JP2019079961A5 - - Google Patents

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Publication number
JP2019079961A5
JP2019079961A5 JP2017206518A JP2017206518A JP2019079961A5 JP 2019079961 A5 JP2019079961 A5 JP 2019079961A5 JP 2017206518 A JP2017206518 A JP 2017206518A JP 2017206518 A JP2017206518 A JP 2017206518A JP 2019079961 A5 JP2019079961 A5 JP 2019079961A5
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JP
Japan
Prior art keywords
semiconductor processing
processing sheet
fixing tape
jig fixing
delamination
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2017206518A
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English (en)
Japanese (ja)
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JP2019079961A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2017206518A priority Critical patent/JP2019079961A/ja
Priority claimed from JP2017206518A external-priority patent/JP2019079961A/ja
Publication of JP2019079961A publication Critical patent/JP2019079961A/ja
Publication of JP2019079961A5 publication Critical patent/JP2019079961A5/ja
Pending legal-status Critical Current

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JP2017206518A 2017-10-25 2017-10-25 半導体加工用シート Pending JP2019079961A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2017206518A JP2019079961A (ja) 2017-10-25 2017-10-25 半導体加工用シート

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017206518A JP2019079961A (ja) 2017-10-25 2017-10-25 半導体加工用シート

Publications (2)

Publication Number Publication Date
JP2019079961A JP2019079961A (ja) 2019-05-23
JP2019079961A5 true JP2019079961A5 (enExample) 2020-12-03

Family

ID=66628912

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017206518A Pending JP2019079961A (ja) 2017-10-25 2017-10-25 半導体加工用シート

Country Status (1)

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JP (1) JP2019079961A (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7465099B2 (ja) * 2020-02-06 2024-04-10 リンテック株式会社 保護膜形成用複合シート、及び保護膜付きチップの製造方法
JP2022146907A (ja) * 2021-03-22 2022-10-05 リンテック株式会社 治具固定用粘着シート、保護膜形成用複合シート、及び保護膜付きチップの製造方法
JP7114013B1 (ja) * 2021-03-22 2022-08-05 リンテック株式会社 治具固定用粘着シート、保護膜形成用複合シート、及び保護膜付きチップの製造方法
WO2024161720A1 (ja) * 2023-02-02 2024-08-08 リンテック株式会社 ワーク加工用シートおよびその製造方法
CN119452453A (zh) * 2023-02-02 2025-02-14 琳得科株式会社 工件加工用片

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008066336A (ja) * 2006-09-04 2008-03-21 Lintec Corp ウエハ加工用シート
JP6129705B2 (ja) * 2013-09-27 2017-05-17 リンテック株式会社 半導体加工用粘着シートおよび半導体装置の製造方法
SG11201609543VA (en) * 2014-05-23 2016-12-29 Lintec Corp Composite sheet for forming protective film

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