JP2019044128A - Resin composition - Google Patents

Abstract

To provide a resin composition that makes it possible to obtain an insulating layer having high adhesion to a conductor layer after an HAST test, and has a low melt viscosity; a resin sheet containing the resin composition; and a printed wiring board having an insulating layer formed with the resin composition, and a semiconductor device.SOLUTION: A resin composition contains (A) an epoxy resin, and (B) a resin composition containing a maleimide compound, the (B) component having at least one of an alkyl group with 5 or more carbon atoms and an alkylene group with 5 or more carbon atoms.SELECTED DRAWING: None

Description

  The present invention relates to a resin composition. Furthermore, the present invention relates to a resin sheet, a printed wiring board, and a semiconductor device obtained using the resin composition.

  As a manufacturing technique of a printed wiring board, a manufacturing method by a build-up method in which insulating layers and conductor layers are alternately stacked is known.

  As an insulating material of a printed wiring board used for such an insulating layer, for example, Patent Document 1 discloses a maleimide compound (A), an epoxy compound (B), a cyanate ester compound (C) having a melting point of 40 ° C. or less And a thermosetting resin composition containing an inorganic filler (D) are disclosed.

JP, 2016-010964, A

  From the viewpoint of enabling formation of fine pattern wiring, from the viewpoint of enhancing the mounting reliability of the printed wiring board, and from the viewpoint of enhancing the connection reliability of the printed wiring board, it is desirable that the adhesion of the insulating layer to the conductor layer be high. Therefore, in recent years, as the performance of the insulating layer, it is required to have high adhesion to the conductor layer. Further, in order to enhance the long-term reliability of the printed wiring board, it is desirable that the adhesion of the insulating layer to the conductor layer be high even after the ultra-accelerated high temperature and high humidity life test (HAST test). In addition, it is also required to keep the melt viscosity low and to improve the wiring embedding property.

  As described above, Patent Document 1 discloses that a resin composition used for an insulating layer of a printed wiring board contains maleimide. However, Patent Document 1 does not discuss at all the adhesion and the wiring embedding after the HAST test. The present inventors have found that by using a predetermined maleimide compound for the resin composition, the adhesion between the conductor layer and the insulating layer can be maintained even after the HAST test. Moreover, it discovered that it was excellent also in wiring embedding property by using a predetermined | prescribed maleimide compound for resin composition. Thus, as far as the present inventors know, the technical idea of obtaining an insulating layer capable of maintaining high adhesion after the HAST test by incorporating a predetermined maleimide compound into the resin composition is as far as possible. It can be said that it was not proposed.

  The object of the present invention is to provide a resin composition capable of obtaining an insulating layer having high adhesion to a conductor layer after HAST test and having a low melt viscosity; a resin sheet containing the resin composition; the resin composition It is providing a printed wiring board provided with the insulating layer formed using the above, and a semiconductor device.

  In order to achieve the object of the present invention, as a result of intensive investigations by the present inventors, it is possible to maintain the adhesion between the conductor layer and the insulating layer even after the HAST test by containing a predetermined maleimide compound. Found out. Moreover, in addition to said adhesiveness, it is excellent also in smear removal property, and it discovers that the melt viscosity of a resin composition becomes low, and came to complete this invention.

一般式（Ｂ−１）中、Ｒはそれぞれ独立に置換基を有していてもよい炭素原子数が５以上のアルキレン基を表し、Ｌは単結合又は２価の連結基を表す。
［３］ （Ｂ）成分の含有量が、樹脂組成物中の不揮発成分を１００質量％とした場合、０．１質量％以上１０質量％以下である、［１］又は［２］に記載の樹脂組成物。
［４］ 更に、（Ｃ）活性エステル化合物を含む、［１］〜［３］のいずれかに記載の樹脂組成物。
［５］ （Ｃ）成分の含有量が、樹脂組成物中の不揮発成分を１００質量％とした場合、５質量％以上である、［４］に記載の樹脂組成物。
［６］ 更に、（Ｄ）無機充填材を含む、［１］〜［５］のいずれかに記載の樹脂組成物。
［７］ （Ｄ）成分の含有量が、５０質量％以上である、［６］に記載の樹脂組成物。
［８］ 一般式（Ｂ−１）中、Ｌは、酸素原子、置換基を有していてもよい炭素原子数６〜２４のアリーレン基、置換基を有していてもよい炭素原子数が１〜５０のアルキレン基、炭素原子数が５以上のアルキル基、フタルイミド由来の２価の基、ピロメリット酸ジイミド由来の２価の基、又はこれらの基の２以上の組み合わせからなる２価の基である、［１］〜［７］のいずれかに記載の樹脂組成物。
［９］ （Ｂ）成分が、下記一般式（Ｂ−２）で表される、［１］〜［８］のいずれかに記載の樹脂組成物。

一般式（Ｂ−２）中、Ｒ’はそれぞれ独立に置換基を有していてもよい炭素原子数が５以上のアルキレン基を表し、Ａはそれぞれ独立に置換基を有していてもよい炭素原子数が５以上のアルキレン基又は置換基を有していてもよい芳香環を有する２価の基を表す。ｎは１〜１０の整数を表す。
［１０］ 一般式（Ｂ−２）中、Ａはそれぞれ独立に、置換基を有していてもよい炭素原子数が５以上の環状のアルキレン基；置換基を有していてもよいベンゼン環を有する２価の基；置換基を有していてもよいフタルイミド環を有する２価の基；又は置換基を有していてもよいピロメリット酸ジイミド環を有する２価の基を表す、［９］に記載の樹脂組成物。
［１１］ プリント配線板の絶縁層形成用である、［１］〜［１０］のいずれかに記載の樹脂組成物。
［１２］ プリント配線板の層間絶縁層形成用である、［１］〜［１１］のいずれかに記載の樹脂組成物。
［１３］ 支持体と、該支持体上に設けられた［１］〜［１２］のいずれかに記載の樹脂組成物で形成された樹脂組成物層とを含む、樹脂シート。
［１４］ 樹脂組成物層の厚みが２５μｍ以下である、［１３］に記載の樹脂シート。
［１５］ 第１の導体層、第２の導体層、及び、第１の導体層と第２の導体層との間に形成された絶縁層を含むプリント配線板であって、
該絶縁層は、［１］〜［１２］のいずれかに記載の樹脂組成物の硬化物である、プリント配線板。
［１６］ ［１５］に記載のプリント配線板を含む、半導体装置。 That is, the present invention includes the following contents.
[1] A resin composition comprising (A) an epoxy resin, and (B) a maleimide compound,
A resin composition, wherein the component (B) contains at least one of an alkyl group having 5 or more carbon atoms and an alkylene group having 5 or more carbon atoms.
[2] The resin composition according to [1], wherein the component (B) is represented by the following general formula (B-1).

In general formula (B-1), R each independently represents an alkylene group having 5 or more carbon atoms which may have a substituent, and L represents a single bond or a divalent linking group.
[3] The component according to [1] or [2], wherein the content of the component (B) is 0.1 mass% or more and 10 mass% or less when the nonvolatile component in the resin composition is 100 mass%. Resin composition.
[4] The resin composition according to any one of [1] to [3], further comprising (C) an active ester compound.
[5] The resin composition according to [4], wherein the content of the component (C) is 5% by mass or more when the nonvolatile component in the resin composition is 100% by mass.
[6] The resin composition according to any one of [1] to [5], further comprising (D) an inorganic filler.
[7] The resin composition according to [6], wherein the content of the component (D) is 50% by mass or more.
[8] In the general formula (B-1), L represents an oxygen atom, an arylene group having 6 to 24 carbon atoms which may have a substituent, or the number of carbon atoms which may have a substituent A divalent group consisting of an alkylene group of 1 to 50, an alkyl group having 5 or more carbon atoms, a divalent group derived from phthalimide, a divalent group derived from pyromellitic diimide, or a combination of two or more of these groups The resin composition in any one of [1]-[7] which is group.
[9] The resin composition according to any one of [1] to [8], wherein the component (B) is represented by the following general formula (B-2).

In general formula (B-2), R 'each independently represents an alkylene group having 5 or more carbon atoms which may have a substituent, and A may independently have a substituent. It represents a divalent group having an alkylene group having 5 or more carbon atoms or an aromatic ring which may have a substituent. n represents an integer of 1 to 10.
[10] In the general formula (B-2), each A independently represents a cyclic alkylene group having 5 or more carbon atoms which may have a substituent; a benzene ring which may have a substituent Or a divalent group having a phthalimide ring which may have a substituent; or a divalent group having a pyromellitic diimide ring which may have a substituent [ The resin composition as described in 9].
[11] The resin composition according to any one of [1] to [10], which is for forming an insulating layer of a printed wiring board.
[12] The resin composition according to any one of [1] to [11], which is for forming an interlayer insulating layer of a printed wiring board.
[13] A resin sheet comprising a support and a resin composition layer formed of the resin composition according to any one of [1] to [12] provided on the support.
[14] The resin sheet according to [13], wherein the thickness of the resin composition layer is 25 μm or less.
[15] A printed wiring board comprising a first conductor layer, a second conductor layer, and an insulating layer formed between the first conductor layer and the second conductor layer,
The printed wiring board, wherein the insulating layer is a cured product of the resin composition according to any one of [1] to [12].
[16] A semiconductor device comprising the printed wiring board according to [15].

  According to the present invention, it is possible to obtain an insulating layer having high adhesion to a conductor layer after the HAST test, and having a low melt viscosity; a resin sheet containing the resin composition; and the resin composition A printed wiring board provided with the insulating layer formed using the above, and a semiconductor device can be provided.

FIG. 1 is a partial cross-sectional view schematically showing an example of a printed wiring board.

  Hereinafter, the resin composition, the resin sheet, the printed wiring board, and the semiconductor device of the present invention will be described in detail.

[Resin composition]
The resin composition of the present invention contains (A) an epoxy resin and (B) a maleimide compound, and the component (B) is at least an alkyl group having 5 or more carbon atoms and an alkylene group having 5 or more carbon atoms. Including any.

  By containing a maleimide compound containing at least one of an alkyl group having 5 or more carbon atoms and an alkylene group having 5 or more carbon atoms in the resin composition, even after the HAST test, the maleimide compound is between the conductor layer and It is possible to obtain a cured product which can maintain adhesion and is also excellent in smear removability. Further, by incorporating the maleimide compound into the resin composition, a resin composition having a low melt viscosity can be obtained. And normally, the cured | curing material which can maintain high adhesiveness even after a HAST test can exhibit high adhesiveness over a long period of time normally.

  The resin composition may contain (C) an active ester compound, (D) an inorganic filler, (E) a curing agent, (F) a curing accelerator, (G), if necessary, in addition to the components (A) to (B). A thermoplastic resin, and (H) optional additives may be included. Hereinafter, each component contained in the resin composition of this invention is demonstrated in detail.

<(A) Epoxy resin>
The resin composition contains (A) an epoxy resin. (A) As an epoxy resin, for example, bixylenol type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol AF type epoxy resin, dicyclopentadiene type epoxy resin, trisphenol type Epoxy resin, naphthol novolac epoxy resin, phenol novolac epoxy resin, tert-butyl-catechol epoxy resin, naphthalene epoxy resin, naphthol epoxy resin, anthracene epoxy resin, glycidyl amine epoxy resin, glycidyl ester epoxy resin Cresol novolac epoxy resin, biphenyl epoxy resin, linear aliphatic epoxy resin, epoxy resin having butadiene structure, alicyclic epoxy resin Heterocyclic epoxy resins, spiro ring-containing epoxy resin, cyclohexane type epoxy resin, cyclohexanedimethanol type epoxy resins, naphthylene ether type epoxy resin, trimethylol type epoxy resin, tetraphenyl ethane epoxy resin and the like. The epoxy resins may be used alone or in combination of two or more.

  The (A) epoxy resin preferably has two or more epoxy groups in one molecule. When the non-volatile component of the epoxy resin is 100% by mass, it is preferable that at least 50% by mass or more is an epoxy resin having two or more epoxy groups in one molecule. Among them, the resin composition is a combination of an epoxy resin which is liquid at a temperature of 20 ° C. (hereinafter also referred to as “liquid epoxy resin”) and an epoxy resin which is solid at a temperature of 20 ° C. (also referred to as “solid epoxy resin”). Is preferably included. The liquid epoxy resin is preferably a liquid epoxy resin having two or more epoxy groups in one molecule, and more preferably an aromatic liquid epoxy resin having two or more epoxy groups in one molecule. The solid epoxy resin is preferably a solid epoxy resin having three or more epoxy groups in one molecule, and more preferably an aromatic solid epoxy resin having three or more epoxy groups in one molecule. In the present invention, an aromatic epoxy resin means an epoxy resin having an aromatic ring in its molecule.

  As liquid epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AF type epoxy resin, naphthalene type epoxy resin, glycidyl ester type epoxy resin, glycidyl amine type epoxy resin, phenol novolac type epoxy resin, ester skeleton The alicyclic epoxy resin which has it, a cyclohexane type epoxy resin, a cyclohexane dimethanol type epoxy resin, a glycidyl amine type epoxy resin, and the epoxy resin which has a butadiene structure are preferable, and a bisphenol A epoxy resin and a bisphenol F type epoxy resin are more preferable. Specific examples of the liquid epoxy resin include "HP4032", "HP4032D", "HP4032SS" (naphthalene type epoxy resin) manufactured by DIC, "828US" manufactured by Mitsubishi Chemical Corp., "jER828EL", "825", "epicoat" “828 EL” (bisphenol A epoxy resin), “jER 807”, “1750” (bisphenol F epoxy resin), “jER 152” (phenol novolac epoxy resin), “630”, “630 LSD” (glycidyl amine epoxy resin) , “ZX1059” (a mixture of bisphenol A epoxy resin and bisphenol F epoxy resin) manufactured by Nippon Steel Sumikin Chemical Co., Ltd., “EX-721” manufactured by Nagase ChemteX (glycidyl ester epoxy resin), manufactured by Daicel "Ceroxide 021P "(alicyclic epoxy resin having an ester skeleton)," PB-3600 "(epoxy resin having a butadiene structure)," ZX1658 "manufactured by Nippon Steel Sumikin Chemical Co., Ltd.," ZX1658GS "(liquid 1,4-glycidyl cyclohexane type Epoxy resin), “630LSD” (glycidyl amine type epoxy resin) manufactured by Mitsubishi Chemical Corporation, and the like. These may be used singly or in combination of two or more.

  As solid epoxy resin, bixylenol type epoxy resin, naphthalene type epoxy resin, naphthalene type tetrafunctional epoxy resin, cresol novolac type epoxy resin, dicyclopentadiene type epoxy resin, trisphenol type epoxy resin, naphthol type epoxy resin, biphenyl Type epoxy resin, naphthalene ether type epoxy resin, anthracene type epoxy resin, bisphenol A type epoxy resin, bisphenol AF type epoxy resin, tetraphenylethane type epoxy resin are preferable, and naphthalene type epoxy resin is more preferable. Specific examples of the solid epoxy resin include “HP4032H” (naphthalene type epoxy resin), “HP-4700”, “HP-4710” (naphthalene type tetrafunctional epoxy resin), “N-690” (N-690) manufactured by DIC Corporation. Cresol novolac epoxy resin), “N-695” (cresol novolac epoxy resin), “HP-7200” (dicyclopentadiene type epoxy resin), “HP-7200HH”, “HP-7200H”, “EXA-7311” “EXA-7311-G3”, “EXA-7311-G4”, “EXA-7311-G4S”, “HP6000” (naphthylene ether type epoxy resin), “EPPN-502H” manufactured by Nippon Kayaku Co., Ltd. Trisphenol type epoxy resin), "NC7000L" (Naphthol novolac type epoxy) Fat), "NC3000H", "NC3000", "NC3000L", "NC3100" (biphenyl type epoxy resin), "ESN 475 V" (naphthalene type epoxy resin) manufactured by Nippon Steel Sumikin Chemical Co., Ltd., "ESN 485" (naphthol novolac type epoxy resin) ), “YX4000H”, “YX4000”, “YL6121” (biphenyl epoxy resin), “YX4000HK” (bixylenol epoxy resin), “YX8800” (anthracene epoxy resin), manufactured by Mitsubishi Chemical Corporation, Osaka Gas Chemical Co., Ltd. "PG-100" and "CG-500" manufactured by Mitsubishi Chemical Co., Ltd. (bisphenol AF type epoxy resin) and "YL 7800" (fluorene type epoxy resin) manufactured by Mitsubishi Chemical Corp. "jER1010" (solid Shaped bisuf Nord A-type epoxy resin), "jER1031S" (tetraphenyl ethane epoxy resin) and the like. These may be used singly or in combination of two or more.

  When a liquid epoxy resin and a solid epoxy resin are used in combination as the component (A), the mass ratio (liquid epoxy resin: solid epoxy resin) is in the range of 1: 1 to 1:20 by mass ratio. preferable. When the ratio of the liquid epoxy resin to the solid epoxy resin is in such a range, i) adequate adhesiveness is provided when used in the form of a resin sheet, ii) when used in the form of a resin sheet Sufficient flexibility is obtained, the handling property is improved, and iii) a cured product having a sufficient breaking strength can be obtained. From the viewpoint of the effects of the above i) to iii), the mass ratio of liquid epoxy resin to solid epoxy resin (liquid epoxy resin: solid epoxy resin) is in the range of 1: 1 to 1:15 by mass ratio Preferably, the range of 1: 1 to 1:10 is more preferable.

The content of the component (A) in the resin composition is preferably 5% when the nonvolatile component in the resin composition is 100% by mass from the viewpoint of obtaining an insulating layer exhibiting good mechanical strength and insulation reliability. % Or more, more preferably 10% by mass or more, further preferably 15% by mass or more. The upper limit of the content of the epoxy resin is not particularly limited as long as the effects of the present invention are exhibited, but is preferably 30% by mass or less, more preferably 25% by mass or less, and still more preferably 20% by mass or less.
In the present invention, the content of each component in the resin composition is a value when the non-volatile component in the resin composition is 100% by mass unless otherwise specified.

  The epoxy equivalent of the component (A) is preferably 50 to 5,000, more preferably 50 to 3,000, still more preferably 80 to 2,000, and still more preferably 110 to 1,000. By being in this range, the crosslink density of the cured product is sufficient, and an insulating layer with a small surface roughness can be provided. In addition, an epoxy equivalent can be measured according to JISK7236, and is a mass of resin containing an epoxy group of 1 equivalent.

  The weight average molecular weight of the component (A) is preferably 100 to 5,000, more preferably 250 to 3,000, and still more preferably 400 to 1,500. Here, the weight average molecular weight of an epoxy resin is a weight average molecular weight of polystyrene conversion measured by the gel permeation chromatography (GPC) method.

<(B) maleimide compound>
The resin composition contains a maleimide compound containing at least one of an alkyl group having 5 or more carbon atoms and an alkylene group having 5 or more carbon atoms. The (B) maleimide compound is a compound having a maleimide group represented by the following formula (1) in the molecule.

  The maleimide compound (B) contains at least one of an alkyl group having 5 or more carbon atoms and an alkylene group having 5 or more carbon atoms. The maleimide compound containing at least one of an alkyl group having 5 or more carbon atoms and an alkylene group having 5 or more carbon atoms has a flexible molecular structure due to the action of its long carbon chain. Thus, it is possible to achieve a lower minimum melt viscosity as compared to a maleimide compound containing an arylene group as a main component. Furthermore, since a maleimide group is easily dissolved in an alkaline solution, a cured product having excellent smear removability can usually be obtained. The alkyl group having 5 or more carbon atoms and the alkylene group having 5 or more carbon atoms exhibit hydrophobicity because the carbon chain is long. Therefore, the (B) maleimide compound is unlikely to deteriorate in a high temperature and high humidity environment, and the delamination accompanied by the destruction of the insulating layer can be suppressed even after the HAST test. As a result, it becomes possible to obtain an insulating layer having high adhesion to the conductor layer after the HAST test.

  The number of carbon atoms of the alkyl group having 5 or more carbon atoms is preferably 6 or more, more preferably 8 or more, preferably 50 or less, more preferably 45 or less, and still more preferably 40 or less. The alkyl group may be linear, branched or cyclic, and is preferably linear. As such an alkyl group, a pentyl group, a hexyl group, a heptyl group, an octyl group, a nonyl group, a decyl group etc. are mentioned, for example. The alkyl group having 5 or more carbon atoms may have as a substituent for an alkylene group having 5 or more carbon atoms.

  The number of carbon atoms of the alkylene group having 5 or more carbon atoms is preferably 6 or more, more preferably 8 or more, preferably 50 or less, more preferably 45 or less, and still more preferably 40 or less. The alkylene group may be linear, branched or cyclic, and among them, linear is preferable. Here, a cyclic alkylene group is a concept also including the case where it consists only of a cyclic alkylene group, and the case where it contains both a linear alkylene group and a cyclic alkylene group. Examples of such an alkylene group include pentylene group, hexylene group, heptylene group, octylene group, nonylene group, nonylene group, decylene group, undecylene group, dodecylene group, tridecylene group, heptadecylene group, hexatriacontylene group, octylene-cyclohexylene. Examples thereof include a group having a structure, a group having an octylene-cyclohexylene-octylene structure, and a group having a propylene-cyclohexylene-octylene structure.

  In the maleimide compound (B), the alkyl group having 5 or more carbon atoms and the alkylene group having 5 or more carbon atoms are preferably directly bonded to the nitrogen atom of the maleimide group. Here, "directly" means that there is no other group between the nitrogen atom of the maleimide group and the alkyl group or the alkylene group. Thereby, the adhesion and the minimum melt viscosity after the HAST test can be made particularly good.

  (B) The maleimide compound has both an alkyl group having 5 or more carbon atoms and an alkylene group having 5 or more carbon atoms from the viewpoint of obtaining an insulating layer having high adhesion to the conductor layer after the HAST test. It is preferable to include.

  The alkyl group having 5 or more carbon atoms and the alkylene group having 5 or more carbon atoms may be bonded to each other to form a ring, and the ring structure also includes a spiro ring and a fused ring. Examples of the ring formed by bonding to each other include a cyclohexane ring and the like.

The alkyl group having 5 or more carbon atoms and the alkylene group having 5 or more carbon atoms preferably have no substituent, but may have a substituent. The substituent is not particularly limited, and examples thereof include a halogen atom, -OH, -O-C _1-6 alkyl group, -N (C _1-10 alkyl group) ₂ , a C _1-10 alkyl group, and C _{6- 10} aryl group, -NH ₂ , -CN, -C (O) O-C _1-10 alkyl group, -COOH, -C (O) H, -NO _{2 and the} like. Here, the term " _Cp-q " (p and q are positive integers and satisfy p <q) means that the number of carbon atoms of the organic group described immediately after this term is p to q. Represents a certain thing. For example, the expression "C _1-10 alkyl group" indicates an alkyl group having 1 to 10 carbon atoms. These substituents may be bonded to each other to form a ring, and the ring structure also includes a spiro ring and a fused ring.

  The above-mentioned substituent may further have a substituent (hereinafter sometimes referred to as "secondary substituent"). As the secondary substituent, the same as the above-mentioned substituent may be used unless otherwise specified.

  The number of maleimide groups per molecule of the maleimide compound (B) may be 1, but is preferably 2 or more, preferably 10 or less, more preferably 6 or less, particularly preferably 3 or less . By using the (B) maleimide compound having two or more maleimide groups per molecule, it is possible to obtain an insulating layer having higher adhesion to the conductor layer after the HAST test.

  The maleimide compounds (B) may be used alone or in combination of two or more.

一般式（Ｂ−１）中、Ｒはそれぞれ独立に置換基を有していてもよい炭素原子数が５以上のアルキレン基を表し、Ｌは単結合又は２価の連結基を表す。 (B) The maleimide compound should contain at least one of an alkyl group having 5 or more carbon atoms and an alkylene group having 5 or more carbon atoms, but higher adhesion to the conductor layer after the HAST test It is preferable that it is a maleimide compound represented by the following general formula (B-1) from a viewpoint of obtaining the insulating layer which has property.

In general formula (B-1), R each independently represents an alkylene group having 5 or more carbon atoms which may have a substituent, and L represents a single bond or a divalent linking group.

  Each R independently represents an alkylene group having 5 or more carbon atoms which may have a substituent. R has the same meaning as the above-mentioned alkylene group having 5 or more carbon atoms, and the preferred range is also the same.

L represents a single bond or a divalent linking group. Examples of the divalent linking group include an alkylene group, an alkenylene group, an alkynylene group, an arylene group, -C (= O)-, -C (= O) -O-, and -NR ^0- (where R ⁰ is a hydrogen atom or carbon Alkyl group having 1 to 3 atoms), oxygen atom, sulfur atom, C (= O) NR ^0- , divalent group derived from phthalimide, divalent group derived from pyromellitic diimide, and 2 of these groups The bivalent group etc. which consist of the above combination are mentioned. The divalent group derived from phthalimide represents a divalent group derived from phthalimide, and is specifically a group represented by General Formula (2). The divalent group derived from pyromellitic acid diimide represents a divalent group derived from pyromellitic acid diimide, and specifically, it is a group represented by the general formula (3). In the formula, "*" represents a bond.

  As an alkylene group, a C1-C50 alkylene group is preferable, a C1-C45 alkylene group is more preferable, and a C1-C40 alkylene group is especially preferable. The alkylene group may be linear, branched or cyclic. As such an alkylene group, for example, methyl ethylene group, cyclohexylene group, pentylene group, hexylene group, heptylene group, octylene group, nonylene group, decylene group, undecylene group, dodecylene group, dodecylene group, tridecylene group, heptadecylene group, hexatria Examples thereof include a contylene group, a group having an octylene-cyclohexylene structure, a group having an octylene-cyclohexylene-octylene structure, and a group having a propylene-cyclohexylene-octylene structure.

  As an alkenylene group, a C2-C20 alkenylene group is preferable, a C2-C15 alkenylene group is more preferable, and a C2-C10 alkenylene group is especially preferable. The alkenylene group may be linear, branched or cyclic. As such an alkenylene group, for example, a methylethylenylene group, a cyclohexenylene group, a pentenylene group, a hexenylene group, a heptenylene group, an octenylene group and the like can be mentioned.

  As an alkynylene group, a C2-C20 alkynylene group is preferable, a C2-C15 alkynylene group is more preferable, and a C2-C10 alkynylene group is especially preferable. The alkynylene group may be linear, branched or cyclic. As such an alkynylene group, for example, a methyl ethynylene group, a cyclohexynylene group, a pentynylene group, a hexynylene group, a heptynylene group, an octynylene group and the like can be mentioned.

  The arylene group is preferably an arylene group having 6 to 24 carbon atoms, more preferably an arylene group having 6 to 18 carbon atoms, still more preferably an arylene group having 6 to 14 carbon atoms, and having 6 to 10 carbon atoms. Arylene groups are even more preferred. As an arylene group, a phenylene group, a naphthylene group, an anthracenylene group etc. are mentioned, for example.

  The alkylene group, alkenylene group, alkynylene group and arylene group which are divalent linking groups may have a substituent. The substituent is the same as the substituent which the alkyl group having 5 or more carbon atoms represented by R in General Formula (B-1) may have, preferably, alkyl having 5 or more carbon atoms It is a group.

  Examples of the divalent group consisting of a combination of two or more of these groups include a divalent group consisting of a combination of an alkylene group, a divalent group derived from phthalimide and an oxygen atom; a divalent group derived from phthalimide, Examples thereof include a divalent group consisting of a combination of an oxygen atom, an arylene group and an alkylene group; a divalent group consisting of a combination of an alkylene group and a divalent group derived from pyromellitic diimide. The divalent group consisting of a combination of two or more of these groups may form a ring such as a fused ring by a combination of the respective groups. The divalent group consisting of a combination of two or more of these groups may be a repeating unit having 1 to 10 repeating units.

  Among them, L in the general formula (B-1) is an oxygen atom, an arylene group having 6 to 24 carbon atoms which may have a substituent, or the number of carbon atoms which may have a substituent A divalent group consisting of an alkylene group of 1 to 50, an alkyl group having 5 or more carbon atoms, a divalent group derived from phthalimide, a divalent group derived from pyromellitic diimide, or a combination of two or more of these groups It is preferably a group. Among them, as L, an alkylene group; a divalent group derived from an alkylene group-phthalimide-a divalent group having a structure of a divalent group derived from a phthalimide; a divalent group derived from an alkylene group-phthalimide- A divalent group having a structure of a divalent group derived from oxygen atom-arylene group-alkylene group-arylene group-oxygen atom-phthalimide; a divalent group having a structure of a divalent group derived from alkylene-pyromellitic acid diimide Groups are more preferred.

一般式（Ｂ−２）中、Ｒ’はそれぞれ独立に置換基を有していてもよい炭素原子数が５以上のアルキレン基を表し、Ａはそれぞれ独立に置換基を有していてもよい炭素原子数が５以上のアルキレン基又は置換基を有していてもよい芳香環を有する２価の基を表す。ｎは１〜１０の整数を表す。 The maleimide compound represented by General Formula (B-1) is preferably represented by General Formula (B-2).

In general formula (B-2), R 'each independently represents an alkylene group having 5 or more carbon atoms which may have a substituent, and A may independently have a substituent. It represents a divalent group having an alkylene group having 5 or more carbon atoms or an aromatic ring which may have a substituent. n represents an integer of 1 to 10.

  R 'each independently represents an alkylene group having 5 or more carbon atoms which may have a substituent. R 'is the same as R in General Formula (B-1).

  A each independently represents an alkylene group having 5 or more carbon atoms which may have a substituent or a divalent group having an aromatic ring which may have a substituent. However, when A represents an alkylene group, it excludes when consisting only of a linear alkylene group. When A represents an alkylene group, it may be branched or cyclic, and among them, a cyclic, that is, a cyclic alkylene group having 5 or more carbon atoms which may have a substituent is preferable. The number of carbon atoms is preferably 6 or more, more preferably 8 or more, preferably 50 or less, more preferably 45 or less, and still more preferably 40 or less. Examples of such an alkylene group include a group having an octylene-cyclohexylene structure, a group having an octylene-cyclohexylene-octylene structure, and a group having a propylene-cyclohexylene-octylene structure.

  Examples of the aromatic ring in the divalent group having an aromatic ring which may have a substituent include a benzene ring, a naphthalene ring, an anthracene ring, a phthalimide ring, a pyromellitic diimide ring, and an aromatic heterocyclic ring. And a benzene ring, a phthalimide ring and a pyromellitic diimide ring are preferred. That is, as a divalent group having an aromatic ring, a divalent group having a benzene ring which may have a substituent, a divalent group having a phthalimide ring which may have a substituent, a substituent A divalent group having a pyromellitic diimide ring which may have a group is preferable. The divalent group having an aromatic ring is, for example, a combination of a divalent group derived from phthalimide and an oxygen atom; a combination of a divalent group derived from phthalimide, an oxygen atom, an arylene group and an alkylene group A group comprising a combination of an alkylene group and a divalent group derived from pyromellitic acid diimide; a divalent group derived from pyromellitic acid diimide; a group comprising a combination of a divalent group derived from phthalimide and an alkylene group; It can be mentioned. The arylene group and the alkylene group are the same as the arylene group and the alkylene group in the divalent linking group represented by L in General Formula (B-1), and the preferred ranges are also the same.

  The alkylene group and the divalent group having an aromatic ring represented by A may have a substituent. The substituent is the same as the substituent which the alkyl group having 5 or more carbon atoms represented by R in General Formula (B-1) may have.

The following groups can be mentioned as specific examples of the group represented by A. In the formula, "*" represents a bond.

一般式（Ｂ−３）中、Ｒ^１はそれぞれ独立に置換基を有していてもよい炭素原子数が５以上のアルキレン基を表し、Ｒ^２はそれぞれ独立に、酸素原子、アリーレン基、アルキレン基、又はこれらの基の２以上の組み合わせからなる２価の基を表す。ｎ１は１〜１５の整数を表す。
一般式（Ｂ−４）中、Ｒ^３はそれぞれ独立に置換基を有していてもよい炭素原子数が５以上のアルキレン基を表し、Ｒ^４はそれぞれ独立に置換基を有していてもよい芳香環を有する２価の基を表し、Ｒ^５はそれぞれ独立に炭素原子数が５以上のアルキル基を表す。ｎ２は０〜１０の整数を表し、ｍはそれぞれ独立に０〜４の整数を表す。 The maleimide compound represented by the general formula (B-1) is either a maleimide compound represented by the general formula (B-3) or a maleimide compound represented by the general formula (B-4) preferable.

In formula (B-3), R ¹ independently represents an alkylene group having 5 or more carbon atoms which may have a substituent, and R ² independently represents an oxygen atom, an arylene group, or an alkylene Or a divalent group consisting of a combination of two or more of these groups. n1 represents an integer of 1-15.
In General Formula (B-4), R ³ independently represents an alkylene group having 5 or more carbon atoms which may have a substituent, and R ⁴ may independently have a substituent. R ⁵ represents a divalent group having a good aromatic ring, and each R ⁵ independently represents an alkyl group having 5 or more carbon atoms. n2 represents an integer of 0 to 10, and m represents an integer of 0 to 4 independently.

Each R ¹ independently represents an alkylene group having 5 or more carbon atoms which may have a substituent. R ¹ is the same as the alkylene group having 5 or more carbon atoms represented by R in the general formula (B-1), and is preferably a hexatriacontylene group.

Each R ² independently represents an oxygen atom, an arylene group, an alkylene group, or a divalent group consisting of a combination of two or more of these groups. The arylene group and the alkylene group are the same as the arylene group and the alkylene group in the divalent linking group represented by L in General Formula (B-1), and the preferred ranges are also the same. As R ² , a divalent group consisting of a combination of two or more of these groups or an oxygen atom is preferable.

As a bivalent group which consists of a 2 or more combination of these groups, the combination of an oxygen atom, an arylene group, and an alkylene group is mentioned. The following groups can be mentioned as specific examples of the divalent group consisting of a combination of two or more of these groups. In the formula, "*" represents a bond.

Each R ³ independently represents an alkylene group having 5 or more carbon atoms which may have a substituent. R ³ is the same as the alkylene group having 5 or more carbon atoms represented by R in the general formula (B-1), and is preferably a hexylene group, heptylene group, octylene group, nonylene group, decylene group, and an octylene group is More preferable.

Each R ⁴ independently represents a divalent group having an aromatic ring which may have a substituent. R ⁴ is the same as a divalent group having an aromatic ring represented by A in the general formula (B-2), and a group consisting of a combination of an alkylene group and a divalent group derived from pyromellitic acid diimide; derived from phthalimide A group consisting of a combination of a divalent group and an alkylene group is preferred, and a group consisting of a combination of an alkylene group and a divalent group derived from pyromellitic diimide is more preferred. The arylene group and the alkylene group are the same as the arylene group and the alkylene group in the divalent linking group represented by L in General Formula (B-1), and the preferred ranges are also the same.

Specific examples of the group R ⁴ represents may be, for example, the following groups. In the formula, "*" represents a bond.

Each R ⁵ independently represents an alkyl group having 5 or more carbon atoms. R ⁵ is the same as the above-mentioned alkyl group having 5 or more carbon atoms, and is preferably hexyl group, heptyl group, octyl group, nonyl group or decyl group, and more preferably hexyl group or octyl group.

  m represents an integer of 0 to 4, preferably an integer of 1 to 3, and more preferably 2.

As specific examples of the (B) maleimide compound, the following compounds (4) to (7) can be mentioned. However, the (B) maleimide compound is not limited to these specific examples. In formula, n represents the integer of 1-10.

  (B) Specific examples of the maleimide compound include “BMI 1500” (compound of formula (4)), “BMI 1700” (compound of formula (5)), “BMI 3000 J” (formula (6)) manufactured by Designer Moreques. Compounds), “BMI 689” (compound of formula (7)), and the like.

  The molecular weight of the (B) maleimide compound is preferably 200 or more, more preferably 300 or more, still more preferably 400 or more, preferably 100000 or less, from the viewpoint of improving the adhesion to the conductor layer after the HAST test. More preferably, it is 80000 or less, still more preferably 60000 or less.

  The content of the maleimide compound (B) is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, more preferably 1% by mass, based on 100% by mass of the non-volatile component in the resin composition. It is above. The upper limit is preferably 10% by mass or less, more preferably 8% by mass or less, and still more preferably 5% by mass or less or 3% by mass or less. By setting the content of the component (B) in such a range, the increase in the minimum melt viscosity of the resin composition is further suppressed, and by the adhesion between the insulating layer and the conductor layer after the HAST test and the smear removability It is possible to obtain an excellent cured product.

<(C) Active ester compound>
In one embodiment, the resin composition may contain (C) an active ester compound. The use of active ester compounds is generally known to have poor smear removability. However, since the resin composition of the present invention contains (B) a maleimide compound, the cured product of the resin composition is excellent in smear removability. Therefore, even if it uses an active ester compound, smear removal property is not inferior.

  The active ester compound is not particularly limited, but generally an ester group having high reaction activity such as phenol ester, thiophenol ester, N-hydroxyamine ester, ester of heterocyclic hydroxy compound, etc. in one molecule Compounds having two or more are preferably used. The active ester compound is preferably obtained by the condensation reaction of a carboxylic acid compound and / or a thiocarboxylic acid compound with a hydroxy compound and / or a thiol compound. In particular, from the viewpoint of improving heat resistance, an active ester compound obtained from a carboxylic acid compound and a hydroxy compound is preferable, and an active ester compound obtained from a carboxylic acid compound and a phenol compound and / or a naphthol compound is more preferable. Examples of the carboxylic acid compound include benzoic acid, acetic acid, succinic acid, maleic acid, itaconic acid, phthalic acid, isophthalic acid, terephthalic acid and pyromellitic acid. As a phenol compound or naphthol compound, for example, hydroquinone, resorcine, bisphenol A, bisphenol F, bisphenol S, phenolphthalin, methylated bisphenol A, methylated bisphenol F, methylated bisphenol S, phenol, o-cresol, m- Cresol, p-cresol, catechol, α-naphthol, β-naphthol, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, dihydroxybenzophenone, trihydroxybenzophenone, tetrahydroxybenzophenone, phloroglucin, Benzenetriol, dicyclopentadiene type diphenol compounds, phenol novolac and the like can be mentioned. Here, the "dicyclopentadiene type diphenol compound" refers to a diphenol compound obtained by condensation of two molecules of phenol with one molecule of dicyclopentadiene.

  Specifically, an active ester compound containing a dicyclopentadiene type diphenol structure, an active ester compound containing a naphthalene structure, an active ester compound containing an acetylated product of a phenol novolac, an active ester compound containing a benzoylated compound of a phenol novolac, Among them, an active ester compound containing a naphthalene structure and an active ester compound containing a dicyclopentadiene type diphenol structure are more preferable. The "dicyclopentadiene type diphenol structure" represents a bivalent structural unit consisting of phenylene-dicyclopentylene-phenylene.

  As a commercial item of an active ester compound, as an active ester compound containing a dicyclopentadiene type diphenol structure, "EXB9451", "EXB 9460", "EXB 9460S", "HPC-8000-65T", "HPC-8000H-65TM" “EXB-8000L-65TM”, “EXB-8150-65T” (manufactured by DIC), “EXB9416-70BK” (manufactured by DIC) as an active ester compound containing a naphthalene structure, an active ester containing an acetylated product of phenol novolac “DC 808” (Mitsubishi Chemical Co., Ltd.) as a compound, “YLH1026” (Mitsubishi Chemical Co., Ltd.) as an active ester compound containing a benzoylated phenol novolak, and an active ester compound as an acetylated phenol novolac "DC 808" (Mitsubishi Chemical Co., Ltd.), an active ester-based curing agent which is a benzyl novolak of phenol novolak "YLH 1026" (Mitsubishi Chemical Co., Ltd.), "YLH 1030" (Mitsubishi Chemical Co., Ltd.), "YLH 1048" And the like.

  When the resin composition contains (C) an active ester compound, the quantitative ratio of the epoxy resin to the active ester compound is [total number of epoxy groups of epoxy resin]: [total number of reactive groups of active ester compound] The ratio is preferably in the range of 1: 0.01 to 1: 5, more preferably 1: 0.05 to 1: 3, and still more preferably 1: 0.1 to 1: 1.5. Here, the reactive group of the active ester compound is an active ester group. Further, the total number of epoxy groups of the epoxy resin is a value obtained by dividing the mass of solid content of each epoxy resin by the epoxy equivalent and totaling for all the epoxy resins, and the total number of reactive groups of the active ester compound The value obtained by dividing the solid content mass of each active ester compound by the reactive group equivalent is the total value of all active ester compounds. By setting the ratio of the epoxy resin to the active ester compound in such a range, the heat resistance of the cured product of the resin composition is further improved.

  When the resin composition contains (C) an active ester compound, the content of the component (C) is preferably 1% by mass or more, more preferably 3 when the nonvolatile component in the resin composition is 100% by mass. % By mass or more, more preferably 5% by mass or more. The upper limit is preferably 30% by mass or less, more preferably 20% by mass or less, and further preferably 15% by mass or less. By setting the content of the component (C) within such a range, it is possible to improve the peel strength before and after the HAST test.

<(D) Inorganic filler>
In one embodiment, the resin composition may contain (D) an inorganic filler. The material of the inorganic filler (D) is not particularly limited as long as it is an inorganic compound, and for example, silica, alumina, glass, cordierite, silicon oxide, barium sulfate, barium carbonate, talc, clay, mica powder, zinc oxide , Hydrotalcite, boehmite, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum nitride, manganese nitride, aluminum borate, aluminum borate, strontium carbonate, strontium titanate, calcium titanate, titanate Magnesium, bismuth titanate, titanium oxide, zirconium oxide, barium titanate, barium titanate zirconate, barium zirconate, calcium zirconate, zirconium phosphate, zirconium tungstate, etc. It is. Among these, silica is particularly preferred. Examples of the silica include amorphous silica, fused silica, crystalline silica, synthetic silica, hollow silica and the like. Moreover, as silica, spherical silica is preferable. The inorganic filler may be used alone or in combination of two or more.

  (D) As a commercial item of the inorganic filler, for example, "SP60-05" and "SP507-05" manufactured by Nippon Steel & Sumikin Materials Co., Ltd .; "YC100C", "YA050C" and "YA050C-MJE" manufactured by Admatechs Co., Ltd. "YAFO C"; "UFP-30" manufactured by Denka; "Sylfil NSS-3N" manufactured by Tokuyama, "Sylfil NSS-4N", "Sylfil NSS-5N"; "SC2500 SQ" manufactured by Admatex Co., Ltd. "SO-C4", "SO-C2", "SO-C1"; etc. are mentioned.

  Usually, the (D) inorganic filler is contained in the form of particles in the resin composition. The average particle diameter of the inorganic filler (D) is preferably 0.01 μm or more, more preferably 0.05 μm or more, particularly preferably 0.1 μm or more, from the viewpoint of obtaining the desired effects of the present invention remarkably. Preferably it is 5.0 micrometers or less, More preferably, it is 2.0 micrometers or less, More preferably, it is 1.0 micrometer or less. In addition, when the average particle diameter of the (D) inorganic filler is in the above range, usually, the circuit embedding property of the resin composition layer can be improved, or the surface roughness of the insulating layer can be reduced.

  (D) The average particle size of the inorganic filler can be measured by a laser diffraction / scattering method based on Mie scattering theory. Specifically, the particle diameter distribution of the inorganic filler (D) can be created on a volume basis by a laser diffraction / scattering particle size distribution measuring device, and the median diameter can be measured as an average particle diameter. As the measurement sample, those obtained by dispersing (D) an inorganic filler in methyl ethyl ketone by ultrasonic waves can be preferably used. As the laser diffraction / scattering type particle size distribution measuring device, “LA-500” manufactured by Horiba, Ltd., “SALD-2200” manufactured by Shimadzu Corporation, etc. can be used.

  The inorganic filler (D) may be surface-treated with a surface treatment agent from the viewpoint of enhancing the moisture resistance and the dispersibility. Examples of surface treatment agents include aminosilane coupling agents, epoxysilane coupling agents, mercaptosilane coupling agents, silane coupling agents, alkoxysilanes, organosilazane compounds and titanate coupling agents. . Examples of commercially available surface treatment agents include "KBM 403" (3-glycidoxypropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., "KBM 803" (3-mercaptopropyl trimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd., Shin-Etsu Chemical Industry Co., Ltd. "KBE 903" (3-aminopropyltriethoxysilane), Shin-Etsu Chemical Co., Ltd. "KBM 573" (N-phenyl-3-aminopropyltrimethoxysilane), Shin-Etsu Chemical Co., Ltd. "SZ-31" ( Hexamethyldisilazane), Shin-Etsu Chemical "KBM 103" (phenyltrimethoxysilane), Shin-Etsu Chemical "KBM-4803" (long-chain epoxy type silane coupling agent), Shin-Etsu Chemical "KBM- 7103 "(3,3,3-trifluoropropyltrimethoxysilane) and the like. The surface treatment agent may be used alone or in combination of two or more.

The degree of surface treatment with a surface treatment agent can be evaluated by the amount of carbon per unit surface area of the (D) inorganic filler. Carbon content per unit surface area of the inorganic filler (D) is, (D) from the viewpoint of the dispersibility of the inorganic filler improved, preferably 0.02 mg / ^{m 2} or more, 0.1 mg / ^{m 2} or more, and 0.2 mg / m ² or more is more preferable. On the other hand, from the viewpoint of suppressing the melt viscosity of the resin varnish and the increase of the melt viscosity in the form of a sheet, 1 mg / m ² or less is preferable, 0.8 mg / m ² or less is more preferable, and 0.5 mg / m ² or less preferable.

  The amount of carbon per unit surface area of the (D) inorganic filler can be measured after washing the (D) inorganic filler after surface treatment with a solvent (for example, methyl ethyl ketone (MEK)). Specifically, sufficient amount of MEK as a solvent is added to the (D) inorganic filler surface-treated with a surface treatment agent, and ultrasonic cleaning is performed at 25 ° C. for 5 minutes. After removing the supernatant and drying the solid content, the carbon analyzer can be used to measure the amount of carbon per unit surface area of the (D) inorganic filler. As a carbon analyzer, "EMIA-320V" etc. by Horiba, Ltd. can be used.

  From the viewpoint of lowering the coefficient of thermal expansion, the content of the (D) inorganic filler is preferably 50% by mass or more, and more preferably 55% by mass or more, when the nonvolatile component in the resin composition is 100% by mass. More preferably, it is 60 mass% or more or 65 mass% or more. The upper limit is preferably 85% by mass or less, more preferably 80% by mass or less, and still more preferably 75% by mass or less. Although it is known that adhesion is reduced when a large amount of inorganic filler is blended, in the present invention, even if a large amount of (D) inorganic filler is mixed, the decrease in adhesion can be effectively suppressed.

<(E) Hardening agent>
In one embodiment, the resin composition may contain (E) a curing agent. However, the (C) active ester compound is not included in the (E) curing agent. The curing agent (E) is not particularly limited as long as it has a function of curing the component (A). For example, a phenol-based curing agent, a naphthol-based curing agent, a benzoxazine-based curing agent, a cyanate ester-based curing Agents and carbodiimide-based curing agents. Among them, from the viewpoint of improving insulation reliability, the (E) curing agent is preferably at least one of a phenol-based curing agent, a naphthol-based curing agent, a cyanate ester-based curing agent, and a carbodiimide-based curing agent. It is more preferable to include a phenolic curing agent. A hardening agent may be used individually by 1 type, or may use 2 or more types together.

  From the viewpoints of heat resistance and water resistance, as the phenol-based curing agent and the naphthol-based curing agent, a phenol-based curing agent having a novolac structure or a naphthol-based curing agent having a novolac structure is preferable. Further, from the viewpoint of adhesion to the conductor layer, a nitrogen-containing phenol-based curing agent is preferable, and a triazine skeleton-containing phenol-based curing agent is more preferable.

  Specific examples of the phenol-based curing agent and naphthol-based curing agent include, for example, “MEH-7700”, “MEH-7810”, “MEH-7851” manufactured by Meiwa Kasei Co., “NHN” manufactured by Nippon Kayaku Co., Ltd. "CBN", "GPH", "SN170", "SN180", "SN190", "SN475", "SN485", "SN495", "SN-495V", "SN375", "SN395" manufactured by Nippon Steel & Sumikin Chemical Co., Ltd. And “TD-2090”, “LA-7052”, “LA-7054”, “LA-1356”, “LA-3018-50P”, “EXB-9500” and the like manufactured by DIC Corporation.

  Specific examples of the benzoxazine-based curing agent include “HFB2006M” manufactured by Showa Highpolymer Co., Ltd. and “Pd” and “Fa” manufactured by Shikoku Kasei Kogyo Co., Ltd.

  As a cyanate ester-based curing agent, for example, bisphenol A dicyanate, polyphenol cyanate, oligo (3-methylene-1,5-phenylene cyanate), 4,4′-methylene bis (2,6-dimethylphenyl cyanate), 4,4 '-Ethylidene diphenyl dicyanate, hexafluoro bisphenol A dicyanate, 2,2-bis (4-cyanate) phenylpropane, 1, 1-bis (4- cyanate phenyl methane), bis (4- cyanate 3,5- dimethyl) Bifunctional cyanate resins such as phenyl) methane, 1,3-bis (4-cyanatophenyl-1- (methylethylidene)) benzene, bis (4-cyanatophenyl) thioether, and bis (4-cyanatophenyl) ether, phenol Novolak and Ku Polyfunctional cyanate resin derived from tetrazole novolac, these cyanate resins and partially triazine of prepolymer. Specific examples of cyanate ester-based curing agents include "PT30" and "PT60" (phenol novolac-type polyfunctional cyanate ester resin), "ULL-950S" (polyfunctional cyanate ester resin), "BA230" manufactured by Lonza Japan Co., Ltd. And “BA 230 S 75” (a prepolymer in which part or all of bisphenol A dicyanate is triazinated to form a trimer), and the like.

  Specific examples of the carbodiimide type curing agent include "V-03" and "V-07" manufactured by Nisshinbo Chemical Co., Ltd.

  When the resin composition contains (E) a curing agent, the quantitative ratio of the epoxy resin to the curing agent is the ratio of [total number of epoxy groups of epoxy resin]: [total number of reactive groups of curing agent] The range of 1: 0.01 to 1: 2 is preferable, 1: 0.01 to 1: 3 is more preferable, and 1: 0.01 to 1: 1.5 is more preferable. Here, the reactive group of the curing agent is an active hydroxyl group or the like, which differs depending on the type of the curing agent. Further, the total number of epoxy groups of the epoxy resin is a value obtained by dividing the mass of the solid content of each epoxy resin by the epoxy equivalent, for all the epoxy resins, and the total number of reactive groups of the curing agent is It is the value which totaled the value which remove | divided the solid content mass of each hardening | curing agent by reaction group equivalent for all the hardening | curing agents. By setting the ratio of the epoxy resin to the curing agent in such a range, the heat resistance of the cured product of the resin composition is further improved.

  When the resin composition contains (C) an active ester compound and (E) a curing agent, the quantitative ratio of the epoxy resin to the active ester compound is [total number of epoxy groups of epoxy resin]: [(C) and E) The ratio of the total number of reactive groups of the component] is preferably in the range of 1: 0.01 to 1: 5, more preferably 1: 0.01 to 1: 3 and 1: 1 to 1: 1 .5 is more preferred. By setting the ratio of the epoxy resin to the component (C) and the component (E) in such a range, the heat resistance of the cured product of the resin composition is further improved.

  When the resin composition contains (E) a curing agent, the content of the (E) curing agent is preferably 0.1% by mass or more, more preferably 100% by mass of the non-volatile component in the resin composition. Preferably it is 0.3 mass% or more, More preferably, it is 0.5 mass% or more. The upper limit is preferably 5% by mass or less, more preferably 3% by mass or less, and further preferably 1% by mass or less. (E) By making content of a hardening agent into such a range, adhesiveness with the conductor layer after a HAST test can be improved.

<(F) Hardening accelerator>
In one embodiment, the resin composition may contain (F) a curing accelerator. Examples of the curing accelerator include phosphorus-based curing accelerators, amine-based curing accelerators, imidazole-based curing accelerators, guanidine-based curing accelerators, metal-based curing accelerators, etc., and phosphorus-based curing accelerators and amine-based curing accelerators. A curing accelerator, an imidazole curing accelerator, and a metal curing accelerator are preferable, and an amine curing accelerator is more preferable. The curing accelerator may be used alone or in combination of two or more.

  As a phosphorus-based curing accelerator, for example, triphenylphosphine, phosphonium borate compounds, tetraphenylphosphonium tetraphenylborate, n-butylphosphonium tetraphenylborate, tetrabutylphosphonium decanoate, (4-methylphenyl) triphenylphosphonium thiocyanate Tetraphenyl phosphonium thiocyanate, butyl triphenyl phosphonium thiocyanate and the like, and triphenyl phosphine and tetrabutyl phosphonium decanoate are preferable.

  Examples of amine curing accelerators include trialkylamines such as triethylamine and tributylamine, 4-dimethylaminopyridine, benzyldimethylamine, 2,4,6-tris (dimethylaminomethyl) phenol, 1,8-diazabicyclo Examples include (5,4,0) -undecene and the like, with preference given to 4-dimethylaminopyridine and 1,8-diazabicyclo (5,4,0) -undecene.

  Examples of the imidazole-based curing accelerator include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, 1-cyanoethyl- 2 Phenylimidazolium trimellitate, 2,4-diamino-6- [2′-methylimidazolyl- (1 ′)]-ethyl-s-triazine, 2,4-diamino-6- [2′-undecylimidazolyl- (1 ′)]-Ethyl-s-triazine, 2,4-diamino-6- [2′-ethyl-4′-methylimidazolyl- (1 ′)]-ethyl-s-triazine, 2,4-diamino- 6- [2'-Methylimidazolyl- (1 ')]-ethyl-s-triazine isocyanuric acid adduct, 2-phenylimidazole isocyanuric acid adduct, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl- 4-methyl-5-hydroxymethylimidazole, 2,3-dihydro-1H-pyrrolo [1,2-a] benzimidazole, 1-dodecyl-2-methane And imidazole compounds such as 2-methylimidazoline, 2-methylimidazoline, and adducts of imidazole compounds with an epoxy resin, and 2-ethyl-4-methylimidazole, 1-benzyl-2 -Phenylimidazole is preferred.

  A commercial item may be used as an imidazole series hardening accelerator, for example, "P200-H50" by Mitsubishi Chemical Corporation etc. is mentioned.

  As the guanidine-based curing accelerator, for example, dicyandiamide, 1-methyl guanidine, 1-ethyl guanidine, 1-cyclohexyl guanidine, 1-phenyl guanidine, 1- (o-tolyl) guanidine, dimethyl guanidine, diphenyl guanidine, trimethyl guanidine, Tetramethylguanidine, pentamethylguanidine, 1,5,7-triazabicyclo [4.4.0] dec-5-ene, 7-methyl-1,5,7-triazabicyclo [4.4.0] Dec-5-ene, 1-methyl biguanide, 1-ethyl biguanide, 1-n-butyl biguanide, 1-n-octadecyl biguanide, 1,1-dimethyl biguanide, 1,1-diethyl biguanide, 1-cyclohexyl biguanide, 1 -Allyl biguanide, 1-phenyl biguanide, 1-( - tolyl) biguanide, and the like, dicyandiamide, 1,5,7-triazabicyclo [4.4.0] dec-5-ene are preferred.

  Examples of the metal-based curing accelerator include organic metal complexes or organic metal salts of metals such as cobalt, copper, zinc, iron, nickel, manganese, and tin. Specific examples of the organic metal complex include organic cobalt complexes such as cobalt (II) acetylacetonate and cobalt (III) acetylacetonate, organic copper complexes such as copper (II) acetylacetonate, zinc (II) acetylacetonate Organic zinc complexes such as iron (III) acetylacetonate, organic nickel complexes such as nickel (II) acetylacetonate, organic manganese complexes such as manganese (II) acetylacetonate, and the like. Examples of the organic metal salt include zinc octylate, tin octylate, zinc naphthenate, cobalt naphthenate, tin stearate, zinc stearate and the like.

  When the resin composition contains (F) a curing accelerator, the content of the curing accelerator is preferably 0.01% by mass or more, and more preferably, when the non-volatile component in the resin composition is 100% by mass. Is 0.05% by mass or more, more preferably 0.1% by mass or more. The upper limit is preferably 3% by mass or less, more preferably 2% by mass or less, and further preferably 1% by mass or less. By making content of a hardening accelerator into such a range, even if it uses an inorganic filler with a small average particle diameter, the hardened | cured material which is excellent in the adhesiveness after a HAST test can be obtained.

<(G) Thermoplastic resin>
In one embodiment, the resin composition may contain (G) a thermoplastic resin. (G) As the thermoplastic resin, for example, phenoxy resin, polyvinyl acetal resin, polyolefin resin, polybutadiene resin, polyimide resin, polyamide imide resin, polyether imide resin, poly sulfone resin, polyether sulfone resin, polyphenylene ether resin, polycarbonate resin And polyether ether ketone resins, polyester resins and the like, and phenoxy resins are preferable. The thermoplastic resin may be used alone or in combination of two or more.

  (G) The polystyrene equivalent weight average molecular weight of the thermoplastic resin is preferably 38,000 or more, more preferably 40000 or more, and still more preferably 42000 or more. The upper limit is preferably 100,000 or less, more preferably 70000 or less, and still more preferably 60000 or less. (G) The polystyrene equivalent weight average molecular weight of the thermoplastic resin is measured by gel permeation chromatography (GPC). Specifically, the polystyrene equivalent weight average molecular weight of the (G) thermoplastic resin is LC-9A / RID-6A manufactured by Shimadzu Corporation as a measuring device, and Shodex K-800P / K-804L manufactured by Showa Denko KK as a column. The column temperature can be measured at 40 ° C. using chloroform or the like as the mobile phase, and / K-804L can be calculated using a standard polystyrene calibration curve.

  As the phenoxy resin, for example, bisphenol A skeleton, bisphenol F skeleton, bisphenol S skeleton, bisphenol acetophenone skeleton, novolac skeleton, biphenyl skeleton, biphenyl skeleton, fluorene skeleton, dicyclopentadiene skeleton, norbornene skeleton, naphthalene skeleton, anthracene skeleton, adamantane skeleton, terpene The phenoxy resin which has 1 or more types of frame | skeleton selected from frame | skeleton, and the group which consists of trimethyl cyclohexane frame | skeleton is mentioned. The terminal of the phenoxy resin may be any functional group such as phenolic hydroxyl group and epoxy group. The phenoxy resin may be used alone or in combination of two or more. Specific examples of the phenoxy resin include “1256” and “4250” (all of which are bisphenol A skeleton-containing phenoxy resins), “YX 8100” (bisphenol S skeleton-containing phenoxy resin), and “YX 6954” (bisphenol acetophenone) manufactured by Mitsubishi Chemical Corporation. Other examples include “FX280” and “FX293” manufactured by Nippon Steel Sumikin Chemical Co., Ltd., “YL7500BH30” manufactured by Mitsubishi Chemical Corporation, “YX6954BH30”, “YX7553”, “YX7553BH30”, and “YL7769BH30”. “YL6794”, “YL7213”, “YL7290”, “YL7482” and the like.

  As polyvinyl acetal resin, polyvinyl formal resin, polyvinyl butyral resin is mentioned, for example, Polyvinyl butyral resin is preferable. Specific examples of the polyvinyl acetal resin include, for example, "electric charge butyral 4000-2", "electric charge butyral 5000-A", "electric charge butyral 6000-C" and "electric charge butyral 6000-EP" manufactured by Denki Kagaku Kogyo K.K. S-LEC BH series, BX series (for example, BX-5Z), KS series (for example, KS-1), BL series, BM series and the like manufactured by Chemical Industry Co., Ltd. may be mentioned.

  As a specific example of a polyimide resin, "Rika coat SN20" and "Rika coat PN20" by Shin Nippon Rika Co., Ltd. are mentioned. Specific examples of the polyimide resin also include a linear polyimide (polyimide described in JP-A-2006-37083) obtained by reacting a bifunctional hydroxyl group-terminated polybutadiene, a diisocyanate compound and a tetrabasic acid anhydride, and a polysiloxane skeleton Modified polyimides such as contained polyimides (polyimides described in JP-A-2002-12667 and JP-A-2000-319386) can be mentioned.

  As a specific example of polyamide imide resin, Toyobo Co., Ltd. "Viromax HR11NN" and "Viromax HR16NN" are mentioned. Specific examples of the polyamideimide resin also include modified polyamideimides such as "KS9100" and "KS9300" (polysiloxane skeleton-containing polyamideimide) manufactured by Hitachi Chemical Co., Ltd.

  As a specific example of polyether sulfone resin, Sumitomo Chemical Co., Ltd. "PES5003P" etc. are mentioned. As a specific example of polyphenylene ether resin, oligo phenylene ether styrene resin "OPE-2St 1200" made by Mitsubishi Gas Chemical Co., Ltd., etc. may be mentioned.

  Specific examples of the polysulfone resin include polysulfone "P1700" and "P3500" manufactured by Solvay Advanced Polymers.

  Among them, as the (G) thermoplastic resin, phenoxy resin and polyvinyl acetal resin are preferable. Thus, in a preferred embodiment, the thermoplastic resin comprises one or more selected from the group consisting of phenoxy resin and polyvinyl acetal resin. Among them, as the thermoplastic resin, a phenoxy resin is preferable, and a phenoxy resin having a weight average molecular weight of 40,000 or more is particularly preferable.

  When the resin composition contains (G) a thermoplastic resin, the content of the (G) thermoplastic resin is preferably 0.1% by mass or more, when the nonvolatile component in the resin composition is 100% by mass. More preferably, it is 0.2 mass% or more, More preferably, it is 0.3 mass% or more. The upper limit is preferably 5% by mass or less, more preferably 3% by mass or less, and further preferably 1% by mass or less. (G) By setting the content of the thermoplastic resin in such a range, a cured product excellent in adhesion after the HAST test can be obtained even when using an inorganic filler having a small average particle diameter.

<(H) Optional additive>
In one embodiment, the resin composition may further contain other additives as needed, and such other additives include, for example, flame retardants, organic fillers, organic copper compounds, organic Examples thereof include organic metal compounds such as zinc compounds and organic cobalt compounds, and resin additives such as thickeners, antifoaming agents, leveling agents, adhesion imparting agents, and colorants.

  As a flame retardant, a phosphazene compound, an organophosphorus flame retardant, an organic nitrogen-containing phosphorus compound, a nitrogen compound, a silicone flame retardant, a metal hydroxide etc. are mentioned, for example. Specific examples of phosphazene compounds include, for example, “SPH-100”, “SPS-100”, “SPB-100”, “SPE-100” manufactured by Otsuka Chemical Co., Ltd., “FP-100” manufactured by Fushimi Pharmaceutical Co., Ltd., "FP-110", "FP-300", "FP-400", etc. may be mentioned, and as the flame retardant other than the phosphazene compound, a commercial item may be used, for example, "HCA-HQ" made by Sanko And “PX-200” manufactured by Daihachi Chemical Industry Co., Ltd., and the like.

  As the organic filler, any organic filler that can be used when forming the insulating layer of the printed wiring board may be used, and examples thereof include rubber particles, polyamide particles, silicone particles and the like. As the rubber particles, commercially available products may be used, and examples thereof include “EXL 2655” manufactured by Dow Chemical Japan Ltd., “AC 3401 N” and “AC 3816 N” manufactured by Aika Kogyo Co., Ltd., and the like.

<Physical Properties of Resin Composition, Applications>
The cured product obtained by heat curing the resin composition at 100 ° C. for 30 minutes, at 170 ° C. for 30 minutes and then at 200 ° C. for 90 minutes usually has the property of being excellent in copper foil peel strength (peel strength) before HAST test. Show. That is, the insulating layer having excellent adhesion before the HAST test is provided. The peel strength before the HAST test is preferably 0.4 kgf / cm or more, more preferably 0.5 kgf / cm or more, and still more preferably 0.6 kgf / cm or more. The upper limit is not particularly limited, but may be 10 kgf / cm or less. The copper foil peel strength before the HAST test can be measured by the method described in the examples described later.

  The cured product obtained by heat curing the resin composition at 100 ° C. for 30 minutes, at 170 ° C. for 30 minutes and then at 200 ° C. for 90 minutes generally has the property of being excellent in copper foil peel strength (peel strength) after HAST test. Show. That is, an insulating layer which is excellent in adhesion after the HAST test and can exhibit high adhesion over a long period of time is provided. The peel strength after the HAST test is preferably 0.15 kgf / cm or more, more preferably 0.2 kgf / cm or more, and still more preferably 0.3 kgf / cm or more. The upper limit is not particularly limited, but may be 10 kgf / cm or less. The peel strength after the HAST test can be measured by the method described in the examples described later.

  A cured product obtained by heat curing the resin composition at 100 ° C. for 30 minutes and then at 170 ° C. for 30 minutes usually exhibits the property of excellent smear removability. That is, even if a via hole is formed in the cured product, an insulating layer having a maximum smear length of 5 μm or less at the bottom of the via hole is obtained. The smear removability can be measured by the method described in the examples described later.

  The resin composition of the present invention exhibits the specification that the minimum melt viscosity at 60 to 200 ° C. is low. That is, the resin composition excellent in the wiring embedding property is obtained. The minimum melt viscosity at 60 to 200 ° C. of the resin composition is preferably 5000 poise or less, more preferably 4500 poise or less, and still more preferably 4000 poise or less. The lower limit of the minimum melt viscosity is preferably 100 poise or more, more preferably 1000 poise or more, from the viewpoint of stably maintaining the thickness even if the resin composition layer is thin. The lowest melt viscosity can be measured by the dynamic viscoelasticity method, and can be measured, for example, according to the methods described in the examples below.

  The resin composition of the present invention can provide an insulating layer which is excellent in thin film insulation and can maintain adhesion with a conductor layer after HAST test. Therefore, the resin composition of the present invention can be suitably used as a resin composition for forming an insulating layer of a printed wiring board (resin composition for an insulating layer of a printed wiring board), and between the layers of the printed wiring board It can be used more suitably as a resin composition (resin composition for interlayer insulation layers of a printed wiring board) for forming an insulation layer. Further, the resin composition of the present invention can be suitably used even when the printed wiring board is a component-embedded circuit board because the resin composition of the present invention provides a good insulating layer for the component embedding property.

[Resin sheet]
The resin sheet of the present invention comprises a support and a resin composition layer provided on the support and formed of the resin composition of the present invention.

  The thickness of the resin composition layer is preferably 25 μm or less, more preferably 20 μm or less, and still more preferably from the viewpoint of thinning the printed wiring board and providing a cured product having excellent insulation properties even if it is a thin film. It is 15 μm or less, or 10 μm or less. The lower limit of the thickness of the resin composition layer is not particularly limited, but may usually be 1 μm or more, 1.5 μm or more, 2 μm or more.

  Examples of the support include a film made of a plastic material, a metal foil, and a release paper, and a film made of a plastic material and a metal foil are preferable.

  When a film made of a plastic material is used as the support, examples of the plastic material include polyethylene terephthalate (hereinafter sometimes abbreviated as "PET") and polyethylene naphthalate (hereinafter abbreviated as "PEN"). ) Polyester, polycarbonate (hereinafter sometimes abbreviated as "PC"), acrylic such as polymethyl methacrylate (PMMA), cyclic polyolefin, triacetyl cellulose (TAC), polyether sulfide (PES), polyether Ketone, polyimide and the like can be mentioned. Among them, polyethylene terephthalate and polyethylene naphthalate are preferable, and inexpensive polyethylene terephthalate is particularly preferable.

  When using metal foil as a support body, copper foil, aluminum foil etc. are mentioned as metal foil, for example, Copper foil is preferable. As the copper foil, a foil made of a single metal of copper may be used, and a foil made of an alloy of copper and another metal (for example, tin, chromium, silver, magnesium, nickel, zirconium, silicon, titanium, etc.) You may use.

  The support may be subjected to a matting treatment, a corona treatment and an antistatic treatment on the surface to be bonded to the resin composition layer.

  Moreover, as a support body, you may use the support body with a release layer which has a release layer in the surface joined to a resin composition layer. As the release agent used for the release layer of the support with release layer, for example, one or more release agents selected from the group consisting of alkyd resin, polyolefin resin, urethane resin, and silicone resin can be mentioned. . The release layer-provided support may be a commercially available product. For example, “SK-1” manufactured by Lintec Co., Ltd., which is a PET film having a release layer containing an alkyd resin-based release agent as a main component AL-5 "," AL-7 "," Lumirror T60 "manufactured by Toray Industries," Purex "manufactured by Teijin," Uni-Pel "manufactured by Unitika, and the like.

  The thickness of the support is not particularly limited, but a range of 5 μm to 75 μm is preferable, and a range of 10 μm to 60 μm is more preferable. In addition, when using the support body with a release layer, it is preferable that the thickness of the support body with a release layer is the said range.

  In one embodiment, the resin sheet may further contain other layers as needed. As such other layers, there may be mentioned, for example, a protective film according to a support, etc. provided on the side of the resin composition layer not bonded to the support (that is, the side opposite to the support). Be Although the thickness of a protective film is not specifically limited, For example, they are 1 micrometer-40 micrometers. By laminating the protective film, it is possible to suppress adhesion of dust and the like to the surface of the resin composition layer and scratches.

  For example, a resin sheet is prepared by dissolving a resin composition in an organic solvent, and the resin varnish is applied onto a support using a die coater or the like, and then dried to form a resin composition layer. Can be manufactured by

  Organic solvents include, for example, ketones such as acetone, methyl ethyl ketone (MEK) and cyclohexanone; ethyl acetate, butyl acetate, cellosolve acetate, acetates such as propylene glycol monomethyl ether acetate and carbitol acetate; cellosolve and butyl carbitol etc. And aromatic hydrocarbons such as toluene and xylene; and amide solvents such as dimethylformamide, dimethylacetamide (DMAc) and N-methylpyrrolidone. The organic solvent may be used singly or in combination of two or more.

  Drying may be carried out by known methods such as heating and hot air blowing. The drying conditions are not particularly limited, but the drying is performed so that the content of the organic solvent in the resin composition layer is 10% by mass or less, preferably 5% by mass or less. Although it changes also with the boiling points of the organic solvent in a resin varnish, when using the resin varnish containing 30 mass%-60 mass% organic solvent, for example, resin composition by making it dry at 50 degreeC-150 degreeC for 3 minutes-10 minutes Object layer can be formed.

  The resin sheet can be wound and stored in a roll. When the resin sheet has a protective film, it can be used by peeling off the protective film.

[Printed wiring board]
The printed wiring board of the present invention includes an insulating layer formed of a cured product of the resin composition of the present invention, a first conductor layer, and a second conductor layer. The insulating layer is provided between the first conductor layer and the second conductor layer, and insulates the first conductor layer from the second conductor layer (the conductor layer is referred to as a wiring layer). is there).

  The insulating layer is formed of a cured product of the resin composition of the present invention. The thickness of the insulating layer between the first and second conductor layers is preferably 6 μm or less, more preferably 5.5 μm or less, and still more preferably 5 μm or less. The lower limit is not particularly limited, but may be 0.1 μm or more. The distance between the first conductor layer and the second conductor layer (the thickness of the insulating layer between the first and second conductor layers) is the main surface of the first conductor layer 1 as shown in an example in FIG. 11 refers to the thickness t1 of the insulating layer 3 between the main surfaces 21 of the second conductor layer 2 and the second conductor layer 2. The first and second conductor layers are conductor layers adjacent to each other via the insulating layer, and the main surface 11 and the main surface 21 face each other.

  The total thickness t2 of the insulating layer is preferably 15 μm or less, more preferably 13 μm or less, and still more preferably 10 μm or less. The lower limit is not particularly limited, but may usually be 1 μm or more, 1.5 μm or more, 2 μm or more.

The printed wiring board can be manufactured by a method including the following steps (I) and (II) using the above-mentioned resin sheet.
(I) Step of laminating the resin composition layer of the resin sheet so as to bond with the inner layer substrate on the inner layer substrate (II) Step of thermally curing the resin composition layer to form an insulating layer

  The "inner layer substrate" used in step (I) is a member to be a substrate of a printed wiring board, and for example, a glass epoxy substrate, a metal substrate, a polyester substrate, a polyimide substrate, a BT resin substrate, a thermosetting polyphenylene ether substrate Etc. The substrate may have a conductor layer on one side or both sides, and the conductor layer may be patterned. The inner layer substrate in which a conductor layer (circuit) is formed on one side or both sides of the substrate may be referred to as "inner layer circuit board". Further, an intermediate product to which an insulating layer and / or a conductor layer is to be further formed in the production of a printed wiring board is also included in the “inner layer substrate” in the present invention. When the printed wiring board is a component built-in circuit board, an inner layer substrate containing components can be used.

  The lamination of the inner layer substrate and the resin sheet can be performed, for example, by heat-pressing the resin sheet from the support side to the inner layer substrate. Examples of the member (hereinafter, also referred to as “heat-pressing member”) for heat-pressing the resin sheet to the inner layer substrate include a heated metal plate (SUS end plate or the like) or a metal roll (SUS roll). In addition, it is preferable to press via an elastic material such as heat resistant rubber so that the resin sheet sufficiently follows the surface unevenness of the inner layer substrate, instead of directly pressing the heat pressure-bonding member on the resin sheet.

  The lamination of the inner layer substrate and the resin sheet may be carried out by a vacuum lamination method. In the vacuum laminating method, the thermocompression bonding temperature is preferably in the range of 60 ° C. to 160 ° C., more preferably 80 ° C. to 140 ° C., and the thermocompression bonding pressure is preferably 0.098 MPa to 1.77 MPa, more preferably 0 The heat compression bonding time is preferably in the range of 20 seconds to 400 seconds, more preferably in the range of 30 seconds to 300 seconds. The lamination is preferably carried out under reduced pressure conditions of a pressure of 26.7 hPa or less.

  Lamination can be performed by a commercially available vacuum laminator. As a commercially available vacuum laminator, for example, a vacuum pressure type laminator manufactured by Nikkiso Co., Ltd., a vacuum applicator manufactured by Nikko Materials, a batch type vacuum pressure laminator, etc. may be mentioned.

  After lamination, the laminated resin sheet may be subjected to a smoothing treatment by normal pressure (atmospheric pressure), for example, by pressing the heat pressure-bonding member from the support side. The pressing conditions for the smoothing treatment can be the same as the heating and pressing conditions for the above-mentioned lamination. The smoothing treatment can be performed by a commercially available laminator. In addition, you may perform lamination | stacking and smoothing processing continuously using said commercially available vacuum laminator.

  The support may be removed between step (I) and step (II) and may be removed after step (II).

  In the step (II), the resin composition layer is thermally cured to form an insulating layer.

  The heat curing conditions of the resin composition layer are not particularly limited, and conditions generally employed for forming an insulating layer of a printed wiring board may be used.

  For example, the heat curing conditions of the resin composition layer vary depending on the type of the resin composition and the like, but the curing temperature is preferably 120 ° C to 240 ° C, more preferably 150 ° C to 220 ° C, still more preferably 170 ° C to 200 ° C. The curing time can be preferably 5 minutes to 120 minutes, more preferably 10 minutes to 100 minutes, and still more preferably 15 minutes to 90 minutes.

  Before thermally curing the resin composition layer, the resin composition layer may be preheated at a temperature lower than the curing temperature. For example, prior to heat curing the resin composition layer, the resin composition layer is heated at a temperature of 50.degree. C. or more and less than 120.degree. C. (preferably 60.degree. C. or more and 115.degree. C. or less, more preferably 70.degree. C. or more and 110.degree. C. or less). It may be preheated for 5 minutes or more (preferably 5 minutes to 150 minutes, more preferably 15 minutes to 120 minutes, still more preferably 15 minutes to 100 minutes).

  When producing a printed wiring board, the steps of: (III) drilling holes in the insulating layer; (IV) roughening the insulating layer; and (V) forming the conductor layer may be further performed. These steps (III) to (V) may be carried out according to various methods known to those skilled in the art, which are used for producing a printed wiring board. When the support is removed after the step (II), the removal of the support may be performed between the step (II) and the step (III), between the step (III) and the step (IV), or It may be carried out between IV) and step (V). In addition, if necessary, the formation of the insulating layer and the conductor layer in the steps (II) to (V) may be repeated to form a multilayer wiring board. In this case, the thickness of the insulating layer between the conductor layers (t1 in FIG. 1) is preferably in the above range.

  The step (III) is a step of forming holes in the insulating layer, whereby holes such as via holes and through holes can be formed in the insulating layer. The step (III) may be carried out using, for example, a drill, a laser, a plasma or the like depending on the composition of the resin composition used for forming the insulating layer. The size and shape of the holes may be appropriately determined according to the design of the printed wiring board.

  Step (IV) is a step of roughening the insulating layer. The procedure and conditions of the roughening treatment are not particularly limited, and known procedures and conditions generally used in forming an insulating layer of a printed wiring board can be adopted. For example, the insulating layer can be roughened by performing a swelling process with a swelling solution, a roughening process with an oxidizing agent, and a neutralization process with a neutralizing solution in this order. The swelling liquid used for the roughening treatment is not particularly limited, and examples thereof include an alkaline solution, a surfactant solution and the like, preferably an alkaline solution, and examples of the alkaline solution include sodium hydroxide solution and potassium hydroxide solution. preferable. As a swelling liquid marketed, "Swelling dip security G" and "Swelling dip security SBU" by Atotech Japan Ltd., etc. are mentioned, for example. Although the swelling process by a swelling liquid is not specifically limited, For example, it can carry out by immersing an insulating layer in the swelling liquid of 30 degreeC-90 degreeC for 1 minute-20 minutes. From the viewpoint of suppressing the swelling of the resin of the insulating layer to an appropriate level, it is preferable to immerse the insulating layer for 5 minutes to 15 minutes in a swelling liquid at 40 ° C to 80 ° C. The oxidizing agent used for the roughening treatment is not particularly limited, and examples thereof include alkaline permanganic acid solutions in which potassium permanganate and sodium permanganate are dissolved in an aqueous solution of sodium hydroxide. The roughening treatment with an oxidizing agent such as an alkaline permanganic acid solution is preferably performed by immersing the insulating layer in the oxidizing agent solution heated to 60 ° C. to 80 ° C. for 10 minutes to 30 minutes. The concentration of permanganate in the alkaline permanganate solution is preferably 5% by mass to 10% by mass. Examples of commercially available oxidizing agents include alkaline permanganic acid solutions such as "Concentrate Compact CP" and "Dosing Solution Security P" manufactured by Atotech Japan Co., Ltd. Moreover, as a neutralization liquid used for roughening treatment, an acidic aqueous solution is preferable, and as a commercial product, for example, "Reduction Solution Security G" manufactured by Atotech Japan Co., Ltd. may be mentioned. The treatment with the neutralization solution can be carried out by immersing the treated surface roughened with the oxidizing agent in the neutralization solution at 30 ° C. to 80 ° C. for 5 minutes to 30 minutes. From the viewpoint of workability and the like, a method of immersing the target subjected to the roughening treatment with the oxidizing agent in a neutralization solution at 40 ° C. to 70 ° C. for 5 minutes to 20 minutes is preferable.

  In one embodiment, the arithmetic mean roughness (Ra) of the surface of the insulating layer after the roughening treatment is preferably 400 nm or less, more preferably 350 nm or less, and still more preferably 300 nm or less. The lower limit is not particularly limited, but preferably 0.5 nm or more, more preferably 1 nm or more. Further, the root mean square roughness (Rq) of the surface of the insulating layer after the roughening treatment is preferably 400 nm or less, more preferably 350 nm or less, and still more preferably 300 nm or less. The lower limit is not particularly limited, but preferably 0.5 nm or more, more preferably 1 nm or more. Arithmetic mean roughness (Ra) and root mean square roughness (Rq) of the insulating layer surface can be measured using a noncontact surface roughness meter.

  Step (V) is a step of forming a conductor layer. When the conductor layer is not formed on the inner layer substrate, the step (V) is a step of forming the first conductor layer. When the conductor layer is formed on the inner layer substrate, the conductor layer is the first conductor layer. Step (V) is a step of forming a second conductor layer.

  The conductor material used for the conductor layer is not particularly limited. In a preferred embodiment, the conductor layer is one or more selected from the group consisting of gold, platinum, palladium, silver, copper, aluminum, cobalt, chromium, zinc, nickel, titanium, tungsten, iron, tin and indium. Contains metal. The conductor layer may be a single metal layer or an alloy layer, and as the alloy layer, for example, an alloy of two or more metals selected from the above group (for example, nickel-chromium alloy, copper, And layers formed of nickel alloy and copper-titanium alloy). Among them, chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver or copper single metal layer, nickel-chromium alloy, copper, from the viewpoint of versatility of conductor layer formation, cost, easiness of patterning, etc. An alloy layer of nickel alloy, copper-titanium alloy is preferable, a single metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver or copper, or an alloy layer of nickel-chromium alloy is more preferable, single copper Metal layers are more preferred.

  The conductor layer may have a single-layer structure or a multilayer structure in which two or more single metal layers or alloy layers made of different types of metals or alloys are laminated. When the conductor layer has a multilayer structure, the layer in contact with the insulating layer is preferably a single metal layer of chromium, zinc or titanium, or an alloy layer of nickel-chromium alloy.

  The thickness of the conductor layer is generally 3 μm to 35 μm, preferably 5 μm to 30 μm, depending on the desired printed wiring board design.

  In one embodiment, the conductor layer may be formed by plating. For example, the conductor layer having a desired wiring pattern can be formed by plating on the surface of the insulating layer by a conventionally known technique such as a semi-additive method or a full-additive method, and from the viewpoint of manufacturing simplicity, semi-additive It is preferable to form by a method. Hereinafter, the example which forms a conductor layer by a semiadditive method is shown.

  First, a plating seed layer is formed on the surface of the insulating layer by electroless plating. Then, on the formed plating seed layer, a mask pattern is formed to expose a part of the plating seed layer corresponding to the desired wiring pattern. After forming a metal layer by electrolytic plating on the exposed plating seed layer, the mask pattern is removed. Thereafter, the unnecessary plating seed layer can be removed by etching or the like to form a conductor layer having a desired wiring pattern.

  The resin sheet of the present invention can also be suitably used when the printed wiring board is a component-embedded circuit board because the resin sheet of the present invention also provides an insulating layer having good component embedding properties. The component built-in circuit board can be manufactured by a known manufacturing method.

  The printed wiring board manufactured using the resin sheet of the present invention is an aspect provided with an insulating layer which is a cured product of the resin composition layer of the resin sheet, and an embedded wiring layer embedded in the insulating layer, It is also good.

[Semiconductor device]
The semiconductor device of the present invention includes the printed wiring board of the present invention. The semiconductor device of the present invention can be manufactured using the printed wiring board of the present invention.

  Examples of the semiconductor device include various semiconductor devices provided for electric products (for example, computers, mobile phones, digital cameras, televisions and the like) and vehicles (for example, motorcycles, automobiles, trains, ships, aircraft and the like) and the like.

  The semiconductor device of the present invention can be manufactured by mounting a component (semiconductor chip) at a conductive portion of a printed wiring board. The "conductive location" is a "location for transmitting an electrical signal in a printed wiring board", and the location may be a surface or an embedded location. The semiconductor chip is not particularly limited as long as it is an electric circuit element made of a semiconductor.

  The mounting method of the semiconductor chip at the time of manufacturing the semiconductor device is not particularly limited as long as the semiconductor chip functions effectively, but specifically, a wire bonding mounting method, a flip chip mounting method, a bumpless buildup layer The mounting method by (BBUL), the mounting method by an anisotropic conductive film (ACF), the mounting method by a nonconductive film (NCF), etc. are mentioned. Here, "the mounting method using a bumpless build-up layer (BBUL)" means "a mounting method in which a semiconductor chip is directly embedded in a recess of a printed wiring board to connect the semiconductor chip and the wiring on the printed wiring board". It is.

  Hereinafter, the present invention will be specifically described by way of examples. The present invention is not limited to these examples. In the following, “parts” and “%” representing amounts mean “parts by mass” and “% by mass” unless otherwise specified.

Example 1
10 parts of bisphenol type epoxy resin ("ZX1059" manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., 1: 1 mixture of bisphenol A type and bisphenol F type, epoxy equivalent 169), and naphthol type epoxy resin ("ESN 475V" manufactured by Nippon Steel Sumikin Chemical Co., Ltd.) , 50 parts of epoxy equivalent weight, was heated and dissolved in 40 parts of solvent naphtha while stirring. The mixture was cooled to room temperature to prepare a solution composition of (A) epoxy resin.

  Phenolic resin having 5 parts of a phenoxy resin ("YX7553BH30" manufactured by Mitsubishi Chemical Corp., a 1: 1 solution of MEK having a solid content of 30% by mass), a triazine skeleton and a novolac structure in the dissolution composition of this (A) epoxy resin 5 parts of a curing agent ("LA-3018-50P" manufactured by DIC, an active group equivalent weight of about 151, 50% solid content in 2-methoxypropanol solution), an active ester curing agent ("HPC-8000-65T" manufactured by DIC) 50 parts of active group equivalent of about 223, solid content of 65 mass% in toluene, 5 parts of curing accelerator (1-benzyl-2-phenylimidazole (1B2PZ), 10 mass% of solid MEK solution), amine alkoxy Spherical silica (average particle size 0.77 μm, AD) surface-treated with silane compound (“KBM 573” manufactured by Shin-Etsu Chemical Co., Ltd.) Mix 250 parts of Tex "SO-C2" and 25 parts of 40 mass% toluene solution of maleimide compound ("BMI 3000 J" manufactured by Designer Morecules) and uniformly disperse with a high-speed rotary mixer to obtain a resin A varnish was made.

  As a support, a polyethylene terephthalate film ("L5" manufactured by Lintec Corporation, 38 μm thick) provided with a release layer was prepared. On the release layer of this support, the above resin varnish was uniformly applied such that the thickness of the resin composition layer after drying was 25 μm. Thereafter, the resin varnish was dried at 80 ° C. to 120 ° C. (average 100 ° C.) for 4 minutes to obtain a resin sheet including a support and a resin composition layer.

Example 2
In Example 1, 25 parts of a 40% by mass toluene solution of a maleimide compound ("BMI 3000J" manufactured by Designer Morecles) is added to 25 parts by weight a 40% by mass toluene solution of a maleimide compound ("BMI 1700" manufactured by Designer Morecles). changed. The resin varnish and the resin sheet were manufactured like Example 1 except the above matter.

[Example 3]
In Example 1, 25 parts of a 40% by mass toluene solution of a maleimide compound ("BMI 3000J" manufactured by Designer Morecules) is added to 25 parts of a 40% by mass toluene solution of a maleimide compound ("BMI 1500" manufactured by Designer Morecles) changed. The resin varnish and the resin sheet were manufactured like Example 1 except the above matter.

Example 4
In Example 1, 25 parts of a 40% by mass solution of a maleimide compound ("BMI 3000J" manufactured by Designer Moreques) in 25 parts of a 40% by mass toluene solution of a maleimide compound ("BMI 689" manufactured by Designer Moreques) changed. The resin varnish and the resin sheet were manufactured like Example 1 except the above matter.

式中、Ｍｅはメチル基を表し、Ｅｔはエチル基を表す。 Comparative Example 1
In Example 1, 40 parts by mass of a 40% by mass toluene solution of a maleimide compound ("BMI 3000J" manufactured by Designer Moreques) and 40 parts by mass of a maleimide compound ("BMI 70" manufactured by Kei I Kasei Co., Ltd.) It changed to 25 parts of MEK solution. The resin varnish and the resin sheet were manufactured like Example 1 except the above matter.

In the formula, Me represents a methyl group, and Et represents an ethyl group.

Comparative Example 2
In Example 2, 250 parts of spherical silica (average particle diameter 0.77 μm, “SO-C2” manufactured by Admatechs Co., Ltd.) surface-treated with an amine alkoxysilane compound (“KBM 573” manufactured by Shin-Etsu Chemical Co., Ltd.) To 240 parts, and no maleimide compound ("BMI3000J" manufactured by Designer Moreques) was used. The resin varnish and the resin sheet were manufactured like Example 2 except the above matter.

[Evaluation method]
The resin sheet obtained by the Example and comparative example which were mentioned above was evaluated by the following method.

[Method of measuring peel strength]
<Preparation of adhesion evaluation substrate>
(1) Substrate treatment of interior substrate:
A glass cloth-based epoxy resin double-sided copper-clad laminate (copper foil thickness 18 μm, substrate thickness 0.8 mm, Panasonic “R1515A”) having a copper foil on the surface was prepared as the inner layer substrate. All copper foils on the surface of the inner layer substrate were removed by etching. Thereafter, drying was performed at 190 ° C. for 30 minutes.

(2) Lamination of resin sheet:
Using the batch type vacuum pressure laminator (two-stage buildup laminator "CVP 700" manufactured by Nikko Materials Co., Ltd.), the resin composition layer obtained by using the resin sheet obtained in the above-described Example and Comparative Example It laminated on both sides of an inner layer board so that it might join. This laminate was carried out by pressure-reducing for 30 seconds to a pressure of 13 hPa or less, and pressure bonding for 30 seconds at a temperature of 100 ° C. and a pressure of 0.74 MPa.

  Then, the laminated resin sheet was heat-pressed for 60 seconds at 100 ° C. under a pressure of 0.5 MPa under atmospheric pressure for smoothing. Thereafter, the support was peeled off to obtain an “intermediate multilayer I” including the resin composition layer, the inner layer substrate and the resin composition layer in this order.

  On the other hand, a copper foil (thickness 35 μm, “3EC-III” manufactured by Mitsui Metals Co., Ltd.) having a glossy surface was prepared. The glossy surface of the copper foil was roughened by etching using a micro-etching agent ("CZ 8101" manufactured by MEC) at a copper etching amount of 1 μm. The copper foil thus obtained is called "roughened copper foil".

  The roughened copper foil was laminated on both sides of the intermediate multilayer I such that the roughened surface of the roughened copper foil was bonded to the resin composition layer of the intermediate multilayer I. This lamination was performed on the same conditions as lamination of the resin sheet to the inner-layer board | substrate mentioned above. As a result, an “intermediate multilayer body II” was obtained that includes a roughened copper foil, a resin composition layer, an inner layer substrate, a resin composition layer, and a roughened copper foil in this order.

  The intermediate multilayer II was placed in an oven at 100 ° C. for 30 minutes, then transferred to an oven at 170 ° C., and heated for 30 minutes. Next, after taking out the intermediate multilayer II from the oven under a room temperature atmosphere, it was further put into a 200 ° C. oven and heated for an additional 90 minutes. Thus, the resin composition layer is thermally cured, and the roughened copper foil, the insulating layer as a cured product of the resin composition layer, the inner layer substrate, the insulating layer as a cured product of the resin composition layer, and An “evaluation substrate A” was obtained which contains the copper foils in this order. In the evaluation substrate A, the roughened copper foil corresponds to the conductor layer.

<Measurement of peel strength before HAST test>
The peel strength of the roughened copper foil and the insulating layer was measured using the evaluation substrate A described above. The measurement of this peeling strength was performed based on JISC6481. Specifically, the peel strength was measured by the following operation.

  The roughened copper foil of the evaluation substrate A was cut into a rectangular portion having a width of 10 mm and a length of 100 mm. One end of this rectangular portion was peeled off and held by a holding tool (manufactured by TS S Corporation, an autocom type tester "AC-50C-SL"). The range of length 35 mm of the said rectangular part was peeled off in the orthogonal | vertical direction, and the load at the time of this peeling (kgf / cm) was measured as peel strength. The above peeling was performed at a speed of 50 mm / min in room temperature.

<Measurement of peel strength after HAST test>
Thereafter, the HAST test was performed in which the evaluation substrate A was placed in an environment of a temperature of 130 ° C. and a humidity of 85% RH for 100 hours. After this HAST test, the peel strength of the roughened copper foil of the evaluation substrate A and the insulating layer was measured by the same method as before the HAST test.

[Evaluation of smear removability]
(1) Substrate treatment of interior substrate:
A glass cloth-based epoxy resin double-sided copper-clad laminate (copper foil thickness 18 μm, substrate thickness 0.8 mm, Panasonic “R1515A”) having a copper foil on the surface was prepared as the inner layer substrate. The copper foil on the surface of the inner layer substrate was roughened by etching using a microetching agent ("CZ 8101" manufactured by MEC) at a copper etching amount of 1 μm. Thereafter, drying was performed at 190 ° C. for 30 minutes.

(2) Lamination and curing of resin sheet:
Using the batch type vacuum pressure laminator (two-stage buildup laminator "CVP 700" manufactured by Nikko Materials Co., Ltd.), the resin composition layer obtained by using the resin sheet obtained in the above-described Example and Comparative Example It laminated on both sides of an inner layer board so that it might join. This laminate was carried out by pressure-reducing for 30 seconds to a pressure of 13 hPa or less, and pressure bonding for 30 seconds at a temperature of 100 ° C. and a pressure of 0.74 MPa.
Then, the laminated resin sheet was heat-pressed for 60 seconds at 100 ° C. under a pressure of 0.5 MPa under atmospheric pressure for smoothing. Furthermore, it was put into an oven at 100 ° C. and heated for 30 minutes, then transferred to an oven at 170 ° C. and heated for 30 minutes.

(3) Via hole formation:
The insulating layer is processed under the conditions of a frequency of 2000 Hz, a pulse width of 3 μs, an output of 0.95 W and a shot number of 3 using a CO ₂ laser processing machine (LK-2K212 / 2C) manufactured by Via Mechanics Co., Ltd. A via hole having a top diameter (diameter) of 50 μm and a diameter of 50 μm at the bottom of the insulating layer was formed. Thereafter, the support was peeled off to obtain a circuit board.

(4) Roughening treatment The surface of the insulating layer of the circuit board was immersed in swelling liquid, swelling dip security g P of Atotech Japan Co., Ltd., at 60 ° C. for 10 minutes. Next, the surface of the insulating layer of the circuit board was immersed for 25 minutes at 80 ° C. in Concentrate Compact P (KMnO ₄ : 60 g / L, NaOH: 40 g / L aqueous solution) of Atotech Japan Co., Ltd., which is a roughening solution. Finally, the surface of the insulating layer of the circuit board was immersed for 5 minutes at 40 ° C. in Atotech Japan's reduction solution Securitygant P, a neutralizing solution.

(5) Evaluation of residue on bottom of via hole The periphery of the bottom of the via hole was observed with a scanning electron microscope (SEM), and the maximum smear length from the wall surface of the bottom of the via hole was measured from the obtained image and evaluated according to the following criteria.
○: Maximum smear length less than 5 μm ×: Maximum smear length 5 μm or more

[Measurement of minimum melt viscosity]
Melt viscosity of the resin composition layer in the resin sheet produced by the Example and the comparative example was measured using the dynamic-viscoelasticity measuring apparatus ("Rheosol-G3000" by UBM company). This measurement was performed using a parallel plate with a diameter of 18 mm for a 1 g sample collected from the resin composition layer. The measurement conditions were a start temperature of 60 ° C. to 200 ° C., a temperature increase rate of 5 ° C./min, a measurement temperature interval of 2.5 ° C., and a vibration of 1 Hz / deg. The lowest melt viscosity was determined from the obtained melt viscosity measurement values.

[result]
The results of the above-described Examples and Comparative Examples are shown in the following table. In the following table, the amount of each component represents the non-volatile component equivalent amount. Further, in the following table, the meanings of the abbreviations are as follows.
ESN 475 V: Naphthol type epoxy resin, manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.
ZX1059: Bisphenol type epoxy resin, manufactured by Nippon Steel & Sumikin Chemical Co., Ltd., 1: 1 mixture of bisphenol A type and bisphenol F type, epoxy equivalent 169
BMI 3000 J: maleimide compound, made by Designer Moreques BMI1700: maleimide compound, made by Designer Moreques BMI 1500: made from maleimide designer, Moreleuz BMI 689: maleimide compound, made by Designer Moreques BMI 70: maleimide compound, Kei・ I Chemical Co., Ltd. HPC-8000-65T: Active ester curing agent, DIC, active group equivalent weight about 223, toluene solution of solid content 65% by mass SO-C2: amine alkoxysilane compound (Shin-Etsu Chemical Co., Ltd.) Spherical silica surface-treated with "KBM 573", average particle diameter 0.5 μm, Admatex LA-3018-50P: phenolic curing agent having triazine skeleton and novolac structure, DIC, active group equivalent weight about 15 2-methoxypropanol solution with solid content of 50% YX7553BH30: phenoxy resin, manufactured by Mitsubishi Chemical Corporation, 1: 1 solution of MEK with solid content of 30% by mass 1B2PZ: curing accelerator, 1-benzyl-2-phenylimidazole, 10% solids by weight MEK solution

  In Examples 1 to 4, even when the components (C) to (G) are not contained, it is confirmed that the results are similar to those of the above-mentioned examples although there is a difference in degree.

1 first conductor layer 11 main surface 2 of first conductor layer 2 second conductor layer 21 main surface of second conductor layer 3 insulating layer t 1 distance between first conductor layer and second conductor layer (first And the thickness of the insulating layer between the second conductor layers)
t2 Thickness of entire insulating layer

Claims (16)

A resin composition comprising (A) an epoxy resin, and (B) a maleimide compound,
A resin composition, wherein the component (B) contains at least one of an alkyl group having 5 or more carbon atoms and an alkylene group having 5 or more carbon atoms. The resin composition according to claim 1, wherein the component (B) is represented by the following general formula (B-1).

In general formula (B-1), R each independently represents an alkylene group having 5 or more carbon atoms which may have a substituent, and L represents a single bond or a divalent linking group.   The resin composition according to claim 1 or 2, wherein the content of the component (B) is 0.1 mass% or more and 10 mass% or less when the nonvolatile component in the resin composition is 100 mass%.   The resin composition according to any one of claims 1 to 3, further comprising (C) an active ester compound.   The resin composition according to claim 4, wherein the content of the component (C) is 5% by mass or more when the nonvolatile component in the resin composition is 100% by mass.   Furthermore, (D) The resin composition of any one of Claims 1-5 containing an inorganic filler.   The resin composition according to claim 6, wherein the content of the component (D) is 50% by mass or more.   In the general formula (B-1), L represents an oxygen atom, an arylene group having 6 to 24 carbon atoms which may have a substituent, or 1 to 50 carbon atoms which may have a substituent. Or an alkyl group having 5 or more carbon atoms, a divalent group derived from phthalimide, a divalent group derived from pyromellitic diimide, or a divalent group consisting of a combination of two or more of these groups. The resin composition according to any one of claims 1 to 7. The resin composition according to any one of claims 1 to 8, wherein the component (B) is represented by the following general formula (B-2).

In general formula (B-2), R 'each independently represents an alkylene group having 5 or more carbon atoms which may have a substituent, and A may independently have a substituent. It represents a divalent group having an alkylene group having 5 or more carbon atoms or an aromatic ring which may have a substituent. n represents an integer of 1 to 10.   In the general formula (B-2), each A independently represents a cyclic alkylene group having 5 or more carbon atoms which may have a substituent; and 2 having a benzene ring which may have a substituent A divalent group having a phthalimido ring which may have a substituent, or a divalent group having a pyromellitic diimide ring which may have a substituent; The resin composition as described.   The resin composition according to any one of claims 1 to 10, which is for forming an insulating layer of a printed wiring board.   The resin composition according to any one of claims 1 to 11, which is for forming an interlayer insulating layer of a printed wiring board.   A resin sheet comprising a support and a resin composition layer formed of the resin composition according to any one of claims 1 to 12 provided on the support.   The resin sheet according to claim 13, wherein the thickness of the resin composition layer is 25 μm or less. A printed wiring board including a first conductor layer, a second conductor layer, and an insulating layer formed between the first conductor layer and the second conductor layer,
The printed wiring board, wherein the insulating layer is a cured product of the resin composition according to any one of claims 1 to 12.   A semiconductor device comprising the printed wiring board according to claim 15.

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