JP2019065226A - Curable resin composition, electronic part device and method for manufacturing electronic part device - Google Patents

Abstract

To provide a curable resin composition excellent in controllability of warpage of a package, and an electronic part device obtained using the same and a method for manufacturing an electronic part device.SOLUTION: A curable resin composition contains a curable resin component, triphenylphosphine oxide and a filler, where the filler contains cristobalite.SELECTED DRAWING: None

Description

  The present invention relates to a curable resin composition, an electronic component device, and a method of manufacturing the electronic component device.

  2. Description of the Related Art Conventionally, a package (electronic component device) in which elements such as a transistor and an IC are sealed with a sealing material containing a curable resin such as an epoxy resin has been widely used in electronic devices.

  In recent years, in order to cope with the downsizing and weight reduction of electronic devices, thinning of electronic component devices has been advanced. Along with this, warpage of the electronic component device due to the difference between the thermal expansion coefficients of the sealing material and the substrate is apt to occur. Therefore, the composition of the sealing material has been studied from the viewpoint of reducing the amount of warpage of the electronic component device (for example, see Patent Document 1).

JP, 2005-29641, A

  A so-called PoP (Package on Package) electronic component device in which a package for sealing a memory chip is disposed on a package for sealing an application processor usually has a state in which a bonding member such as a solder ball is disposed between the packages. The package is heated to melt the bonding member, and the package is bonded and manufactured. At this time, the lower package and the upper package may show different warpage behavior under the temperature condition at the time of bonding, and sufficient bonding may not be obtained. For this reason, it may be desirable to control the state of warpage of the other package in accordance with the state of warpage of one package instead of simply suppressing the warpage of the package.

  An object of the present invention is to provide a curable resin composition excellent in controllability of package warpage, and an electronic component device and an electronic component device manufacturing method obtained using the curable resin composition, in view of the above circumstances.

Means for solving the above problems include the following embodiments.
The curable resin composition which contains a <1> curable resin component, a triphenyl phosphine oxide, and a filler, and the said filler contains cristobalite.
<2> The curable resin composition according to <1>, wherein the curable resin component contains an epoxy resin and a curing agent.
The curable resin composition as described in <1> or <2> which is a sealing material of a <3> electronic component apparatus.
The curable resin composition according to any one of <1> to <3>, which is a sealing material used for producing at least one of the two or more packages in an electronic component device including the <4> two or more packages. object.
The electronic component apparatus provided with the package containing the hardened | cured material of the curable resin composition of any one of <5><1>-<4>.
The electronic component apparatus as described in <5> provided with the 1st package containing the hardened | cured material of the <6> above-mentioned curable resin composition, and a 2nd package.
The process of joining the 1st package containing the hardened | cured material of the curable resin composition of any one of <7><1>-<4>, and a 2nd package, The said joining is said The manufacturing method of the electronic component apparatus performed on the conditions which the state of curvature of a 1st package and the state of curvature of a said 2nd package correspond.

  ADVANTAGE OF THE INVENTION According to this invention, the curable resin composition which is excellent in the controllability of the curvature of a package, and the manufacturing method of the electronic component apparatus obtained by using this, and an electronic component apparatus are provided.

  Hereinafter, modes for carrying out the present invention will be described in detail. However, the present invention is not limited to the following embodiments. In the following embodiments, the constituent elements (including element steps and the like) are not essential unless otherwise specified. The same applies to numerical values and ranges thereof, and does not limit the present invention.

In the present disclosure, the term “step” includes, in addition to steps independent of other steps, such steps as long as the purpose of the step is achieved even if it can not be clearly distinguished from other steps. .
In the numerical value range indicated by using “to” in the present disclosure, the numerical values described before and after “to” are included as the minimum value and the maximum value, respectively.
The upper limit value or the lower limit value described in one numerical value range may be replaced with the upper limit value or the lower limit value of the other stepwise description numerical value range in the numerical value range described stepwise in the present disclosure. . In addition, in the numerical range described in the present disclosure, the upper limit value or the lower limit value of the numerical range may be replaced with the value shown in the example.
In the present disclosure, each component may contain a plurality of corresponding substances. When a plurality of substances corresponding to each component are present in the composition, the content or content of each component is the total content or content of the plurality of substances present in the composition unless otherwise specified. Means quantity.
In the present disclosure, particles corresponding to each component may contain a plurality of types. When there are a plurality of particles corresponding to each component in the composition, the particle diameter of each component means the value for the mixture of the plurality of particles present in the composition unless otherwise specified.

<Curable resin composition>
The curable resin composition of the present disclosure is a curable resin composition containing a curable resin component, triphenylphosphine oxide, and a filler, and the filler contains cristobalite.

  In the curable resin composition used as a sealing material for a package of an electronic component device, the use of triphenylphosphine oxide as a substitute component of a halogen-containing flame retardant such as bromoantimony under the demand for halogen-free conversion It is being considered.

  A package sealed with a curable resin composition containing triphenylphosphine oxide has a smile-type warpage (warping which becomes convex downward) under high temperature conditions (for example, 230 ° C. or higher) during bonding. It became clear by examination of the present inventors that it is easy to produce. It is presumed that this is because triphenyl phosphine oxide acts as a plasticizer in the curable resin composition.

  When a curable resin composition which is likely to cause a smile-type warp under high temperature conditions is used to seal the package, for example, in the case of bonding to another package in a PoP type electronic component device, the other package is cry at the time of bonding. When the mold is warped (warped to be convex upward), the warped state of the packages does not match, and there is a possibility that good bonding can not be obtained.

  In the present disclosure, by using a curable resin composition containing cristobalite in addition to triphenyl phosphine oxide, it is possible to produce a warpage of cry type in the produced package. Therefore, it is possible to achieve good bonding with a package that causes warpage of the cry type at the time of bonding. It is not always clear why the package made with a curable resin composition containing cristobalite in addition to triphenylphosphine oxide causes warping of the cry type, but cristobalite under high temperature conditions (230 ° C to 240 ° C) It is considered that the expansion coefficient is increased by the occurrence of phase transition, and the property of triphenylphosphine oxide is offset by this property.

The content of cristobalite contained in the curable resin composition is not particularly limited, and the desired state of warpage of the package sealed with the curable resin composition, other components contained in the curable resin composition It can be set according to the content rate etc.
From the viewpoint of sufficiently obtaining the effect of controlling the warpage of the package, the cristobalite content is preferably 2% by mass or more, more preferably 4% by mass or more, and more preferably 6% by mass of the entire curable resin composition. It is more preferable that it is more than.

  The proportion of cristobalite in the filler is not particularly limited, but from the viewpoint of the balance of the properties of the curable resin composition, the proportion of cristobalite in the entire filler is preferably 2% by mass or more.

  From the viewpoint of preventing soft errors when applied to a memory package, the cristobalite contained in the curable resin composition preferably has an α dose of 5 ppb or less. By combining cristobalite with an alpha dose of 5 ppb or less and other fillers with a small alpha dose, it is possible to effectively prevent soft errors in the electronic component device due to the emission of alpha rays from the curable resin composition. The alpha dose of cristobalite can be measured, for example, by a Geiger counter.

The content of triphenylphosphine oxide contained in the curable resin composition is not particularly limited, and it depends on the degree of desired performance such as flame retardancy, the content of other components contained in the curable resin composition, etc. It can be set.
From the viewpoint of sufficiently obtaining the flame retardant effect, the content of triphenylphosphine oxide is preferably 0.2% by mass or more, and more preferably 0.3% by mass or more of the entire curable resin composition. More preferably, it is 0.5% by mass or more.
From the viewpoint of the balance with other components contained in the curable resin composition, the content of triphenylphosphine oxide is preferably 3.0% by mass or less of the entire curable resin composition, and 2.0 mass % Or less is more preferable, and 1.0% by mass or less is more preferable.

  The curable resin composition may be solid or liquid. Examples of the shape when the curable resin composition is solid include powder, tablet and the like. From the viewpoint of handleability, the curable resin composition is preferably solid at the time of use, and more preferably powdery.

(Curable resin component)
The kind in particular of the curable resin component contained in curable resin composition is not restrict | limited. From the viewpoint of the balance of various properties as a sealing material, a combination of an epoxy resin and a curing agent is preferable.

  The type of epoxy resin is not particularly limited, and can be selected according to the desired properties of the curable resin composition. Specifically, the epoxy resin is at least one selected from the group consisting of phenol compounds such as phenol, cresol, xylenol, resorcine, catechol, bisphenol A, bisphenol F and naphthol compounds such as α-naphthol, β-naphthol and dihydroxynaphthalene. Novolak type epoxy resin (phenol novolac type epoxy resin) which is obtained by epoxidizing a novolac resin obtained by condensation or cocondensation of a phenolic compound of the type with an aliphatic aldehyde compound such as formaldehyde, acetaldehyde or propionaldehyde under acidic catalyst Epoxy resin, ortho cresol novolac epoxy resin, etc.); condensation of the above-mentioned phenolic compound with an aromatic aldehyde compound such as benzaldehyde or salicylaldehyde under an acidic catalyst Is a triphenylmethane type epoxy resin obtained by epoxidizing a triphenylmethane type phenol resin obtained by cocondensation; a novolak obtained by cocondensing the above-mentioned phenol compound and naphthol compound with an aldehyde compound under an acidic catalyst Copolymer-type epoxy resin which is obtained by epoxidizing resin; diphenylmethane-type epoxy resin which is diglycidyl ether such as bisphenol A and bisphenol F; biphenyl-type epoxy resin which is diglycidyl ether of alkyl-substituted or unsubstituted biphenol; stilbene Stilbene type epoxy resin which is a diglycidyl ether of a phenolic compound; sulfur atom-containing epoxy resin which is a diglycidyl ether such as bisphenol S; butanediol, polyethylene glycol, polypropylene Epoxy resins which are glycidyl ethers of alcohols such as glycols; glycidyl ester type epoxy resins which are glycidyl esters of polyvalent carboxylic acid compounds such as phthalic acid, isophthalic acid and tetrahydrophthalic acid; nitrogen such as aniline, diaminodiphenylmethane and isocyanuric acid A glycidyl amine type epoxy resin in which active hydrogen bonded to an atom is substituted with a glycidyl group; a dicyclopentadiene type epoxy resin in which a co-condensed resin of dicyclopentadiene and a phenol compound is epoxidized; Vinylcyclohexene diepoxide which is epoxidized, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate, 2- (3,4-epoxy) cyclohexyl-5, Alicyclic epoxy resins such as spiro (3,4-epoxy) cyclohexane-m-dioxane; paraxylylene modified epoxy resins which are glycidyl ethers of paraxylylene modified phenolic resins; metaxylylene modified epoxy resins which are glycidyl ethers of metaxylylene modified phenolic resins; Terpene-modified epoxy resin which is a glycidyl ether of terpene-modified phenolic resin; dicyclopentadiene-modified epoxy resin which is a glycidyl ether of dicyclopentadiene-modified phenolic resin; cyclopentadiene-modified epoxy resin which is a glycidyl ether of cyclopentadiene-modified phenolic resin; Polycyclic aromatic ring modified epoxy resin which is a glycidyl ether of aromatic ring modified phenolic resin; Glycidyl ether of naphthalene ring containing phenolic resin Naphthalene type epoxy resin which is a terpolymer; halogenated phenol novolac type epoxy resin; hydroquinone type epoxy resin; trimethylolpropane type epoxy resin; linear aliphatic epoxy resin obtained by oxidizing an olefin bond with a peroxy acid such as peracetic acid; An aralkyl type epoxy resin which is obtained by epoxidizing an aralkyl type phenol resin such as a phenol aralkyl resin or a naphthol aralkyl resin; These epoxy resins may be used alone or in combination of two or more.

  The epoxy equivalent (molecular weight / epoxy group number) of the epoxy resin is not particularly limited. From the viewpoint of the balance of various properties such as moldability, reflow resistance and electrical reliability, it is preferably 100 g / eq to 1000 g / eq, and more preferably 150 g / eq to 500 g / eq.

  The epoxy equivalent of the epoxy resin may be, for example, a value measured by a method according to JIS K 7236: 2009.

  The softening point or melting point of the epoxy resin is not particularly limited. It is preferable that it is 50 degreeC-130 degreeC from a viewpoint of the handleability at the time of preparation of a curable resin composition.

  The melting point or softening point of the epoxy resin may be, for example, a value measured by a single cylindrical rotational viscometer method described in JIS K 7234: 1986 and JIS K 7233: 1986.

(Hardening agent)
The type of the curing agent is not particularly limited, and can be selected according to the desired properties of the curable resin composition. When the resin used in combination is an epoxy resin, examples of curing agents include phenol curing agents, amine curing agents, acid anhydride curing agents, polymercaptan curing agents, polyaminoamide curing agents, isocyanate curing agents, blocked isocyanate curing agents, etc. Be From the viewpoint of heat resistance, the curing agent is preferably one having a phenolic hydroxyl group in the molecule (phenol curing agent).

  Specifically as phenolic curing agents, polyhydric phenol compounds such as resorcin, catechol, bisphenol A, bisphenol F, and substituted or unsubstituted biphenols; phenol, cresol, xylenol, resorcin, catechol, bisphenol A, bisphenol F, phenylphenol And at least one phenolic compound selected from the group consisting of phenol compounds such as aminophenol and naphthol compounds such as .alpha.-naphthol, .beta.-naphthol and dihydroxynaphthalene, and aliphatic aldehyde compounds such as formaldehyde, acetaldehyde and propionaldehyde Novolak-type phenol resin obtained by condensation or co-condensation under an acidic catalyst; the above-mentioned phenolic compound, dimethoxyparaxylene, bis (methoxymethyl) bi Aralkyl type phenol resin such as phenolaralkyl resin and naphtholaralkyl resin synthesized from phenyl and the like; phenol resin modified with at least one of paraxylylene and metaxylylene; melamine modified phenolic resin; terpene modified phenolic resin; the above phenolic compound, diphenol Dicyclopentadiene-type phenolic resin and dicyclopentadiene-type naphthol resin synthesized by copolymerization with cyclopentadiene; cyclopentadiene-modified phenolic resin; polycyclic aromatic ring-modified phenolic resin; biphenyl-type phenolic resin; the above-mentioned phenolic compound and benzaldehyde And triphenylmethane-type phenolic resins obtained by condensation or co-condensation with an aromatic aldehyde compound such as salicylaldehyde under an acidic catalyst; Phenol resins obtained by copolymerizing the like. These phenol curing agents may be used alone or in combination of two or more.

  The functional group equivalent of the curing agent (hydroxyl equivalent in the case of a phenol curing agent) is not particularly limited. From the viewpoint of the balance of various properties such as moldability, reflow resistance, electrical reliability, etc., 70 g / eq to 1000 g / eq is preferable, and 80 g / eq to 500 g / eq is more preferable.

  The functional group equivalent of the curing agent (hydroxyl equivalent in the case of a phenol curing agent) may be, for example, a value measured by a method according to JIS K 0070: 1992.

  The softening point or melting point of the curing agent is not particularly limited. It is preferable that it is 40 degreeC-180 degreeC from a moldability and reflow resistant viewpoint, and it is more preferable that it is 50 degreeC-130 degreeC from a viewpoint of the handleability at the time of manufacture of a resin composition.

  The melting point or softening point of the curing agent may be, for example, a value measured by a single cylindrical rotational viscometer method described in JIS K 7234: 1986 and JIS K 7233: 1986.

  The equivalent ratio of the resin to the curing agent, that is, the ratio of the number of functional groups in the curing agent to the number of functional groups in the resin (the number of functional groups in the curing agent / the number of functional groups in the resin) is not particularly limited. It is preferable to set to the range of 0.5-2.0, and it is more preferable to set to the range of 0.6-1.3 from a related relation which suppresses each non-reacted part small. It is more preferable to set in the range of 0.8 to 1.2 from the viewpoint of moldability and reflow resistance.

(Filling material)
The filler contains at least cristobalite, and may optionally contain fillers other than cristobalite. Types of fillers other than cristobalite are not particularly limited. Specifically, silica (fused silica, crystalline silica etc.), glass, alumina, calcium carbonate, zirconium silicate, calcium silicate, silicon silicate, silicon nitride, aluminum nitride, boron nitride, beryllia, zirconia, zircon, forsterite, steatite And inorganic materials such as spinel, mullite, titania, talc, clay and mica. A filler having a flame retardant effect may be used. Examples of the filler having a flame retardant effect include composite metal hydroxides such as aluminum hydroxide, magnesium hydroxide, a composite hydroxide of magnesium and zinc, zinc borate and the like.

  Among the above-mentioned fillers, silica is preferable from the viewpoint of reducing the linear expansion coefficient, and alumina is preferable from the viewpoint of high thermal conductivity. The fillers may be used alone or in combination of two or more. As the state of the filler, non-powder, beads obtained by spheroidizing powder, fibers and the like can be mentioned.

  The content of the filler contained in the curable resin composition is not particularly limited. From the viewpoint of flowability and strength, it is preferably 30% by volume to 90% by volume, more preferably 35% by volume to 80% by volume, of the entire curable resin composition, and 40% by volume to 70% by volume It is further preferred that If the content of the filler is 30% by volume or more of the entire curable resin composition, properties such as the thermal expansion coefficient, the thermal conductivity, and the elastic modulus of the cured product tend to be further improved. When the content of the filler is 90% by volume or less of the entire curable resin composition, the increase in viscosity of the curable resin composition is suppressed, and the flowability is further improved, and the moldability tends to be better. is there.

  When the filler is particulate, its average particle size is not particularly limited. For example, the volume average particle diameter is preferably 0.2 μm to 20 μm, and more preferably 0.5 μm to 15 μm. When the volume average particle diameter is 0.2 μm or more, the increase in the viscosity of the curable resin composition tends to be further suppressed. When the volume average particle size is 20 μm or less, the filling property in the narrow gap tends to be further improved. The volume average particle size of the filler should be measured as the particle size (D50) at which the volume accumulation from the small diameter side becomes 50% in the volume-based particle size distribution obtained by the laser scattering diffraction particle size distribution measuring apparatus. it can.

(Hardening accelerator)
The curable resin composition may contain a curing accelerator. The type of the curing accelerator is not particularly limited, and can be selected according to the type of the curable resin, the desired characteristics of the curable resin composition, and the like.
As curing accelerators, diazabicycloalkenes such as 1,5-diazabicyclo [4.3.0] nonene-5 (DBN), 1,8-diazabicyclo [5.4.0] undecene-7 (DBU), etc. Cyclic amidine compounds such as 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-heptadecylimidazole; derivatives of the cyclic amidine compounds; phenol novolac salts of the cyclic amidine compounds or their derivatives; Compounds of the formula: maleic anhydride, 1,4-benzoquinone, 2,5-toluquinone, 1,4-naphthoquinone, 2,3-dimethylbenzoquinone, 2,6-dimethylbenzoquinone, 2,3-dimethoxy-5-methyl-1 , 4-benzoquinone, 2,3-dimethoxy-1,4-benzoquinone, phenyl-1, 1, 4-benzoquinone -A compound having an internal polarization formed by adding a compound having a π bond such as quinone compound such as benzoquinone and diazophenylmethane; tetraphenyl borate salt of DBU, tetraphenyl borate salt of DBN, 2-ethyl-4- Cyclic amidinium compounds such as methylimidazole tetraphenylborate salt, N-methylmorpholine tetraphenylborate salt, etc .; pyridine, triethylamine, triethylenediamine, benzyldimethylamine, triethanolamine, dimethylaminoethanol, tris (dimethylaminomethyl) phenol, etc. Tertiary amine compounds of the above; derivatives of said tertiary amine compounds; tetra-n-butylammonium acetate, tetra-n-butylammonium phosphate, tetraethylammonium acetate, tetra-n-hexyl benzoate Ammonium salt compounds such as ammonium sulfate and tetrapropylammonium hydroxide; triphenylphosphine, diphenyl (p-tolyl) phosphine, tris (alkylphenyl) phosphine, tris (alkoxyphenyl) phosphine, tris (alkylalkoxyphenyl) phosphine, tris (Dialkylphenyl) phosphine, tris (trialkylphenyl) phosphine, tris (tetraalkylphenyl) phosphine, tris (dialkoxyphenyl) phosphine, tris (trialkoxyphenyl) phosphine, tris (tetraalkoxyphenyl) phosphine, trialkylphosphine, Tertiary phosphines such as dialkyl aryl phosphines and alkyl diaryl phosphines; complexes of the above tertiary phosphines with organic borons, etc. Sphin compounds; said tertiary phosphine or said phosphine compound and maleic anhydride, 1,4-benzoquinone, 2,5-toluquinone, 1,4-naphthoquinone, 2,3-dimethylbenzoquinone, 2,6-dimethylbenzoquinone, 2, Quinone compounds such as 3-dimethoxy-5-methyl-1,4-benzoquinone, 2,3-dimethoxy-1,4-benzoquinone, phenyl-1,4-benzoquinone, and compounds having a π bond such as diazophenylmethane A compound having an intramolecular polarization formed by addition; said tertiary phosphine or said phosphine compound and 4-bromophenol, 3-bromophenol, 2-bromophenol, 4-chlorophenol, 3-chlorophenol, 2-chlorophenol, 4-iodophenol, 3-iodophenol, 2-iodophenol , 4-bromo-2-methylphenol, 4-bromo-3-methylphenol, 4-bromo-2,6-dimethylphenol, 4-bromo-3,5-dimethylphenol, 4-bromo-2,6 Halogenated phenolic compounds such as -di-t-butylphenol, 4-chloro-1-naphthol, 1-bromo-2-naphthol, 6-bromo-2-naphthol, 4-bromo-4'-hydroxybiphenyl etc. are reacted Later, a compound having an internal polarization obtained through the step of dehydrohalogenation; tetra-substituted phosphonium such as tetraphenyl phosphonium; tetra-substituted phosphonium having no phenyl group bonded to a boron atom such as tetra-p-tolylborate Tetrasubstituted borates; salts of tetraphenylphosphonium with a phenol compound and the like can be mentioned.

  When the curable resin composition contains a curing accelerator, the amount thereof is preferably 0.1 part by mass to 30 parts by mass, and 1 part by mass to 15 parts by mass with respect to 100 parts by mass of the curable resin component. Is more preferred.

[Various additives]
The curable resin composition may contain, in addition to the components described above, various additives such as a coupling agent, a mold release agent, and a colorant as exemplified below. The curable resin composition may contain various additives well known in the art, as needed, in addition to the additives exemplified below.

(Coupling agent)
The curable resin composition may contain a coupling agent in order to enhance the adhesion between the resin component and the filler. Examples of the coupling agent include known coupling agents such as epoxysilane, mercaptosilane, aminosilane, alkylsilane, ureidosilane, silane compounds such as vinylsilane, titanium compounds, aluminum chelate compounds, and aluminum / zirconium compounds. Among them, silane compounds are preferable from the viewpoint of handleability. The coupling agents may be used alone or in combination of two or more.

  When the curable resin composition contains a coupling agent, the amount of the coupling agent is preferably 0.05 parts by mass to 5 parts by mass with respect to 100 parts by mass of the filler. More preferably, it is 0.5 parts by mass.

(Release agent)
The curable resin composition may contain a release agent from the viewpoint of obtaining good releasability with the mold at the time of molding. The release agent is not particularly limited, and conventionally known ones can be used. Specific examples thereof include carnauba wax, higher fatty acids such as montanic acid and stearic acid, higher fatty acid metal salts, ester waxes such as montanic acid esters, and polyolefin waxes such as oxidized polyethylene and non-oxidized polyethylene. The mold release agent may be used alone or in combination of two or more.

  When the curable resin composition contains a release agent, the amount is preferably 0.01 parts by mass to 10 parts by mass with respect to a total of 100 parts by mass of the curable resin components, and 0.1 parts by mass to 5 parts by mass More preferably, it is part by mass.

(Colorant)
The curable resin composition may further contain a colorant. Examples of colorants include known colorants such as carbon black, organic dyes, organic pigments, titanium oxide, red lead, red iron oxide and the like. The content of the coloring agent can be appropriately selected according to the purpose and the like. The colorants may be used alone or in combination of two or more.

  When the curable resin composition contains a colorant, the amount is preferably 0.01 parts by mass to 10 parts by mass with respect to a total of 100 parts by mass of the curable resin components, and 0.1 parts by mass to 5 parts by mass It is more preferable that it is a part.

(Use of curable resin composition)
The curable resin composition can be used in various mounting techniques as a sealing material for an electronic component device. In one embodiment, a curable resin composition is used as a sealing material when producing at least one of two or more packages in an electronic component device including two or more packages. By using the curable resin composition as a sealing material for one package, the warpage of the package can be controlled according to the warpage of the other package, and good bonding between the packages can be achieved. .

  As a method of producing a package using a curable resin composition, a compression molding method, a transfer molding method, an injection molding method, etc. are mentioned, and any of these can be adopted.

(Method of preparing curable resin composition)
The method for preparing the curable resin composition is not particularly limited. As a general method, there is a method in which components of a predetermined blending amount are sufficiently mixed by a mixer or the like, then melt-kneaded by a mixing roll, an extruder or the like, cooled, and crushed. More specifically, for example, a method of uniformly stirring and mixing predetermined amounts of the components described above, kneading with a kneader, roll, extruder, etc. which has been heated to 70 ° C. to 140 ° C. in advance, cooling and grinding Can be mentioned.

<Electronic component device>
The electronic component device of the present disclosure includes a package including a cured product of the above-described curable resin composition.

  The electronic component device of the present disclosure may be a device (for example, a PoP type electronic component device) including a first package and a second package including the cured product of the curable resin composition described above. In this case, the positional relationship between the first package and the second package is not particularly limited, but it is preferable that the first package be located on the second package (opposite to the substrate on which the electronic component device is disposed) .

  As a method of producing a package using a curable resin composition, a low pressure transfer molding method, an injection molding method, a compression molding method, etc. are mentioned, and any of these can be adopted.

<Method of manufacturing electronic component device>
The method of manufacturing an electronic component device of the present disclosure includes the step of bonding a first package containing a cured product of the curable resin composition described above and a second package, wherein the bonding is performed by using the first package of the first package. It is the manufacturing method of the electronic component apparatus performed on the conditions which the state of curvature and the state of curvature of said 2nd package correspond.

  The method of bonding the first package and the second package in the above method is not particularly limited, but heating to a temperature at which a bonding member such as a solder ball disposed between the first package and the second package melts May be used.

  The state of warpage of the second package because the first package includes the cured product of the curable resin composition described above (that is, the sealing material of the first package is the curable resin composition described above). Accordingly, the state of warpage of the first package can be controlled, and good bonding between the packages can be achieved.

  In the above method, it is preferable that the first package causes the same warpage as the second package under the temperature conditions at the time of bonding. Control of the state of warpage of the first package can be performed, for example, by changing the content of cristobalite contained in the curable resin composition. Therefore, the method may include the step of controlling the state of warpage of the first package based on the state of warpage of the second package.

  Although the positional relationship between the first package and the second package is not particularly limited in the above method, the first package is located on the second package (opposite the substrate on which the electronic component device is disposed). May be

  Hereinafter, although the said embodiment is concretely described with an Example, the scope of the said embodiment is not limited to these Examples.

(Preparation of a curable resin composition)
The component shown below was mixed by the mixing | blending (mass part) shown in Table 1, and curable resin composition of the Example and the comparative example was prepared.

-Epoxy resin 1-Biphenyl type epoxy resin, epoxy equivalent 192 g / eq, Mitsubishi Chemical Corporation, product name "YX-4000")
・ Epoxy resin 2: Biphenylene aralkyl type epoxy resin, epoxy equivalent 277 g / eq, Nippon Kayaku Co., Ltd., product name “NC-3000”)

Hardening agent 1: Biphenyl type phenol resin, hydroxyl equivalent 202 g / eq, Meiwa Kasei Co., Ltd., product name "MEHC-7851-SS")
Curing agent 2. Triphenylmethane type phenol resin, hydroxyl group equivalent 103 g / eq, Meiwa Chemical Co., Ltd., product name "MEH-7500-3S")

Hardening accelerator 1: Adduct of triphenylphosphine and 1,4-benzoquinone Curing accelerator 2: Adduct of tri-n-butyl phosphine and 1,4-benzoquinone Coupling agent 1: N-phenyl -3-Aminopropyltrimethoxysilane (Shin-Etsu Chemical Co., Ltd., Product Name "KBM-573")
・ Coupling agent 2 ... methyltrimethoxysilane (Shin-Etsu Chemical Co., Ltd., product name "KBM-13")
· Releasing agent 1: Montanic acid ester wax (Clariant, HW-E)
-Releasing agent 2: Polyethylene wax-Pigment-carbon black (Mitsubishi Chemical Corporation, product name "MA600MJ")

· Ion trap agent ... Magnesium · aluminum hydroxide · carbonate · hydrate (・ Chemical Industry Co., Ltd., STABIACE HT-P)
・ Silicone compound: Polysiloxane (Toray Dow Corning Silicone Co., Ltd., product name “AY 42-119”)
・ Triphenylphosphine oxide (TPPO)
· Filler 1 ... fused silica (volume average particle size: 20 μm)
· Filler 2 ... cristobalite (volume average particle diameter: 11 μm)

(Evaluation of the state of warpage)
Using the curable resin composition prepared, a package for evaluation (15 mm × 15 mm, sealing thickness: 350 mm, overall thickness: 440 mm) was mounted with a chip of 9 mm × 9 mm and a thickness of 150 μm. After post curing at 175 ° C for 5 hours, place in a heating device and raise the temperature in the device from 30 ° C (heating rate 10 ° C / 25 seconds) to reach 260 ° C and then reach 30 ° C A test was conducted to lower the temperature (temperature decrease rate 10 ° C./25 seconds), and the state of warpage of the evaluation package at 260 ° C. and the maximum height (μm) of the warpage from the ground plane were examined. The results are shown in Table 1 as a maximum value when the warpage of the smile type is generated is a negative value, and a maximum height when the warpage of the cry type is generated is a positive value.

As shown in the results of Table 1, in Comparative Example 1 using a curable resin composition containing triphenylphosphine oxide and not containing cristobalite, a smile-type warp occurs when the heat treatment temperature reaches 260 ° C. It was On the other hand, in Examples 1 to 3 using a curable resin composition containing triphenylphosphine oxide and cristobalite, when the heat treatment temperature reached 260 ° C., the warpage of cry type occurred.
From the above, it was found that the cristobalite-containing curable resin composition containing triphenylphosphine oxide can control the state of warp of the package at 260 ° C. to a cry type.

Claims (7)

  A curable resin composition comprising a curable resin component, triphenylphosphine oxide, and a filler, wherein the filler comprises cristobalite.   The curable resin composition according to claim 1, wherein the curable resin component comprises an epoxy resin and a curing agent.   The curable resin composition according to claim 1, which is a sealing material for an electronic component device.   The curable resin composition according to any one of claims 1 to 3, which is a sealing material used for producing at least one of the two or more packages in an electronic component device including two or more packages.   The electronic component apparatus provided with the package containing the hardened | cured material of the curable resin composition of any one of Claims 1-4.   The electronic component device according to claim 5, comprising: a first package including a cured product of the curable resin composition; and a second package. A step of bonding a first package containing a cured product of the curable resin composition according to any one of claims 1 to 4 and a second package, the bonding comprising the steps of: The manufacturing method of the electronic component apparatus performed on the conditions which the state of curvature of a package, and the state of curvature of said 2nd package correspond.