JP2019050372A - Dfbレーザ用のtoパッケージ - Google Patents
Dfbレーザ用のtoパッケージ Download PDFInfo
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Abstract
Description
半導体レーザの放出波長は、温度に依存しているため、多くの用途に関してレーザチップの温度を狭いウインドウ内に保持することが重要である。
これに対して本発明の根底を成す課題は、上述した従来技術の欠点が少なくとも低減されている、コンパクトで簡単に製造可能なTOパッケージを提供することにある。
本発明の課題は、各独立請求項に記載のTOパッケージ、TOパッケージを製造する方法ならびにTOパッケージ用のサブマウントにより解決される。
図1は、本発明の1つの好適な実施例によるTOパッケージ1を示す斜視図である。
2 ベース部品
3 支持体
4 実装領域
5a,5b 導体路
6 端面
7 上面
8a,8b フィードスルー
9 接続ピン
10 ガラス
11a〜11c 接続ピン
12a〜12c 接続ピン
13 アース導体路
14a,14b アース導体路
15 サブマウント
16 TEC
17 L字形部分
18 DFBレーザダイオード
19 サブマウント
20a,20b ボンディングワイヤ
21a,21b ボンディングワイヤ
22 ろう接部
23 実装領域
24 アース導体路
25 導体路
26 導体路
27 ボンディングワイヤ
28 貫通孔
29 コーナー領域
30 コーナー領域
31 コーナー領域
32a,32b 貫通孔
33 厚肉部
34 接続領域
35 金属層
36 サーミスタ
Claims (17)
- TOパッケージ、特にTO−56パッケージであって、熱電冷却機用の実装領域を有するベース部品を備え、前記ベース部品は、光エレクトロニクス素子、特にDFBレーザの接続用の少なくとも2つのフィードスルーを有する、TOパッケージにおいて、
前記ベース部品の床部を起点として支持体が延在しており、前記支持体には少なくとも2つの導体路が配置されており、これらの導体路はそれぞれ、前記光エレクトロニクス素子の接続用の前記フィードスルーのうちの1つと接続されていることを特徴とする、TOパッケージ。 - 前記2つの導体路は曲げられていて、前記支持体の側方に配置された端面に通じている、請求項1記載のTOパッケージ。
- 前記導体路間にアース導体路が配置されている、請求項1または2記載のTOパッケージ。
- 前記導体路は、サブマウント上に配置されており、前記サブマウントは、前記アース導体路の領域に複数の空所、特に貫通孔を有しており、少なくとも、これらの貫通孔の側壁は金属化されている、請求項3記載のTOパッケージ。
- 前記支持体はプレート状に形成されている、請求項1から4までのいずれか1項記載のTOパッケージ。
- 前記フィードスルーと前記導体路とから成る信号路は、それぞれ20〜30Ωのインピーダンスを有しており、
かつ/または前記支持体は、2.0〜3.5mmの高さおよび/または0.3〜1mmの厚さおよび/または1.0〜2.0mmの幅を有しており、
かつ/または前記ベース部品は、5〜7mmの直径および/または0.5〜2.5mmの厚さを有しており、
かつ/または少なくとも前記ベース部品および前記支持体はコーティング、特に金めっきされている、請求項1から5までのいずれか1項記載のTOパッケージ。 - 前記実装領域は、前記ベース部品の上面の中央に配置された領域内に位置しており、前記実装領域の片側だけに、前記光エレクトロニクス素子の接続用の導体路のための前記支持体が位置している、請求項1から6までのいずれか1項記載のTOパッケージ。
- さらに、熱電冷却機ならびに光エレクトロニクス素子を備え、前記熱電冷却機は、前記ベース部品上に配置されており、少なくとも部分的に前記熱電冷却機の上方で前記ベース部品の上面に対して垂直方向に、前記光エレクトロニクス素子を有するサブマウントが延在しており、前記光エレクトロニクス素子を有する前記サブマウントは、前記導体路を有するサブマウントに隣接している、請求項1から7までのいずれか1項記載のTOパッケージ。
- 前記熱電冷却機は、部分的にL字形に形成されており、前記光エレクトロニクス素子を有する前記サブマウントは、L字形の前記熱電冷却機の、前記ベース部品の上面に対して垂直に向けられた側に配置されている、請求項8記載のTOパッケージ。
- 前記光エレクトロニクス素子を有する前記サブマウントは、複数のボンディングワイヤを介して前記導体路を有するサブマウントに接続されており、好適には前記ボンディングワイヤは、それぞれ1mm未満、特に好適には0.5mm未満の長さを有している、請求項8または9記載のTOパッケージ。
- 前記TOパッケージは、複数の接続ピンを介して電子回路、特にドライバ回路に接続されており、好適には、前記ドライバ回路は、20〜30Ωのインピーダンスを有しており、好適には、前記電子回路から前記光エレクトロニクス素子に到るまでの信号路のインピーダンスは、+/−5Ωの前記電子回路のインピーダンスに相当する、請求項1から10までのいずれか1項記載のTOパッケージ。
- 前記ベース部品および前記支持体を打ち抜く、請求項1から11までのいずれか1項記載のTOパッケージを製造する方法。
- 前記ベース部品および前記支持体を単一の原材料片から打ち抜く、請求項12記載のTOパッケージを製造する方法。
- 前記ベース部品と前記支持体とを互いに結合する、特に互いにろう接または溶接する、請求項12記載のTOパッケージを製造する方法。
- 請求項1から14までのいずれか1項記載のTOパッケージ用のサブマウントであって、前記サブマウントは、信号線路として働く少なくとも2つの導体路を有しており、これらの導体路は、前記サブマウントの第1の側から、この第1の側に対して横方向に延びる、前記サブマウントの第2の側に通じており、2つの前記導体路間にはアース導体路が配置されている、サブマウント。
- 請求項1から15までのいずれか1項記載のTOパッケージ用のサブマウントであって、前記サブマウントには、光エレクトロニクス素子が実装されており、前記サブマウントは、縁部側に第1の導体路を有しており、前記第1の導体路は、一方の縁部側の接続領域を形成していると共に、他方の側ではアース導体路により包囲されており、第2の導体路は、一方の縁部から前記光エレクトロニクス素子に通じており、前記第1の導体路は、ボンディングワイヤにより前記光エレクトロニクス素子に接続されている、サブマウント。
- 請求項15または16記載のサブマウントを備える、TOパッケージ。
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DE102017120216.1A DE102017120216B4 (de) | 2017-09-01 | 2017-09-01 | TO-Gehäuse für einen DFB-Laser |
DE102017120216.1 | 2017-09-01 |
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