JP2019050267A - Hollow package container and semiconductor element package - Google Patents

Abstract

To provide a hollow package container which inhibits a package from being cracked in the case where the package is exposed at a high temperature, and a semiconductor element package using the hollow package container.SOLUTION: The present invention relates to a hollow package container 110 in which an opening of a recess 111 is closed by a transparent plate 130, thereby forming a hollow part 112 for accommodating a semiconductor element 120 therein. The hollow package container comprises: a support member 113 for supporting the semiconductor element; a resin frame 114 which is disposed on the support member or in an outer peripheral part of the support member and constitutes the recess together with the support member; and a metal wire 115 including an internal terminal 115a exposed in the recess and an external terminal 115b which is conducted with the internal terminal and exposed to an outside of the hollow package container. The resin frame includes a ventilation part causing the recess to communicate with the outside of the resin frame.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a hollow package container and a semiconductor device package.

  Many semiconductor devices are sealed, packaged, and used in a state of being shut off from the outside air because the characteristics may be affected by changes in ambient humidity and dew condensation. When packaging a solid-state imaging device such as a CCD or C-MOS, which is one of semiconductor devices, it is necessary to secure a light transmission path between the semiconductor device mounted in the package and the outside of the package. Therefore, in order to package the solid-state imaging device, the solid-state imaging device is mounted on a hollow package container having a recess, and the opening of the recess is sealed using a transparent window material such as a glass plate. An element package is used.

  FIG. 1 is a cross-sectional view showing the configuration of a conventional semiconductor device package. As shown in FIG. 1, in Patent Document 1, a metal plate 5, a resin frame 3 disposed on the outer periphery thereof, leads 1 and 2, and a recess formed of the metal plate 5 and the resin frame 3 A semiconductor element package 10 is disclosed having a semiconductor element 7 mounted and a lid member 9 forming a hollow portion 20 by closing a recess in which the semiconductor element 7 is mounted.

JP, 2006-278607, A

  Such a semiconductor element package is mounted on a printed wiring board or the like through a reflow soldering process or the like. In the reflow soldering process, the semiconductor device package is exposed to high temperatures. However, when the conventional semiconductor device package as shown in Patent Document 1 is exposed to high temperature, the air in the hollow portion 20 expands and the pressure in the hollow portion 20 tends to rise. As a result, there is a problem that the package body 3 made of resin is easily cracked.

  The present invention has been made in view of such circumstances, and it is an object of the present invention to provide a container for a hollow package capable of suppressing a crack of the package when exposed to high temperature and a semiconductor element package using the same. Do.

  The container for a hollow package according to the present invention is a container for a hollow package in which a hollow portion for housing a semiconductor element is formed by closing an opening of a recess with a transparent plate, and for supporting the semiconductor element And a resin frame disposed on the support member or on an outer peripheral portion of the support member and forming the recess together with the support member, conducting to the internal terminal exposed to the recess and the internal terminal, And a metal wire having an external terminal exposed to the outside of the hollow package container, wherein the resin frame has a vent portion communicating the recess with the outside of the resin frame.

  A semiconductor device package according to the present invention includes a container for a hollow package according to the present invention, a semiconductor device housed in the recess of the container for a hollow package, and electrically connected to the internal terminal, and the semiconductor device And a transparent plate placed so as to close the opening of the recessed portion accommodated.

  The present invention can provide a hollow package container capable of suppressing package cracks when exposed to high temperatures, and a semiconductor device package using the same.

FIG. 1 is a cross-sectional view showing the configuration of a conventional semiconductor device package. FIGS. 2A and 2B are diagrams showing the configuration of the semiconductor element package according to the present embodiment. 3A and 3B are diagrams showing the configuration of the hollow package container according to the present embodiment. FIG. 4 is a view showing a part of the manufacturing process of the semiconductor element package. 5A and 5B are diagrams showing the configuration of a hollow package container according to a modification. 6A and 6B are diagrams showing the configuration of a hollow package container according to a modification. FIG. 7 is a partially enlarged cross-sectional view of the hollow package container of FIG. 6A taken along line A-A. 8A to 8E are cross-sectional views showing the configuration of a semiconductor device package using a hollow package container according to a modification.

  Hereinafter, a hollow package container and a semiconductor element package according to an embodiment of the present invention will be described in detail with reference to the drawings.

(Structure of semiconductor device package)
2A and 2B are diagrams showing the configuration of the semiconductor element package 100 according to the present embodiment. FIG. 2A is a perspective view of the semiconductor device package 100, and FIG. 2B is a cross-sectional view taken along line 2B-2B shown in FIG. 2A. In the figure, the adhesive layer disposed between the hollow package container 110 and the transparent plate 130 is not shown.

  As shown in FIGS. 2A and 2B, the semiconductor device package 100 according to the present embodiment includes the hollow package container 110, the semiconductor device 120 accommodated in the recess 111, and the recess 111 in which the semiconductor device 120 is accommodated. And a transparent plate 130 for closing the opening of the lens.

  The hollow package container 110 is a container having a recess 111 for housing the semiconductor element 120. The recessed portion 111 becomes a hollow portion 112 when the opening is closed by the transparent plate 130. The hollow package container 110 includes a support member 113, a resin frame 114 disposed on the outer peripheral portion thereof, and a metal wiring 115. The specific configuration of the hollow package container 110 will be separately described in detail.

  The semiconductor device 120 may be, for example, a solid-state imaging device such as a C-MOS or a CCD. The semiconductor element 120 is accommodated in the recess 111 (the hollow portion 112 of the semiconductor element package 100) of the hollow package container 110, and is electrically connected to the internal terminal 115a of the metal wiring 115 (not shown).

  The transparent plate 130 is not particularly limited as long as it is a plate capable of transmitting light detected by the semiconductor element 120, and is, for example, a transparent glass plate or a transparent resin plate. The transparent plate 130 can be fixed to the hollow package container 110 via, for example, an adhesive layer. Accordingly, light incident from the outside can reach the semiconductor element 120 through the transparent plate 130.

(Configuration of container for hollow package)
3A and 3B are diagrams showing an example of the configuration of the hollow package container 110 according to the present embodiment. FIG. 3A is a perspective view of the hollow package container 110, and FIG. 3B is a partially enlarged perspective view of the vicinity of the ventilation part 116.

  As shown in FIG. 3A, the hollow package container 110 includes a support member 113, a resin frame 114, and a metal wire 115.

  The support member 113 is a member for supporting the semiconductor element 120, and constitutes a bottom portion of the hollow package container 110. The support member 113 is not particularly limited as long as it is a member capable of supporting, for example, the semiconductor element 120. For example, a heat sink or a base plate (a metal plate having positioning holes etc.), a ceramic plate, or a printed circuit board (resin base material etc.) A substrate including an insulating substrate of the above and a conductive wire arranged in a pattern thereon, specifically, a glass epoxy substrate, a polyimide substrate, a ceramic substrate, etc.). The support member 113 may be configured by only one type, or may be configured by combining two or more types (for example, a printed circuit board and a heat sink). In the present embodiment, the support member 113 is a heat sink.

  The heat sink and the base plate are usually metal plates. Examples of the material constituting the metal plate include copper, iron, aluminum, an alloy thereof or a 42 alloy, and the like, and a 42 alloy or a copper alloy is preferable because of high heat dissipation.

  The thickness of the support member 113 is not particularly limited, but it is preferably 0.3 mm to 2 mm and 0.4 mm to 1.2 mm from the viewpoint of enhancing the heat capacity of the hollow package to enhance the heat capacity as a heat sink. Is more preferred.

  The resin frame 114 is a resin molded body disposed on the outer peripheral portion of the support member 113 and constituting a recess 111 for housing the semiconductor element 120 together with the support member 113. The shape of the resin frame 114 in a plan view is not particularly limited, but is usually substantially rectangular. The substantially rectangular shape also includes a rounded rectangular shape with rounded corners. The resin material constituting the resin frame 114 is preferably a thermosetting resin from the viewpoint of being able to be molded by transfer molding or the like. Examples of thermosetting resins include epoxy resins, polyimides, phenolic resins and unsaturated polyester resins.

  The resin frame 114 has a vent portion 116 communicating the recess 111 with the outside of the resin frame 114. The ventilation part 116 may be a through hole, may be a groove, or may be a rough part. In the present embodiment, the ventilation portion 116 is a groove disposed on the surface (top surface) on which the transparent plate 130 of the resin frame 114 is placed.

  The shape of the ventilation portion 116 may be linear, curved or cranked. In the present embodiment, the shape of the ventilation portion 116 is linear.

  The depth of the ventilation portion 116 is so that air can be released so that the pressure in the hollow portion 112 does not increase excessively under high temperature while suppressing the moisture in the outside air from entering the hollow portion 112. It is preferable that the depth is

  The number of vents 116 may be one or more. In the present embodiment, the number of vents 116 is three.

  The ventilation part 116 can be disposed at any position. In the present embodiment, the ventilation portion 116 is disposed inside the resin frame 114 so as to open at a corner. The corner of the resin frame 114 refers to a range from the corner to 25% of the length of one side on the inner side of the resin frame 114 when the resin frame 114 is viewed in plan. As a result, even if external moisture or unexpected dust or the like infiltrates into the hollow portion 112 from the ventilation portion 116, it is difficult to diffuse onto the semiconductor element 120 and damage to the semiconductor element 120 is minimized. Can. The vent portion 116 may be opened at an arbitrary position outside the resin frame 114.

  A water trap portion (not shown) may be further disposed in at least a part of the ventilation portion 116 to prevent water in the outside air from intruding into the hollow portion 112. Examples of water trap sections include mesh sections such as HEPA filters.

  The metal wire 115 has an internal terminal 115a electrically connectable to the connection terminal of the mounted semiconductor element 120, and an external terminal 115b electrically connected to the internal terminal 115a (see FIGS. 2B and 3A). A part of the internal terminal 115 a is exposed in the recess 111, and a part of the external terminal 115 b is exposed to the outside of the hollow package container 110. Specifically, “exposed to the outside of the hollow package container 110” means exposed to the side surface or bottom surface of the resin frame 114 or the bottom surface (back surface) of the support member 113.

  In the present embodiment, the metal wiring 115 may be a plurality of leads disposed so as to surround the periphery of the mounting surface of the semiconductor element 120 (the bottom surface of the hollow portion 112). That is, in the present embodiment, the internal terminal 115a is also referred to as an inner lead, and the external terminal 115b is also referred to as an outer lead.

  The material constituting the metal wiring 115 may be any material having conductivity, and is not particularly limited, and examples thereof include copper, iron, aluminum, alloys or alloys of these, 42 alloy or copper Alloys are preferred. The thickness of the metal wiring 115 is preferably 0.1 mm to 0.3 mm, and more preferably 0.15 mm to 0.25 mm.

(Container for hollow package and method of manufacturing semiconductor device package)
The hollow package container 110 can be manufactured by insert molding. Insert molding may be transfer molding or injection molding or the like. Specifically, the hollow package container 110 is a mold for forming the metal wiring 115 and the support member 113 (for example, a metal frame in which a metal island and a metal lead are connected by an outer frame and integrated). And a step of filling the thermosetting resin in a molding die in which at least the metal wiring 115 and the like are inserted, and curing. Then, the obtained molded product is taken out from the molding die, and an unnecessary portion (for example, an outer frame connecting a metal island and a lead) is removed to obtain the hollow package container 110.

  The semiconductor device package 100 can be manufactured by the following procedure. The semiconductor element 120 is disposed in the recess 111 of the hollow package container 110, and the connection terminal of the semiconductor element 120 and the internal terminal 115 a of the hollow package container 110 are electrically connected. The electrical connection can be made, for example, by wire bonding or flip chip. And the opening part of the recessed part 111 in which the semiconductor element 120 was accommodated can be closed and fixed with the transparent plate 130, and the semiconductor element package 100 can be obtained.

  The fixing method of the transparent plate 130 is not particularly limited, but can be performed using, for example, an adhesive. FIG. 4 is a view showing a part of the manufacturing process of the semiconductor element package. As shown in FIG. 4, for example, after the adhesive layer 140 is formed on the surface on which the transparent plate 130 of the resin frame 114 of the hollow package container 110 is mounted, the transparent plate 130 is mounted and fixed. Can. However, from the viewpoint of preventing the ventilation portion 116 from being blocked by the adhesive layer 140, for example, in the area of the resin frame 114 on which the transparent plate 130 is placed, the adhesive is disposed in the region where the ventilation portion 116 is disposed. It is preferable not to form a layer (to form the non-formation portion 140A).

(effect)
The effects of the semiconductor element package 100 according to the present embodiment will be described in comparison with the conventional semiconductor element package 10.

  As described above, the conventional semiconductor device package 10 as shown in FIG. 1 does not have the vent portion communicating the hollow portion 20 with the outside of the semiconductor device package 10. Therefore, for example, when being mounted on a printed wiring board, when exposed to a high temperature such as a reflow soldering process, the air in the hollow portion 20 expands and the pressure in the hollow portion 20 tends to rise. As a result, the pressure difference between the inside and the outside of the hollow portion 20 becomes large, and the semiconductor element package 10 is easily cracked.

  On the other hand, the semiconductor device package 100 according to the present embodiment has the ventilation portion 116 which communicates the hollow portion 112 with the outside of the semiconductor device package 100. Accordingly, the semiconductor element package 100 according to the present embodiment can extract the air expanded in the hollow portion 112 to the outside of the hollow package container 110 even under high temperature such as a reflow soldering process. As a result, since the pressure inside the hollow portion 112 can be suppressed from rising excessively, the pressure difference between the inside and the outside of the hollow portion 112 can be reduced, and the generation of a crack in the semiconductor element package 100 can be suppressed. it can.

(Modification)
In the present embodiment, an example in which the ventilation portion 116 is a linear groove disposed on the top surface of the resin frame 114 has been described. However, the present invention is not limited to this. Groove or the like may be used.

  5A and 5B are diagrams showing the configuration of a hollow package container 210 according to a modification. FIG. 5A is a perspective view of the hollow package container 210, and FIG. 5B is a partially enlarged perspective view of the vicinity of the ventilation part 216. As shown in FIGS. 5A and B, the vent 216 may be a crank shaped groove. Such a crank-like groove can make it more difficult for moisture and the like in the outside air to infiltrate into the hollow portion 112 than a linear groove.

  Moreover, although the example which the ventilation | gas_flowing part 116 is arrange | positioned only to one corner | angular part among four corner | angular parts of the resin frame 114 was shown in this Embodiment, it is not limited to this, It may be arranged.

  Further, although the present embodiment shows an example in which the ventilation portion 116 is a groove disposed on the top surface of the resin frame 114, the present invention is not limited thereto, and a rough surface portion disposed on the top surface of the resin frame 114 It may be (convex and concave) or may be a through hole disposed in the resin frame 114.

  6A and 6B are diagrams showing the configuration of a hollow package container 310 according to a modification. FIG. 6A is a perspective view of the hollow package container 310, and FIG. 6B is a partially enlarged perspective view of the vicinity of the ventilation part 316. FIG. 7 is a partial enlarged cross-sectional view of line AA in the vicinity of the ventilation portion 316 of FIG. 6A. As shown in FIGS. 6A, B and 7, the venting portion 316 may be a rough surface portion disposed on the top surface of the resin frame 114 and roughened by, for example, a laser beam. The surface roughness of the rough surface portion is preferably such a size that the dust can be trapped at an expected dust level of the use environment while securing air permeability. Such a rough surface portion can make it more difficult for moisture and the like in the outside air to infiltrate into the hollow portion 112 than the groove.

  Further, in the present embodiment, an example in which the ventilation portion 116 is disposed in the resin frame 114 of the hollow package container 110 has been described, but the present invention is not limited thereto. The resin frame 114 of the hollow package container 110 and the transparent plate It may be disposed on an adhesive layer between 130 and 130. That is, the venting portion may be a venting portion disposed between the hollow package container and the transparent plate, specifically, a venting portion in which at least the inner wall surface is formed of an adhesive layer. As a result, it is possible to eliminate the need to arrange the vent in the hollow package container 110 itself.

  Further, although the example in which the support member 113 and the resin frame 114 are separately formed is shown in the present embodiment, the present invention is not limited to this, and the support member 113 and the resin frame 114 may be integrally formed according to the type of the support member 113. Good.

  In the present embodiment, an example in which the resin frame 114 is disposed on the outer peripheral portion of the support member 113 is shown, but the present invention is not limited to this. The resin frame 114 is supported according to the type of the support member 113. It may be disposed only on the surface of the member 113, or may be disposed on both the surface and the outer periphery.

  8A to 8E are cross-sectional views of a semiconductor device package using hollow package containers 410 to 810 according to modifications.

  As shown in FIG. 8A, the support member 113 and the resin frame 114 may be integrally formed. The support member 113 is a resin member.

  As shown in FIG. 8B, the support member 113 and the resin frame 114 may be integrally formed. The support member 113 may further have a buried metal island 113A. Examples of the material of the metal island 113A include the same as the material of the metal lead.

  As shown in FIGS. 8C-E, the support member 213 may be a printed circuit board. In that case, the internal terminal 115a of the metal wiring 115 is disposed on the surface of the printed board, and is also referred to as an internal electrode. The external terminal 115 b of the metal wiring 115 is disposed on the back surface of the printed board, and is also referred to as an external electrode or a back surface electrode. The internal terminals 115a and the external terminals 115b can be electrically connected by through holes or conductors (not shown) provided on the printed circuit board. The resin frame 114 may be disposed on the surface (see FIGS. 8C and 8E) of the support member 213, or may be disposed on both the surface and the outer peripheral portion (see FIG. 8D).

  The container for hollow package and the semiconductor device package of the present invention can be used, for example, in a solid-state imaging device.

DESCRIPTION OF SYMBOLS 100 Semiconductor element package 110, 210, 310, 410, 510, 610, 710, 810 Container 111 for hollow package 111 recessed part 112 Hollow part 113, 213 Support member 113A Metal island 114 Resin frame 115 Metal wiring 115a Internal terminal 115b External terminal 116, 216, 316 Ventilation part 120 Semiconductor device 130 Transparent plate 140 Adhesive layer 140A Non-formed part

Claims (7)

A container for a hollow package, wherein a hollow portion for housing a semiconductor element is formed by closing an opening of a recess with a transparent plate,
A support member for supporting the semiconductor device;
A resin frame disposed on the support member or at an outer peripheral portion of the support member and constituting the recess together with the support member;
A metal wire having an internal terminal exposed in the recess and an external terminal electrically connected to the internal terminal and exposed to the outside of the hollow package container;
Have
The resin frame has a vent portion communicating the recess with the outside of the resin frame.
Container for hollow package. The ventilation portion is a groove disposed on the surface of the resin frame on which the transparent plate is placed.
The container for hollow package according to claim 1. The shape of the groove is linear or cranked,
The hollow package container according to claim 2. The ventilation portion is a rough surface portion disposed on the surface of the resin frame on which the transparent plate is mounted.
The container for hollow package according to claim 1. The support member and the resin frame are integral,
The container for hollow package according to any one of claims 1 to 4. The support member and the resin frame are separate members,
The container for hollow package according to any one of claims 1 to 4. A container for a hollow package according to any one of claims 1 to 6,
A semiconductor element accommodated in the recess of the hollow package container and electrically connected to the internal terminal;
A transparent plate placed so as to close the opening of the recess in which the semiconductor element is accommodated;
Have
Semiconductor device package.

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