JP2019050306A - 液浸冷却装置 - Google Patents
液浸冷却装置 Download PDFInfo
- Publication number
- JP2019050306A JP2019050306A JP2017174188A JP2017174188A JP2019050306A JP 2019050306 A JP2019050306 A JP 2019050306A JP 2017174188 A JP2017174188 A JP 2017174188A JP 2017174188 A JP2017174188 A JP 2017174188A JP 2019050306 A JP2019050306 A JP 2019050306A
- Authority
- JP
- Japan
- Prior art keywords
- immersion tank
- immersion
- cooling
- liquid
- cooling system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/2079—Liquid cooling without phase change within rooms for removing heat from cabinets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20263—Heat dissipaters releasing heat from coolant
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
(1)比較技術:液浸冷却システム101の構成
○液浸槽112の大きさ:幅0.6×奥0.75×液高0.9m
○液浸槽内ICT機器容積:96L
(2)本実施形態:液浸冷却システム1の構成
○液浸槽12の大きさ:直径0.75×液高0.9m
○液浸槽内ICT機器容積:96L
○筐体11(一次冷却槽)の大きさ:幅(1.0m、1.2m、1.4m、1.6mから選択)×奥0.75×液高0.9m
10 液浸冷却装置
202 熱交換器
11 筐体
12、112、212 液浸槽
13、113、213 ICT機器(電子機器)
14、114、214 実装レール
16 一次冷却系冷媒(一次冷媒)
17、117、217 液浸槽冷却液(二次冷媒)
18 駆動機構
19、203 チラー
120 クーリングタワー
121、221 液浸槽冷却液用ポンプ
21 一次冷却系冷媒用ポンプ
22 第1撹拌フィン
23 第2撹拌フィン
24 第1膨出部
25 第2膨出部
26 モータ
27 ギア
28 液浸槽回転ギア
29 回転軸
30、131 配管
230 一次冷媒用配管
130 散水用配管
132 送風ファン
133 散水ポンプ
20、232 コンプレッサ
31 開閉蓋
32 回転支持軸
33 回転軸受
34 設置脚
35 凸部
37 取っ手
38 固定用支持部材
39 ローラ
40 支持部
41 引き出し口
Claims (5)
- 電子機器及び二次冷媒を格納し、前記電子機器を前記二次冷媒に浸し液冷する液浸槽と、
前記液浸槽及び一次冷媒を格納し、前記液浸槽を前記一次冷媒に浸し液冷する筐体と、
前記液浸槽を回転させる駆動部と、を備え、
前記液浸槽は、前記筐体内において回転可能に取付けられるとともに、前記電子機器が格納される側の内面と前記内面の反対側の外面とのそれぞれに凸部を有する、
液浸冷却装置。 - 前記凸部は、前記一次冷媒及び前記二次冷媒を撹拌するヒレ状に形成されたフィンを含む、請求項1に記載の液浸冷却装置。
- 前記凸部は、前記液浸槽の一部が、前記電子機器が格納される側又は前記電子機器が格納される側の反対側に膨出するよう形成された膨出部を含む、請求項1又は2に記載の液浸冷却装置。
- 前記液浸槽は回転軸を中心にした円筒状に形成され、前記凸部は前記液浸槽の底部において前記回転軸から放射状に配置される、請求項1から3のいずれか一項に記載の液浸冷却装置。
- 前記二次冷媒の電気伝導率は、前記一次冷媒の電気伝導率より低い、請求項1から4のいずれか一項に記載の液浸冷却装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017174188A JP6919442B2 (ja) | 2017-09-11 | 2017-09-11 | 液浸冷却装置 |
US16/114,934 US10356958B2 (en) | 2017-09-11 | 2018-08-28 | Immersion cooling apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017174188A JP6919442B2 (ja) | 2017-09-11 | 2017-09-11 | 液浸冷却装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019050306A true JP2019050306A (ja) | 2019-03-28 |
JP6919442B2 JP6919442B2 (ja) | 2021-08-18 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017174188A Active JP6919442B2 (ja) | 2017-09-11 | 2017-09-11 | 液浸冷却装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US10356958B2 (ja) |
JP (1) | JP6919442B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022138210A1 (ja) * | 2020-12-23 | 2022-06-30 | 株式会社資生堂 | 化粧品成形装置、及び化粧品成形装置における棒状化粧品の成形方法 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111324189A (zh) * | 2018-12-15 | 2020-06-23 | 鸿富锦精密电子(天津)有限公司 | 散热装置及应用所述散热装置的服务器 |
US11006547B2 (en) * | 2019-03-04 | 2021-05-11 | Baidu Usa Llc | Solution for precision cooling and fluid management optimization in immersion cooling |
US10765033B1 (en) * | 2019-05-23 | 2020-09-01 | Microsoft Technology Licensing, Llc | Immersion cooling enclosures with insulating liners |
CN111077970B (zh) * | 2019-11-28 | 2021-06-22 | 江苏德普尔门控科技有限公司 | 一种自动门控电子配件检测设备组装型机箱 |
US11528827B2 (en) | 2020-01-10 | 2022-12-13 | Liquidstack Holding B.V. | Method and system for in-situ measuring of a heat transfer fluid in a device for immersion cooling and device for immersion cooling |
CN112333988B (zh) * | 2020-11-11 | 2022-06-21 | 广州电力通信网络有限公司 | 一种基于智能化动态调节的数据中心制冷系统 |
CN113015394A (zh) * | 2021-03-02 | 2021-06-22 | 豪业(广州)五金有限公司 | 一种用于信号基站机房的节能型日常维护装置 |
CN114153292B (zh) * | 2021-11-18 | 2023-08-22 | 南方电网数字电网研究院有限公司 | 一种服务器散热装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04372159A (ja) * | 1991-06-21 | 1992-12-25 | Fujitsu Ltd | 半導体装置の冷却装置及び冷却方法 |
JPH05118773A (ja) * | 1991-10-25 | 1993-05-14 | Fuji Electric Co Ltd | 油冷却装置 |
JP2017050548A (ja) * | 2016-10-13 | 2017-03-09 | 株式会社ExaScaler | 電子機器の冷却システム |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101115711B1 (ko) | 2008-04-21 | 2012-06-13 | 하드코어 컴퓨터, 인크. | 전자장치 어레이의 액체 잠김 냉각형 케이스 및 랙 시스템 |
US8902033B2 (en) * | 2012-04-18 | 2014-12-02 | Hamilton Sundstrand Corporation | Sealed inductor connection using litz wire |
US9921622B2 (en) * | 2013-02-01 | 2018-03-20 | Dell Products, L.P. | Stand alone immersion tank data center with contained cooling |
-
2017
- 2017-09-11 JP JP2017174188A patent/JP6919442B2/ja active Active
-
2018
- 2018-08-28 US US16/114,934 patent/US10356958B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04372159A (ja) * | 1991-06-21 | 1992-12-25 | Fujitsu Ltd | 半導体装置の冷却装置及び冷却方法 |
JPH05118773A (ja) * | 1991-10-25 | 1993-05-14 | Fuji Electric Co Ltd | 油冷却装置 |
JP2017050548A (ja) * | 2016-10-13 | 2017-03-09 | 株式会社ExaScaler | 電子機器の冷却システム |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022138210A1 (ja) * | 2020-12-23 | 2022-06-30 | 株式会社資生堂 | 化粧品成形装置、及び化粧品成形装置における棒状化粧品の成形方法 |
Also Published As
Publication number | Publication date |
---|---|
US20190082556A1 (en) | 2019-03-14 |
JP6919442B2 (ja) | 2021-08-18 |
US10356958B2 (en) | 2019-07-16 |
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