JP2019087674A - Grinding device - Google Patents
Grinding device Download PDFInfo
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- JP2019087674A JP2019087674A JP2017215844A JP2017215844A JP2019087674A JP 2019087674 A JP2019087674 A JP 2019087674A JP 2017215844 A JP2017215844 A JP 2017215844A JP 2017215844 A JP2017215844 A JP 2017215844A JP 2019087674 A JP2019087674 A JP 2019087674A
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- Prior art keywords
- unit
- grinding
- surface roughness
- workpiece
- light
- Prior art date
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- 230000003746 surface roughness Effects 0.000 claims abstract description 64
- 238000003860 storage Methods 0.000 claims abstract description 17
- 238000004439 roughness measurement Methods 0.000 claims abstract description 16
- 238000005259 measurement Methods 0.000 abstract description 6
- 238000006748 scratching Methods 0.000 abstract description 2
- 230000002393 scratching effect Effects 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 14
- 238000004140 cleaning Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 241001422033 Thestylus Species 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000013307 optical fiber Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Polarising Elements (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Disintegrating Or Milling (AREA)
Abstract
Description
本発明は、ウェーハ等の被加工物を研削する際に用いられる研削装置に関する。 The present invention relates to a grinding apparatus used when grinding a workpiece such as a wafer.
各種の電子機器等に組み込まれるデバイスチップを小型化、軽量化するために、デバイスチップへと分割される前のウェーハを薄く加工する機会が増えている。例えば、ウェーハのデバイスが設けられた表面側をチャックテーブルで保持し、回転させた砥石工具をウェーハの裏面側に押し当てることで、このウェーハを研削して薄くできる（例えば、特許文献１参照）。 In order to reduce the size and weight of device chips incorporated in various electronic devices and the like, opportunities for thinning wafers before being divided into device chips are increasing. For example, the wafer can be ground and thinned by holding the front side of the wafer on which the device is provided with a chuck table and pressing the rotated grinding tool against the back side of the wafer (for example, see Patent Document 1) .
ところで、研削により薄くなったウェーハを分割して得られるデバイスチップの抗折強度は、ウェーハの被研削面（裏面）の表面粗さと密接に関わっている。そこで、ウェーハを研削した後には、通常、このウェーハの被研削面の表面粗さを測定する。表面粗さの測定には、例えば、測定対象である被研削面に接触させる触針を備えた表面粗さ測定装置が用いられる。 The bending strength of the device chip obtained by dividing the wafer thinned by grinding is closely related to the surface roughness of the surface to be ground (rear surface) of the wafer. Therefore, after grinding the wafer, the surface roughness of the surface to be ground of the wafer is usually measured. For the measurement of the surface roughness, for example, a surface roughness measuring device provided with a stylus to be brought into contact with the surface to be ground to be measured is used.
しかしながら、上述のような表面粗さ測定装置を用いると、例えば、研削装置から表面粗さ測定装置へとウェーハを搬送する際に誤ってウェーハを落下させ、このウェーハを破損させる可能性がある。また、表面粗さ測定装置の触針によってウェーハの被研削面に傷が付き、デバイスチップの抗折強度が低下する恐れもある。 However, with the surface roughness measuring apparatus as described above, there is a possibility that, for example, the wafer may be dropped accidentally when transporting the wafer from the grinding apparatus to the surface roughness measuring apparatus, and the wafer may be broken. In addition, there is a risk that the surface to be ground of the wafer may be damaged by the stylus of the surface roughness measuring device, and the bending strength of the device chip may be reduced.
本発明はかかる問題点に鑑みてなされたものであり、その目的とするところは、表面粗さを測定する際に被加工物を破損させたり被研削面に傷を付けたりする可能性を低く抑えられる研削装置を提供することである。 The present invention has been made in view of such problems, and the object of the present invention is to lower the possibility of damaging the workpiece or scratching the surface to be ground when measuring the surface roughness. It is providing a grinding device which can be suppressed.
本発明の一態様によれば、被加工物を保持するチャックテーブルと、該チャックテーブルに保持された該被加工物を研削する研削ユニットと、該研削ユニットで研削された該被加工物の被研削面の表面粗さを非接触で測定する非接触表面粗さ測定ユニットと、を備え、該非接触表面粗さ測定ユニットは、該被研削面に光を照射する発光部と、該被研削面で反射した光を受ける受光部と、該受光部の受光量と該被研削面の該表面粗さとの関係が記憶された記憶部と、該記憶部に記憶された該関係と該受光部の該受光量とから該被研削面の表面粗さを算出する算出部と、を含む研削装置が提供される。 According to one aspect of the present invention, a chuck table for holding a workpiece, a grinding unit for grinding the workpiece held by the chuck table, and a workpiece of the workpiece ground by the grinding unit And a non-contact surface roughness measurement unit for measuring the surface roughness of the ground surface in a non-contacting manner, the non-contact surface roughness measurement unit emitting light to the ground surface, and the ground surface And a storage unit storing the relationship between the amount of light received by the light receiving unit and the surface roughness of the surface to be ground, the relationship stored in the storage unit, and the relationship between the light receiving unit and the storage unit There is provided a grinding apparatus including a calculation unit that calculates the surface roughness of the surface to be ground from the light reception amount.
本発明の一態様に係る研削装置は、被加工物の被研削面に光を照射する発光部と、被研削面で反射した光を受ける受光部と、受光部の受光量と被研削面の表面粗さとの関係が記憶された記憶部と、記憶部に記憶された関係と受光部の受光量とから被研削面の表面粗さを算出する算出部と、を含む非接触表面粗さ測定ユニットを備え、受光部の受光量に基づいて非接触で表面粗さを測定できるので、触針の接触によって被研削面に傷が付くことはない。 A grinding apparatus according to an aspect of the present invention includes a light emitting unit that emits light to a surface to be ground of a workpiece, a light receiving unit that receives light reflected by the surface to be ground, a light receiving amount of the light receiving unit, and Non-contact surface roughness measurement including a storage unit in which the relationship with the surface roughness is stored, and a calculation unit that calculates the surface roughness of the surface to be ground from the relationship stored in the storage unit and the light receiving amount of the light receiving unit Since the surface roughness can be measured in a non-contact manner based on the amount of light received by the light receiving unit, the surface to be ground is not damaged by the contact of the stylus.
また、研削装置内に非接触表面粗さ測定ユニットが設けられているので、被研削面の表面粗さを測定するために、研削装置とは別の表面粗さ測定装置に被加工物を搬送する必要がない。つまり、被加工物の搬送の経路が短くなり、又はなくなるので、この搬送の際に誤って被加工物を破損させる可能性を低く抑えられる。 In addition, since the non-contact surface roughness measuring unit is provided in the grinding apparatus, the workpiece is conveyed to a surface roughness measuring apparatus other than the grinding apparatus in order to measure the surface roughness of the surface to be ground. There is no need to That is, since the transport path of the workpiece is shortened or eliminated, the possibility of erroneously damaging the workpiece during transport can be reduced.
添付図面を参照して、本発明の一態様に係る実施形態について説明する。図１は、本実施形態に係る研削装置２の構成例を模式的に示す斜視図である。図１に示すように、研削装置２は、各構成要素を支持する基台４を備えている。基台４の後端には、壁状の支持構造６が設けられている。基台４の上面前側には、開口４ａが形成されており、この開口４ａ内には、板状の被加工物１１を搬送する搬送ユニット８が配置されている。 Embodiments according to one aspect of the present invention will be described with reference to the attached drawings. FIG. 1: is a perspective view which shows typically the structural example of the grinding apparatus 2 which concerns on this embodiment. As shown in FIG. 1, the grinding apparatus 2 includes a base 4 that supports each component. At the rear end of the base 4, a wall-like support structure 6 is provided. An opening 4 a is formed on the front side of the upper surface of the base 4, and a conveyance unit 8 for conveying a plate-like workpiece 11 is disposed in the opening 4 a.
被加工物１１は、例えば、シリコン（Ｓｉ）等の材料でなる円盤状のウェーハである。ただし、被加工物１１の材質、形状、構造、大きさ等に制限はない。例えば、他の半導体、セラミックス、樹脂、金属等の材料でなる基板を被加工物１１とすることもできる。また、被加工物１１の被研削面１１ａ（図２参照）とは反対側の面に、保護部材１７等が貼付されても良い。 The workpiece 11 is, for example, a disk-shaped wafer made of a material such as silicon (Si). However, the material, shape, structure, size, etc. of the workpiece 11 are not limited. For example, a substrate made of another semiconductor, ceramic, resin, metal or the like may be used as the workpiece 11. In addition, a protective member 17 or the like may be attached to the surface of the workpiece 11 opposite to the surface to be ground 11a (see FIG. 2).
開口４ａの側方の領域には、複数の被加工物１１を収容するカセット１０ａ，１０ｂが載せられる。カセット１０ａが載せられる領域の後方には、センタリング機構１２が設けられている。センタリング機構１２は、例えば、カセット１０ａから搬送ユニット８で搬送された被加工物１１の中心の位置を調整する。 Cassettes 10a and 10b for storing a plurality of workpieces 11 are placed on the side area of the opening 4a. A centering mechanism 12 is provided at the rear of the area on which the cassette 10a is placed. The centering mechanism 12 adjusts, for example, the position of the center of the workpiece 11 transported by the transport unit 8 from the cassette 10 a.
センタリング機構１２の後方には、被加工物１１を保持して旋回する搬入ユニット１４が設けられている。搬入ユニット１４の後方には、開口４ｂが形成されている。この開口４ｂ内には、Ｘ軸移動テーブル（不図示）、Ｘ軸移動テーブルをＸ軸方向（前後方向）に移動させるＸ軸移動ユニット（不図示）、Ｘ軸移動テーブルを覆うテーブルカバー１６、及びＸ軸移動ユニットを覆う防塵防滴カバー１８が配置されている。 At the rear of the centering mechanism 12, a carry-in unit 14 is provided which holds and rotates the workpiece 11. An opening 4 b is formed at the rear of the loading unit 14. In the opening 4b, an X-axis moving table (not shown), an X-axis moving unit (not shown) for moving the X-axis moving table in the X-axis direction (back and forth), a table cover 16 covering the X-axis moving table, And a dustproof drip-proof cover 18 covering the X-axis moving unit.
Ｘ軸移動ユニットは、Ｘ軸方向に平行な一対のＸ軸ガイドレール（不図示）を備えており、Ｘ軸ガイドレールには、Ｘ軸移動テーブルがスライド可能に取り付けられている。Ｘ軸移動テーブルの下面側には、ナット部（不図示）が設けられており、このナット部には、Ｘ軸ガイドレールに平行なＸ軸ボールネジ（不図示）が螺合されている。 The X-axis movement unit includes a pair of X-axis guide rails (not shown) parallel to the X-axis direction, and an X-axis movement table is slidably attached to the X-axis guide rail. A nut (not shown) is provided on the lower surface side of the X-axis moving table, and an X-axis ball screw (not shown) parallel to the X-axis guide rail is screwed into this nut.
Ｘ軸ボールネジの一端部には、Ｘ軸パルスモータ（不図示）が連結されている。Ｘ軸パルスモータでＸ軸ボールネジを回転させることにより、Ｘ軸移動テーブルはＸ軸ガイドレールに沿ってＸ軸方向に移動する。Ｘ軸移動テーブルの上面側には、被加工物１１を吸引、保持するチャックテーブル２０が設けられている。 An X axis pulse motor (not shown) is connected to one end of the X axis ball screw. By rotating the X-axis ball screw with the X-axis pulse motor, the X-axis moving table moves in the X-axis direction along the X-axis guide rail. A chuck table 20 for suctioning and holding the workpiece 11 is provided on the upper surface side of the X-axis moving table.
チャックテーブル２０は、モータ等の回転駆動源（不図示）に連結されており、Ｚ軸方向（鉛直方向）に概ね平行な回転軸の周りに回転する。また、チャックテーブル２０は、上述のＸ軸移動ユニットにより、被加工物１１が搬入、搬出される前方の搬入搬出領域と、被加工物１１が研削される後方の研削領域との間を移動する。 The chuck table 20 is connected to a rotational drive source (not shown) such as a motor, and rotates around a rotational axis substantially parallel to the Z-axis direction (vertical direction). In addition, the chuck table 20 moves between the front loading / unloading area where the workpiece 11 is loaded and unloaded and the rear grinding area where the workpiece 11 is ground by the above-described X-axis moving unit. .
チャックテーブル２０の上面は、テーブルカバー１６の外部に露出しており、この上面の一部が、被加工物１１を吸引、保持する保持面になる。保持面は、チャックテーブル２０の内部に形成された吸引路（不図示）等を介して吸引源（不図示）に接続されている。搬入ユニット１４でチャックテーブル２０に搬入された被加工物１１は、保持面に作用する吸引源の負圧によりチャックテーブル２０に吸引、保持される。 The upper surface of the chuck table 20 is exposed to the outside of the table cover 16, and a part of the upper surface is a holding surface for sucking and holding the workpiece 11. The holding surface is connected to a suction source (not shown) via a suction path (not shown) or the like formed inside the chuck table 20. The workpiece 11 carried into the chuck table 20 by the carry-in unit 14 is sucked and held by the chuck table 20 by the negative pressure of the suction source acting on the holding surface.
支持構造６の前面には、Ｚ軸移動ユニット２２が設けられている。Ｚ軸移動ユニット２２は、Ｚ軸方向に平行な一対のＺ軸ガイドレール２４を備えており、このＺ軸ガイドレール２４には、Ｚ軸移動プレート２６がスライド可能に取り付けられている。Ｚ軸移動プレート２６の後面側（裏面側）には、ナット部（不図示）が設けられており、このナット部には、Ｚ軸ガイドレール２４に平行なＺ軸ボールネジ２８が螺合されている。 A Z-axis moving unit 22 is provided on the front surface of the support structure 6. The Z-axis moving unit 22 includes a pair of Z-axis guide rails 24 parallel to the Z-axis direction. A Z-axis moving plate 26 is slidably attached to the Z-axis guide rails 24. A nut portion (not shown) is provided on the rear surface side (back surface side) of the Z-axis moving plate 26, and a Z-axis ball screw 28 parallel to the Z-axis guide rail 24 is screwed into this nut portion. There is.
Ｚ軸ボールネジ２８の一端部には、Ｚ軸パルスモータ３０が連結されている。Ｚ軸パルスモータ３０でＺ軸ボールネジ２８を回転させることにより、Ｚ軸移動プレート２６はＺ軸ガイドレール２４に沿ってＺ軸方向に移動する。 The Z-axis pulse motor 30 is connected to one end of the Z-axis ball screw 28. By rotating the Z-axis ball screw 28 by the Z-axis pulse motor 30, the Z-axis moving plate 26 moves in the Z-axis direction along the Z-axis guide rail 24.
Ｚ軸移動プレート２６の前面（表面）には、被加工物１１を研削する研削ユニット３２が設けられている。研削ユニット３２は、Ｚ軸移動プレート２６に固定される筒状のスピンドルハウジング３４を備えている。スピンドルハウジング３４の内部には、Ｚ軸方向（鉛直方向）に概ね平行な回転軸となるスピンドル３６が収容されている。 A grinding unit 32 for grinding the workpiece 11 is provided on the front surface (surface) of the Z-axis moving plate 26. The grinding unit 32 includes a cylindrical spindle housing 34 fixed to the Z-axis moving plate 26. Inside the spindle housing 34, a spindle 36 which is a rotation axis substantially parallel to the Z-axis direction (vertical direction) is accommodated.
スピンドルハウジング３４から露出するスピンドル３６の先端部（下端部）には、円盤状のマウント３８が固定されている。マウント３８の下面には、マウント３８と概ね同径の研削ホイール４０が装着される。研削ホイール４０は、例えば、ステンレスやアルミニウム等の金属材料で形成されるホイール基台を含む。ホイール基台の下面には、樹脂や金属等の結合材にダイヤモンド等の砥粒を分散させてなる複数の研削砥石が配列されている。 A disc-like mount 38 is fixed to the tip (lower end) of the spindle 36 exposed from the spindle housing 34. A grinding wheel 40 having substantially the same diameter as the mount 38 is mounted on the lower surface of the mount 38. The grinding wheel 40 includes, for example, a wheel base formed of a metal material such as stainless steel or aluminum. On the lower surface of the wheel base, a plurality of grinding wheels formed by dispersing abrasive grains such as diamond in a bonding material such as resin or metal are arranged.
スピンドル３６の基端側（上端側）には、モータ等の回転駆動源（不図示）が連結されている。研削ホイール４０は、スピンドル３６を介して回転駆動源から伝達される力によって回転する。研削ユニット３２の内部又は近傍には、純水等の研削液を被加工物１１等に供給するノズル（不図示）が設けられている。 A rotary drive source (not shown) such as a motor is connected to the base end side (upper end side) of the spindle 36. The grinding wheel 40 is rotated by the force transmitted from the rotational drive source via the spindle 36. Inside or in the vicinity of the grinding unit 32, a nozzle (not shown) for supplying a grinding fluid such as pure water to the workpiece 11 or the like is provided.
搬入ユニット１４に隣接する位置には、被加工物１１を保持して旋回する搬出ユニット４２が設けられている。搬出ユニット４２の前方、かつ、カセット１０ｂが載せられる領域の後方には、研削された後の被加工物１１を洗浄する洗浄ユニット４４が配置されている。洗浄ユニット４４で洗浄された被加工物１１は、搬送ユニット８で搬送され、例えば、カセット１０ｂに収容される。開口４ａの前方には、研削の条件等を入力するための操作パネル４６が設けられている。 At a position adjacent to the carry-in unit 14, a carry-out unit 42 is provided which holds and rotates the workpiece 11. A cleaning unit 44 for cleaning the workpiece 11 after grinding is disposed in front of the carry-out unit 42 and behind the area where the cassette 10 b is placed. The workpiece 11 cleaned by the cleaning unit 44 is transported by the transport unit 8 and accommodated, for example, in the cassette 10 b. In front of the opening 4a, an operation panel 46 for inputting conditions for grinding and the like is provided.
被加工物１１を研削する際には、例えば、搬入搬出領域に位置付けられたチャックテーブル２０に、被研削面１１ａが上方に露出する態様で被加工物１１を搬入する。そして、この被加工物１１をチャックテーブル２０に吸引、保持させた上で、チャックテーブル２０を研削領域に移動させる。その後、チャックテーブル２０と研削ホイール４０とをそれぞれ回転させて、被加工物１１の被研削面１１ａ等に研削液を供給しながら研削ユニット３２を下降させる。 When grinding the workpiece 11, for example, the workpiece 11 is carried into the chuck table 20 positioned in the carry-in / out area in such a manner that the workpiece surface 11a is exposed upward. Then, after the workpiece 11 is sucked and held by the chuck table 20, the chuck table 20 is moved to the grinding area. Thereafter, the chuck table 20 and the grinding wheel 40 are respectively rotated to lower the grinding unit 32 while supplying the grinding fluid to the surface to be ground 11 a of the workpiece 11 and the like.
これにより、研削ホイール４０の研削砥石を被加工物１１の被研削面１１ａに接触させて、被加工物１１を研削できる。なお、研削ユニット３２の下降速度（下降量）は、研削砥石の下面が適切な力で被加工物１１の被研削面１１ａ側に押し当てられるように調整される。 Thereby, the workpiece 11 can be ground by bringing the grinding wheel of the grinding wheel 40 into contact with the surface 11 a to be ground of the workpiece 11. The lowering speed (falling amount) of the grinding unit 32 is adjusted so that the lower surface of the grinding wheel is pressed against the surface 11 a of the workpiece 11 with an appropriate force.
搬入搬出領域の上方には、被加工物１１の被研削面１１ａの表面粗さを非接触で測定する非接触表面粗さ測定ユニット４８が設けられている。図２は、非接触表面粗さ測定ユニット４８の構成例を模式的に示す図である。この非接触表面粗さ測定ユニット４８は、被研削面１１ａの表面粗さと、被研削面１１ａで反射した光の反射量（強度）と、の間にある相関を利用して表面粗さを測定するものであり、発光部５０と受光部５２とを含む。 A noncontact surface roughness measurement unit 48 that measures the surface roughness of the surface to be ground 11 a of the workpiece 11 in a noncontact manner is provided above the loading / unloading area. FIG. 2 is a view schematically showing a configuration example of the non-contact surface roughness measurement unit 48. As shown in FIG. The non-contact surface roughness measuring unit 48 measures the surface roughness using the correlation between the surface roughness of the surface to be ground 11 a and the reflection amount (intensity) of light reflected by the surface to be ground 11 a And includes a light emitting unit 50 and a light receiving unit 52.
発光部５０は、例えば、ＬＥＤ等の光源であり、下方に位置付けられた被加工物１１の被研削面１１ａに光を照射する。一方、受光部５２は、例えば、受光素子等の光検出器であり、発光部５０から照射され被研削面１１ａで反射した光を受けて、受光量（受光強度）に相当する電圧等の信号を生成する。そのため、発光部５０から被研削面１１ａに照射される光の波長は、被研削面１１ａで反射される範囲内に設定される。 The light emitting unit 50 is, for example, a light source such as an LED, and irradiates light to the surface 11 a to be ground of the workpiece 11 positioned below. On the other hand, the light receiving unit 52 is, for example, a light detector such as a light receiving element, and receives a light emitted from the light emitting unit 50 and reflected by the ground surface 11a, and a signal such as a voltage corresponding to a light receiving amount (light receiving intensity). Generate Therefore, the wavelength of the light irradiated from the light emitting unit 50 to the surface to be ground 11a is set within the range reflected by the surface to be ground 11a.
ただし、発光部５０や受光部５２の構造等に特段の制限はない。発光部５０は、例えば、光源の光を光ファイバー等で導き、下方へと放射するように構成されても良い。同様に、受光部５２は、例えば、受けた光を光ファイバー等で光検出器へと導くように構成されても良い。発光部５０から被研削面１１ａに照射される光の強度は、任意に設定される。 However, there is no particular limitation on the structures and the like of the light emitting unit 50 and the light receiving unit 52. The light emitting unit 50 may be configured to, for example, guide the light of the light source with an optical fiber or the like and emit the light downward. Similarly, the light receiving unit 52 may be configured to, for example, guide the received light to the light detector with an optical fiber or the like. The intensity of the light emitted from the light emitting unit 50 to the ground surface 11 a is arbitrarily set.
また、本実施形態では、０．１ｍｍ程度の直径の円形の領域（被照射領域）に発光部５０からの光が照射されるように、発光部５０と被加工物１１との位置関係等を調整する。同様に、本実施形態では、被研削面１１ａで反射する光を受光部５２で適切に受けることができるように、受光部５２と被加工物１１との位置関係等を調整する。 Further, in the present embodiment, the positional relationship between the light emitting unit 50 and the workpiece 11 is set so that light from the light emitting unit 50 is irradiated to a circular area (irradiated area) having a diameter of about 0.1 mm. adjust. Similarly, in the present embodiment, the positional relationship between the light receiving unit 52 and the workpiece 11 is adjusted so that the light reflected by the surface to be ground 11 a can be appropriately received by the light receiving unit 52.
これにより、０．１ｍｍ程度の直径の円形の被照射領域で被研削面１１ａの表面粗さを測定できるようになる。ただし、被照射領域の形状や大きさ等は、求められる測定精度や測定範囲等に応じて適切に変更される。なお、この非接触表面粗さ測定ユニット４８では、被照射領域の平均の表面粗さが測定されることになる。 As a result, the surface roughness of the surface to be ground 11a can be measured in a circular irradiated area having a diameter of about 0.1 mm. However, the shape, size, and the like of the irradiated region are appropriately changed in accordance with the required measurement accuracy, measurement range, and the like. The non-contact surface roughness measuring unit 48 measures the average surface roughness of the irradiated area.
受光部５２には、受光部５２で生成される電圧等の信号を処理する処理部５４が接続されている。この処理部５４は、受光部５２で生成される信号の強度Ｉ（すなわち、受光部５２の受光量）と、被研削面１１ａの表面粗さＲ（例えば、算術平均粗さ）との関係が予め記憶されている記憶部５４ａを含む。 The light receiving unit 52 is connected to a processing unit 54 that processes a signal such as a voltage generated by the light receiving unit 52. The processing unit 54 has a relationship between the intensity I of the signal generated by the light receiving unit 52 (that is, the amount of light received by the light receiving unit 52) and the surface roughness R (for example, arithmetic average roughness) of the surface 11a to be ground A storage unit 54a stored in advance is included.
図３は、記憶部５４ａに記憶されている関係の例を示すグラフである。この関係は、例えば、被加工物１１の被研削面１１ａで反射する光を受光部５２で受けて強度Ｉを測定するとともに、この被研削面１１ａの表面粗さを従来の方法等によって測定することで得られる。なお、図３では、表面粗さＲと強度Ｉとの関係が曲線状のグラフで表現されているが、これらの関係は、直線状のグラフで表現されることもある。 FIG. 3 is a graph showing an example of the relationship stored in the storage unit 54a. In this relationship, for example, the light reflected by the to-be-ground surface 11 a of the workpiece 11 is received by the light receiving unit 52 to measure the intensity I, and the surface roughness of the to-be-ground surface 11 a is measured by a conventional method. It is obtained by In FIG. 3, the relationship between the surface roughness R and the intensity I is represented by a curved graph, but the relationship may be represented by a linear graph.
また、処理部５４は、記憶部５４ａに記憶されている関係と、受光部５２で生成される信号の強度Ｉ（すなわち、受光部５２の受光量）とから、被研削面１１ａの表面粗さＲを算出する算出部５４ｂを含む。例えば、図３に示すように、受光部５２で強度Ｉ１の信号が生成された場合には、算出部５４ｂは、記憶部５４ａに記憶された関係を参酌して、強度Ｉ１に相当する表面粗さＲ１を算出する。 Further, the processing unit 54 has the surface roughness of the surface 11a to be ground according to the relationship stored in the storage unit 54a and the intensity I of the signal generated by the light receiving unit 52 (that is, the amount of light received by the light receiving unit 52). It includes a calculation unit 54b that calculates R. For example, as illustrated in FIG. 3, when the light receiving unit 52 generates a signal of the intensity I 1 , the calculating unit 54 b corresponds to the intensity I 1 in consideration of the relationship stored in the storage unit 54 a. The surface roughness R 1 is calculated.
このように構成される非接触表面粗さ測定ユニット４８で被加工物１１の被研削面１１ａの表面粗さＲを測定する際には、例えば、チャックテーブル２０を搬入搬出領域に移動させて、上方の発光部５０から下方の被研削面１１ａに光を照射する。そして、この被研削面１１ａで反射した光を受光部５２で受ける。これにより、受光部５２では、受光量に対応する強度Ｉの信号が生成される。 When measuring the surface roughness R of the to-be-ground surface 11 a of the workpiece 11 by the non-contact surface roughness measurement unit 48 configured as described above, for example, the chuck table 20 is moved to the loading and unloading region Light is emitted from the upper light emitting unit 50 to the lower surface 11 a to be ground. Then, the light reflected by the surface to be ground 11 a is received by the light receiving unit 52. As a result, the light receiving unit 52 generates a signal of intensity I corresponding to the amount of light received.
その後、算出部５４ｂは、記憶部５４ａに記憶された関係を参酌して、強度Ｉに相当する表面粗さＲを算出する。算出された表面粗さＲは、被加工物１１の品質管理等に用いられる。なお、表面粗さＲの測定は、非接触表面粗さ測定ユニット４８に対して被加工物１１を停止させた状態で行われても良いし、非接触表面粗さ測定ユニット４８に対して被加工物１１を移動させながら行われても良い。 Thereafter, the calculation unit 54b calculates the surface roughness R corresponding to the intensity I in consideration of the relationship stored in the storage unit 54a. The calculated surface roughness R is used for quality control of the workpiece 11 and the like. The measurement of the surface roughness R may be performed in a state where the workpiece 11 is stopped with respect to the noncontact surface roughness measurement unit 48, or the measurement of the surface roughness R may be performed on the noncontact surface roughness measurement unit 48. It may be performed while moving the workpiece 11.
以上のように、本実施形態に係る研削装置２は、被加工物１１の被研削面１１ａに光を照射する発光部５０と、被研削面１１ａで反射した光を受ける受光部５２と、受光部５２で生成される信号の強度Ｉ（すなわち、受光部５２の受光量）と被研削面１１ａの表面粗さＲとの関係が記憶された記憶部５４ａと、記憶部５４ａに記憶された関係と受光部５２で生成される信号の強度Ｉとから被研削面１１ａの表面粗さＲを算出する算出部５４ｂと、を含む非接触表面粗さ測定ユニット４８を備え、受光部５２の受光量に基づいて非接触で表面粗さＲを測定できるので、触針の接触によって被研削面１１ａに傷が付くことはない。 As described above, the grinding apparatus 2 according to the present embodiment includes the light emitting unit 50 that emits light to the surface 11 a to be ground of the workpiece 11, the light receiving unit 52 that receives the light reflected by the surface 11 a to be ground, Storage unit 54a storing the relationship between the intensity I of the signal generated by the unit 52 (that is, the amount of light received by the light receiving unit 52) and the surface roughness R of the surface to be ground 11a; And a non-contact surface roughness measurement unit 48 including a calculation unit 54b for calculating the surface roughness R of the surface 11a to be ground from the intensity I of the signal generated by the light reception unit 52; Since the surface roughness R can be measured in a non-contact manner based on the above, the contact of the stylus does not damage the surface to be ground 11a.
また、研削装置２内に非接触表面粗さ測定ユニット４８が設けられているので、被研削面１１ａの表面粗さＲを測定するために、研削装置２とは別の表面粗さ測定装置に被加工物１１を搬送する必要がない。つまり、被加工物１１の搬送の経路が短くなり、又はなくなるので、この搬送の際に誤って被加工物１１を破損させる可能性を低く抑えられる。 In addition, since the non-contact surface roughness measuring unit 48 is provided in the grinding apparatus 2, in order to measure the surface roughness R of the surface 11a to be ground, a surface roughness measuring apparatus different from the grinding apparatus 2 is used. There is no need to transport the workpiece 11. That is, since the conveyance path of the workpiece 11 is shortened or eliminated, the possibility of damaging the workpiece 11 by mistake during the conveyance can be reduced.
なお、本発明は、上記実施形態の記載に制限されず種々変更して実施可能である。例えば、搬入搬出領域及び非接触表面粗さ測定ユニット４８を含む領域を遮光部材等で囲み、外部の光の受光部５２への入射を防いでも良い。これにより、表面粗さＲをより精度良く測定できるようになる。 The present invention is not limited to the description of the above embodiment, and can be implemented with various modifications. For example, the area including the carry-in / out area and the non-contact surface roughness measurement unit 48 may be surrounded by a light shielding member or the like to prevent external light from being incident on the light receiving unit 52. As a result, the surface roughness R can be measured more accurately.
その他、上記実施形態に係る構造、方法等は、本発明の目的の範囲を逸脱しない限りにおいて適宜変更して実施できる。 In addition, the structure, method, and the like according to the above-described embodiment can be appropriately modified and implemented without departing from the scope of the object of the present invention.
２ 研削装置
４ 基台
４ａ，４ｂ 開口
６ 支持構造
８ 搬送ユニット
１０ａ，１０ｂ カセット
１２ センタリング機構
１４ 搬入ユニット
１６ テーブルカバー
１８ 防塵防滴カバー
２０ チャックテーブル
２２ Ｚ軸移動ユニット
２４ Ｚ軸ガイドレール
２６ Ｚ軸移動プレート
２８ Ｚ軸ボールネジ
３０ Ｚ軸パルスモータ
３２ バイト切削ユニット
３４ スピンドルハウジング
３６ スピンドル
３８ マウント
４０ 研削ホイール
４２ 搬出ユニット
４４ 洗浄ユニット
４６ 操作パネル
４８ 非接触表面粗さ測定ユニット
５０ 発光部
５２ 受光部
５４ 処理部
５４ａ 記憶部
５４ｂ 算出部
１１ 被加工物
１１ａ 被研削面
DESCRIPTION OF SYMBOLS 2 Grinding apparatus 4 Base 4a, 4b Opening 6 Support structure 8 Conveying unit 10a, 10b Cassette 12 Centering mechanism 14 Carrying-in unit 16 Table cover 18 Dustproof drip-proof cover 20 Chuck table 22 Z axis moving unit 24 Z axis guide rail 26 Z axis Moving plate 28 Z-axis ball screw 30 Z-axis pulse motor 32 bite cutting unit 34 spindle housing 36 spindle 38 mount 40 grinding wheel 42 unloading unit 44 cleaning unit 46 operation panel 48 non-contact surface roughness measurement unit 50 light emitting unit 52 light receiving unit 54 processing Part 54a Storage part 54b Calculation part 11 Workpiece 11a Surface to be ground
Claims (1)
該チャックテーブルに保持された該被加工物を研削する研削ユニットと、
該研削ユニットで研削された該被加工物の被研削面の表面粗さを非接触で測定する非接触表面粗さ測定ユニットと、を備え、
該非接触表面粗さ測定ユニットは、
該被研削面に光を照射する発光部と、
該被研削面で反射した光を受ける受光部と、
該受光部の受光量と該被研削面の該表面粗さとの関係が記憶された記憶部と、
該記憶部に記憶された該関係と該受光部の該受光量とから該被研削面の表面粗さを算出する算出部と、を含むことを特徴とする研削装置。 A chuck table for holding a workpiece;
A grinding unit for grinding the workpiece held by the chuck table;
And a non-contact surface roughness measurement unit that non-contactly measures the surface roughness of the surface to be ground of the workpiece ground by the grinding unit;
The non-contact surface roughness measurement unit
A light emitting unit that emits light to the surface to be ground;
A light receiving unit that receives light reflected by the surface to be ground;
A storage unit storing a relationship between the amount of light received by the light receiving unit and the surface roughness of the surface to be ground;
A grinding apparatus comprising: a calculation unit that calculates the surface roughness of the surface to be ground from the relationship stored in the storage unit and the amount of light received by the light receiving unit.
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| JP2017215844A JP2019087674A (en) | 2017-11-08 | 2017-11-08 | Grinding device |
| TW107135088A TWI783054B (en) | 2017-11-08 | 2018-10-04 | Grinding device |
| CN201811299132.3A CN109759915A (en) | 2017-11-08 | 2018-11-02 | Grinding attachment |
| KR1020180134392A KR20190052624A (en) | 2017-11-08 | 2018-11-05 | Grinding apparatus |
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| JP2017215844A JP2019087674A (en) | 2017-11-08 | 2017-11-08 | Grinding device |
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| KR (1) | KR20190052624A (en) |
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| JP2021053716A (en) * | 2019-09-27 | 2021-04-08 | 株式会社ディスコ | Grinding device |
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| CN111745499A (en) * | 2020-07-17 | 2020-10-09 | 江苏联峰工业装备科技有限公司 | Ball sealing surface grinding machine with screening structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021053716A (en) * | 2019-09-27 | 2021-04-08 | 株式会社ディスコ | Grinding device |
| JP7328104B2 (en) | 2019-09-27 | 2023-08-16 | 株式会社ディスコ | Grinding equipment |
| CN112595283A (en) * | 2021-01-07 | 2021-04-02 | 广州鸣琴科技有限公司 | Electronic heat radiator mesa roughness measurement equipment |
| CN112595283B (en) * | 2021-01-07 | 2022-04-29 | 山东韵丰环保科技有限公司 | Electronic heat radiator mesa roughness measurement equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109759915A (en) | 2019-05-17 |
| TWI783054B (en) | 2022-11-11 |
| KR20190052624A (en) | 2019-05-16 |
| TW201923873A (en) | 2019-06-16 |
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