JP2019013944A5 - - Google Patents

Download PDF

Info

Publication number
JP2019013944A5
JP2019013944A5 JP2017131925A JP2017131925A JP2019013944A5 JP 2019013944 A5 JP2019013944 A5 JP 2019013944A5 JP 2017131925 A JP2017131925 A JP 2017131925A JP 2017131925 A JP2017131925 A JP 2017131925A JP 2019013944 A5 JP2019013944 A5 JP 2019013944A5
Authority
JP
Japan
Prior art keywords
copper
tin
connection pad
based solder
nickel layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2017131925A
Other languages
English (en)
Japanese (ja)
Other versions
JP7041477B2 (ja
JP2019013944A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2017131925A priority Critical patent/JP7041477B2/ja
Priority claimed from JP2017131925A external-priority patent/JP7041477B2/ja
Priority to US16/023,483 priority patent/US10446512B2/en
Publication of JP2019013944A publication Critical patent/JP2019013944A/ja
Publication of JP2019013944A5 publication Critical patent/JP2019013944A5/ja
Application granted granted Critical
Publication of JP7041477B2 publication Critical patent/JP7041477B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2017131925A 2017-07-05 2017-07-05 導電性ボール及び電子装置とそれらの製造方法 Active JP7041477B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2017131925A JP7041477B2 (ja) 2017-07-05 2017-07-05 導電性ボール及び電子装置とそれらの製造方法
US16/023,483 US10446512B2 (en) 2017-07-05 2018-06-29 Conductive ball and electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017131925A JP7041477B2 (ja) 2017-07-05 2017-07-05 導電性ボール及び電子装置とそれらの製造方法

Publications (3)

Publication Number Publication Date
JP2019013944A JP2019013944A (ja) 2019-01-31
JP2019013944A5 true JP2019013944A5 (OSRAM) 2020-04-09
JP7041477B2 JP7041477B2 (ja) 2022-03-24

Family

ID=64903850

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017131925A Active JP7041477B2 (ja) 2017-07-05 2017-07-05 導電性ボール及び電子装置とそれらの製造方法

Country Status (2)

Country Link
US (1) US10446512B2 (OSRAM)
JP (1) JP7041477B2 (OSRAM)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10347602B1 (en) * 2018-07-23 2019-07-09 Mikro Mesa Technology Co., Ltd. Micro-bonding structure
US10388627B1 (en) * 2018-07-23 2019-08-20 Mikro Mesa Technology Co., Ltd. Micro-bonding structure and method of forming the same
JP7069404B2 (ja) * 2019-03-25 2022-05-17 三菱電機株式会社 プリント配線板および電子機器
KR102408109B1 (ko) * 2020-10-07 2022-06-10 성균관대학교산학협력단 전기화학적 마이그레이션 방지를 위해 솔더를 무전해 팔라듐 및 니켈 도금 방법
TWI849757B (zh) * 2023-02-18 2024-07-21 矽品精密工業股份有限公司 電子封裝件及其封裝基板與製法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001319994A (ja) * 2000-02-29 2001-11-16 Allied Material Corp 半導体パッケージとその製造方法
TWI224837B (en) * 2003-07-10 2004-12-01 Advanced Semiconductor Eng Ball grid array package substrate and method for manufacturing the same
JP2007075856A (ja) * 2005-09-14 2007-03-29 Nippon Steel Materials Co Ltd Ｃｕコアボール
WO2009051181A1 (ja) * 2007-10-19 2009-04-23 Nihon Superior Sha Co., Ltd. 無鉛はんだ合金
JP4831502B2 (ja) * 2008-09-25 2011-12-07 日立金属株式会社 耐落下衝撃特性に優れた接続端子用ボールおよび接続端子ならびに電子部品
JP6136690B2 (ja) * 2012-08-01 2017-05-31 三菱マテリアル株式会社 ハンダペースト
CN105873716B (zh) * 2013-11-05 2018-11-09 千住金属工业株式会社 Cu芯球、焊膏、成形焊料和钎焊接头
JP7014535B2 (ja) * 2017-07-07 2022-02-01 新光電気工業株式会社 導電性ボール及び電子装置とそれらの製造方法

Similar Documents

Publication Publication Date Title
JP2019013944A5 (OSRAM)
JP2015072996A5 (OSRAM)
JP2012134500A5 (OSRAM)
JP2016192568A5 (OSRAM)
JP2019013960A5 (OSRAM)
JP2015026722A5 (OSRAM)
JP2017108019A5 (OSRAM)
JP2007502530A5 (OSRAM)
JP2017505999A5 (OSRAM)
WO2015175554A3 (en) Forming a conductive connection by melting a solder portion without melting another solder portion with the same melting point and a corresponding conductive connection
JP2009277916A5 (OSRAM)
JP2018511180A5 (OSRAM)
JP2017118067A5 (OSRAM)
JP2019186243A5 (OSRAM)
JP2015159197A5 (OSRAM)
JP2017515295A5 (OSRAM)
JP2016213238A5 (OSRAM)
WO2016155965A3 (de) Kontaktanordnung und verfahren zu herstellung der kontaktanordnung
JP2016032090A (ja) 基板及びその製造方法
JP2015008179A5 (OSRAM)
JP2014150102A5 (OSRAM)
JP2017050310A5 (OSRAM)
JP2017228720A5 (OSRAM)
US9788427B2 (en) Circuit board structure with embedded fine-pitch wires and fabrication method thereof
JP2014107427A5 (OSRAM)