JP2019070179A5 - - Google Patents

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Publication number
JP2019070179A5
JP2019070179A5 JP2017196464A JP2017196464A JP2019070179A5 JP 2019070179 A5 JP2019070179 A5 JP 2019070179A5 JP 2017196464 A JP2017196464 A JP 2017196464A JP 2017196464 A JP2017196464 A JP 2017196464A JP 2019070179 A5 JP2019070179 A5 JP 2019070179A5
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JP
Japan
Prior art keywords
forming method
film forming
group
periodic table
raw material
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Application number
JP2017196464A
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English (en)
Japanese (ja)
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JP7023445B2 (ja
JP2019070179A (ja
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Priority to JP2017196464A priority Critical patent/JP7023445B2/ja
Priority claimed from JP2017196464A external-priority patent/JP7023445B2/ja
Priority to CN201811147185.3A priority patent/CN109628910B/zh
Priority to US16/151,461 priority patent/US10927458B2/en
Publication of JP2019070179A publication Critical patent/JP2019070179A/ja
Publication of JP2019070179A5 publication Critical patent/JP2019070179A5/ja
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Publication of JP7023445B2 publication Critical patent/JP7023445B2/ja
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JP2017196464A 2017-10-07 2017-10-07 成膜方法 Active JP7023445B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2017196464A JP7023445B2 (ja) 2017-10-07 2017-10-07 成膜方法
CN201811147185.3A CN109628910B (zh) 2017-10-07 2018-09-29 形成膜的方法
US16/151,461 US10927458B2 (en) 2017-10-07 2018-10-04 Method of forming film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017196464A JP7023445B2 (ja) 2017-10-07 2017-10-07 成膜方法

Publications (3)

Publication Number Publication Date
JP2019070179A JP2019070179A (ja) 2019-05-09
JP2019070179A5 true JP2019070179A5 (zh) 2020-11-19
JP7023445B2 JP7023445B2 (ja) 2022-02-22

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ID=66441860

Family Applications (1)

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JP2017196464A Active JP7023445B2 (ja) 2017-10-07 2017-10-07 成膜方法

Country Status (1)

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JP (1) JP7023445B2 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021210350A1 (ja) * 2020-04-13 2021-10-21 信越化学工業株式会社 成膜装置及び成膜方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4975299A (en) * 1989-11-02 1990-12-04 Eastman Kodak Company Vapor deposition process for depositing an organo-metallic compound layer on a substrate
JPH05345983A (ja) * 1991-06-18 1993-12-27 Denki Kagaku Kogyo Kk 耐食性金属部材
JP2008120654A (ja) * 2006-11-15 2008-05-29 Nihon Ceratec Co Ltd セラミックコーティング部材およびその製造方法
FI20105719A0 (fi) * 2010-06-21 2010-06-21 Beneq Oy Pinnoituslaite
WO2013192220A1 (en) * 2012-06-18 2013-12-27 University Of Florida Research Foundation, Inc. Tungsten nitrido precursors for the cvd of tungsten nitride, carbonitride, and oxide films
JP2014043640A (ja) * 2012-07-31 2014-03-13 Tosoh Corp ケイ素含有薄膜の製造方法及びケイ素含有薄膜
JP6916426B2 (ja) * 2014-09-02 2021-08-11 株式会社Flosfia 積層構造体およびその製造方法、半導体装置ならびに結晶膜
JP6613520B2 (ja) * 2015-03-30 2019-12-04 株式会社Flosfia 霧化装置および成膜装置
WO2016191199A1 (en) * 2015-05-22 2016-12-01 Dow Corning Corporation Diisopropylaminopentachlorodisilane
TWI754626B (zh) * 2015-12-18 2022-02-11 中國大陸商南大光電半導體材料有限公司 高純度三矽烷胺、製造方法、及用途

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