JP2019068265A5 - - Google Patents
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- JP2019068265A5 JP2019068265A5 JP2017192050A JP2017192050A JP2019068265A5 JP 2019068265 A5 JP2019068265 A5 JP 2019068265A5 JP 2017192050 A JP2017192050 A JP 2017192050A JP 2017192050 A JP2017192050 A JP 2017192050A JP 2019068265 A5 JP2019068265 A5 JP 2019068265A5
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Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017192050A JP6991816B2 (ja) | 2017-09-29 | 2017-09-29 | 半導体装置および機器 |
| US16/142,651 US10674106B2 (en) | 2017-09-29 | 2018-09-26 | Semiconductor apparatus and equipment |
| CN201811143651.0A CN109585475B (zh) | 2017-09-29 | 2018-09-29 | 半导体装置和器械 |
| US16/851,854 US11108986B2 (en) | 2017-09-29 | 2020-04-17 | Semiconductor apparatus and equipment |
| US17/393,835 US11528445B2 (en) | 2017-09-29 | 2021-08-04 | Semiconductor apparatus and equipment |
| JP2021199256A JP7293323B2 (ja) | 2017-09-29 | 2021-12-08 | 半導体装置および機器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017192050A JP6991816B2 (ja) | 2017-09-29 | 2017-09-29 | 半導体装置および機器 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021199256A Division JP7293323B2 (ja) | 2017-09-29 | 2021-12-08 | 半導体装置および機器 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019068265A JP2019068265A (ja) | 2019-04-25 |
| JP2019068265A5 true JP2019068265A5 (enExample) | 2021-06-10 |
| JP6991816B2 JP6991816B2 (ja) | 2022-01-13 |
Family
ID=65898112
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017192050A Active JP6991816B2 (ja) | 2017-09-29 | 2017-09-29 | 半導体装置および機器 |
Country Status (3)
| Country | Link |
|---|---|
| US (3) | US10674106B2 (enExample) |
| JP (1) | JP6991816B2 (enExample) |
| CN (1) | CN109585475B (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6991816B2 (ja) * | 2017-09-29 | 2022-01-13 | キヤノン株式会社 | 半導体装置および機器 |
| JP7102119B2 (ja) * | 2017-09-29 | 2022-07-19 | キヤノン株式会社 | 半導体装置および機器 |
| JP6957559B2 (ja) * | 2019-06-24 | 2021-11-02 | キヤノン株式会社 | 半導体装置および機器 |
| US20210305303A1 (en) * | 2020-03-31 | 2021-09-30 | Canon Kabushiki Kaisha | Photoelectric conversion apparatus, photoelectric conversion system, and moving object |
| CN113078174B (zh) * | 2021-04-13 | 2022-08-12 | 厦门天马微电子有限公司 | 阵列基板、显示面板及显示装置 |
| JPWO2022270158A1 (enExample) * | 2021-06-22 | 2022-12-29 | ||
| US12096138B2 (en) | 2022-12-20 | 2024-09-17 | Caeleste Cvba | Quasi-global shutter for image sensors |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4349232B2 (ja) | 2004-07-30 | 2009-10-21 | ソニー株式会社 | 半導体モジュール及びｍｏｓ型固体撮像装置 |
| TWI429066B (zh) | 2005-06-02 | 2014-03-01 | 新力股份有限公司 | Semiconductor image sensor module and manufacturing method thereof |
| US8106474B2 (en) * | 2008-04-18 | 2012-01-31 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| ATE543215T1 (de) * | 2009-03-24 | 2012-02-15 | Sony Corp | Festkörper-abbildungsvorrichtung, ansteuerverfahren für festkörper- abbildungsvorrichtung und elektronische vorrichtung |
| US20100270668A1 (en) * | 2009-04-28 | 2010-10-28 | Wafer-Level Packaging Portfolio Llc | Dual Interconnection in Stacked Memory and Controller Module |
| JP5633323B2 (ja) * | 2010-11-11 | 2014-12-03 | ソニー株式会社 | 固体撮像装置及び電子機器 |
| CA2835870A1 (en) | 2011-05-12 | 2012-11-15 | Olive Medical Corporation | Pixel array area optimization using stacking scheme for hybrid image sensor with minimal vertical interconnects |
| JP5791571B2 (ja) | 2011-08-02 | 2015-10-07 | キヤノン株式会社 | 撮像素子及び撮像装置 |
| US8890047B2 (en) | 2011-09-21 | 2014-11-18 | Aptina Imaging Corporation | Stacked-chip imaging systems |
| US9185307B2 (en) * | 2012-02-21 | 2015-11-10 | Semiconductor Components Industries, Llc | Detecting transient signals using stacked-chip imaging systems |
| US9165968B2 (en) * | 2012-09-14 | 2015-10-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | 3D-stacked backside illuminated image sensor and method of making the same |
| CN103730455B (zh) * | 2012-10-16 | 2017-04-12 | 豪威科技股份有限公司 | 底部芯片上具有光敏电路元件的堆叠芯片图像传感器 |
| WO2014109044A1 (ja) * | 2013-01-11 | 2014-07-17 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| CN105308747B (zh) * | 2013-06-11 | 2018-07-17 | 拉姆伯斯公司 | 分离栅极有条件重置的图像传感器 |
| JP6463944B2 (ja) * | 2013-11-25 | 2019-02-06 | キヤノン株式会社 | 撮像素子、撮像装置及び携帯電話機 |
| JP2016058532A (ja) | 2014-09-09 | 2016-04-21 | ソニー株式会社 | 固体撮像素子、並びに、電子機器 |
| JP6520036B2 (ja) | 2014-09-30 | 2019-05-29 | 株式会社ニコン | 電子機器 |
| JP2016171375A (ja) | 2015-03-11 | 2016-09-23 | 株式会社東芝 | 固体撮像装置 |
| JP2016171399A (ja) | 2015-03-11 | 2016-09-23 | 株式会社東芝 | 固体撮像装置 |
| JP2016171455A (ja) | 2015-03-12 | 2016-09-23 | 株式会社東芝 | 固体撮像装置 |
| JP6651720B2 (ja) | 2015-07-10 | 2020-02-19 | 株式会社ニコン | 撮像素子および撮像装置 |
| KR102423813B1 (ko) * | 2015-11-27 | 2022-07-22 | 삼성전자주식회사 | 반도체 소자 |
| JP2017123381A (ja) * | 2016-01-06 | 2017-07-13 | ソニー株式会社 | 固体撮像素子、固体撮像素子の駆動方法、及び、電子機器 |
| JP6991816B2 (ja) * | 2017-09-29 | 2022-01-13 | キヤノン株式会社 | 半導体装置および機器 |
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2017
- 2017-09-29 JP JP2017192050A patent/JP6991816B2/ja active Active
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2018
- 2018-09-26 US US16/142,651 patent/US10674106B2/en active Active
- 2018-09-29 CN CN201811143651.0A patent/CN109585475B/zh active Active
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2020
- 2020-04-17 US US16/851,854 patent/US11108986B2/en active Active
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2021
- 2021-08-04 US US17/393,835 patent/US11528445B2/en active Active