JP2019083307A - 動的靭帯バランシングシステム - Google Patents
動的靭帯バランシングシステム Download PDFInfo
- Publication number
- JP2019083307A JP2019083307A JP2018159212A JP2018159212A JP2019083307A JP 2019083307 A JP2019083307 A JP 2019083307A JP 2018159212 A JP2018159212 A JP 2018159212A JP 2018159212 A JP2018159212 A JP 2018159212A JP 2019083307 A JP2019083307 A JP 2019083307A
- Authority
- JP
- Japan
- Prior art keywords
- collet
- vacuum
- valve
- coupling
- locking element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000008878 coupling Effects 0.000 claims abstract description 68
- 238000010168 coupling process Methods 0.000 claims abstract description 68
- 238000005859 coupling reaction Methods 0.000 claims abstract description 68
- 238000000034 method Methods 0.000 claims abstract description 41
- 230000008569 process Effects 0.000 claims abstract description 35
- 238000012423 maintenance Methods 0.000 claims abstract description 13
- 230000003993 interaction Effects 0.000 claims abstract description 9
- 239000000758 substrate Substances 0.000 claims description 48
- 238000012545 processing Methods 0.000 claims description 33
- 238000007789 sealing Methods 0.000 claims description 29
- 230000008859 change Effects 0.000 claims description 21
- 230000009471 action Effects 0.000 claims description 9
- 230000000694 effects Effects 0.000 claims description 9
- 238000000926 separation method Methods 0.000 claims description 9
- 238000009434 installation Methods 0.000 claims description 5
- 230000000903 blocking effect Effects 0.000 claims description 3
- 238000012546 transfer Methods 0.000 description 16
- 235000012431 wafers Nutrition 0.000 description 12
- 239000004065 semiconductor Substances 0.000 description 8
- 239000002245 particle Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000007246 mechanism Effects 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- 238000013461 design Methods 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 5
- 238000006073 displacement reaction Methods 0.000 description 4
- 230000001276 controlling effect Effects 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 239000003566 sealing material Substances 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 229920002449 FKM Polymers 0.000 description 2
- 229920006169 Perfluoroelastomer Polymers 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229920001973 fluoroelastomer Polymers 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000012811 non-conductive material Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000003750 conditioning effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
- 238000004073 vulcanization Methods 0.000 description 1
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K3/00—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing
- F16K3/02—Gate valves or sliding valves, i.e. cut-off apparatus with closing members having a sliding movement along the seat for opening and closing with flat sealing faces; Packings therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P19/00—Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes
- B23P19/02—Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes for connecting objects by press fit or for detaching same
- B23P19/027—Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes for connecting objects by press fit or for detaching same using hydraulic or pneumatic means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K31/00—Actuating devices; Operating means; Releasing devices
- F16K31/12—Actuating devices; Operating means; Releasing devices actuated by fluid
- F16K31/18—Actuating devices; Operating means; Releasing devices actuated by fluid actuated by a float
- F16K31/20—Actuating devices; Operating means; Releasing devices actuated by fluid actuated by a float actuating a lift valve
- F16K31/22—Actuating devices; Operating means; Releasing devices actuated by fluid actuated by a float actuating a lift valve with the float rigidly connected to the valve
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
- F16K51/00—Other details not peculiar to particular types of valves or cut-off apparatus
- F16K51/02—Other details not peculiar to particular types of valves or cut-off apparatus specially adapted for high-vacuum installations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B21/00—Means for preventing relative axial movement of a pin, spigot, shaft or the like and a member surrounding it; Stud-and-socket releasable fastenings
- F16B21/10—Means for preventing relative axial movement of a pin, spigot, shaft or the like and a member surrounding it; Stud-and-socket releasable fastenings by separate parts
- F16B21/20—Means for preventing relative axial movement of a pin, spigot, shaft or the like and a member surrounding it; Stud-and-socket releasable fastenings by separate parts for bolts or shafts without holes, grooves, or notches for locking members
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T279/00—Chucks or sockets
- Y10T279/17—Socket type
- Y10T279/17231—Pivoted jaws
- Y10T279/17239—Moving-cam actuator
- Y10T279/17256—Reciprocating cam sleeve
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Sealing Devices (AREA)
- Die Bonding (AREA)
Abstract
Description
真空領域用に設計されたかかる調整装置は、例えば、真空チャンバ内で処理される基板を位置付けるために使用される。基板は、通常はロボットによってプロセス体積に導入され、ここで、基板は格納ポイントでの格納のためにチャンバ内に設置され、続いて、処理後にこれらのポイントを上昇させなければならない。処理チャンバ内でのこの位置付け及び移動は、いわゆるピン引き上げシステムであり、ピンリフタとも呼ばれる特定の調整装置によって実現される。
Claims (15)
- プロセス雰囲気エリア(P)、特に真空領域内で可動である能動素子(15、34)のための真空調整装置(10、30)であって、
前記能動素子(15、34)を結合するために設計された継手(11、20、40)と、
前記能動素子(15、34)が結合された状態において、その目的の効果に関して実質的に無効な状態にある通常位置から、前記能動素子(15、34)がその目的の効果を提供する能動位置に、前記継手(11、20、40)が行ったり来たりするように調整可能であるように、設計され、前記継手(11、20、40)と協働する、駆動ユニット(12、37)と、
外部雰囲気領域(A)から前記プロセス雰囲気領域(P)を分離するための分離装置であって、前記駆動ユニット(12、37)が前記外部雰囲気領域(A)に少なくとも部分的に割り当てられ、前記継手(11、20、40)が特に前記プロセス雰囲気領域(P)に割り当てられる、分離装置と、を備え、
前記継手(11、20、40)が、コレット(24、44)と、前記コレット(24、44)と協働する係止素子(21、41)とを有し、
前記継手(11、20、40)が、前記能動素子(15、34)を受容するための受軸(Z)を画定し、
前記係止素子(21、41)が前記コレット(24、44)に対して、特に開位置まで及び閉位置まで変位可能であるように調整可能である相対位置変動のために、前記コレット(24、44)及び前記係止素子(21、41)が、軸方向に又は前記受軸(Z)に対して平行に配置され、
前記継手(11、20、40)が、前記開位置において前記コレット(24、44)の前記係止素子(21、41)との前記相互作用による開変更状態を提供し、前記閉位置において前記係止素子(21、41)による閉作用状態を提供する、真空調整装置。 - 前記開位置と前記閉位置との間での前記係止素子(21、41)の変化が、前記駆動ユニットによる前記継手(11、20、40)の軸方向の調整によって、ひいては前記コレット(24、44)又は前記係止素子(21、41)に対する軸方向移動制限が存在することによって、実現可能であるように、前記真空調整装置(10、30)が形成及び構成される、
請求項に記載1の真空調整装置(10、30)。 - 少なくとも1つの停止部素子(13、14、34、46)が設けられ、
前記少なくとも1つの停止部素子(13、14、34、46)が、前記係止素子(21、41)又は前記コレット(24、44)と協働するために配置及び形成される、
請求項1又は2に記載の真空調整装置(10、30)。 - 前記停止部素子(13、14、34、46)が、
前記真空調整装置(10、30)のハウジング(31)上に、前記真空調整装置(10、30)と協働する処理チャンバ(16)上に、若しくは前記能動素子(15、34)上に配置されるか、又は、
前記ハウジング(31)、前記処理チャンバ若しくは前記能動素子(15、34)によって形成される、
請求項3に記載の真空調整装置(10、30)。 - 前記係止素子(21、41)が、前記駆動ユニット(12、37)によってもたらされる前記継手(11、20、40)の移動による前記少なくとも1つの停止部素子(13、14、34、46)との協働によって前記開位置及び/又は閉位置に変位可能であるように、前記駆動ユニット(12、37)が形成される、
請求項3又は4に記載の真空調整装置(10、30)。 - 前記駆動ユニット(12、37)が、特定の全移動領域にわたる、前記受軸(Z)に沿った、又はそれと並行な前記継手(11、20、40)の線形軸方向移動のために設計され、
前記少なくとも1つの停止部素子(13、14、34、46)が、前記継手(11、20、40)の移動の一部として、前記係止素子(21、41)を調節するために前記全移動領域内に配置される、
請求項3〜5のいずれか1項に記載の真空調整装置(10、30)。 - 前記全移動領域が、第1及び第2の端位置によって、前記継手(11、20、40)に対して、特に前記コレット(24、44)に対して制限され、
前記開変更状態が、前記第1の端位置に存在し、
前記閉作用状態が、前記第2の端位置に存在し、
特に、
前記開変更状態が、前記継手(11、20、40)及び前記コレット(24、44)の前記第1の端位置への調整によって提供されることができ、
前記閉作用状態が、前記継手(11、20、40)及び前記コレット(24、44)の前記第2の端位置への調整によって提供されることができる、
請求項6に記載の真空調整装置(10、30)。 - 前記全移動領域にわたって、第1及び第2の作動ゾーンが画定され、
前記第1の端位置が前記第1の作動ゾーンを制限し、前記係止素子(21、41)が、前記第1の作動ゾーンにおいて、前記コレット(24、44)が実質的に半径方向に力をうけることなしに存在するように調整可能であり、
前記第2の端位置が、前記第2の作動ゾーンを制限し、前記係止素子(21、41)が、前記第2の作動ゾーンにおいて、前記コレット(24、44)が半径方向の力の作用を受けるように調整可能である、
請求項6又は7に記載の真空調整装置(10、30)。 - 前記継手(11、20、40)の前記通常位置及び前記能動位置が、前記全移動領域に関して、前記第1及び/又は前記第2の作動ゾーン内部の少なくとも一部に設けられる、請求項8に記載の真空調整装置(10、30)。
- 前記コレット(24、44)が、前記受軸(Z)を画定する、特に円筒形又は円錐形の内側コレット容器を有し、
前記コレット(24、44)が、前記受軸(Z)に沿って変動する外径を有する、半径方向にスロットが付けられたスリーブとして設計され、
前記係止素子(21、41)の内径が、前記コレット(24、44)の最大外径よりも小さく、
前記コレット(24、44)の前記外径が前記係止素子(21、41)の前記内径と連携し、前記係止素子(21、41)を前記受軸(Z)に沿って調整することによって、前記コレット(24、44)の内部に向かって半径方向に向けられる力が前記コレット(24、44)において生成されるように、コレット(24、44)及び係止素子(21、41)が配置される、
請求項1〜9のいずれか1項に記載の真空調整装置(10、30)。 - 前記分離装置が、前記駆動ユニット(12、37)のハウジング又はベローによって形成され、
及び/又は、
前記駆動ユニット(12、37)が、空気駆動型シリンダとして設計される、
請求項1〜10のいずれか1項に記載の真空調整装置(10、30)。 - 前記能動素子(15、34)が、支持ピン(15)として、又はバルブ閉鎖部(34)として形成される、
請求項1〜11のいずれか1項に記載の真空調整装置(10、30)。 - 前記真空調整装置(10、30)が、前記駆動ユニット(12、37)を制御するための制御ユニットを備え、
その実行において、前記継手(11、20、40)の前記軸方向位置が、前記開変更状態又は前記閉作用状態を提供するように可変であるように構成された保守機能性を、前記制御ユニットが有する、
請求項1〜12のいずれか1項に記載の真空調整装置(10、30)。 - 前記真空調整装置(10、30)が、真空処理チャンバによって提供されたプロセス雰囲気領域(P)内で処理される基板、特にウェーハの前記移動及び位置付けのためのピン引き上げ装置(10)、特にピンリフタとして形成され、特に複数の継手のうちの第1の継手として前記継手(11)を備え、
前記駆動ユニット(12)が、前記第1の継手(11)の線形移動性を少なくとも提供し、
前記能動位置が、前記ピン引き上げ装置に前記基板を装備するための装備位置によって形成され、
前記継手(11)が、前記基板に接触してそれを支持するように設計された支持ピン(15)を受容し、前記能動素子を形成するように設計される、
請求項1〜13のいずれか1項に記載の真空調整装置(10、30)。 - 前記真空調整装置(10、30)が、
体積流量又は質量流量を調節するための、及び/又は流路のガス密な遮断のための真空バルブ(30)、特に真空摺動バルブ、振り子バルブ又はモノバルブとして形成され、
開口軸(H)を画定するバルブ開口(32)と、前記バルブ開口(32)を包囲する第1のシール面(33)とを有するバルブシートと、
前記第1のシール面(33)に対応する第2のシール面(36)で、前記体積流量又は質量流量を調節するための、及び/又は前記流路を遮断するための前記能動素子(15、34)、特にバルブプレートを形成するバルブ閉鎖部(34)と、を有し、
前記バルブ閉鎖部(34)が、前記継手(40)によって前記駆動ユニット(37)に結合され、
それによって、前記バルブ閉鎖部(34)が、
通常位置としての開位置であって、前記真空バルブ(30)の前記バルブ閉鎖部及びバルブシートが、接触なしに互いに対して存在する開位置から、
能動位置としての閉位置であって、前記第1のシール面(33)と前記第2のシール面(36)との間のシール接触が、介在するシールを介して提供され、前記バルブ開口(32)が、ガス密の方法でシールされる閉位置との間で、再度戻るように調整可能であり、
前記継手(40)が、前記バルブ閉鎖部(34)を受容するように設計される、
請求項1〜13のいずれか1項に記載の真空調整装置(10、30)。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP17188778.9A EP3450809A1 (de) | 2017-08-31 | 2017-08-31 | Verstellvorrichtung mit spannzangenkupplung für den vakuumbereich |
EP17188778.9 | 2017-08-31 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2019083307A true JP2019083307A (ja) | 2019-05-30 |
JP2019083307A5 JP2019083307A5 (ja) | 2021-07-26 |
JP7222631B2 JP7222631B2 (ja) | 2023-02-15 |
Family
ID=59772429
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018159212A Active JP7222631B2 (ja) | 2017-08-31 | 2018-08-28 | 真空調整装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US10840124B2 (ja) |
EP (1) | EP3450809A1 (ja) |
JP (1) | JP7222631B2 (ja) |
KR (1) | KR102545005B1 (ja) |
CN (1) | CN109420893B (ja) |
TW (1) | TWI775929B (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11289355B2 (en) | 2017-06-02 | 2022-03-29 | Lam Research Corporation | Electrostatic chuck for use in semiconductor processing |
US11469084B2 (en) * | 2017-09-05 | 2022-10-11 | Lam Research Corporation | High temperature RF connection with integral thermal choke |
KR102655866B1 (ko) | 2018-01-31 | 2024-04-05 | 램 리써치 코포레이션 | 정전 척 (electrostatic chuck, ESC) 페데스탈 전압 분리 |
US11086233B2 (en) | 2018-03-20 | 2021-08-10 | Lam Research Corporation | Protective coating for electrostatic chucks |
WO2019185124A1 (de) * | 2018-03-27 | 2019-10-03 | Vat Holding Ag | Stifthubvorrichtung mit kupplung zum aufnehmen und lösen eines tragstifts |
DE102018129960A1 (de) * | 2018-11-27 | 2020-05-28 | Vat Holding Ag | Schleusenvorrichtung, Schleusensystem und Verfahren zu einem Betrieb einer Schleusenvorrichtung |
DE102019007194A1 (de) * | 2019-10-16 | 2021-04-22 | Vat Holding Ag | Verstellvorrichtung für den Vakuumbereich mit Druckmessfunktionalität |
DE102020120732A1 (de) | 2020-08-06 | 2022-02-10 | Vat Holding Ag | Stifthubvorrichtung |
CN113488370B (zh) * | 2021-07-06 | 2024-05-31 | 北京屹唐半导体科技股份有限公司 | 用于等离子体处理设备的升降销组件 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6153930U (ja) * | 1984-09-14 | 1986-04-11 | ||
JPH062677U (ja) * | 1992-06-04 | 1994-01-14 | 東京応化工業株式会社 | ホットプレート用リフトピン |
JP2002540624A (ja) * | 1999-03-30 | 2002-11-26 | ラム・リサーチ・コーポレーション | 外周でのウェーハ持ち上げ |
US6572708B2 (en) * | 2000-02-28 | 2003-06-03 | Applied Materials Inc. | Semiconductor wafer support lift-pin assembly |
US20030136341A1 (en) * | 2002-01-14 | 2003-07-24 | Sung-Min Na | Wafer lift pin for manufacturing a semiconductor device |
KR20070111900A (ko) * | 2006-05-19 | 2007-11-22 | 주식회사 아이피에스 | 진공처리장치의 리프트 핀 구동장치 |
JP2008112801A (ja) * | 2006-10-30 | 2008-05-15 | Dainippon Screen Mfg Co Ltd | ピンホルダおよび基板処理装置 |
JP2013128117A (ja) * | 2011-12-16 | 2013-06-27 | New Power Plasma Co Ltd | 両方向ゲートバルブ及びこれを備えた基板処理システム |
Family Cites Families (59)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US633852A (en) * | 1899-06-28 | 1899-09-26 | Frank B Kendrick | Tool-holder. |
US935977A (en) * | 1908-03-23 | 1909-10-05 | Henry W Haskell | Tool-holder. |
US1013438A (en) * | 1911-06-05 | 1912-01-02 | Henry S Post | Handle-attaching device. |
US1208846A (en) * | 1915-02-16 | 1916-12-19 | Ward J Sheldon | Fishing-tool for wells. |
US1849101A (en) * | 1926-08-02 | 1932-03-15 | Gerald R Livergood | Connection for pump plungers and the like |
US1667485A (en) * | 1927-08-25 | 1928-04-24 | Leo O Smith | Connecter |
US2179930A (en) * | 1937-09-10 | 1939-11-14 | George P Harrington | Hose coupling |
US2252767A (en) * | 1938-12-31 | 1941-08-19 | Pacific Pump Works | Standing valve puller |
US2670963A (en) * | 1950-11-02 | 1954-03-02 | Leonard C Osborn | Chuck |
US2784987A (en) * | 1954-02-03 | 1957-03-12 | Corcoran Richard Stanley | Pipe coupling with detent means |
US3145969A (en) | 1961-07-03 | 1964-08-25 | High Voltage Engineering Corp | Gate valve having fluid pressure seal and limit stop means |
US3172676A (en) * | 1962-03-07 | 1965-03-09 | Densco Inc | Collet chuck |
US3240520A (en) * | 1962-11-16 | 1966-03-15 | North American Aviation Inc | Quick releasing high strength connector |
US3171664A (en) * | 1962-12-14 | 1965-03-02 | Erickson Tool Co | Chuck |
DE1264191B (de) | 1963-01-15 | 1968-03-21 | Hochvakuum Appbau Emil Kammere | Absperrschieber |
US3790182A (en) * | 1972-06-05 | 1974-02-05 | Warner Swasey Co | Toolholder |
FR2283375A1 (fr) * | 1974-07-15 | 1976-03-26 | Commissariat Energie Atomique | Vanne a tiroir pour ultra-vide |
US3967847A (en) * | 1975-09-15 | 1976-07-06 | Anchor Hocking Corporation | Chuck apparatus for glass container coating line |
US4059883A (en) * | 1976-02-25 | 1977-11-29 | Milton English | Apparatus for removing an ignition key cylinder |
DE7731993U1 (de) | 1977-10-15 | 1978-01-26 | Emil Kammerer Kg, 5060 Bergisch Gladbach | Absperrschieber |
FR2516615A1 (fr) * | 1981-11-17 | 1983-05-20 | Jaeger | Dispositif d'accouplement de deux pieces |
JPS60136671A (ja) | 1983-12-26 | 1985-07-20 | Fuji Seikou Kk | ゲ−トバルブのシ−ル構造 |
GB2157786B (en) * | 1984-04-24 | 1988-09-01 | Salter & Co Ltd G | Retaining ring |
US4656727A (en) * | 1984-09-06 | 1987-04-14 | Kabushiki Kaisha Ito Seisakusho | Tool mounting and demounting device for changing tools of a drilling machine |
US4867463A (en) * | 1988-09-02 | 1989-09-19 | Eaton Leonard Technologies, Inc. | Quick release collet |
US4850734A (en) * | 1988-12-23 | 1989-07-25 | United Technologies Corporation | Coupling device for a machine tool |
US5215538A (en) * | 1992-02-05 | 1993-06-01 | Abbott Laboratories | Connector-activated in-line valve |
US5207130A (en) * | 1992-03-19 | 1993-05-04 | Payne Jerry A | Ratchet locking plier |
US5489225A (en) * | 1993-12-16 | 1996-02-06 | Ventritex, Inc. | Electrical terminal with a collet grip for a defibrillator |
AU1920695A (en) * | 1994-02-22 | 1995-09-04 | Confidence Tool Company | Socket wrench |
US5577707A (en) | 1995-12-18 | 1996-11-26 | Vat Holding Ag | Slide valve |
US5879128A (en) * | 1996-07-24 | 1999-03-09 | Applied Materials, Inc. | Lift pin and support pin apparatus for a processing chamber |
US6056472A (en) * | 1997-09-29 | 2000-05-02 | Latulippe; Michael Leo | Versatile coupling member for injection molding ejector system |
DE19746241C2 (de) | 1997-10-20 | 2000-05-31 | Vat Holding Ag Haag | Einrichtung zum Verschließen einer Öffnung |
US6213478B1 (en) * | 1999-03-11 | 2001-04-10 | Moore Epitaxial, Inc. | Holding mechanism for a susceptor in a substrate processing reactor |
US6089537A (en) | 1999-06-23 | 2000-07-18 | Mks Instruments, Inc. | Pendulum valve assembly |
US6629682B2 (en) | 2001-01-11 | 2003-10-07 | Vat Holding Ag | Vacuum valve |
US6416037B1 (en) | 2001-01-11 | 2002-07-09 | Vat Holding Ag | Vacuum pipe |
US6481723B1 (en) | 2001-03-30 | 2002-11-19 | Lam Research Corporation | Lift pin impact management |
US6646857B2 (en) | 2001-03-30 | 2003-11-11 | Lam Research Corporation | Semiconductor wafer lifting device and methods for implementing the same |
US7032882B2 (en) | 2003-09-29 | 2006-04-25 | Mks Instruments, Inc. | Valve assembly having novel flow characteristics |
CN1296878C (zh) | 2003-11-04 | 2007-01-24 | 爱德牌工程有限公司 | 平板显示器制造装置 |
US7718032B2 (en) * | 2006-06-22 | 2010-05-18 | Tokyo Electron Limited | Dry non-plasma treatment system and method of using |
US7988817B2 (en) * | 2006-11-10 | 2011-08-02 | Adp Engineering Co., Ltd. | Lift pin driving device and a flat panel display manufacturing apparatus having same |
US7750818B2 (en) * | 2006-11-29 | 2010-07-06 | Adp Engineering Co., Ltd. | System and method for introducing a substrate into a process chamber |
JP4824590B2 (ja) * | 2007-01-31 | 2011-11-30 | 東京エレクトロン株式会社 | 基板処理装置 |
DE102007034927A1 (de) | 2007-07-24 | 2009-02-05 | Vat Holding Ag | Verfahren zur Steuerung oder Regelung eines Vakuumventils |
US20090314211A1 (en) * | 2008-06-24 | 2009-12-24 | Applied Materials, Inc. | Big foot lift pin |
US8363378B2 (en) * | 2009-02-17 | 2013-01-29 | Intevac, Inc. | Method for optimized removal of wafer from electrostatic chuck |
JP5551420B2 (ja) * | 2009-12-04 | 2014-07-16 | 東京エレクトロン株式会社 | 基板処理装置及びその電極間距離の測定方法並びにプログラムを記憶する記憶媒体 |
DE102010005706A1 (de) * | 2010-01-26 | 2011-07-28 | Stryker Trauma Ag | Spannvorrichtung für chirurgische Elemente |
TWI362312B (en) * | 2011-04-19 | 2012-04-21 | Chung Taan Ind Co Ltd | Connecting rod |
JP5044725B1 (ja) * | 2012-04-27 | 2012-10-10 | 株式会社ブイテックス | シール材のつぶし量が制御可能なゲートバルブ |
US9321087B2 (en) * | 2013-09-10 | 2016-04-26 | TFL FSI, Inc. | Apparatus and method for scanning an object through a fluid spray |
KR102411747B1 (ko) * | 2013-10-30 | 2022-06-22 | 가부시키가이샤 니콘 | 기판 유지 장치, 노광 장치 및 디바이스 제조 방법 |
US10892180B2 (en) * | 2014-06-02 | 2021-01-12 | Applied Materials, Inc. | Lift pin assembly |
US9822901B2 (en) * | 2014-06-25 | 2017-11-21 | Ge Oil & Gas Pressure Control Lp | Actuator adapter for bonnet nub stem design |
US10490436B2 (en) * | 2015-11-04 | 2019-11-26 | Applied Materials, Inc. | Enhanced lift pin design to eliminate local thickness non-uniformity in teos oxide films |
US10332778B2 (en) * | 2015-11-11 | 2019-06-25 | Lam Research Corporation | Lift pin assembly and associated methods |
-
2017
- 2017-08-31 EP EP17188778.9A patent/EP3450809A1/de not_active Withdrawn
-
2018
- 2018-08-28 JP JP2018159212A patent/JP7222631B2/ja active Active
- 2018-08-29 TW TW107130043A patent/TWI775929B/zh active
- 2018-08-30 US US16/118,154 patent/US10840124B2/en active Active
- 2018-08-31 KR KR1020180103902A patent/KR102545005B1/ko active IP Right Grant
- 2018-08-31 CN CN201811009078.4A patent/CN109420893B/zh active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6153930U (ja) * | 1984-09-14 | 1986-04-11 | ||
JPH062677U (ja) * | 1992-06-04 | 1994-01-14 | 東京応化工業株式会社 | ホットプレート用リフトピン |
JP2002540624A (ja) * | 1999-03-30 | 2002-11-26 | ラム・リサーチ・コーポレーション | 外周でのウェーハ持ち上げ |
US6572708B2 (en) * | 2000-02-28 | 2003-06-03 | Applied Materials Inc. | Semiconductor wafer support lift-pin assembly |
US20030136341A1 (en) * | 2002-01-14 | 2003-07-24 | Sung-Min Na | Wafer lift pin for manufacturing a semiconductor device |
KR20070111900A (ko) * | 2006-05-19 | 2007-11-22 | 주식회사 아이피에스 | 진공처리장치의 리프트 핀 구동장치 |
JP2008112801A (ja) * | 2006-10-30 | 2008-05-15 | Dainippon Screen Mfg Co Ltd | ピンホルダおよび基板処理装置 |
JP2013128117A (ja) * | 2011-12-16 | 2013-06-27 | New Power Plasma Co Ltd | 両方向ゲートバルブ及びこれを備えた基板処理システム |
Also Published As
Publication number | Publication date |
---|---|
CN109420893B (zh) | 2022-06-17 |
EP3450809A1 (de) | 2019-03-06 |
TW201920864A (zh) | 2019-06-01 |
CN109420893A (zh) | 2019-03-05 |
US20190067076A1 (en) | 2019-02-28 |
JP7222631B2 (ja) | 2023-02-15 |
KR20190024851A (ko) | 2019-03-08 |
TWI775929B (zh) | 2022-09-01 |
KR102545005B1 (ko) | 2023-06-20 |
US10840124B2 (en) | 2020-11-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2019083307A (ja) | 動的靭帯バランシングシステム | |
KR102625920B1 (ko) | 자성 서셉터 대 베이스플레이트 시일 | |
JP2019083307A5 (ja) | 真空調整装置 | |
KR102178150B1 (ko) | 반도체 장비를 위한 밀봉 홈 방법 | |
TWI659174B (zh) | 封閉元件、真空閥、多功能器具以及製造有一真空閥之一密封件的一封閉元件之方法 | |
CN110291465B (zh) | 气动销举升装置和气动举升缸 | |
KR20090118088A (ko) | 슬릿 도어 밀봉 압력의 제어 장치 및 방법 | |
CN102171499B (zh) | 具有气密轴杆贯通部的真空阀 | |
US20080017117A1 (en) | Substrate support with adjustable lift and rotation mount | |
CN108700223B (zh) | 以两件式阀盘关闭流路的真空阀 | |
US20220415702A1 (en) | Semiconductor processing chamber with dual-lift mechanism for edge ring elevation management | |
JP7368460B2 (ja) | ピンリフトデバイス | |
US11530751B2 (en) | Closure mechanism vacuum chamber isolation device and sub-system | |
US20130269599A1 (en) | Methods and Apparatus for Continuous Pressure Control Processing | |
CN114555989B (zh) | 用于真空区的具有压力测量功能的调节装置 | |
US9520312B2 (en) | System and method for moving workpieces between multiple vacuum environments | |
US20220403953A1 (en) | Gas inlet valve for vacuum process chambers | |
TWI850482B (zh) | 具有壓力測量功能的真空範圍調整裝置 | |
TWI708131B (zh) | 具有多埠閥組件之電漿處理裝置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20210526 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20210526 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20220630 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20220726 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20221021 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20221214 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20230117 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20230203 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 7222631 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |