JP2019054045A - Component mounting device - Google Patents

Abstract

To provide a component mounting device capable of preventing balance of a production number between a priority lane and a non-priority lane from being considerably disordered.SOLUTION: A component mounting device 2 comprises: a conveying lane 20a; a conveying lane 20b independently provided from the conveying lane 20a; head units 30a and 30b mounting a component E to a substrate P on the conveying lanes 20a or 20b; and a control part 70 that performs a priority mounting control allowing the component E to mount, by the head units 30a and 30b, with priority over a non-priority substrate Pd on a non-priority lane 23 of the conveying lanes 20a or 20b to a priority substrate Pc on a priority lane 22 of the conveying lanes 20a or 20b. The control part 70 is constructed so as to perform the priority mounting control on the basis of a ratio of a preset priority with the setting of the priority of the priority lane 22 and the non-priority lane 23 at the ratio.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a component mounting apparatus, and particularly to a component mounting apparatus including a first transport lane and a second transport lane.

  Conventionally, a component mounting apparatus including a first transport lane and a second transport lane is known (see, for example, Patent Document 1).

  Patent Document 1 discloses a component mounting apparatus that includes two lanes for board conveyance of a first conveyance lane and a second conveyance lane. In this component mounting apparatus, the first transport lane and the second transport lane may be set as a priority lane and a non-priority lane, respectively. When priority lanes and non-priority lanes are set, when the conditions for priority mounting are satisfied, mounting on non-priority boards on non-priority lanes is interrupted, and parts are preferentially assigned to priority boards on priority lanes. Implementation is done.

JP 2014-103316 A

  However, in the component mounting apparatus described in Patent Document 1, since priority lanes and non-priority lanes are simply set, if the conditions for priority mounting are satisfied, the priority board on the priority lanes is unlimited. Is preferentially implemented. For this reason, if conditions for performing preferential mounting are excessive, preferential mounting on the preferential board on the preferential lane may be performed excessively. If preferential mounting on the priority board on the priority lane is performed too much, the number of priority board production will increase excessively, while the number of non-priority board production will not increase, so the balance of the number of production between lanes will be greatly disrupted Problems arise.

  The present invention has been made to solve the above-described problems, and one object of the present invention is to prevent the production number balance between the priority lanes and the non-priority lanes from being greatly disrupted. It is to provide a component mounting apparatus capable of satisfying the requirements.

  The component mounting apparatus according to the first aspect of the present invention includes a first transport lane, a second transport lane provided independently of the first transport lane, and a substrate on the first transport lane or the second transport lane. A non-priority lane on the non-priority lane of the first conveyance lane and the second conveyance lane with respect to the priority board on the priority lane of the first conveyance lane and the second conveyance lane with respect to the head unit for mounting the component. A control unit that performs priority mounting control in which components are mounted by the head unit in preference to the priority board, and the control unit sets the priority of the priority lane and the priority of the non-priority lane in a ratio. Based on the set priority ratio, priority mounting control is performed.

  In the component mounting apparatus according to the first aspect of the present invention, the control unit sets the priority of the priority lane and the priority of the non-priority lane as a ratio, and uses the priority mounting based on the set priority ratio. Configure to perform control. As described above, by performing the priority mounting control based on the priority ratio, it is possible to set an upper limit on the number of times of priority mounting, thereby suppressing excessive priority mounting on the priority board on the priority lane. Can do. As a result, it is possible to continue to produce an appropriate number of priority boards on priority lanes and non-priority boards on non-priority lanes, so that the balance of the number of productions between priority lanes and non-priority lanes is greatly disrupted. This can be suppressed. Thereby, for example, when producing a double-sided mounting substrate, it is possible to suppress an excessive increase or decrease in the intermediate inventory of the double-sided mounting substrate mounted on only one side.

  In the component mounting apparatus according to the first aspect, preferably, the control unit is configured to acquire the priority ratio based on at least the scheduled production number of the priority boards. According to this configuration, it is possible to obtain a priority ratio that can reliably complete the production of the number of priority substrates to be produced. Then, by performing priority mounting control based on this priority ratio, it is possible to prevent the production number balance between the priority lane and the non-priority lane from being greatly disrupted and to produce the priority number of priority boards. Can be completed reliably.

  In this case, preferably, the control unit sets the priority so that the production of the priority board of the scheduled production number is completed at the production completion desired time based on the production completion desired time of the priority lane and the scheduled production quantity of the priority board. Is configured to obtain the ratio. According to this configuration, it is possible to obtain a priority ratio such that the production of the number of priority substrates to be produced is completed substantially at the desired production completion time. Then, by performing priority mounting control based on this priority ratio, it is possible to prevent the production number balance between the priority lane and the non-priority lane from being greatly disrupted and to produce the priority number of priority boards. It can be surely completed at the desired production completion time. Further, since the worker can grasp the production completion time of the priority board, the work after the production of the priority board (for example, the setup work) is efficiently started in accordance with the production completion time of the priority board. be able to.

  In the configuration in which the control unit acquires the priority ratio based on at least the scheduled production number of priority substrates, preferably, the control unit produces based on the scheduled production number of priority substrates and the scheduled production number of non-priority substrates. The priority ratio is acquired so that the production of the predetermined number of priority substrates and non-priority substrates is completed at substantially the same time. According to this configuration, it is possible to obtain a priority ratio such that the production of the scheduled number of priority substrates and non-priority substrates is completed at substantially the same time. By performing priority mounting control based on this priority ratio, it is possible to prevent the production number balance between the priority lanes and the non-priority lanes from being greatly disrupted, and to control the number of priority boards and non-priority productions. Both substrate productions can be completed at approximately the same time. In addition, both the priority lane and the non-priority lane can be operated until the production of both the priority board and the non-priority board for the planned number of productions is completed. Can be done. In addition, since the production of both the priority substrate and the non-priority substrate of the planned production number can be completed at substantially the same time, the operator can perform the work after the completion of the production of both the priority substrate and the non-priority substrate (for example, setup). Work) can be started at about the same time.

  In the component mounting apparatus according to the first aspect, the control unit is preferably configured to change the priority ratio according to the production status during the production of the board. With this configuration, when the balance between the number of production between the priority lane and the non-priority lane is lost during production due to a change in the number of production during production or an error stop of the lane during production, etc. However, the priority ratio can be changed to an appropriate value according to the production status. As a result, even if the production number balance between the priority lanes and the non-priority lanes is lost during production, it is possible to prevent the production number balance between the priority lanes and the non-priority lanes from greatly breaking. .

  In this case, it is preferable that the control unit is configured to change the priority ratio based on at least the remaining scheduled production number of the priority substrates during the production of the substrates. By configuring in this way, even when the balance of the number of production between the priority lane and the non-priority lane is lost during production, the production of the number of priority boards to be produced with the priority ratio is surely completed. The priority ratio can be changed. As a result, even if the balance between the number of priority lanes and non-priority lanes is lost during production, the priority lanes and non-priority lanes can be It is possible to prevent the production number balance during the period from being greatly disrupted.

  In the component mounting apparatus according to the first aspect, preferably, the control unit is configured not to perform the priority mounting control when there is no board in another component mounting apparatus arranged on the downstream side. With this configuration, when there is no board in another component mounting apparatus arranged on the downstream side, the board is quickly mounted on the board without performing preferential mounting control, and the other parts mounted on the downstream side. It can be conveyed to the component mounting apparatus. As a result, the operating rate of other component mounting apparatuses on the downstream side can be improved, so that the total production time can be shortened.

  A component mounting apparatus according to a second aspect of the present invention includes a first transport lane, a second transport lane provided independently of the first transport lane, and a substrate on the first transport lane or the second transport lane. A non-priority lane on the non-priority lane of the first conveyance lane and the second conveyance lane with respect to the priority board on the priority lane of the first conveyance lane and the second conveyance lane with respect to the head unit for mounting the component. A control unit that performs priority mounting control in which components are mounted by the head unit in preference to the priority board, and the control unit is configured as a priority number in the priority lane or a priority number in the non-priority lane. In addition to setting the priority count, priority mounting control is performed based on the set priority count or non-priority count.

  In the component mounting apparatus according to the second aspect of the present invention, the controller sets the priority number as the priority in the priority lane or the non-priority number as the priority in the non-priority lane, and sets the priority number or non-priority. Based on the number of priorities, it is configured to perform prioritized mounting control. As described above, by performing the priority mounting control based on the set priority number or non-priority number, it is possible to set an upper limit on the number of priority mountings, so that the priority mounting on the priority board on the priority lane is performed too much. This can be suppressed. As a result, it is possible to continue to produce an appropriate number of priority boards on priority lanes and non-priority boards on non-priority lanes, so that the balance of the number of productions between priority lanes and non-priority lanes is greatly disrupted. This can be suppressed. Thereby, for example, when producing a double-sided mounting substrate, it is possible to suppress an excessive increase or decrease in the intermediate inventory of the double-sided mounting substrate mounted on only one side.

  According to the present invention, as described above, it is possible to provide a component mounting apparatus capable of suppressing the production number balance between the priority lanes and the non-priority lanes from being greatly collapsed.

It is a typical top view showing the component mounting system of one embodiment. It is a block diagram which shows the control structure of the component mounting apparatus of one Embodiment. It is a figure for demonstrating the mounting control of the component mounting apparatus of one Embodiment, Comprising: (A) is a figure for demonstrating normal alternate mounting control, (B) demonstrates priority mounting control. FIG. It is a flowchart for demonstrating the priority mounting process by the component mounting apparatus of one Embodiment. It is a flowchart for demonstrating the ratio change process of the priority by the component mounting apparatus of one Embodiment. It is a flowchart for demonstrating the ratio change process of the priority by the component mounting apparatus of one Embodiment.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments embodying the present invention will be described below with reference to the drawings.

(Configuration of component mounting system)
With reference to FIG. 1, the structure of the component mounting system 100 by one Embodiment is demonstrated. In the following description, the “upstream side” simply means the upstream side in the substrate transport direction, and the “downstream side” simply means the downstream side in the substrate transport direction. Further, a direction along the substrate transport direction is defined as an X direction, and a direction orthogonal to the X direction in the horizontal plane is defined as a Y direction. The vertical direction perpendicular to the X direction and the Y direction is taken as the Z direction.

  As shown in FIG. 1, a component mounting system 100 mounts a component (electronic component) E such as an IC, a transistor, a capacitor, and a resistor on a substrate P such as a printed circuit board, and the substrate P on which the component E is mounted. This is a production system.

  The component mounting system 100 includes a printing apparatus 1, a plurality (three) of component mounting apparatuses 2 to 4, and a reflow furnace 5. In the component mounting system 100, the printing device 1, the plurality of component mounting devices 2 to 4, and the reflow furnace 5 are arranged in this order from the upstream side (X1 direction side) to the downstream side (X2 direction side). .

  The printing apparatus 1 is an apparatus that performs a printing operation for screen-printing a bonding material such as solder on the substrate P. The component mounting apparatuses 2 to 4 are apparatuses that perform a mounting operation of mounting the component E on the board P on which the bonding material is printed. The reflow furnace 5 is a device that performs a reflow operation for bonding the mounted component E to the substrate P by melting and solidifying the bonding material printed on the substrate P. In the component mounting system 100, the substrate P is conveyed in the order of the printing device 1, the plurality of component mounting devices 2 to 4, and the reflow furnace 5, and the components E are mounted and joined by working in each device. A substrate P is produced.

(Configuration of component mounting device)
Next, with reference to FIG. 1 and FIG. 2, the structure of the component mounting apparatuses 2-4 is demonstrated. Since the component mounting apparatuses 2 to 4 have substantially the same configuration, the component mounting apparatus 2 will be described below.

  As shown in FIGS. 1 and 2, the component mounting apparatus 2 includes a base 10, a plurality (two) of transport lanes 20a and 20b, a plurality (two) of head units 30a and 30b, and a plurality (two). Two moving mechanism sections 40a and 40b (see FIG. 2), a plurality (two) of component imaging sections 50a and 50b, a plurality (two) of board imaging sections 60a and 60b, and a control section 70 (FIG. 2). Reference). The transport lanes 20a and 20b are examples of the “first transport lane” and the “second transport lane” in the claims, respectively.

  The base 10 is a base serving as a basis for arranging each component in the component mounting apparatus 2. On the base 10, a transportation lane 20a, a transportation lane 20b, a component imaging unit 50a, and a component imaging unit 50b are provided. A control unit 70 is provided in the base 10. The base 10 is also provided with component supply units 11a and 11b on both sides in the Y direction (Y1 direction side and Y2 direction side).

  The component supply units 11 a and 11 b are devices that supply a component E mounted on the board P. Each of the component supply units 11 a and 11 b includes a plurality of tape feeders 12. The tape feeder 12 holds a reel (not shown) around which a component supply tape (not shown) holding a plurality of components E is wound.

  The component supply unit 11a is provided on the Y1 direction side with respect to the transport lane 20a, and is configured to supply the component E to the head unit 30a. The component supply unit 11b is provided on the Y2 direction side with respect to the transport lane 20b, and is configured to supply the component E to the head unit 30b.

  The transport lane 20a is a transport path for transporting the substrate Pa, and is a transport path including a transport unit 21a including a pair of transport belts. The transport lane 20b is a transport path for transporting a substrate Pb different from the substrate Pa, and is a transport path including a transport unit 21b including a pair of transport belts. The substrate Pa and the substrate Pb are, for example, a double-sided mounting substrate on which both sides are not mounted and this double-sided mounting substrate on which only one side is mounted. Note that the substrate Pa and the substrate Pb may be, for example, different types of single-sided mounting substrates. The transport lanes 20a and 20b are provided independently of each other, and are arranged side by side in the Y direction so as to be parallel to each other.

  The transport unit 21a (21b) carries the board Pa (Pb) before mounting onto the transport lane 20a (20b), transports it on the transport lane 20a (20b) in the board transport direction (X2 direction), and after mounting. The substrate Pa (Pb) is configured to be unloaded from the transfer lane 20a (20b). The transport unit 21a (21b) transports the loaded substrate Pa (Pb) to the substrate fixing position Aa (Ab) on the transport lane 20a (20b), and at the substrate fixing position Aa (Ab). It is comprised so that it may fix by (not shown).

  The head units 30a and 30b are component mounting head units. The head unit 30a acquires the component E supplied from the component supply unit 11a, and mounts the acquired component E on either the substrate Pa on the transfer lane 20a or the substrate Pb on the transfer lane 20b. It is configured. The head unit 30b acquires the component E supplied from the component supply unit 11b, and mounts the acquired component E on either the substrate Pa on the transfer lane 20a or the substrate Pb on the transfer lane 20b. It is configured. The head units 30a and 30b are configured to be movable independently of each other.

  The head unit 30a (30b) includes a plurality of (five) heads (mounting heads) 31a (31b), a Z-axis motor 32a (32b) for moving the head 31a (31b) in the vertical direction, and a head 31a ( And an R-axis motor 33a (33b) for rotating a nozzle (not shown) attached to the tip of 31b) around a rotation axis extending in the vertical direction (Z direction). Each of the plurality of heads 31a (31b) is connected to a vacuum generator (not shown), and holds (adsorbs) the component E on a nozzle attached to the tip by a negative pressure supplied from the vacuum generator. It is configured to be possible.

  The moving mechanism units 40a and 40b (see FIG. 2) are configured to move the head units 30a and 30b in the horizontal direction (X direction and Y direction), respectively. Specifically, the moving mechanism unit 40a (40b) moves the head unit 30a (30b) in the X direction and the X axis motor 41a (41b) for moving the head unit 30a (30b) in the Y direction. Y axis motor 42a (42b). The moving mechanism section 40a (40b) is configured to move the head unit 30a (30b) in the horizontal direction by, for example, a ball screw shaft mechanism.

  The head unit 30a (30b) is configured to be movable in the horizontal direction (X direction and Y direction) on the base 10 by the moving mechanism 40a (40b). Thus, the head unit 30a (30b) can move above the component supply unit 11a (11b) and can hold (suck) the component E supplied from the component supply unit 11a (11b). Further, the head unit 30a (30b) moves above either the substrate Pa fixed at the substrate fixing position Aa or the substrate Pb fixed at the substrate fixing position Ab, and holds the held (sucked) component E. It can be mounted on the substrate P.

  The component imaging unit 50a is a component recognition camera that images the component E held (sucked) by the head unit 30a prior to mounting the component E on the board Pa or Pb. The component imaging unit 50b is a component recognition camera that captures an image of the component E held (sucked) by the head unit 30b prior to mounting the component E on the board Pa or Pb. The component imaging unit 50a is disposed between the component supply unit 11a and the transport lane 20a. The component imaging unit 50b is disposed between the component supply unit 11b and the transport lane 20b.

  The component imaging unit 50a (50b) is fixed on the upper surface of the base 10, and images the component E held (adsorbed) by the head unit 30a (30b) from below the component E (Z2 direction). It is configured. Based on the imaging result of the component E by the component imaging unit 50a (50b), the control unit 70 is configured to acquire (recognize) the suction state (rotational posture and suction position with respect to the head 31a (31b)) of the component E. ing.

  Prior to mounting the component E on the board Pa or Pb, the board imaging units 60a and 60b are positioned recognition marks (fiducial marks) attached to the upper surface of the board Pa or position recognition attached to the upper surface of the board Pb. This is a mark recognition camera for imaging a mark. The position recognition mark is a mark for recognizing the position of the substrate Pa (Pb). Based on the imaging result of the position recognition mark by the board imaging unit 60a or 60b, the control unit 70 acquires (recognizes) the accurate position and orientation of the board Pa (Pb) fixed at the board fixing position Aa (Ab). It is configured as follows. Moreover, the board | substrate imaging part 60a (60b) is attached to the head unit 30a (30b), and is comprised with the head unit 30a (30b) so that a horizontal movement on the base 10 is possible.

  The control unit 70 includes a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), and the like, and is a control circuit that controls the operation of the component mounting apparatus 2. The control unit 70 controls the transport unit 21a (21b), the component supply unit 11a (11b), the moving mechanism unit 40a (40b), and the like according to the production program, so that the head unit 30a (30b) transfers the substrate Pa or the substrate Pb. The component E is mounted.

(Configuration related to mounting control)
Next, the mounting control of the component mounting apparatus 2 will be described with reference to FIGS.

  In FIGS. 3A and 3B, “carrying” means carrying out the board Pa (Pb) after completion of mounting from the board fixing position Aa (Ab) and the next board Pa (Pb) before mounting. This is a concept including the loading of the substrate to the substrate fixing position Aa (Ab) and the fixing of the loaded substrate Pa (Pb) at the substrate fixing position Aa (Ab).

  As shown in FIG. 3A, the component mounting apparatus 2 is configured to be able to perform alternate mounting control.

  In normal alternate mounting control, the control unit 70 controls both the head units 30a and 30b to mount the component E on the board Pa at the board fixing position Aa on the transport lane 20a until the mounting is completed, and the head unit 30a. And 30b are configured to alternately perform the control of mounting the component E on the board Pb at the board fixing position Ab on the transport lane 20b until the mounting is completed. Therefore, in normal alternate mounting control, it is possible to produce the same number of substrates Pa and substrates Pb.

  Further, in normal alternate mounting control, the control unit 70 is one of the substrates Pa and Pb during the mounting of the component E on either one of the substrates Pa and Pb by both the head units 30a and 30b. It is configured to perform control to perform the other conveyance. As a result, the production time can be shortened by the conveyance time of the substrates Pa and Pb.

  Specifically, during the mounting of the component E on the substrate Pa at the substrate fixing position Aa on the transport lane 20a by both the head units 30a and 30b, the control unit 70 completes the mounting of the substrate Pb on the transport lane 20b. Control for releasing the fixing at the board fixing position Ab, carrying out from the board fixing position Ab, carrying the next board Pb before mounting into the board fixing position Ab on the transport lane 20b, and fixing at the board fixing position Ab. Is configured to do. Further, immediately after the completion of mounting of the component E on the board Pa on the transport lane 20a, the control unit 70 fixes the board Pb on the transport lane 20b fixed at the board fixing position Ab by both the head units 30a and 30b. It is configured to perform control for starting the mounting of the component E on.

  Similarly, during the mounting of the component E on the substrate Pb at the substrate fixing position Ab on the transport lane 20b by both the head units 30a and 30b, the control unit 70 performs the mounting of the substrate Pa on the substrate Pa after completion of mounting on the transport lane 20a. Control is performed to release fixation at the fixed position Aa, carry out from the board fixed position Aa, carry in the next board Pa before mounting to the board fixed position Aa on the transfer lane 20a, and fix at the board fixed position Aa. It is configured as follows. Further, immediately after the mounting of the component E on the board Pb on the transport lane 20b is completed, the control unit 70 fixes the board Pa on the transport lane 20a fixed at the board fixing position Aa by both the head units 30a and 30b. It is configured to perform control for starting the mounting of the component E on.

  In addition, when the production of the substrate (Pa or Pb) in one of the transfer lanes 20a and 20b is completed earlier, the control unit 70 causes the substrate (Pa or Pb) in the transfer lane (20a or 20b) in which production is not completed. It is configured to perform control for continuously producing Pb). FIG. 3A shows a case where the production of the substrate Pa in the transfer lane 20a is completed earlier than the production of the substrate Pb in the transfer lane 20b. In this case, the production of the substrate Pb in the transfer lane 20b that has not been produced is continuously performed.

<Configuration for priority mounting control>
By the way, depending on the planned number of boards Pa and Pb to be produced and the degree of production progress, it may be desired to produce more of either the board Pa or the board Pb while performing the alternate mounting control.

  Therefore, as shown in FIG. 3B, the component mounting apparatus 2 is configured to be able to perform priority mounting control (priority alternate mounting control).

  In the priority mounting control, when the condition for performing the priority mounting is satisfied, the control unit 70 performs the transport lane 20a and the transport lane 20b with respect to the priority board Pc on the priority lane 22 of the transport lane 20a and the transport lane 20b. Are controlled so that the component E is mounted by both the head units 30a and 30b in preference to the non-priority substrate Pd on the non-priority lane 23. Moreover, the control part 70 is comprised so that normal alternating mounting control may be performed when the conditions for performing priority mounting are not satisfied. Thereby, it is possible to produce more priority substrates Pc than non-priority substrates Pd while performing alternate mounting control.

  Specifically, the control unit 70 mounts the component E on the priority substrate Pc on the priority lane 22 during the mounting of the component E on the non-priority substrate Pd on the non-priority lane 23 by both the head units 30a and 30b. When it becomes possible to mount the component E, the mounting of the component E on the non-priority substrate Pd is interrupted, and control is performed so that the component E is preferentially mounted on the priority substrate Pc on the priority lane 22 by both the head units 30a and 30b. Configured to do. The case where the component E can be mounted on the priority board Pc on the priority lane 22 is, for example, the case where the priority board Pc is fixed at the board fixing position Ab.

  In this embodiment, for convenience of explanation, a case where the transport lane 20b is set as the priority lane 22 and the transport lane 20a is set as the non-priority lane 23 will be described. In this case, the substrate Pb becomes the priority substrate Pc, and the substrate Pa becomes the non-priority substrate Pd.

  Here, in the present embodiment, the control unit 70 sets the priority of the priority lane 22 and the priority of the non-priority lane 23 as a ratio, and performs priority mounting control based on the set priority ratio. Configured to do. In other words, the control unit 70 sets the number of priority in the priority lane 22 or the number of non-priority (the number of times of discontinuation of mounting) in the non-priority lane 23 and performs priority mounting control based on the set priority number or non-priority number. Configured to do.

  Specifically, when the priority of the priority lane 22 is n and the priority of the non-priority lane 23 is m, the control unit 70 is configured to set the priority ratio as n: m. . In the following, the priority ratio is described as the priority ratio n: m as appropriate. When the priority ratio n: m is set, the control unit 70 interrupts the mounting of the component E on the non-priority board Pd n−m times during the production of n priority boards Pc. The preferential mounting control is performed so that the component E is preferentially mounted on the priority board Pc.

  In other words, the control unit 70 sets the number of priorities (non-priority number) nm based on the priority ratio n: m, and also produces the number of priorities (non-priority) during the production of n priority substrates Pc. Prioritized control) It is configured to perform priority mounting control so that the mounting of the component E on the non-priority board Pd is interrupted and the component E is preferentially mounted on the priority board Pc, with the upper limit being nm times. ing. The number of times of priority can be said to be the upper limit number of times that the component E is preferentially mounted on the priority board Pc. The non-priority number can also be said to be the upper limit number of times that the mounting of the component E on the non-priority board Pd is interrupted.

  For example, when the priority ratio n: m is 2: 1, the control unit 70 interrupts the mounting of the component E on the non-priority board Pd only once during the production of the two priority boards Pc. Then, control for preferentially mounting the component E on the priority board Pc is performed.

  For example, when the priority ratio n: m is 6: 5, the control unit 70 mounts the component E on the non-priority board Pd only once during the production of six priority boards Pc. And control to preferentially mount the component E on the priority board Pc.

  Further, for example, when the priority ratio n: m is 3: 1, the control unit 70 mounts the component E on the non-priority board Pd only twice during the production of the three priority boards Pc. And control to preferentially mount the component E on the priority board Pc.

  When the priority number (non-priority number) is a plurality of times as described above, for example, the control unit 70 applies the non-priority substrate Pd to the non-priority substrate Pd continuously nm times with respect to one non-priority substrate Pd. Control to suspend mounting of component E is performed.

  Next, an example of priority mounting control will be described with reference to FIG. FIG. 3B illustrates a case where priority mounting control is performed when the priority ratio n: m is 3: 1.

  As shown in FIG. 3B, the component E can be mounted on the priority board Pc on the priority lane 22 while the part E is mounted on the non-priority board Pd on the non-priority lane 23 at time T1. And the number of times that the priority mounting has been executed (0 times) does not reach the set priority number (2 times).

  In this case, at the time T1, the control unit 70 determines that the condition for preferential mounting is satisfied, and performs preferential mounting control. That is, the control unit 70 interrupts the mounting of the component E on the non-priority substrate Pd after mounting the component E held by the heads 31a and 31b (head units 30a and 30b) on the non-priority substrate Pd, Control to preferentially mount the component E on the priority board Pc on the priority lane 22 is performed.

  After that, when the preferential mounting of the component E on the priority board Pc on the priority lane 22 is completed at time T2, the control unit 70 causes the component E to the non-priority board Pd on the non-priority lane 23 that has been interrupted. Control to resume the implementation of. In addition, in parallel with the mounting of the component E on the non-priority board Pd on the resumed non-priority lane 23, the control unit 70 carries out the priority board Pc on which the mounting on the priority lane 22 has been completed. Control to carry in the next priority substrate Pc to the substrate fixing position Ab on the priority lane 22 is performed.

  Thereafter, at the time T3, the component E can be mounted on the priority board Pc on the priority lane 22 and the priority mounting is executed while the component E is mounted on the non-priority board Pd on the non-priority lane 23. There occurs a point in time when the number of performed times (one time) does not reach the set priority number (two times).

  In this case, at the time T3, the control unit 70 determines that the condition for preferential mounting is satisfied, and performs preferential mounting control again. That is, the control unit 70 performs control to preferentially mount the component E on the priority board Pc on the priority lane 22 by interrupting again the mounting of the component E on the non-priority board Pd whose mounting has been interrupted. .

  Thereafter, at time T4, when the preferential mounting of the component E on one priority board Pc on the priority lane 22 is completed, the control unit 70 moves to the interrupted non-priority board Pd on the non-priority lane 23. The control for restarting the mounting of the part E is performed. In addition, in parallel with the mounting of the component E on the non-priority board Pd on the resumed non-priority lane 23, the control unit 70 carries out the priority board Pc on which the mounting on the priority lane 22 has been completed. Control to carry in the next priority substrate Pc to the substrate fixing position Ab on the priority lane 22 is performed.

  Thereafter, at time T5, the component E can be mounted on the priority board Pc on the priority lane 22 and the priority mounting is executed while the component E is mounted on the non-priority board Pd on the non-priority lane 23. There occurs a point in time when the number of times (2 times) has reached the set priority number (2 times).

  In this case, the control unit 70 determines that the conditions for preferential mounting are not satisfied, and does not perform preferential mounting control. That is, even if the component E can be mounted on the priority substrate Pc on the priority lane 22, the control unit 70 does not interrupt the mounting of the component E on the non-priority substrate Pd until the mounting is completed. Control to continue mounting the component E on the non-priority board Pd is performed. Thereafter, the number of times that the priority mounting has been executed is reset, and similar priority mounting control is repeated.

<Acquisition of priority ratio (1)>
Further, in the present embodiment, the control unit 70 is configured to acquire the priority ratio n: m based on at least the scheduled production number of the priority substrates Pc.

  As an example, the control unit 70 prioritizes the production of the scheduled production number of priority substrates Pc at substantially the desired production completion time based on the production completion desired time of the priority lane 22 and the scheduled production number of priority substrates Pc. The degree ratio n: m is obtained. For example, a value input by the producer is set as the desired production completion time of the priority lane 22.

  First, the control unit 70 sets the current time, the desired production completion time of the priority lane 22, the production time (cycle time) of each priority substrate Pc in the priority lane 22, and one non-priority substrate Pd in the non-priority lane 23. Based on the per-production time (cycle time) and the scheduled production number of the priority substrate Pc, the production possible number of non-priority substrates Pd that can be produced by the production completion desired time of the priority lane 22 is obtained. ing. Further, the control unit 70 is configured to acquire the ratio between the scheduled production number of the priority substrates Pc and the production possible number of the non-priority substrates Pd as the priority ratio n: m. Note that the production time per one priority substrate Pc in the priority lane 22 is a value including the transfer time, and the production time per one non-priority substrate Pd in the non-priority lane 23 is also a value including the transfer time. is there.

  For example, it is assumed that the current time is 9:00 and the desired production completion time is 17:00. Further, the production time per one priority substrate Pc in the priority lane 22 is 1 minute (including the transfer time of 5 seconds), and the production time per one non-priority substrate Pd in the non-priority lane 23 is 1 minute. Suppose there is. Further, it is assumed that the scheduled production number of the priority substrates Pc is 360.

  In this case, since the time from the current time to the desired production completion time is 9:00 to 17:00, it is 480 minutes. Further, the production time in the case of continuous production only in the priority lane 22 is 360 minutes because it is 360 sheets × 1 minute. Further, the transport time in the case of continuous production only in the priority lane 22 is 30 minutes because it is 360 sheets × 5 seconds. In addition, the number of non-priority substrates Pd that can be produced by the desired production completion time in the priority lane 22 is (480 minutes−360 minutes + 30 minutes) / 1 minute, and is 150 pieces. In this case, the control unit 70 sets the ratio 360: 150 (= 12: 5) between the planned production number of the priority substrate Pc and the production possible number of the non-priority substrate Pd, and the priority ratio n: m (= 12: 5). ) Get as.

  In addition, the control unit 70 performs priority mounting control based on the acquired priority ratio 12: 5. Thereby, the production of 360 priority substrates Pc and 150 non-priority substrates Pd is completed around 17:00.

  Note that when the planned number of non-priority substrates Pd (for example, 180) is larger than the number of non-priority substrates Pd that can be produced (for example, 150), the production is scheduled at the desired time of completion of the production in the priority lane 22. Production of the number of non-priority substrates Pd is not completed. In this case, the control unit 70 continues the production from the desired production completion time of the priority lane 22 to produce the non-priority substrate Pd corresponding to the difference between the production planned number and the production possible number (for example, 30). Control.

<Acquisition of priority ratio (2)>
Further, in the present embodiment, the control unit 70 generates substantially the same time for the production of the priority substrate Pc and the non-priority substrate Pd of the production schedule number based on the production schedule number of the priority substrate Pc and the production schedule number of the non-priority substrate Pd. The priority ratio n: m is acquired so as to be completed. Specifically, the control unit 70 is configured to acquire the ratio between the scheduled production number of the priority substrate Pc and the scheduled production number of the non-priority substrate Pd as the priority ratio n: m.

  For example, when the scheduled production number of the priority substrate Pc is 100 and the production schedule number of the non-priority substrate Pd is 50, the control unit 70 produces the production schedule number of the priority substrate Pc and the production schedule of the non-priority substrate Pd. A ratio 100: 50 (= 2: 1) to the number of sheets is acquired as a priority ratio n: m (= 2: 1).

  Further, the control unit 70 performs priority mounting control based on the acquired priority ratio 2: 1. Thereby, the production of 100 priority substrates Pc and 50 non-priority substrates Pd is completed at substantially the same time.

<Change of priority ratio>
In the present embodiment, the control unit 70 is configured to change the priority ratio according to the production status during the production of the substrate P (priority substrate Pc and non-priority substrate Pd). Specifically, during the production of the substrate P, the control unit 70 reacquires the priority ratio according to the production status, and the reacquired priority ratio is the same as the original priority ratio. If they are different, the priority ratio is changed to the re-acquired priority ratio. For example, when the desired production completion time is set, the control unit 70 changes the lane-to-lane (priority lane 22 and non-priority lane 23 when the scheduled production number of the priority substrate Pc or the production schedule number of the non-priority substrate Pd is changed. If the balance of the production number is lost, or periodically, the priority ratio is reacquired.

  In the present embodiment, during the production of the substrates P (priority substrates Pc and non-priority substrates Pd), the priority ratio is reacquired and changed based on at least the remaining production number of the priority substrates Pc. It is configured. For example, based on the desired production completion time of the priority lane 22 and the remaining scheduled production number of the priority board Pc, the control unit 70 causes the production of the scheduled production number of priority boards Pc to be completed substantially at the desired production completion time. Re-acquire priority ratio. Alternatively, the control unit 70 produces substantially the same production of the remaining scheduled production number of priority substrates Pc and non-priority substrate Pd based on the remaining scheduled production number of priority substrates Pc and the remaining scheduled production number of non-priority substrates Pd. Re-acquire priority ratios to complete at time. Since the method for obtaining the priority ratios is as described above, detailed description thereof is omitted.

<Cooperation with downstream aircraft>
In the present embodiment, the control unit 70 determines whether or not to perform priority mounting control based on the presence or absence of the board P in another component mounting apparatus 3 (see FIG. 1) disposed on the downstream side. It is configured. Specifically, when it is determined that there is no board P in the other component mounting apparatus 3 arranged on the downstream side, the control unit 70 performs the priority mounting control even if the condition for performing the priority mounting is satisfied. It is configured not to do. In this case, the control unit 70 is configured to perform normal alternate mounting control. Further, when it is determined that the board P is present in the other component mounting apparatus 3 arranged on the downstream side, the control unit 70 performs the priority mounting control as long as the condition for performing the priority mounting is satisfied as usual. It is configured.

  For example, when receiving a board conveyance request signal from another component mounting apparatus 3 disposed on the downstream side, the control unit 70 determines that the other component mounting apparatus 3 disposed on the downstream side has no board P. . Moreover, when the control part 70 has not received the board | substrate conveyance request | requirement signal from the other component mounting apparatus 3 arrange | positioned downstream, when the board | substrate P exists in the other component mounting apparatus 3 arrange | positioned downstream, to decide.

(Priority implementation processing)
Next, with reference to FIG. 4, the preferential mounting process by the component mounting apparatus 2 is demonstrated based on a flowchart. Each process of the flowchart is performed by the control unit 70.

  As shown in FIG. 4, first, in step S <b> 1, the component E is mounted on the non-priority board Pd on the non-priority lane 23.

  In step S2, it is determined whether or not the mounting of the component E on the non-priority board Pd on the non-priority lane 23 is completed. When it is determined that the mounting is completed, the priority mounting process is terminated.

  If it is determined in step S2 that the mounting has not been completed, the process proceeds to step S3.

  In step S <b> 3, it is determined whether or not the priority board Pc is loaded onto the priority lane 22 and the component E can be mounted on the priority board Pc on the priority lane 22. If it is determined that the component E is not ready to be mounted on the priority board Pc on the priority lane 22, the process proceeds to step S1. In step S1, the mounting of the component E on the non-priority board Pd on the non-priority lane 23 is continued without interruption.

  If it is determined in step S3 that the component E can be mounted on the priority board Pc on the priority lane 22, the process proceeds to step S4.

  In step S4, it is determined whether or not the number of times that the priority mounting has been executed has reached the priority number (non-priority number) set based on the priority ratio. When it is determined that the number of times that the priority mounting has been executed has reached the set priority number, the process proceeds to step S1. In step S1, the mounting of the component E on the non-priority board Pd on the non-priority lane 23 is continued without interruption.

  On the other hand, if it is determined in step S4 that the number of times priority mounting has been executed has not reached the set priority number, the process proceeds to step S5.

  In step S5, the mounting of the component E on the non-priority board Pd on the non-priority lane 23 is interrupted.

  In step S6, the component E is mounted on the priority board Pc on the priority lane 22.

  In step S7, it is determined whether or not the mounting of the component E on the priority board Pc on the priority lane 22 is completed. If it is determined that the mounting is not completed, the process proceeds to step S6. In step S6, the mounting of the component E on the priority board Pc on the priority lane 22 is continued.

  If it is determined in step S7 that the mounting has been completed, the process proceeds to step S1. In step S1, the mounting of the component E on the non-priority board Pd on the non-priority lane 23 that has been interrupted is resumed. Thereafter, the priority mounting process is continued for the plurality of boards P until it is determined in step S2 that the mounting is completed.

(Priority ratio change processing (1))
Next, with reference to FIG. 5, priority ratio change processing by the component mounting apparatus 2 will be described based on a flowchart. Each process of the flowchart is performed by the control unit 70. FIG. 5 illustrates an example in which the priority ratio is changed based on the desired production completion time.

  As shown in FIG. 5, first, in step S11, it is determined whether it is a change timing of the priority ratio. In step S11, for example, whether or not the desired production completion time has been set, whether or not the scheduled production number of the priority substrate Pc or the production schedule number of the non-priority substrate Pd has been changed, or whether the production number balance between the lanes has been lost. It is determined whether or not it is a predetermined timing periodically determined. If it is determined in step S11 that it is not the timing for changing the priority ratio, the priority ratio changing process is terminated.

  If it is determined in step S11 that the timing of changing the priority ratio is reached, the process proceeds to step S12.

  In step S12, the current time, the cycle time of the priority substrate Pc in the priority lane 22 (production time per substrate), and the remaining scheduled number of production of the priority substrates Pc are acquired.

  In step S13, based on the cycle time of the priority substrate Pc in the priority lane 22 and the remaining production scheduled number of priority substrates Pc, the production time in the case of continuous production only in the priority lane 22 is acquired. Specifically, the production time is obtained by multiplying the remaining scheduled production number of the priority substrate Pc by the cycle time of the priority substrate Pc in the priority lane 22.

  In step S14, it is determined whether it is possible to complete the production of the remaining scheduled production number of priority substrates Pc at the desired production completion time. Specifically, it is determined whether the time obtained by adding the production time to the current time is later than the production completion desired time. If it is determined that the added time is later than the desired production completion time, it is determined that the production cannot be completed at the desired production completion time, and the process proceeds to step S15. In step S15, an error is notified by outputting an alarm, turning on a warning lamp, displaying a warning screen, or the like.

  If it is determined in step S14 that the added time is before the desired production completion time, it is determined that the production can be completed at the desired production completion time. move on.

  In step S16, the cycle time (production time per one board) of the non-priority substrate Pd in the non-priority lane 23 is acquired.

  In step S17, the non-priority board that can be produced by the desired production completion time in the priority lane 22 based on the current time, the desired production completion time, the production time, and the cycle time of the non-priority board Pd in the non-priority lane 23. The number of Pd that can be produced is acquired. Specifically, the above production time is subtracted from the time from the current time to the desired production completion time, and the transport time in the case of continuous production only in the priority lane 22 is added and subtracted and added. By dividing the obtained time by the cycle time of the non-priority substrate Pd in the non-priority lane 23, the number of non-priority substrates Pd that can be produced is obtained.

  In step S18, the ratio between the scheduled production number of the priority substrate Pc and the production possible number of the non-priority substrate Pd is acquired as the priority ratio.

  In step S19, it is determined whether the acquired priority ratio is different from the original priority ratio. If it is determined that the acquired priority ratio is the same as the original priority ratio, the priority ratio changing process is terminated without changing the priority ratio.

  If it is determined in step S19 that the acquired priority ratio is different from the original priority ratio, the process proceeds to step S20.

  In step S20, the priority ratio is changed to the acquired priority ratio. Thereafter, the priority ratio changing process is terminated.

(Priority ratio change processing (2))
Next, with reference to FIG. 6, the priority ratio changing process by the component mounting apparatus 2 will be described based on a flowchart. Each process of the flowchart is performed by the control unit 70. FIG. 6 illustrates an example in which the priority ratio is changed based on the remaining scheduled production number of the priority substrates Pc and the remaining scheduled production number of the non-priority substrates Pd.

  As shown in FIG. 6, first, in step S <b> 21, it is determined whether it is a timing for changing the priority ratio. In step S21, for example, whether or not the scheduled production number of the priority substrate Pc or the production schedule number of the non-priority substrate Pd has been changed, whether or not the balance of the production numbers among the lanes has been lost, or is determined periodically. It is determined whether it is a predetermined timing. If it is determined in step S21 that the timing for changing the priority ratio is not reached, the priority ratio changing process is terminated.

  If it is determined in step S21 that the priority ratio change timing is reached, the process proceeds to step S22.

  In step S22, the remaining scheduled number of production of the priority substrate Pc and the remaining scheduled number of production of the non-priority substrate Pd are acquired.

  In step S23, the ratio between the remaining scheduled production number of the priority substrates Pc and the remaining scheduled production number of the non-priority substrates Pd is acquired as the priority ratio.

  In step S24, it is determined whether or not the acquired priority ratio is different from the original priority ratio. If it is determined that the acquired priority ratio is the same as the original priority ratio, the priority ratio changing process is terminated without changing the priority ratio.

  If it is determined in step S24 that the acquired priority ratio is different from the original priority ratio, the process proceeds to step S25.

  In step S25, the priority ratio is changed to the acquired priority ratio. Thereafter, the priority ratio changing process is terminated.

(Effect of this embodiment)
In the present embodiment, the following effects can be obtained.

  In the present embodiment, as described above, the control unit 70 sets the priority of the priority lane 22 and the priority of the non-priority lane 23 as a ratio, and performs priority implementation based on the set priority ratio. Configure to perform control. In other words, the control unit 70 sets the priority number as the priority in the priority lane 22 or the non-priority number as the priority in the non-priority lane 23, and prioritizes based on the set priority number or non-priority number. Configure to perform mounting control. As described above, by performing the priority mounting control based on the priority ratio (priority number, non-priority number), it is possible to set an upper limit on the number of priority mountings. It can suppress that mounting is performed too much. As a result, it is possible to continue to produce an appropriate number of priority substrates Pc on the priority lanes 22 and non-priority substrates Pd on the non-priority lanes 23, so that production between the priority lanes 22 and the non-priority lanes 23 is possible. It is possible to prevent the number balance from being greatly lost. Thereby, for example, when producing a double-sided mounting substrate, it is possible to suppress an excessive increase or decrease in the intermediate inventory of the double-sided mounting substrate mounted on only one side.

  Further, in the present embodiment, as described above, the control unit 70 is configured to acquire the priority ratio based on at least the scheduled production number of the priority substrates Pc. Thereby, it is possible to obtain a priority ratio that can reliably complete the production of the scheduled production number of priority substrates Pc. Then, by performing the priority mounting control based on the priority ratio, it is possible to prevent the production number balance between the priority lanes 22 and the non-priority lanes 23 from being greatly disturbed, and to produce the number of priority substrates Pc to be produced. Production can be completed reliably.

  Further, in the present embodiment, as described above, the control unit 70 causes the production of the scheduled production number of priority substrates Pc to be substantially completed based on the desired production completion time of the priority lane 22 and the production schedule number of the preference substrates Pc. The priority ratio is acquired so as to be completed at a desired time. As a result, it is possible to acquire a priority ratio such that the production of the scheduled production number of priority substrates Pc is completed at a substantially desired production completion time. Then, by performing the priority mounting control based on the priority ratio, it is possible to prevent the production number balance between the priority lanes 22 and the non-priority lanes 23 from being greatly disturbed, and to produce the number of priority substrates Pc to be produced. Can be surely completed at a desired production completion time. Further, since the worker can accurately grasp the production completion time of the priority substrate Pc, the work after the completion of the production of the priority substrate Pc (for example, a setup operation) is performed in accordance with the production completion time of the priority substrate Pc. Can start efficiently.

  Further, in the present embodiment, as described above, the control unit 70 determines the number of priority substrates Pc and non-priority substrates Pd to be produced based on the scheduled production number of priority substrates Pc and the scheduled production number of non-priority substrates Pd. The priority ratio is acquired so that production is completed at substantially the same time. As a result, it is possible to acquire a priority ratio such that the production of the priority substrate Pc and the non-priority substrate Pd of the scheduled production number is completed at substantially the same time. Then, by performing the priority mounting control based on the priority ratio, it is possible to prevent the production number balance between the priority lanes 22 and the non-priority lanes 23 from being greatly disturbed, and to produce the number of priority substrates Pc to be produced. Production of both the non-priority substrate Pd and the non-priority substrate Pd can be completed at substantially the same time. In addition, since both the priority lane 22 and the non-priority lane 23 can continue to be operated until the production of both the priority substrate Pc and the non-priority substrate Pd of the planned production number is completed, the priority substrate Pc and the non-priority substrate Pd Can be produced more efficiently. Further, since the production of both the priority substrate Pc and the non-priority substrate Pd of the scheduled production number can be completed at substantially the same time, the operator can perform the work after the production of both the priority substrate Pc and the non-priority substrate Pd. (For example, the setup work) can be started at substantially the same time.

  Further, in the present embodiment, as described above, the control unit 70 is configured to change the priority ratio according to the production status during the production of the substrate P. As a result, even if the production number balance between the priority lane 22 and the non-priority lane 23 is lost during production due to a change in the production number during production or an error stop of the lane being produced, The priority ratio can be changed to an appropriate value according to the production status. As a result, even if the balance of the number of production between the priority lane 22 and the non-priority lane 23 is broken during production, the balance of the number of production between the priority lane 22 and the non-priority lane 23 is prevented from being greatly broken. can do.

  In the present embodiment, as described above, the control unit 70 is configured to change the priority ratio during the production of the substrate P based on at least the remaining production number of the priority substrates Pc. As a result, even when the balance of the number of production between the priority lane 22 and the non-priority lane 23 is lost during production, the production of the number of priority substrates Pc to be produced is surely completed. The priority ratio can be changed. As a result, even when the balance of the number of production between the priority lane 22 and the non-priority lane 23 is lost during production, the production of the number of priority substrates Pc to be produced is surely completed and It is possible to prevent the production number balance with the priority lane 23 from being greatly broken.

  In the present embodiment, as described above, the control unit 70 is configured not to perform the priority mounting control when there is no board P in the other component mounting apparatus 3 arranged on the downstream side. Thereby, when there is no board | substrate P in the other component mounting apparatus 3 arrange | positioned on the downstream side, without performing priority mounting control, the mounting to the board | substrate P is performed rapidly, and other arrangement | positioning on the downstream side is carried out. It can be conveyed to the component mounting apparatus 3. As a result, the operating rate of the other component mounting apparatus 3 on the downstream side can be improved, so that the total production time can be shortened.

[Modification]
In addition, it should be thought that embodiment disclosed this time is an illustration and restrictive at no points. The scope of the present invention is shown not by the above description of the embodiment but by the scope of claims, and further includes meanings equivalent to the scope of claims and all modifications (variants) within the scope.

  For example, in the above-described embodiment, an example in which the component mounting system includes a printing device, three component mounting devices, and a reflow furnace is shown, but the present invention is not limited to this. In the present invention, the component mounting system may include a plurality of printing devices, a plurality of component mounting devices other than one or three, or a plurality of reflow furnaces. Good. Further, the component mounting system may include devices other than the printing device, the component mounting device, and the reflow furnace. For example, the component mounting system may include a print inspection device that inspects the state of the bonding material printed on the substrate, or may include an appearance inspection device that inspects the state of the component mounted on the substrate. .

  Moreover, although the component mounting apparatus has shown the example provided with two head units in the said embodiment, this invention is not limited to this. In the present invention, the component mounting apparatus may include one or three or more head units.

  In the above-described embodiment, an example is shown in which the priority ratio is acquired based on at least the planned number of priority substrates to be produced. However, the present invention is not limited to this. For example, a value input by the producer may be acquired as the priority ratio.

  In the above-described embodiment, the example in which the priority ratio is changed according to the production status during the production of the substrate is shown, but the present invention is not limited to this. For example, during the production of a substrate, the priority ratio may be changed based on an operation of a producer such as an input operation of a new priority ratio.

  In the above embodiment, an example in which the number of priorities (non-priority number) is set based on the ratio of the priorities has been described, but the present invention is not limited to this. In the present invention, the priority number (non-priority number) may be set directly without being based on the priority ratio. For example, the priority number (non-priority number) may be acquired and set based on at least the scheduled production number of priority substrates. Moreover, the value input by the producer may be acquired and set as the priority number (non-priority number).

  Moreover, in the said embodiment, although the process operation | movement of the control part was demonstrated using the flow drive type flowchart which processes in order along a process flow for convenience of explanation, this invention is not limited to this. In the present invention, the processing operation of the control unit may be performed by event-driven (event-driven) processing that executes processing in units of events. In this case, it may be performed by a complete event drive type or a combination of event drive and flow drive.

20a Transport lane (first transport lane)
20b Transport lane (second transport lane)
22 priority lane 23 non-priority lane 30a, 30b head unit 70 control unit 2-4 component mounting device E component P, Pa, Pb substrate Pc priority substrate Pd non-priority substrate

Claims (8)

A first transport lane;
A second transport lane provided independently of the first transport lane;
A head unit for mounting components on a substrate on the first transport lane or the second transport lane;
The priority substrate on the priority lane of the first transport lane and the second transport lane is more than the non-priority substrate on the non-priority lane of the first transport lane and the second transport lane. A control unit for performing preferential mounting control for preferentially mounting the component by the head unit;
The control unit is configured to set the priority of the priority lane and the priority of the non-priority lane as a ratio, and to perform the priority mounting control based on the set priority ratio. , Component mounting equipment.   The component mounting apparatus according to claim 1, wherein the control unit is configured to acquire the priority ratio based on at least a scheduled production number of the priority boards.   The control unit sets the priority level so that the production of the scheduled number of priority boards is completed at the desired production completion time based on the desired production time of the priority lane and the scheduled production number of the priority boards. The component mounting apparatus according to claim 2, wherein the component mounting apparatus is configured to acquire a ratio of   The control unit, based on the scheduled production number of the priority substrate and the scheduled production number of the non-priority substrate, so that the production of the scheduled substrate and the non-priority substrate is completed at substantially the same time. The component mounting apparatus according to claim 2, wherein the component mounting apparatus is configured to acquire a priority ratio.   5. The component mounting apparatus according to claim 1, wherein the control unit is configured to change the priority ratio according to a production state during the production of the substrate.   The component mounting apparatus according to claim 5, wherein the control unit is configured to change the priority ratio based on at least a remaining scheduled number of the priority boards during the production of the boards. .   The said control part is comprised so that the said priority mounting control may not be performed, when the said board | substrate does not exist in the other component mounting apparatus arrange | positioned downstream. Component mounting equipment. A first transport lane;
A second transport lane provided independently of the first transport lane;
A head unit for mounting components on a substrate on the first transport lane or the second transport lane;
The priority substrate on the priority lane of the first transport lane and the second transport lane is more than the non-priority substrate on the non-priority lane of the first transport lane and the second transport lane. A control unit for performing preferential mounting control for preferentially mounting the component by the head unit;
The control unit sets a priority number as a priority in the priority lane or a non-priority number as a priority in the non-priority lane, and the priority based on the set priority number or the non-priority number. A component mounting apparatus configured to perform mounting control.

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