JP2019068265A5 - - Google Patents

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Publication number
JP2019068265A5
JP2019068265A5 JP2017192050A JP2017192050A JP2019068265A5 JP 2019068265 A5 JP2019068265 A5 JP 2019068265A5 JP 2017192050 A JP2017192050 A JP 2017192050A JP 2017192050 A JP2017192050 A JP 2017192050A JP 2019068265 A5 JP2019068265 A5 JP 2019068265A5
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JP
Japan
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circuits
row
column
pixel
electric
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JP2017192050A
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English (en)
Japanese (ja)
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JP2019068265A (ja
JP6991816B2 (ja
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Priority claimed from JP2017192050A external-priority patent/JP6991816B2/ja
Priority to JP2017192050A priority Critical patent/JP6991816B2/ja
Application filed filed Critical
Priority to US16/142,651 priority patent/US10674106B2/en
Priority to CN201811143651.0A priority patent/CN109585475B/zh
Publication of JP2019068265A publication Critical patent/JP2019068265A/ja
Priority to US16/851,854 priority patent/US11108986B2/en
Publication of JP2019068265A5 publication Critical patent/JP2019068265A5/ja
Priority to US17/393,835 priority patent/US11528445B2/en
Priority to JP2021199256A priority patent/JP7293323B2/ja
Publication of JP6991816B2 publication Critical patent/JP6991816B2/ja
Application granted granted Critical
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JP2017192050A 2017-09-29 2017-09-29 半導体装置および機器 Active JP6991816B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2017192050A JP6991816B2 (ja) 2017-09-29 2017-09-29 半導体装置および機器
US16/142,651 US10674106B2 (en) 2017-09-29 2018-09-26 Semiconductor apparatus and equipment
CN201811143651.0A CN109585475B (zh) 2017-09-29 2018-09-29 半导体装置和器械
US16/851,854 US11108986B2 (en) 2017-09-29 2020-04-17 Semiconductor apparatus and equipment
US17/393,835 US11528445B2 (en) 2017-09-29 2021-08-04 Semiconductor apparatus and equipment
JP2021199256A JP7293323B2 (ja) 2017-09-29 2021-12-08 半導体装置および機器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017192050A JP6991816B2 (ja) 2017-09-29 2017-09-29 半導体装置および機器

Related Child Applications (1)

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JP2021199256A Division JP7293323B2 (ja) 2017-09-29 2021-12-08 半導体装置および機器

Publications (3)

Publication Number Publication Date
JP2019068265A JP2019068265A (ja) 2019-04-25
JP2019068265A5 true JP2019068265A5 (OSRAM) 2021-06-10
JP6991816B2 JP6991816B2 (ja) 2022-01-13

Family

ID=65898112

Family Applications (1)

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JP2017192050A Active JP6991816B2 (ja) 2017-09-29 2017-09-29 半導体装置および機器

Country Status (3)

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US (3) US10674106B2 (OSRAM)
JP (1) JP6991816B2 (OSRAM)
CN (1) CN109585475B (OSRAM)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7102119B2 (ja) * 2017-09-29 2022-07-19 キヤノン株式会社 半導体装置および機器
JP6991816B2 (ja) * 2017-09-29 2022-01-13 キヤノン株式会社 半導体装置および機器
JP6957559B2 (ja) 2019-06-24 2021-11-02 キヤノン株式会社 半導体装置および機器
US20210305303A1 (en) 2020-03-31 2021-09-30 Canon Kabushiki Kaisha Photoelectric conversion apparatus, photoelectric conversion system, and moving object
CN113078174B (zh) * 2021-04-13 2022-08-12 厦门天马微电子有限公司 阵列基板、显示面板及显示装置
CN117529932A (zh) * 2021-06-22 2024-02-06 新唐科技日本株式会社 固体摄像装置及摄像装置
US12096138B2 (en) 2022-12-20 2024-09-17 Caeleste Cvba Quasi-global shutter for image sensors

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Publication number Priority date Publication date Assignee Title
JP4349232B2 (ja) 2004-07-30 2009-10-21 ソニー株式会社 半導体モジュール及びｍｏｓ型固体撮像装置
TWI429066B (zh) 2005-06-02 2014-03-01 新力股份有限公司 Semiconductor image sensor module and manufacturing method thereof
US8106474B2 (en) * 2008-04-18 2012-01-31 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
ATE543215T1 (de) * 2009-03-24 2012-02-15 Sony Corp Festkörper-abbildungsvorrichtung, ansteuerverfahren für festkörper- abbildungsvorrichtung und elektronische vorrichtung
US20100270668A1 (en) * 2009-04-28 2010-10-28 Wafer-Level Packaging Portfolio Llc Dual Interconnection in Stacked Memory and Controller Module
JP5633323B2 (ja) 2010-11-11 2014-12-03 ソニー株式会社 固体撮像装置及び電子機器
CN103648378B (zh) 2011-05-12 2016-10-12 橄榄医疗公司 用于使用竖直互连的混合堆叠图像传感器的子列并行数字转换器的系统和方法
JP5791571B2 (ja) 2011-08-02 2015-10-07 キヤノン株式会社 撮像素子及び撮像装置
US8890047B2 (en) 2011-09-21 2014-11-18 Aptina Imaging Corporation Stacked-chip imaging systems
US9185307B2 (en) * 2012-02-21 2015-11-10 Semiconductor Components Industries, Llc Detecting transient signals using stacked-chip imaging systems
US9165968B2 (en) * 2012-09-14 2015-10-20 Taiwan Semiconductor Manufacturing Co., Ltd. 3D-stacked backside illuminated image sensor and method of making the same
CN103730455B (zh) * 2012-10-16 2017-04-12 豪威科技股份有限公司 底部芯片上具有光敏电路元件的堆叠芯片图像传感器
WO2014109044A1 (ja) 2013-01-11 2014-07-17 ルネサスエレクトロニクス株式会社 半導体装置
KR102212100B1 (ko) * 2013-06-11 2021-02-03 램버스 인코포레이티드 분할-게이트 조건부-재설정 이미지 센서
JP6463944B2 (ja) 2013-11-25 2019-02-06 キヤノン株式会社 撮像素子、撮像装置及び携帯電話機
JP2016058532A (ja) 2014-09-09 2016-04-21 ソニー株式会社 固体撮像素子、並びに、電子機器
JP6520036B2 (ja) 2014-09-30 2019-05-29 株式会社ニコン 電子機器
JP2016171375A (ja) 2015-03-11 2016-09-23 株式会社東芝 固体撮像装置
JP2016171399A (ja) 2015-03-11 2016-09-23 株式会社東芝 固体撮像装置
JP2016171455A (ja) 2015-03-12 2016-09-23 株式会社東芝 固体撮像装置
JP6651720B2 (ja) 2015-07-10 2020-02-19 株式会社ニコン 撮像素子および撮像装置
KR102423813B1 (ko) * 2015-11-27 2022-07-22 삼성전자주식회사 반도체 소자
JP2017123381A (ja) 2016-01-06 2017-07-13 ソニー株式会社 固体撮像素子、固体撮像素子の駆動方法、及び、電子機器
JP6991816B2 (ja) * 2017-09-29 2022-01-13 キヤノン株式会社 半導体装置および機器

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