 deionised water Substances 0.000 description 3
- 229910021641 deionized water Inorganic materials 0.000 description 3
- 238000001878 scanning electron micrograph Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 230000003592 biomimetic effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000001965 increasing effect Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- DAJSVUQLFFJUSX-UHFFFAOYSA-M sodium;dodecane-1-sulfonate Chemical compound [Na+].CCCCCCCCCCCCS([O-])(=O)=O DAJSVUQLFFJUSX-UHFFFAOYSA-M 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
- C25C5/00—Electrolytic production, recovery or refining of metal powders or porous metal masses
- C25C5/02—Electrolytic production, recovery or refining of metal powders or porous metal masses from solutions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Thermal Sciences (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrolytic Production Of Metals (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
Description
一定量の硫酸銅を量り取り、脱イオン水に溶解させて硫酸銅溶液とし、その後、濃硫酸を適切な量でこの硫酸銅溶液に添加して、0.1mol/Lの硫酸銅と、0.5mol/Lの硫酸との混合液を第1の電着用電解液として得る。
硫酸銅の濃度を0.5mol/Lとし、硫酸の濃度を1.8mol/Lとする以外は、実施例1と同様にして第1の電着用電解液を製造する。
硫酸銅の濃度を0.2mol/Lとし、硫酸の濃度を0.8mol/Lとする以外は、実施例1と同様にして第1の電着用電解液を製造する。
硫酸銅の濃度を0.1mol/Lとし、硫酸の濃度を0.9mol/Lとする以外は、実施例1と同様にして第1の電着用電解液を製造する。
硫酸銅の濃度を0.3mol/Lとし、硫酸の濃度を0.7mol/Lとする以外は、実施例1と同様にして第1の電着用電解液を製造する。
硫酸銅の濃度を0.45mol/Lとし、硫酸の濃度を0.55mol/Lとする以外は、実施例1と同様にして第1の電着用電解液を製造する。
実施例1で製造された多孔質吸液芯と、同サイズの銅シートとに対し、同様にして放熱効果試験を行う。その結果を図3に示す。
Claims (8)
- (a)第1の電着用電解液として、0.5−1.8mol/Lの硫酸と、0.1−0.5mol/Lの硫酸銅とを含む水溶液を調製するステップと、
(b)第2の電着用電解液として、0.2−0.9mol/Lの硫酸と、0.4−0.9mol/Lの硫酸銅とを含む水溶液を調製するステップと、
(c)界面活性剤と塩基性化合物との混合溶液で金属基板の表面を洗浄し、さらに希塩酸で活性化させた後、洗浄するステップと、
(d)前記第1の電着用電解液中で、処理された基板に対して第1の電着を行った後、前記第2の電着用電解液中で第2の電着を行い、第2の電着における電流密度が第1の電着における電流密度よりも小さいであるステップとを含むことを特徴とする、多孔質吸液芯の製造方法。 - 前記第1の電着用電解液における硫酸と硫酸銅のモル比を5.5:4.5〜9:1とすることを特徴とする、請求項1に記載の多孔質吸液芯の製造方法。
- 前記第1の電着用電解液における硫酸と硫酸銅のモル比を7:3〜8:2とすることを特徴とする、請求項2に記載の多孔質吸液芯の製造方法。
- 前記第1の電着における電流密度を0.5〜5A/cm2とし、電着時間を10s〜10minとすることを特徴とする、請求項1に記載の多孔質吸液芯の製造方法。
- 前記第1の電着における電流密度を0.8〜1.5A/cm2とし、電着時間を50s〜90sとすることを特徴とする、請求項4に記載の多孔質吸液芯の製造方法。
- 前記第2の電着における電流密度を0.01〜0.1A/cm2とし、電着時間を5〜15minとすることを特徴とする、請求項1に記載の多孔質吸液芯の製造方法。
- 前記第2の電着における電流密度を0.02〜0.05A/cm2とし、電着時間を10〜15minとすることを特徴とする、請求項6に記載の多孔質吸液芯の製造方法。
- 請求項1〜7のいずれか1項に記載の多孔質吸液芯の製造方法により製造され、上層よりも下層のほうが孔隙サイズが小さくなり、また下層よりも上層のほうが孔壁が緻密になることを特徴とする、多孔質吸液芯。
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CN201711137877.5 | 2017-11-16 | ||
CN201711137877.5A CN107937943B (zh) | 2017-11-16 | 2017-11-16 | 多孔吸液芯及其制备方法 |
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JP2019090101A true JP2019090101A (ja) | 2019-06-13 |
JP6684856B2 JP6684856B2 (ja) | 2020-04-22 |
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JP2018109100A Expired - Fee Related JP6684856B2 (ja) | 2017-11-16 | 2018-06-07 | 多孔質吸液芯及びその製造方法 |
Country Status (4)
Country | Link |
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US (1) | US20190145714A1 (ja) |
JP (1) | JP6684856B2 (ja) |
CN (1) | CN107937943B (ja) |
TW (1) | TWI642814B (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
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CN109137020A (zh) * | 2018-09-19 | 2019-01-04 | 江西华度电子新材料有限公司 | 一种厚吸液芯的制备方法 |
CN109234771A (zh) * | 2018-09-19 | 2019-01-18 | 江西华度电子新材料有限公司 | 一种超薄热板吸液芯的制备方法 |
CN109137021A (zh) * | 2018-09-19 | 2019-01-04 | 江西华度电子新材料有限公司 | 一种热板吸液芯的制备方法 |
CN108914178A (zh) * | 2018-09-19 | 2018-11-30 | 江西华度电子新材料有限公司 | 一种解决电镀法制备吸液芯厚度不均的方法 |
CN109295484A (zh) * | 2018-11-02 | 2019-02-01 | 江西华度电子新材料有限公司 | 一种抗氧化热板吸液芯及其制备方法 |
CN110629258A (zh) * | 2019-10-16 | 2019-12-31 | 东莞领杰金属精密制造科技有限公司 | 一种多孔铜吸液芯的制备方法 |
CN112522747B (zh) * | 2020-11-19 | 2022-01-07 | 瑞声科技(南京)有限公司 | 均温板上盖板的制备方法以及均温板 |
CN114061347B (zh) * | 2021-10-18 | 2024-08-06 | 中天超容科技有限公司 | 泡沫金属吸液芯及其制备方法和均热板 |
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JPS51131425A (en) * | 1975-05-13 | 1976-11-15 | Inoue Japax Res | Production method for heattconducting members |
JPH0945579A (ja) * | 1995-07-26 | 1997-02-14 | Kyowa Densen Kk | コンデンサ用リード線 |
JPH09148508A (ja) * | 1995-11-29 | 1997-06-06 | Nippon Denkai Kk | 半導体装置用リードフレーム及びこれを用いた樹脂封止型半導体装置 |
JP2017075406A (ja) * | 2013-07-23 | 2017-04-20 | Jx金属株式会社 | 表面処理銅箔、キャリア付銅箔、基材の製造方法、プリント配線板の製造方法、プリント回路板の製造方法、銅張積層板の製造方法 |
JP2019090100A (ja) * | 2017-11-16 | 2019-06-13 | 中▲達▼▲電▼子(江▲蘇▼)有限公司Delta Electronics (Jiangsu) Ltd. | 銅合金多孔質吸液芯及びその製造方法 |
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CN101206374A (zh) * | 2006-12-21 | 2008-06-25 | 西北工业大学 | 一种基于树枝状结构的红外波段超材料 |
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- 2017-12-19 TW TW106144628A patent/TWI642814B/zh not_active IP Right Cessation
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2018
- 2018-04-18 US US15/956,725 patent/US20190145714A1/en not_active Abandoned
- 2018-06-07 JP JP2018109100A patent/JP6684856B2/ja not_active Expired - Fee Related
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JPS51131425A (en) * | 1975-05-13 | 1976-11-15 | Inoue Japax Res | Production method for heattconducting members |
JPH0945579A (ja) * | 1995-07-26 | 1997-02-14 | Kyowa Densen Kk | コンデンサ用リード線 |
JPH09148508A (ja) * | 1995-11-29 | 1997-06-06 | Nippon Denkai Kk | 半導体装置用リードフレーム及びこれを用いた樹脂封止型半導体装置 |
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JP2019090100A (ja) * | 2017-11-16 | 2019-06-13 | 中▲達▼▲電▼子(江▲蘇▼)有限公司Delta Electronics (Jiangsu) Ltd. | 銅合金多孔質吸液芯及びその製造方法 |
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TW201923156A (zh) | 2019-06-16 |
CN107937943A (zh) | 2018-04-20 |
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CN107937943B (zh) | 2019-04-26 |
JP6684856B2 (ja) | 2020-04-22 |
US20190145714A1 (en) | 2019-05-16 |
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