JPH10154727A - Slender driver ic and flay display device using this - Google Patents

Abstract

PROBLEM TO BE SOLVED: To realize the enhancement of the reliability in connection and moistureprood reliability pertaining to mounting of a slender driver IC and a narrow marginal region in the frame of a falt display device, by a method wherein the shortest distance between the profile line of the driver IC and projections for connection is set a specified tomes as long as or over the length in the direction along the shortest distance of the projection. SOLUTION: A terminal row consisting of a plurality of output bumps (projection terminals) 11 and a terminal row consisting of a plurality of input bumps 12 are arranged in parallel to the profile-long sides of a slender driver IC 1 and are arranged adjacent to each other in the vicinity of the center line in the width direction of the driver IC 1. Each of the bumps 11 and the bumps 132 is formed into roughly a rectangle and is arranged in such a way that the long sides of it coincide with the width direction of the driver IC 1. The size of the short sides (a) of the driver IC 1 is 2mm and and the size of the long sides (b) of the driver IC 1 is 7 times as long as that of the short sides (a). The size of the long sides of the bump 11 is three times as long as or longer than that of the short sides of the bumps 11 and is roughly the same size as that of the long sides of the bumps 12. As the bumps 11 and 12 are arranged on the inside of the terminal formation surface of the driver IC 1, water does never penetrate up to this region of the terminal formation surface.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an elongated driver IC for a flat panel display, and a flat panel display using the same.

[0002]

2. Description of the Related Art In a conventional technique, an electrode terminal 111, 1 of an elongated driver IC 101 for a flat panel display device is used.
FIG. 4A shows the appearance when the surface on which 12 is formed faces upward.
Is shown schematically in FIG.

[0003] The elongated driver IC 101 is a bare chip (naked chip) that is not packaged, and is formed to be considerably longer and thinner than a normal IC chip. Generally, the length is at least five times the width.

[0004] As shown in the enlarged view of FIG. 4 (b), a row of output terminals consisting of a plurality of output bumps 111 is provided on the protruding terminal (bump) forming surface (upper surface in the figure) of the elongated driver IC 101. And a row of input terminals composed of a plurality of input bumps 112 are provided near two long sides, respectively. On the electrode terminal formation surface, the distances y and z between the output bumps 111 and the input bumps 112 and the long sides are substantially equal to or smaller than the longitudinal dimension x of the bumps 111 and 112. Output bump 1
The distance v between the input bump 112 and the input bump 112 is much larger than the distance y between the output bump 111 and the long side on the output terminal side and the distance z between the input bump 112 and the long side on the input terminal side. It is significantly larger than the sum of these.

The elongated driver IC 101 is a COG
FIG. 5 shows a state of being mounted on a flat panel display device by a (Chip On Glass) method.

In the present specification, the term COG is not limited to the one on the original glass substrate, but is a system in which a bare chip is directly mounted on an electrode substrate made of various materials. Further, in this specification, the term of the COG method refers only to a face-down type, that is, a normal type in which a surface on which input / output terminals are formed is directed to a substrate to be connected.

The display panel of the flat panel display device includes an array electrode substrate 102 and an opposing electrode substrate 103 having a smaller dimension than the array electrode substrate 102. The lower electrode electrode substrate 102 is provided on the edge protruding like a shelf. Slender driver IC 101
And output wiring 121 and input wiring 122 from now on,
An input terminal 123 is provided. The connection of the elongated driver IC 101 to the array electrode substrate 102 at the edge is made by an anisotropic conductive film (ACF) or an anisotropic conductive adhesive. This edge portion is located on the display panel and forms an image non-display area called a frame area. It is desirable that the edge be as narrow as possible. Particularly, in a portable flat display device, an extremely narrow frame is required.

In order to realize a narrow frame, a COG type flat display device uses a driver IC as shown in FIG.
As shown in the figure, a considerably elongated one is used.
By adopting a slender chip (slim chip), the width for mounting the driver IC can be reduced,
The width of the area required for the obliquely arranged output wiring 121 and input wiring 122 can be reduced. This diagonal input / output wiring 1
The width for 21 and 122 can be reduced by shortening the distance for extending the input / output wirings 121 and 122 in the direction along the edge.

The narrowing of the width for the oblique wiring can be realized by increasing the angle at which the input / output wirings 121 and 122 are obliquely inclined. However, the width and interval of the oblique wiring become smaller. It is not practical because it is very difficult to obtain reliability in conduction and short circuit prevention. In order to respond to the demand for higher definition of image display, the pixel pitch becomes finer, and it is even more so.

[0010]

SUMMARY OF THE INVENTION It is an object of the present invention to further improve the reliability of connection between a driver IC and an electrode substrate for a flat display device and to ensure durability in a humid and highly turbulent use environment such as outdoor use. Required.

In addition, while responding to the high definition of image display,
It is required to further reduce the frame area.

SUMMARY OF THE INVENTION In view of the above, it is an object of the present invention to provide a flat display device with improved connection reliability and humidity resistance and reduced frame width for mounting a driver IC.

[0013]

According to a first aspect of the present invention, there is provided an elongated driver IC, wherein one long side has a substantially rectangular shape having a length of about 5 times or more of one short side, and electrical connection is provided on one main surface. Elongated driver IC provided with a plurality of connecting projections for obtaining the same
Wherein the shortest distance between the contour of the elongated driver IC and one of the connection protrusions is at least three times the length of the one connection protrusion along the shortest distance direction.

With such a configuration, it is possible to improve the connection reliability and the moisture resistance reliability and reduce the frame width of the flat display device with respect to the mounting of the driver IC.

According to a second aspect of the present invention, there is provided an elongated driver IC, wherein one long side has a substantially rectangular shape having a length of about five times or more the one short side, and a plurality of connections for obtaining electrical connection on one main surface. The shortest distance between the contour of the elongated driver IC and one of the connection projections is the length of the elongated driver IC along the direction of the shortest distance. It is characterized by being at least 1/4.

According to a third aspect of the present invention, there is provided an elongated driver IC having a plurality of inputs for obtaining an electrical connection on one main surface, each of the long sides being substantially rectangular having a length of at least about five times the short side. And a connection projection for output and a connection projection for output, each of which includes a row of input connection projections and a row of output connection projections disposed along the one long side direction. The sum of the shortest distance between the contour line and the input connection projection row and the output connection projection row is longer than the shortest distance between the input connection projection row and the output connection projection row.

With such a configuration, the frame of the flat display device can be narrowed.

In the flat display device according to the fourth aspect,
A display panel in which a light modulation layer is disposed between a pair of substrates to form a display area; and a display panel disposed on at least one substrate of the display panel along the display area, one long side being approximately five times longer than one short side. An elongated driver IC having a substantially rectangular shape and having a plurality of connection projections for obtaining electrical connection on one main surface, wherein the elongated driver IC The shortest distance between the contour line and the connection projection is at least three times the length of the one connection projection in the direction of the shortest distance.

According to a fifth aspect of the present invention, there is provided the flat panel display device,
5. The flat panel display according to claim 4, wherein the connection protrusion and the one substrate are provided between the one main surface of the elongated driver IC and the one substrate. An anisotropic conductive film disposed in a corresponding region in the one main surface is included.

In the flat display device according to the sixth aspect,
6. The flat display device according to claim 5, wherein the anisotropic conductive film and the contour line of the elongated driver IC are provided between the one main surface of the elongated driver IC and the one substrate. It is characterized by including a sealant layer filled in between.

[0021]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention are shown in FIGS.
This will be described with reference to FIG.

FIG. 1A shows an elongated driver I of the embodiment.
FIG. 4 is a perspective view schematically illustrating an appearance of C1 when a surface on which electrode terminals 11 and 12 are formed is faced up;

On the bump forming surface (upper surface in the figure) of the elongated driver IC 1, a row of output terminals composed of a plurality of output bumps 11 and a row of input terminals composed of a plurality of input bumps 12 are formed. The driver IC1 is arranged in parallel with the long side of the outer periphery (outline), and is arranged adjacent to each other in the vicinity of a center line that divides the elongated driver IC1 into two in the width direction. Each of the output bumps 11 and the input bumps 12 has a substantially rectangular shape, and is arranged such that long sides thereof coincide with the width direction of the elongated driver IC 1.

The dimensional configuration of the elongated driver IC according to the present embodiment is as follows.

The width of the elongated driver IC1, that is, the short side a
Is 2 mm, and the length, that is, the dimension of the long side b is 7 times the width.

As shown in FIG. 1B, the output bump 11
The dimension of the long side d is three times longer than the short side c of the output bump 11, and is substantially the same as the dimension of the long side e of the input bump 12.
The short side f of the input bump 12 is slightly shorter than the long side e.

The distances g and h from the output bumps 11 and the input bumps 12 to the contours of the elongated driver IC 1 (long and short sides defining the contour of the bump forming surface) are determined by the bumps 11 in the width direction of the elongated driver IC. , 12 are four times the dimensions of the long sides d, e. The distance i between the output bump 11 and the input bump 12 is substantially the same as the dimension of the long sides d and e of the output bump 11 and the input bump 12, and therefore, the distance g from the output bump 11 and the input bump 12 to the contour line , H.

FIG. 2 shows a plan view of this elongated driver I.
A state in which C1 is mounted on a flat display device by a COG method is schematically shown.

The elongated driver IC 1 is mounted on the array electrode substrate 2 so as to cover obliquely the areas of the IC output wiring 21 and the IC input wiring 22. Therefore, the frame region can be made narrower than that of the conventional technology by the overlap of the mounting region of the elongated driver IC 1 and the region of the oblique wirings 21 and 22.

FIG. 3 is a longitudinal sectional view schematically showing the AA cross section of FIG.

Elongated driver IC 1 and array electrode substrate 2
And the input bump 11 and the output bump 12
The continuous strip-shaped anisotropic conductive film (AC
F) 4 is arranged. In a region where the anisotropic conductive film 4 is not provided in the gap, a sealing resin 5 having no anisotropic conductive ability is provided.

The anisotropic conductive film 4 is a film in which conductive particles are dispersed in a resin. When the conductive particles are heated and pressed between the elongated driver IC 1 and the array electrode substrate 2, the conductive particles are Are held between the input bumps 11 and the output bumps 12 and the terminals on the array electrode substrate 2, thereby realizing conduction.

According to this embodiment, since the bumps 11 and 12 are arranged inside the terminal forming surface of the elongated driver IC 1, moisture hardly enters the area where the bumps 11 and 12 are arranged. Therefore, the connection failure is prevented, and the moisture resistance reliability and weather resistance reliability are improved.

According to this embodiment, in order to inspect the driver IC, it is sufficient that the driver IC is connected to the array electrode substrate only by the narrow anisotropic conductive film 4. Therefore, the driver I which has been found to be defective
C can be easily removed. Further, as the sealing resin 5, a resin having better sealing performance than the anisotropic conductive film 4 can be selected, whereby the connection reliability and the moisture resistance and weather resistance can be further improved.

As a modified example, even when both terminal rows of the output bumps 11 and the input bumps 12 are arranged close to the outer long side on the input side, the frame width of the flat display device similar to the above embodiment can be reduced. Can be realized.

[0036]

According to the flat display device, it is possible to improve the connection reliability and the moisture resistance reliability of the mounting of the driver IC and realize a narrow frame.

[Brief description of the drawings]

FIG. 1A shows an elongated driver IC according to an embodiment;
It is a perspective view which shows typically the external appearance when the surface in which the electrode terminal was formed faces upward. (B) It is the elements on larger scale of (a) for demonstrating the dimension structure of the slender driver IC of an Example.

FIG. 2 is a top plan view schematically showing a mounting area of an elongated driver IC and its peripheral portion in the flat panel display device of the embodiment.

FIG. 3 is a longitudinal sectional view schematically showing an AA cross section of FIG. 2;

FIG. 4A shows an elongated driver IC according to the related art.
FIG. 3 is a perspective view schematically showing the appearance when the surface on which the electrode terminals are formed faces upward. (B) It is the elements on larger scale of (a).

FIG. 5 is a plan view from above showing a mounting area of an elongated driver IC and its peripheral portion in a conventional flat panel display device.

[Explanation of symbols]

 1 Slender driver IC 11 Output bump 12 Input bump

Claims (6)

[Claims] An elongated driver having a substantially rectangular shape whose one long side is at least about five times the short side and having a plurality of connection projections for obtaining electrical connection on one main surface. In the IC, a shortest distance between a contour line of the elongated driver IC and the one connection protrusion is at least three times a length of the one connection protrusion in a direction of the shortest distance. Slender driver IC. 2. An elongated driver having a substantially rectangular shape whose one long side is about five times or more the one short side and having a plurality of connection projections for obtaining electrical connection on one main surface. In the IC, a shortest distance between a contour line of the elongated driver IC and one of the connection protrusions is at least 1/4 of a length of the elongated driver IC along a direction of the shortest distance. Slender driver IC. 3. A plurality of input connection projections and output connection projections for obtaining an electrical connection on one main surface, wherein one long side has a substantially rectangular shape whose length is about five times or more the one short side. An elongated driver IC including an input connection projection row and an output connection projection row each arranged along the one long side direction, wherein a contour line of the elongated driver IC, the input connection projection row, and An elongated driver IC, wherein the sum of the shortest distances from the output connection projection row is longer than the shortest distance between the input connection projection row and the output connection projection row. 4. A display panel in which a light modulation layer is disposed between a pair of substrates to form a display area; and a display panel is disposed on at least one substrate of the display panel along the display area, and one long side is short. An elongated driver IC having a substantially rectangular shape having a size of at least about five times the side and having a plurality of connection protrusions for obtaining electrical connection on one main surface.
Wherein the shortest distance between the contour of the elongated driver IC and one of the connection projections is at least three times the length of the one connection projection along the shortest distance direction. A flat panel display device, characterized in that: 5. A connection between the one main surface of the elongated driver IC and the one substrate, and in the one main surface for obtaining an electrical connection between the connection projection and the one substrate. The flat display device according to claim 4, further comprising an anisotropic conductive film disposed in a region corresponding to (a). 6. A space between the one main surface of the elongated driver IC and the one substrate and between the anisotropic conductive film and the contour of the elongated driver IC. The flat display device according to claim 5, further comprising a sealant layer.