JP2019075520A5 - - Google Patents

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Publication number
JP2019075520A5
JP2019075520A5 JP2017202620A JP2017202620A JP2019075520A5 JP 2019075520 A5 JP2019075520 A5 JP 2019075520A5 JP 2017202620 A JP2017202620 A JP 2017202620A JP 2017202620 A JP2017202620 A JP 2017202620A JP 2019075520 A5 JP2019075520 A5 JP 2019075520A5
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Japan
Prior art keywords
fluid
supply
supply amount
predetermined period
lapse
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JP2017202620A
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English (en)
Japanese (ja)
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JP7141204B2 (ja
JP2019075520A (ja
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Priority to JP2017202620A priority Critical patent/JP7141204B2/ja
Priority claimed from JP2017202620A external-priority patent/JP7141204B2/ja
Priority to SG10201808877SA priority patent/SG10201808877SA/en
Priority to US16/162,914 priority patent/US11667007B2/en
Publication of JP2019075520A publication Critical patent/JP2019075520A/ja
Publication of JP2019075520A5 publication Critical patent/JP2019075520A5/ja
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Publication of JP7141204B2 publication Critical patent/JP7141204B2/ja
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JP2017202620A 2017-10-19 2017-10-19 研磨装置、及び研磨方法 Active JP7141204B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2017202620A JP7141204B2 (ja) 2017-10-19 2017-10-19 研磨装置、及び研磨方法
SG10201808877SA SG10201808877SA (en) 2017-10-19 2018-10-09 Polishing apparatus and polishing method
US16/162,914 US11667007B2 (en) 2017-10-19 2018-10-17 Polishing apparatus and polishing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017202620A JP7141204B2 (ja) 2017-10-19 2017-10-19 研磨装置、及び研磨方法

Publications (3)

Publication Number Publication Date
JP2019075520A JP2019075520A (ja) 2019-05-16
JP2019075520A5 true JP2019075520A5 (enExample) 2020-11-26
JP7141204B2 JP7141204B2 (ja) 2022-09-22

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ID=66170423

Family Applications (1)

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JP2017202620A Active JP7141204B2 (ja) 2017-10-19 2017-10-19 研磨装置、及び研磨方法

Country Status (3)

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US (1) US11667007B2 (enExample)
JP (1) JP7141204B2 (enExample)
SG (1) SG10201808877SA (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6357260B2 (ja) * 2016-09-30 2018-07-11 株式会社荏原製作所 研磨装置、及び研磨方法
US20200306927A1 (en) 2019-03-29 2020-10-01 Saint Gobain Abrasives, Inc. Performance Grinding Solutions
US12226876B2 (en) 2019-04-03 2025-02-18 Saint-Gobain Abrasives, Inc. Abrasive article, abrasive system and method for using and forming same
JP7519804B2 (ja) * 2020-04-27 2024-07-22 株式会社ディスコ 加工装置
US20250262713A1 (en) * 2024-02-20 2025-08-21 Applied Materials, Inc. Processing of signals from an in-situ monitoring system in chemical mechanical polishing

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6399501B2 (en) 1999-12-13 2002-06-04 Applied Materials, Inc. Method and apparatus for detecting polishing endpoint with optical monitoring
US7101257B2 (en) 2003-05-21 2006-09-05 Ebara Corporation Substrate polishing apparatus
EP1758711B1 (en) 2004-06-21 2013-08-07 Ebara Corporation Polishing apparatus and polishing method
WO2008044786A1 (fr) 2006-10-06 2008-04-17 Ebara Corporation Procédé de detection de point de fin d'usinage, procédé de rectification, et rectifieuse
JP5415735B2 (ja) * 2008-09-26 2014-02-12 株式会社荏原製作所 ドレッシング方法、ドレッシング条件の決定方法、ドレッシング条件決定プログラム、および研磨装置
JP5340795B2 (ja) 2009-04-27 2013-11-13 株式会社荏原製作所 研磨方法及び研磨装置
JP5730747B2 (ja) 2010-12-10 2015-06-10 株式会社荏原製作所 渦電流センサ並びに研磨方法および装置

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