JP2019021947A - Electronic component, connection body, manufacturing method of connection body, and connection method of electronic component - Google Patents

Abstract

To improve connection reliability by cancelling pressure difference caused by a thermo-compression bonding head even in electronic components having area difference between an input bump region and an output bump region and disposed asymmetrically.SOLUTION: On a mounting surface 2 onto a circuit board 14, an output bump region 4 is provided in which output bumps 3 are arrayed proximately to one side 2a of a pair of opposite side edges, and an input bump region 6 is provided in which input bumps 5 are arrayed proximately to the other side 2b of the pair of side edges. The output bump region 4 and the input bump region 6 have different area and are disposed asymmetrically on the mounting surface 2. One bump region having relatively larger area out of the output bump region 4 or the input bump region 6, is formed inside of the proximate one or other side edge 2a or 2b by distance equal to or more than 4% of width W between the pair of side edges.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an electronic component connected to a circuit board via an adhesive, a connection body in which the electronic component is connected to the circuit board, a manufacturing method of the connection body, and a connection method of the electronic component, and more particularly to the circuit board. The present invention relates to an electronic component in which a plurality of bump electrodes are arranged asymmetrically on the mounting surface, a connection body to which the electronic component is connected, a manufacturing method of the connection body, and a connection method of the electronic component.

  2. Description of the Related Art Conventionally, a connection body is provided in which electronic components such as an IC chip and an LSI chip are connected to circuit boards of various electronic devices. In recent years, various electronic devices use IC chips or LSI chips in which bumps, which are protruding electrodes, are arranged on the mounting surface as electronic components from the viewpoints of fine pitch, light weight, and thinning. So-called COB (chip on board) or COG (chip on glass) for directly mounting electronic components on the circuit board is employed.

  In COB connection and COG connection, an IC chip is thermocompression-bonded on a terminal portion of a circuit board via an anisotropic conductive film. An anisotropic conductive film is a film formed by mixing conductive particles in a thermosetting binder resin, and heat conduction is performed between two conductors so that electrical conduction between the conductors is achieved with the conductive particles. The mechanical connection between the conductors is maintained by the binder resin. As an adhesive constituting the anisotropic conductive film, a highly reliable thermosetting adhesive is usually used. On the other hand, connection using a photo-curable resin or a connection method using both thermosetting and photo-curing is also used. However, in the case of applying pressure with a tool, it is assumed that the same problems as thermosetting adhesives are included. The

  For example, as shown in FIG. 5A, the bumped IC chip 50 has an input bump area 52 in which input bumps 51 are arranged in a line along one side edge 50a on the mounting surface of the circuit board. An output bump area 54 in which output bumps 53 are arranged in two rows in a zigzag manner is provided along the other side edge 50b facing one side edge 50a. The bump arrangement varies depending on the type of IC chip. In general, a conventional IC chip with bumps has a larger number of output bumps 53 than the number of input bumps 51, and an output bump area 54 than the area of the input bump area 52. And the shape of the input bump 51 is formed larger than the shape of the output bump 53.

  In COG mounting, the IC chip 50 is mounted on the electrode terminal 57 of the circuit board 56 via the anisotropic conductive film 55, and then heated and pressed from above the IC chip 50 by the thermocompression bonding head 58. By the heat and pressure by the thermocompression bonding head 58, the binder resin of the anisotropic conductive film 55 is melted and flows from between the input / output bumps 51 and 53 and the electrode terminals 57 of the circuit board 56, and each input / output. Conductive particles are sandwiched between the bumps 51 and 53 and the electrode terminal 57 of the circuit board 56, and in this state, the binder resin is thermally cured. As a result, the IC chip 50 is electrically and mechanically connected to the circuit board 56.

JP 2004-214373 A

  Here, as described above, in the electronic component such as the IC chip 50 with bumps, the bump arrangement and size of the input bump 51 and the output bump 53 formed on the mounting surface are different, and the input bump region 52 and the output bump are different. There is an area difference from the region 54. In the electronic component, the input bump area 52 and the output bump area 54 are asymmetrically arranged on the mounting surface.

  Therefore, in the conventional COB connection or COG connection, the pressing force applied to the input bump 51 and the output bump 53 by the thermocompression bonding head 58 becomes non-uniform. For example, in the output bump region 54, it is arranged on the other side edge 50b side. There may be a pressure difference between the output bump 53 and the output bump 53 arranged on the inner side of the mounting surface.

  In addition, when the pressure by the thermocompression bonding head 58 is biased to the inner edges of the input bump area 52 and the output bump area 54, in the output bump area 54, the output bump 53 is arranged on the other side edge 50b side. There is a risk that the pressure of the electric field becomes weak and the conductive particles are insufficiently pushed to cause poor conduction.

  In order to solve such problems, so-called dummy bumps that are not used for signal input and output are formed, and stress applied from the thermocompression bonding head to the entire surface of the IC chip is dispersed and made uniform. However, this technique also increases the technical difficulty by increasing the stress fulcrum. Further, in order to form dummy bumps, the number of man-hours for manufacturing electronic components increases, and material costs are also required. Therefore, a configuration that does not use dummy bumps is desired.

  Therefore, the present invention provides an electronic component capable of eliminating the pressure difference caused by the thermocompression bonding head and improving the connection reliability in the electronic component in which the input bump region and the output bump region have an area difference and are disposed asymmetrically. It is an object of the present invention to provide a connection body, a manufacturing method of the connection body, and a connection method.

  In order to solve the above-described problem, an electronic component according to the present invention is provided with an output bump area in which output bumps are arranged in proximity to one side of a pair of side edges facing each other. An input bump area in which input bumps are arranged adjacent to the other side is provided, and the output bump area and the input bump area are arranged in different areas and asymmetrically, and the output bump area or the input bump area Of these, one having a relatively large area is formed on the inner side from the adjacent one or other side edge by a distance of 4% or more of the width between the pair of side edges.

  In addition, the connection body according to the present invention is a connection body in which the electronic component is arranged on the circuit board via an adhesive and is pressed by a pressure tool so that the electronic component is connected to the circuit board. The mounting surface of the electronic component on the circuit board is provided with an output bump area in which output bumps are arranged adjacent to one side of the pair of side edges facing each other, and the other of the pair of side edges An input bump area in which input bumps are arranged close to the side is provided, and the output bump area and the input bump area are arranged in different areas and asymmetrically on the mounting surface, and the output bump area or the input bump One of the bump areas having a relatively large area is formed on the inner side from the adjacent one or other side edge by a distance of 4% or more of the width between the pair of side edges. .

  Moreover, the manufacturing method of the connection body which concerns on this invention arrange | positions an electronic component on a circuit board via an adhesive agent, and connects the said electronic component on the said circuit board by pressurizing with a pressurization tool. In the manufacturing method, the mounting surface of the electronic component on the circuit board is provided with an output bump region in which output bumps are arranged adjacent to one side of the pair of side edges facing each other, and the pair of side edges An input bump area in which input bumps are arranged adjacent to the other side of the output bump area is provided, and the output bump area and the input bump area are arranged in different areas and asymmetrically on the mounting surface. One of the input bump regions having a relatively large area is formed on the inner side from the adjacent one or other side edge by a distance of 4% or more of the width between the pair of side edges. It is.

  Further, the connection method according to the present invention is an electronic component connection method in which an electronic component is arranged on a circuit board via an adhesive, and the electronic component is connected to the circuit board by applying pressure with a pressure tool. The mounting surface of the electronic component on the circuit board is provided with an output bump area in which output bumps are arranged adjacent to one side of the pair of side edges facing each other, and the other side of the pair of side edges. An input bump area in which input bumps are arranged is provided adjacent to the output bump area, and the output bump area and the input bump area are arranged in different areas and asymmetrically on the mounting surface, and the output bump area or the input bump area. One of the regions having a relatively large area is formed on the inner side from the one or the other side edge adjacent by a distance of 4% or more of the width between the pair of side edges.

  According to the present invention, the pressure gradient formed across the width direction of the bump region is formed by forming the large bump region from the side edge to the inside by a predetermined ratio with respect to the width of the mounting surface. It is gently leveled to prevent a situation where the pressing force by the thermocompression bonding head is insufficient on the side edge side. As a result, the electronic component can reliably hold conductive particles between the bumps on the side edge side and the electrode terminals formed on the circuit board to ensure conductivity.

FIG. 1 is a plan view showing a mounting surface of an electronic component according to the present invention. FIG. 2 is a cross-sectional view showing a connection body to which electronic components are connected. FIG. 3 is a plan view showing a mounting surface of the electronic component according to the present invention provided with dummy bumps. FIG. 4 is a cross-sectional view showing an anisotropic conductive film. FIG. 5 is a plan view showing a mounting surface of a conventional electronic component.

  Hereinafter, an electronic component to which the present invention is applied, a connection body, a method for manufacturing the connection body, and a connection method will be described in detail with reference to the drawings. It should be noted that the present invention is not limited to the following embodiments, and various modifications can be made without departing from the scope of the present invention. Further, the drawings are schematic, and the ratio of each dimension may be different from the actual one. Specific dimensions should be determined in consideration of the following description. Moreover, it is a matter of course that portions having different dimensional relationships and ratios are included between the drawings.

  An electronic component to which the present invention is applied is an electronic component that is arranged on a circuit board via an adhesive and is connected to the circuit board by being pressed by a thermocompression bonding head. For example, a driver IC or a system LSI Etc. are packaged electronic components. Hereinafter, the IC chip 1 will be described as an example of the electronic component.

  As shown in FIG. 1, the mounting surface 2 connected to the circuit board of the IC chip 1 has a substantially rectangular shape, and along the pair of side edges 2a and 2b facing each other in the length direction, output bumps are formed. An output bump area 4 in which 3 is arranged and an input bump area 6 in which input bumps 5 are arranged are formed. In the IC chip 1, the output bump region 4 is formed on the side edge 2 a side of the mounting surface 2, and the input bump region 6 is formed on the other side edge 2 b side of the mounting surface 2. Thus, the IC chip 1 is formed such that the output bump area 4 and the input bump area 6 are separated from each other in the width direction of the mounting surface 2.

  In the output bump region 4, for example, a plurality of output bumps 3 formed in the same shape are arranged in a staggered pattern in three rows along the longitudinal direction of the mounting surface 2. In the input bump area 6, for example, a plurality of input bumps 5 formed in the same shape are arranged in a line along the longitudinal direction of the mounting surface 2. The input bump 5 is formed larger than the output bump 3. Thus, in the IC chip 1, the output bump region 4 and the input bump region 6 have an area difference and are disposed asymmetrically on the mounting surface 2. The output bumps 3 arranged in the output bump region 4 are preferably formed with the same dimensions. Similarly, the input bumps 5 arranged in the input bump area 6 are preferably formed with the same dimensions.

[Offset of large area bump area]
In the IC chip 1 according to the present invention, the output bump region 4 is inward from the one side edge 2a by a predetermined ratio with respect to the IC width W extending between the one side edge 2a and the other side edge 2b. Is formed. Thereby, when the IC chip 1 is heated and pressed on the circuit board 14 by a thermocompression bonding head 17 to be described later, the pressing force is prevented from being unevenly distributed inside the output bump region 4, and the one side edge 2a side It is possible to apply an appropriate pressing force to the output pumps 3 arranged in the above.

  That is, since the IC chip 1 has an area difference between the output bump region 4 and the input bump region 6 and is disposed asymmetrically on the mounting surface 2, the thermocompression bonding head 17 applies pressure to the entire surface of the mounting surface 2. When applied, in the output bump region 4 formed in a large area across the width direction by arranging the output bumps 3 in a plurality of rows, the pressing force at the inner edge facing the input bump region 6 is increased and mounting is performed. The pressure gradient is such that the pressing force weakens toward one side edge 2a of the surface 2, and the pressing force against the output bumps 3 arranged on the one side edge 2a side is insufficient. Thereby, there is a possibility that the conduction resistance of the output bump 3 is increased particularly in the outer edge region of the bump due to insufficient pushing of the conductive particles.

  Therefore, the IC chip 1 is formed across the width direction of the output bump region 4 by forming the output bump region 4 inward from the one side edge 2a by a predetermined ratio with respect to the width of the mounting surface 2. The pressure gradient that is applied is gently leveled to prevent the pressing force by the thermocompression bonding head 17 from being insufficient on the one side edge 2a side. As a result, the IC chip 1 reliably holds the conductive particles between the output bumps 3 on the one side edge 2a side and the electrode terminals 15 formed on the circuit board 14 to ensure conductivity. Can do.

  The distance A from the one side edge 2a to the output bump region 4 is preferably 4% or more with respect to the IC width W between the opposing side edges 2a2b of the mounting surface 2. By forming the output bump region 4 inward from one side edge 2a by a distance of 4% or more with respect to the IC width W, the output bump region 4 and the input bump region 6 having an area difference are arranged asymmetrically. Even when the thermocompression bonding head 17 applies pressure evenly to the mounting surface 2, the pressing force is sufficiently transmitted to the output bumps 3 arranged on the first side edge 2 a side. However, if the distance A from one side edge 2a to the output bump 3 is less than 4% of the IC width W, the pressing force by the thermocompression bonding head 17 is sufficient to the output bump 3 on the one side edge 2a side. There is a risk of poor conduction due to insufficient push-in of conductive particles.

  Further, if the distance A becomes too large, the pressure on the entire surface of the IC chip 1 is made uniform, and there is a possibility that pressure imbalance is separately induced. Therefore, the distance A is preferably within 30%, more preferably within 20%, and even more preferably within 15%.

[Distance A> Distance B]
In the IC chip 1, the distance A from the one side edge 2 a of the output bump region 4 having a relatively large area is preferably longer than the distance B from the other side edge 2 b of the input bump region 6. That is, if the distance B from the other side edge 2b of the relatively small area input bump region 6 is longer than the distance A from the one side edge 2a of the large area output bump region 4, the width in the output bump region 4 The pressure gradient over the direction is increased, and obstruction of insufficient pressing of the conductive particles in the output bump 3 on the side edge 2a side is hindered.

  In addition, since the input bumps 5 are arranged in a line, in the input bump region 6 having a relatively small area, the pressing force by the thermocompression bonding head 17 is unevenly distributed due to an area difference from the output bump region 4 and an asymmetrical arrangement. Since the risk of insufficient push-in is small, there is no problem even if the distance B from the other side edge 2b of the mounting surface 2 is short.

[Offset large area input bump area 6]
In the IC chip 1, the configuration of the input / output bumps on the mounting surface 2 can be appropriately designed. As described above, the IC chip 1 forms the output bump region 4 having a relatively large area by arranging a plurality of output bumps 3 in the width direction. Conversely, a plurality of input bumps 5 are arranged in the width direction. By doing so, the input bump region 6 may be relatively enlarged.

  When the input bump area 6 has a relatively large area, the IC chip 1 determines that the input bump area 6 has a predetermined ratio to the IC width W, preferably a distance of 4% or more of the IC width W, It forms inside from the side edge 2b. In this case, the distance B from the other side edge 2 b of the relatively large area input bump region 6 is preferably longer than the distance A from the one side edge 2 a of the output bump region 4.

  When the input bump region 6 is formed at least 4% of the IC width W from the other side edge 2b, as shown in FIG. 2, the flexible substrate 16 is adjacent to the circuit substrate 14 on the anisotropic conductive film. 10, the connection position between the input bump 5 and the electrode terminal 15 is separated from the thermocompression bonding head 17 that heat-presses the flexible substrate 16. Therefore, it is possible to prevent deterioration in connectivity due to heat radiation from the thermocompression bonding head 17 after the IC chip 1 is connected.

[Dummy bump]
As shown in FIG. 3, the IC chip 1 appropriately includes a dummy bump area 19 in which so-called dummy bumps 18 that are not used for input / output of signals and the like are arranged between the output bump area 4 and the input bump area 6. May be.

[adhesive]
As an adhesive for connecting the IC chip 1 to the circuit board 14, an anisotropic conductive film 10 (ACF) can be suitably used. As shown in FIG. 4, the anisotropic conductive film 10 is generally formed by forming a binder resin layer (adhesive layer) 13 containing conductive particles 12 on a release film 11 serving as a base material. As shown in FIG. 2, the anisotropic conductive film 10 has the circuit board 14 and the IC chip 1 by interposing a binder resin layer 13 between the electrode terminal 15 formed on the circuit board 14 and the IC chip 1. Are used for connecting and conducting.

  The adhesive composition of the binder resin layer 13 includes a normal binder component containing, for example, a film-forming resin, a thermosetting resin, a latent curing agent, a silane coupling agent, and the like.

  As the film-forming resin, a resin having an average molecular weight of about 10,000 to 80,000 is preferable, and various resins such as an epoxy resin, a modified epoxy resin, a urethane resin, and a phenoxy resin are particularly mentioned. Among these, phenoxy resin is preferable from the viewpoint of film formation state, connection reliability, and the like.

  It does not specifically limit as a thermosetting resin, For example, a commercially available epoxy resin, an acrylic resin, etc. can be used.

  The epoxy resin is not particularly limited. For example, naphthalene type epoxy resin, biphenyl type epoxy resin, phenol novolac type epoxy resin, bisphenol type epoxy resin, stilbene type epoxy resin, triphenolmethane type epoxy resin, phenol aralkyl type epoxy resin. Naphthol type epoxy resin, dicyclopentadiene type epoxy resin, triphenylmethane type epoxy resin and the like. These may be used alone or in combination of two or more.

  There is no restriction | limiting in particular as an acrylic resin, According to the objective, an acrylic compound, liquid acrylate, etc. can be selected suitably. For example, methyl acrylate, ethyl acrylate, isopropyl acrylate, isobutyl acrylate, epoxy acrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, trimethylolpropane triacrylate, dimethylol tricyclodecane diacrylate, tetramethylene glycol tetraacrylate, 2-hydroxy- 1,3-diacryloxypropane, 2,2-bis [4- (acryloxymethoxy) phenyl] propane, 2,2-bis [4- (acryloxyethoxy) phenyl] propane, dicyclopentenyl acrylate, tricyclo Examples include decanyl acrylate, tris (acryloxyethyl) isocyanurate, urethane acrylate, and epoxy acrylate. In addition, what made acrylate the methacrylate can also be used. These may be used individually by 1 type and may use 2 or more types together.

  The latent curing agent is not particularly limited, and examples thereof include a heat curing type curing agent. The latent curing agent does not normally react, but is activated by various triggers selected according to applications such as heat, light, and pressure, and starts the reaction. The activation method of the thermal activation type latent curing agent includes a method of generating active species (cation, anion, radical) by a dissociation reaction by heating, etc., and it is stably dispersed in the epoxy resin near room temperature, and epoxy at high temperature There are a method of initiating a curing reaction by dissolving and dissolving with a resin, a method of initiating a curing reaction by eluting a molecular sieve encapsulated type curing agent at a high temperature, and an elution / curing method using microcapsules. Thermally active latent curing agents include imidazole, hydrazide, boron trifluoride-amine complexes, sulfonium salts, amine imides, polyamine salts, dicyandiamide, etc., and modified products thereof. The above mixture may be sufficient. As the radical polymerization initiator, a known one can be used, and among them, an organic peroxide can be preferably used.

  Although it does not specifically limit as a silane coupling agent, For example, an epoxy type, an amino type, a mercapto sulfide type, a ureido type etc. can be mentioned. By adding the silane coupling agent, the adhesion at the interface between the organic material and the inorganic material is improved.

[Conductive particles]
Examples of the conductive particles 12 contained in the binder resin layer 13 include any known conductive particles used in anisotropic conductive films. That is, as the conductive particles, for example, particles of various metals and metal alloys such as nickel, iron, copper, aluminum, tin, lead, chromium, cobalt, silver, gold, metal oxide, carbon, graphite, glass, ceramic Examples thereof include those in which the surface of particles such as plastic is coated with metal, or the surface of these particles is further coated with an insulating thin film. In the case where the surface of the resin particle is coated with metal, examples of the resin particle include an epoxy resin, a phenol resin, an acrylic resin, an acrylonitrile / styrene (AS) resin, a benzoguanamine resin, a divinylbenzene resin, a styrene resin, and the like. Can be mentioned.

  The adhesive composition constituting the binder resin layer 13 is not limited to the case where it contains a film-forming resin, a thermosetting resin, a latent curing agent, a silane coupling agent, etc. You may make it comprise from any material used as an adhesive composition of a film.

  The release film 11 that supports the binder resin layer 13 includes, for example, a release agent such as silicone on PET (Poly Ethylene Terephthalate), OPP (Oriented Polypropylene), PMP (Poly-4-methylpentene-1), PTFE (Polytetrafluoroethylene), and the like. It is applied and prevents the anisotropic conductive film 10 from being dried, and maintains the shape of the anisotropic conductive film 10.

  Although the anisotropic conductive film 10 may be produced by any method, for example, it can be produced by the following method. An adhesive composition containing a film-forming resin, a thermosetting resin, a latent curing agent, a silane coupling agent, conductive particles and the like is prepared. An anisotropic conductive film 10 in which the binder resin layer 13 is supported on the release film 11 by applying the adjusted adhesive composition on the release film 11 using a bar coater, a coating apparatus, and the like, and drying it by an oven or the like. Get.

  In the above-described embodiment, the adhesive film obtained by forming a thermosetting resin composition appropriately containing the conductive particles 12 in the binder resin layer 13 as a film has been described as an example. Such an adhesive is not limited to this, and may be, for example, an insulating adhesive film made of only the binder resin layer 13. In addition, the adhesive according to the present invention has a configuration in which an insulating adhesive layer made of only the binder resin layer 13 and a conductive particle-containing layer made of the binder resin layer 13 containing the conductive particles 12 are laminated. it can. Further, the adhesive is not limited to such an adhesive film formed into a film, but an insulating adhesive consisting of a conductive adhesive paste in which conductive particles 12 are dispersed in a binder resin composition or a binder resin composition alone. It may be a paste. The adhesive according to the present invention includes any of the forms described above.

[Connection process]
Next, a connection process for connecting the IC chip 1 to the circuit board 14 will be described. First, the anisotropic conductive film 10 is temporarily attached on the mounting portion of the circuit board 14 on which the electrode terminals 15 are formed. Next, the circuit board 14 is placed on the stage of the connection device, and the IC chip 1 is placed on the mounting portion of the circuit board 14 via the anisotropic conductive film 10.

  Next, the thermocompression bonding head 17 heated to a predetermined temperature for curing the binder resin layer 13 is hot-pressed from above the IC chip 1 for a predetermined pressure and time. Thereby, the binder resin layer 13 of the anisotropic conductive film 10 exhibits fluidity and flows out from between the mounting surface 2 of the IC chip 1 and the mounting portion of the circuit board 14, and the conductive particles in the binder resin layer 13. 12 is sandwiched between the output bumps 3 and 5 of the IC chip 1 and the electrode terminals 15 of the circuit board 14 and is crushed.

  At this time, according to the IC chip 1 to which the present invention is applied, the output bump region 4 is formed on the inner side from the one side edge 2a by a distance of 4% or more with respect to the IC width W. The pressure gradient formed over the width direction 4 is leveled, the pressing force by the thermocompression bonding head 17 is applied substantially uniformly throughout the output bump region 4, and the pressing force is insufficient on the one side edge 2a side. Is prevented.

  As a result, the binder resin electrically connected by sandwiching the conductive particles 12 between the output bumps 3 and 5 and the electrode terminals 15 of the circuit board 14 and heated in this state by the thermocompression bonding head 17. Is cured. Therefore, the IC chip 1 can reliably ensure electrical continuity with the electrode terminal 15 formed on the circuit board 14 also in the output bump 3 on the one side edge 2a side.

  The conductive particles 12 that are not between the output bumps 3 and the input bumps 5 and the electrode terminals 15 are dispersed in the binder resin and maintain an electrically insulated state. Thereby, electrical conduction is achieved only between the output bumps 3 and 5 of the IC chip 1 and the electrode terminals 15 of the circuit board 14. In addition, by using a fast curing type radical polymerization reaction system as the binder resin, the binder resin can be rapidly cured even with a short heating time. In addition, the anisotropic conductive film 10 is not limited to the thermosetting type, and may be a photocurable or photothermal combination type adhesive as long as pressure connection is performed.

  Next, examples of the present invention will be described. In this example, an IC chip having an area difference between the output bump area and the input bump area and asymmetrically arranged on the mounting surface is used to manufacture a connected sample connected to a circuit board via an anisotropic conductive film. did. The IC chips according to the example and the comparative example are different in the IC width and the distance A from one side edge 2a of the mounting surface to the output bump region, and measure the conduction resistance values of the output bump and the input bump in the connection sample, respectively. ,evaluated.

  The IC chip according to the example and the comparative example includes an output bump region 4 in which output bumps 3 are arranged along a pair of side edges 2a and 2b facing each other in the length direction of the substantially rectangular mounting surface 2. An input bump area 6 in which the input bumps 5 are arranged is formed. In the IC chip 1, the output bump region 4 is formed on the side edge 2 a side of the mounting surface 2, and the input bump region 6 is formed on the other side edge 2 b side of the mounting surface 2. As a result, in the IC chip 1, the output bump region 4 and the input bump region 6 are formed apart from each other in the width direction of the mounting surface (see FIG. 1).

In the output bump area 4, a plurality of output bumps 3 formed in the same shape are arranged in a staggered pattern in three rows along the longitudinal direction of the mounting surface 2. The output bumps formed in the output bump area 4 are divided into columns, and are designated as output bump columns 3A, 3B, 3C in order from one side edge 2a side. The output bumps 3 formed in each row have a rectangular shape (area: 1437.5 μm ² , width: 12.5 μm, length: 115 μm), and 1276 are arranged for each of the output bump rows 3A, 3B, 3C. Yes. The total area of the output bump 3 in each bump row 3A, 3B, 3C is 1834250 μm ² , respectively. The total area of the output bump region 4 is 12919500 μm ² (width: 31900 μm, length: 405 μm).

In the input bump area 6, a plurality of input bumps 5 formed in the same shape are arranged in a line along the longitudinal direction of the mounting surface 2. One input bump row formed in the input bump area 6 is defined as an input bump row 5A. The input bumps 5 arranged in the input bump row 5A have a rectangular shape (area: 3600 μm ² , width: 45.0 μm, length: 80 μm), and 515 are arranged. The total area of the input bumps 5 in the input bump row 5A is 1854000 μm ² . The total area of the input bump region 6 is 2553040 μm ² (width: 31913 μm, length: 80 μm).

  In the IC chip according to the first embodiment, the IC width W between the opposing side edges 2a and 2b of the mounting surface 2 is 1.5 mm, and the IC length in the arrangement direction of the input / output bumps 3 and 5 is 32 mm. . The distance A from one side edge 2a to the output bump region 4 is 150 μm, which is a 10% distance with respect to the IC width W (1.5 mm). In the IC chip according to the first embodiment, no dummy bump area is provided between the output bump area 4 and the input bump area 6, and the distance B from the other side edge 2b to the input bump area 6 is 50 μm. .

  The IC chip according to Example 2 was set to the same conditions as Example 1 except that the distance A from one side edge 2a to the output bump region 4 was set to 100 μm. The distance A in Example 2 is a distance of 6.6% with respect to the IC width W (1.5 mm).

  The IC chip according to Example 3 was set to the same conditions as Example 1 except that the distance A from one side edge 2a to the output bump region 4 was set to 75 μm. The distance A in Example 3 is 5.0% of the distance with respect to the IC width W (1.5 mm).

  The IC chip according to Example 4 was under the same conditions as Example 1 except that the distance A from one side edge 2a to the output bump region 4 was set to 62.5 μm. The distance A in Example 4 is 4.2% of the IC width W (1.5 mm).

  The IC chip according to the fifth embodiment has an IC width W of 2.0 mm between the opposing side edges 2a and 2b of the mounting surface 2 and an IC length of 32 mm in the arrangement direction of the input / output bumps 3 and 5. . The distance A from one side edge 2a to the output bump region 4 is 83 μm, which is 4.2% of the IC width W (2.0 mm). In the IC chip according to the fifth embodiment, no dummy bump area is provided between the output bump area 4 and the input bump area 6, and the distance B from the other side edge 2b to the input bump area 6 is 50 μm. .

  The IC chip according to Example 6 has an IC width W of 3.0 mm between the opposing side edges 2a and 2b of the mounting surface 2 and an IC length of 32 mm in the arrangement direction of the input / output bumps 3 and 5. . The distance A from one side edge 2a to the output bump region 4 is 125 μm, which is 4.2% of the IC width W (3.0 mm). In the IC chip according to the sixth embodiment, no dummy bump area is provided between the output bump area 4 and the input bump area 6, and the distance B from the other side edge 2b to the input bump area 6 is 50 μm. .

  The IC chip according to Comparative Example 1 was the same as Example 1 except that the distance A from one side edge 2a to the output bump region 4 was set to 50 μm. The distance A in Comparative Example 1 is 3.3% of the IC width W (1.5 mm).

The IC chip according to Comparative Example 2 was set to the same conditions as Comparative Example 1 except that a dummy bump region D was provided between the output bump region 4 and the input bump region 6. In the dummy bump area D, dummy bumps are arranged in a line in the length direction of the IC chip. Each dummy bump has a rectangular shape (area: 1250 μm ² , width: 12.5 μm, length: 100 μm), and 1276 are arranged. The total area of the dummy bumps in the dummy bump row D is 1595000 μm ² . The total area of the dummy bump region D is 319000 μm ² (width: 31900 μm, length: 100 μm).

  The IC chip according to Comparative Example 3 has an IC width W of 1.2 mm between the opposing side edges 2a and 2b of the mounting surface 2 and an IC length of 32 mm in the arrangement direction of the input / output bumps 3 and 5. . The distance A from one side edge 2a to the output bump area 4 is 40 μm, which is 3.3% of the IC width W (1.2 mm). In the IC chip according to Comparative Example 3, no dummy bump area is provided between the output bump area 4 and the input bump area 6, and the distance B from the other side edge 2b to the input bump area 6 is 50 μm. .

  The IC chips according to Examples 1 to 6 and Comparative Examples 1 to 3 are connected to a circuit board via an anisotropic conductive film (trade name CP36931-18AJ: manufactured by Dexerials Corporation) to produce a connected body sample. did. The connection conditions are 150 ° C., 130 MPa, and 5 seconds. About each connection body sample, the conduction resistance in the output bump row | line | column 3A, 3B, 3C and the input bump row | line | column 5A was measured using the 4-terminal method. As a result of the measurement, the case where the conduction resistance was 1.0Ω or less was determined as OK, and the case where the conduction resistance exceeded 1.0Ω was determined as NG. The measurement results are shown in Table 1.

  As shown in Table 1, in Examples 1 to 6, the conduction resistance is 1.0Ω or less in all of the output bump rows 3A, 3B, and 3C and the input bump row 5A, and is arranged on one side edge 2a side. It can be seen that each output bump 3 in the output bump row 3A could be pushed in with a sufficient pressing force. This is because, in Examples 1 to 6, the distance A from one side edge 2a to the output bump area 4 is set to 4% or more of the IC width W, and therefore the pressure gradient in the width direction of the output bump area 4 is increased. It depends on being averaged.

  On the other hand, in Comparative Example 1, the conduction resistance in the output bump rows 3A and 3B was high. This is because the distance A from one side edge 2a to the output bump region 4 is 3.3% of the IC width W, and therefore the pressure gradient at which the pressing force of the thermocompression bonding head decreases toward the outer output bump row. Because it became. From this, it can be seen that it is preferable to provide a distance A from one side edge 2a to the output bump region 4 of 4% or more of the IC width W.

  In Comparative Example 2, the dummy bump region D is provided between the output bump region 4 and the input bump region 6, but the conduction resistance in the output bump rows 3A and 3B is high. Accordingly, when the distance A from the one side edge 2a to the output bump region 4 is 3.3% of the IC width W, the pressure that can improve the conductivity in the outer bump row may be formed by forming a dummy bump. It can be seen that it is difficult to obtain a gradient.

  From Examples 5 and 6, by setting the distance A from one side edge 2a to the output bump region 4 to be 4% or more of the IC width W, the continuity in the outer bump row is improved even if the IC width is widened. It can be seen that a pressure gradient that can be improved is obtained.

1 IC chip, 2 mounting surface, 2a one side edge, 2b the other side edge, 3 output bump, 4 output bump area, 5 input bump, 6 input bump area, 10 anisotropic conductive film, 11 release film, 12 Conductive particles, 13 binder resin layer, 14 circuit board, 15 electrode terminal, 17 thermocompression bonding head

In order to solve the above-described problem, an electronic component according to the present invention is provided with an output bump area in which output bumps are arranged in proximity to one side of a pair of side edges facing each other. An input bump area in which input bumps are arranged adjacent to the other side is provided, and the output bump area and the input bump area are arranged asymmetrically with the output bumps and the input bumps arranged in different numbers of bump rows. One of the output bump areas or the input bump areas, which has a large number of bump rows , is adjacent to the one or other side edge by a distance of 4% to 30% of the width between the pair of side edges. Is formed on the inside.

In addition, the connection body according to the present invention is a connection body in which the electronic component is arranged on the circuit board via an adhesive and is pressed by a pressure tool so that the electronic component is connected to the circuit board. The electronic component is the electronic component described above .

Moreover, the manufacturing method of the connection body which concerns on this invention arrange | positions an electronic component on a circuit board via an adhesive agent, and connects the said electronic component on the said circuit board by pressurizing with a pressurization tool. In the manufacturing method, the electronic component is the electronic component described above .

Further, the connection method according to the present invention is an electronic component connection method in which an electronic component is arranged on a circuit board via an adhesive and the electronic component is connected to the circuit board by applying pressure with a pressure tool. The electronic component is the electronic component described above .

Claims (10)

An output bump area in which output bumps are arranged adjacent to one side of a pair of opposite side edges is provided, and an input bump area in which input bumps are arranged adjacent to the other side of the pair of side edges is provided. And
The output bump area and the input bump area are arranged in different areas and asymmetrically,
One of the output bump area or the input bump area, which has a relatively large area, is inward from the adjacent one or other side edge by a distance of 4% or more of the width between the pair of side edges. Electronic components that are formed.   2. The electronic component according to claim 1, wherein the output bump region is formed inward from the one side edge by a distance of 4% or more with respect to a width between the pair of side edges.   The electronic component according to claim 2, wherein a distance from the one side edge to the output bump area is longer than a distance from the other side edge to the input bump area.   2. The electronic component according to claim 1, wherein the input bump region is formed inwardly from the other side edge by a distance of 4% or more with respect to a width between the pair of side edges.   The electronic component according to claim 4, wherein a distance from the other side edge to the input bump region is longer than a distance from the one side edge to the output bump region.   The electronic component according to claim 1, wherein a dummy bump is formed between the input bump region and the output bump region on the mounting surface of the electronic component.   The electronic component according to claim 1, wherein the electronic component is an IC chip. In the connection body in which the electronic component is arranged on the circuit board via an adhesive and pressed by a pressure tool, the electronic component is connected to the circuit board.
The mounting surface of the electronic component on the circuit board is provided with an output bump area in which output bumps are arranged adjacent to one side of a pair of side edges facing each other, and on the other side of the pair of side edges. An input bump area in which input bumps are arranged adjacent to each other is provided,
The output bump area and the input bump area are arranged in different areas and asymmetrically on the mounting surface,
One of the output bump area or the input bump area, which has a relatively large area, is inward from the adjacent one or other side edge by a distance of 4% or more of the width between the pair of side edges. Connected body formed. In the method of manufacturing a connection body, in which an electronic component is arranged on a circuit board via an adhesive, and the electronic component is connected to the circuit board by applying pressure with a pressure tool.
The mounting surface of the electronic component on the circuit board is provided with an output bump area in which output bumps are arranged adjacent to one side of a pair of side edges facing each other, and on the other side of the pair of side edges. An input bump area in which input bumps are arranged adjacent to each other is provided,
The output bump area and the input bump area are arranged in different areas and asymmetrically on the mounting surface,
One of the output bump area or the input bump area, which has a relatively large area, is inward from the adjacent one or other side edge by a distance of 4% or more of the width between the pair of side edges. A method for manufacturing a formed connection body. In the electronic component connecting method of placing the electronic component on the circuit board via an adhesive and connecting the electronic component on the circuit board by applying pressure with a pressure tool,
The mounting surface of the electronic component on the circuit board is provided with an output bump area in which output bumps are arranged adjacent to one side of a pair of side edges facing each other, and on the other side of the pair of side edges. An input bump area in which input bumps are arranged adjacent to each other is provided,
The output bump area and the input bump area are arranged in different areas and asymmetrically on the mounting surface,
One of the output bump area or the input bump area, which has a relatively large area, is inward from the adjacent one or other side edge by a distance of 4% or more of the width between the pair of side edges. A method for connecting formed electronic components.