JP2019010884A - Screen printing method, screen printing device, and component mounting line - Google Patents

Screen printing method, screen printing device, and component mounting line Download PDF

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JP2019010884A
JP2019010884A JP2018192201A JP2018192201A JP2019010884A JP 2019010884 A JP2019010884 A JP 2019010884A JP 2018192201 A JP2018192201 A JP 2018192201A JP 2018192201 A JP2018192201 A JP 2018192201A JP 2019010884 A JP2019010884 A JP 2019010884A
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substrate
screen printing
mask
contact
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JP6803527B2 (en
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萬谷 正幸
Masayuki Mantani
正幸 萬谷
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Panasonic Intellectual Property Management Co Ltd
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Abstract

To provide a screen printing method capable of efficiently printing 2 kinds of paste having different thickness without increasing the size of whole device, a screen printing device, and a component mounting line.SOLUTION: After a printing head 17 is abutted against an intermediate region Rm in a state that a substrate 2 is in contact with a front masking region R1, the printing head 17 is moved to a region in an opposite side of the intermediate region Rm of the front masking region R1, and further the printing head 17 is moved to the intermediate region Rm to conduct primary printing on the substrate 2, after the substrate 2 is snapped off from a mask 13, the printing head 17 is moved from the intermediate region Rm to a region in an opposite side of the intermediate region Rm of a back masking region R2 with a state that the substrate 2 is in contact with the back masking region R2, and further the printing head 17 is moved to the intermediate region Rm to conduct secondary printing on the substrate 2. After primary printing is completed, the secondary printing is initiated while the printing head 17 is kept to be abutted against the intermediate region Rm.SELECTED DRAWING: Figure 4

Description

本発明は、開口が形成されたマスクを用いて基板にペーストを印刷するスクリーン印刷方法、スクリーン印刷装置及びこのスクリーン印刷装置を備えた部品実装ラインに関するものである。   The present invention relates to a screen printing method for printing a paste on a substrate using a mask having openings formed therein, a screen printing apparatus, and a component mounting line including the screen printing apparatus.

スクリーン印刷装置は、開口が形成されたマスクを基板に接触させうえで、印刷ヘッドにより開口にペーストを充填することで、基板にペーストを印刷する。基板に印刷されるペーストの厚さはマスクの厚さによって設定でき、通常は1枚の基板についてはペーストの厚さは単一(1種)である。チップ部品等の小型部品とコネクタ等の大型部品とが混載される基板については、大型部品の接合時には小型部品の接合時よりも多くのペースト量が必要となるため、基板に厚さの異なる2種のペーストを印刷しなければならない場合もある。この場合、従来では、厚さが互いに異なりそれぞれに開口が形成された2枚のマスクをスクリーン印刷装置内に並設し、厚さの薄い方のマスクで印刷を行った後、次いで厚さの厚いマスクで印刷を行うようにしていた(例えば、特許文献1)。   The screen printing apparatus prints the paste on the substrate by bringing the mask in which the opening is formed into contact with the substrate and filling the opening with the paste by the print head. The thickness of the paste printed on the substrate can be set according to the thickness of the mask. Usually, the thickness of the paste for a single substrate is single (one type). For a board on which a small part such as a chip part and a large part such as a connector are mixedly mounted, a larger amount of paste is required when joining a large part than when joining a small part. Sometimes it is necessary to print a seed paste. In this case, conventionally, two masks having different thicknesses and having openings formed in each other are arranged in parallel in the screen printing apparatus, and after printing with the thinner mask, Printing was performed with a thick mask (for example, Patent Document 1).

特開2014−120745号公報JP 2014-120745 A

しかしながら、2枚のマスクを1つのスクリーン印刷装置の中に配置すると、装置全体が大型化してしまうという問題点があった。   However, when two masks are arranged in one screen printing apparatus, there is a problem that the whole apparatus becomes large.

そこで本発明は、装置を大型化させることなく、効率よく厚さの異なる2種のペーストを印刷することができるスクリーン印刷方法、スクリーン印刷装置及び部品実装ラインを提供することを目的とする。   Therefore, an object of the present invention is to provide a screen printing method, a screen printing apparatus, and a component mounting line capable of efficiently printing two types of pastes having different thicknesses without increasing the size of the apparatus.

本発明のスクリーン印刷方法は、第1の領域に第1の開口を有するとともに前記第1の領域よりも厚さの大きい第2の領域に第2の開口を有し、更に、前記第1の領域と前記第2の領域との間に中間領域を有したマスクを介して、印刷ヘッドにより、基板にペーストを印刷するスクリーン印刷方法であって、前記基板が前記第1の領域に接触した状態で前記印刷ヘッドを前記中間領域に当接させた後、前記印刷ヘッドを第1の領域の前記中間領域とは反対側の領域まで移動させ、更に前記印刷ヘッドを前記中間領域まで移動させることによって前記基板に対する1次印刷を行い、前記基板を前記マスクから版離れさせた後、前記基板が前記第2の領域に接触した状態で前記印刷ヘッドを前記中間領域から前記第2の領域の前記中間領域とは反対側の領域まで移動させ、更に前記印刷ヘッドを前記中間領域まで移動させることによって前記基板に対する2次印刷を行い、前記1次印刷の終了後、前記印刷ヘッドを前記中間領域に当接させたまま前記2次印刷を開始する。   The screen printing method of the present invention has a first opening in the first region and a second opening in a second region having a thickness larger than that of the first region, and further includes the first opening. A screen printing method for printing paste on a substrate by a print head through a mask having an intermediate region between a region and the second region, wherein the substrate is in contact with the first region After the print head is brought into contact with the intermediate region, the print head is moved to a region of the first region opposite to the intermediate region, and the print head is further moved to the intermediate region. After performing primary printing on the substrate and separating the plate from the mask, the print head is moved from the intermediate region to the intermediate region in a state where the substrate is in contact with the second region. Contrary to region The secondary printing is performed on the substrate by moving the print head to the intermediate area, and the print head is kept in contact with the intermediate area after the primary printing is completed. The secondary printing is started.

本発明のスクリーン印刷装置は、第1の領域に第1の開口を有するとともに前記第1の領域よりも厚さの大きい第2の領域に第2の開口を有し、更に、前記第1の領域と前記第2の領域との間に中間領域を有したマスクと、基板が前記第1の領域に接触した状態で前記第1の開口にペーストを充填し、前記基板が前記第2の領域に接触した状態で前記第2の開口にペーストを充填する印刷ヘッドと、前記基板を保持するとともに、前記基板を前記第1の領域又は前記第2の領域に接触させる基板保持部とを備え、前記印刷ヘッドは、前記基板が前記第1の領域に接触した状態で前記中間領域に当接した後、第1の領域の前記中間領域とは反対側の領域まで移動し、更に前記中間領域まで移動することによって前記基板に対する1次印刷を行い、前記基板が前記マスクから版離れした後、前記第2の領域に接触した状態で前記中間領域から前記第2の領域の前記中間領域とは反対側の領域まで移動し、更に前記中間領域まで移動することによって前記基板に対する2次印刷を行うようになっており、前記1次印刷の終了後、前記中間領域に当接したまま前記2次印刷を開始し、前記基板保持部は、前記1次印刷の後に前記第1の領域に接触している基板を版離れさせ、前記第2の領域に接触させる。   The screen printing apparatus of the present invention has a first opening in the first region and a second opening in a second region having a thickness larger than that of the first region, and further includes the first opening. A mask having an intermediate region between the region and the second region; and a paste is filled in the first opening in a state where the substrate is in contact with the first region, and the substrate is in the second region A print head that fills the second opening with a paste in contact with the substrate, and a substrate holding unit that holds the substrate and brings the substrate into contact with the first region or the second region, The print head contacts the intermediate region in a state where the substrate is in contact with the first region, and then moves to a region opposite to the intermediate region of the first region, and further to the intermediate region. Perform primary printing on the substrate by moving After the substrate is released from the mask, the substrate moves from the intermediate region to a region on the opposite side of the second region in contact with the second region, and further moves to the intermediate region. Thus, the secondary printing is performed on the substrate, and after the primary printing is finished, the secondary printing is started while being in contact with the intermediate region, and the substrate holding unit After printing, the substrate that is in contact with the first region is released from the plate and is brought into contact with the second region.

本発明の部品実装ラインは、上記本発明のスクリーン印刷装置と、前記スクリーン印刷装置によりペーストが印刷された基板に部品を装着する部品実装装置とを備えた。   A component mounting line according to the present invention includes the screen printing apparatus according to the present invention, and a component mounting apparatus that mounts a component on a substrate on which a paste is printed by the screen printing apparatus.

本発明によれば、装置を大型化させることなく、効率よく厚さの異なる2種のペーストを印刷することができる。   According to the present invention, it is possible to efficiently print two types of pastes having different thicknesses without increasing the size of the apparatus.

本発明の第1実施形態における部品実装ラインの平面図The top view of the component mounting line in 1st Embodiment of this invention 本発明の第1実施形態における部品実装ラインが部品実装を行う基板の平面図The top view of the board | substrate which the component mounting line in 1st Embodiment of this invention mounts components 本発明の第1実施形態におけるスクリーン印刷装置の平面図The top view of the screen printing apparatus in 1st Embodiment of this invention. 本発明の第1実施形態におけるスクリーン印刷装置の側面図The side view of the screen printing apparatus in 1st Embodiment of this invention. 本発明の第1実施形態におけるスクリーン印刷装置が備えるマスクの平面図The top view of the mask with which the screen printing apparatus in 1st Embodiment of this invention is provided. 本発明の第1実施形態におけるスクリーン印刷装置が備えるマスクの側断面図Side sectional drawing of the mask with which the screen printing apparatus in 1st Embodiment of this invention is provided. (a)(b)本発明の第1実施形態におけるスクリーン印刷装置の部分側面図(A) (b) The partial side view of the screen printing apparatus in 1st Embodiment of this invention. (a)(b)本発明の第1実施形態におけるスクリーン印刷装置が備えるマスクと基板の側断面図(A) (b) Side sectional view of the mask and substrate provided in the screen printing apparatus according to the first embodiment of the present invention. 本発明の第1実施形態におけるスクリーン印刷装置の制御系統を示すブロック図The block diagram which shows the control system of the screen printing apparatus in 1st Embodiment of this invention. (a)(b)本発明の第1実施形態におけるスクリーン印刷装置の動作説明図(A) (b) Operation | movement explanatory drawing of the screen printing apparatus in 1st Embodiment of this invention. (a)(b)本発明の第1実施形態におけるスクリーン印刷装置の動作説明図(A) (b) Operation | movement explanatory drawing of the screen printing apparatus in 1st Embodiment of this invention. (a)(b)本発明の第1実施形態におけるスクリーン印刷装置が備えるマスクと基板を示す図(A) (b) The figure which shows the mask and board | substrate with which the screen printing apparatus in 1st Embodiment of this invention is provided. (a)(b)本発明の第1実施形態におけるスクリーン印刷装置の動作説明図(A) (b) Operation | movement explanatory drawing of the screen printing apparatus in 1st Embodiment of this invention. (a)(b)本発明の第1実施形態におけるスクリーン印刷装置が備えるマスクと基板を示す図(A) (b) The figure which shows the mask and board | substrate with which the screen printing apparatus in 1st Embodiment of this invention is provided. (a)(b)本発明の第1実施形態におけるスクリーン印刷装置の動作説明図(A) (b) Operation | movement explanatory drawing of the screen printing apparatus in 1st Embodiment of this invention. (a)(b)本発明の第1実施形態におけるスクリーン印刷装置の動作説明図(A) (b) Operation | movement explanatory drawing of the screen printing apparatus in 1st Embodiment of this invention. (a)(b)本発明の第1実施形態におけるスクリーン印刷装置が備えるマスクと基板を示す図(A) (b) The figure which shows the mask and board | substrate with which the screen printing apparatus in 1st Embodiment of this invention is provided. (a)(b)本発明の第1実施形態におけるスクリーン印刷装置の動作説明図(A) (b) Operation | movement explanatory drawing of the screen printing apparatus in 1st Embodiment of this invention. (a)(b)本発明の第1実施形態におけるスクリーン印刷装置が備えるマスクと基板を示す図(A) (b) The figure which shows the mask and board | substrate with which the screen printing apparatus in 1st Embodiment of this invention is provided. 本発明の第2実施形態におけるスクリーン印刷装置の側面図Side view of the screen printing apparatus according to the second embodiment of the present invention. 本発明の第2実施形態におけるスクリーン印刷装置が備えるマスクの側面図The side view of the mask with which the screen printing apparatus in 2nd Embodiment of this invention is provided. 本発明の第3実施形態におけるスクリーン印刷装置の側面図Side view of a screen printing apparatus according to a third embodiment of the present invention. 本発明の第3実施形態におけるスクリーン印刷装置が備えるマスクの側面図The side view of the mask with which the screen printing apparatus in 3rd Embodiment of this invention is provided. (a)(b)本発明の第3実施形態におけるスクリーン印刷装置の部分側面図(A) (b) The partial side view of the screen printing apparatus in 3rd Embodiment of this invention.

(第1実施形態)
図1は本発明の第1実施形態における部品実装ライン1を示している。部品実装ライン1は基板2に部品3を装着して実装基板2Jを製造するものであり、スクリーン印刷装置4とその下流工程側に配置された部品実装装置5を備えている。スクリーン印刷装置4は上流工程側から投入された基板2を受け取ってその基板2の電極2D上にペーストPstをスクリーン印刷し、部品実装装置5に受け渡す。部品実装装置5は、スクリーン印刷装置4から基板2を受け取り、ペーストPstが印刷された電極2D上に部品3を装着する。以下の説明では便宜上、作業者OPから見た部品実装ライン1の左右方向をX軸方向とし、基板2はX軸方向を左方から右方へ流れるものとする。また、作業者OPから見た部品実装ライン1の前後方向をY軸方向とし、上下方向をZ軸方向とする。
(First embodiment)
FIG. 1 shows a component mounting line 1 according to the first embodiment of the present invention. The component mounting line 1 is for manufacturing the mounting substrate 2J by mounting the component 3 on the substrate 2, and includes a screen printing device 4 and a component mounting device 5 arranged on the downstream process side. The screen printing device 4 receives the substrate 2 input from the upstream process side, screen-prints the paste Pst on the electrode 2D of the substrate 2, and transfers it to the component mounting device 5. The component mounting device 5 receives the substrate 2 from the screen printing device 4, and mounts the component 3 on the electrode 2D on which the paste Pst is printed. In the following description, for the sake of convenience, it is assumed that the left-right direction of the component mounting line 1 viewed from the operator OP is the X-axis direction, and the board 2 flows in the X-axis direction from left to right. Further, the front-rear direction of the component mounting line 1 viewed from the operator OP is defined as the Y-axis direction, and the vertical direction is defined as the Z-axis direction.

図2に示すように、基板2が有する電極2Dは2種の電極(第1種電極2a及び第2種電極2b)から成る。第1種電極2aはチップ部品等の小型の部品3が装着される電極であり、第2種電極2bはコネクタ等の大型の部品3が装着される電極である。このため第2種電極2bには第1種電極2aよりも多くのペーストPstが必要であり、スクリーン印刷装置4は、第2種電極2bには第1種電極2aよりも厚さの大きいペーストPstを印刷する。図2中に示す領域S1は第1種電極2aが設けられている基板2上の領域を示しており、領域S2は第2種電極2bが設けられている基板2上の領域を示している。   As shown in FIG. 2, the electrode 2D included in the substrate 2 includes two types of electrodes (a first type electrode 2a and a second type electrode 2b). The first type electrode 2a is an electrode on which a small component 3 such as a chip component is mounted, and the second type electrode 2b is an electrode on which a large component 3 such as a connector is mounted. For this reason, the second type electrode 2b requires more paste Pst than the first type electrode 2a, and the screen printing apparatus 4 has a thicker paste for the second type electrode 2b than the first type electrode 2a. Print Pst. A region S1 shown in FIG. 2 indicates a region on the substrate 2 where the first type electrode 2a is provided, and a region S2 indicates a region on the substrate 2 where the second type electrode 2b is provided. .

図3に及び図4において、スクリーン印刷装置4は、基台11上に基板保持移動機構12を備えており、基板保持移動機構12の上方にはマスク13が設けられている。基台11上の基板保持移動機構12の上流工程側には、スクリーン印刷装置4の外部から投入された基板2を受け取って基板保持移動機構12に搬送する搬入コンベア14が設けられている。基台11上の基板保持移動機構12の下流工程側には、基板保持移動機構12から基板2を受け取って下流工程側の装置(ここでは部品実装装置5)に搬送する搬出コンベア15が設けられている。マスク13の下方にはカメラ16が設けられており、マスク13の上方には印刷ヘッド17が設けられている。   3 and 4, the screen printing apparatus 4 includes a substrate holding / moving mechanism 12 on a base 11, and a mask 13 is provided above the substrate holding / moving mechanism 12. On the upstream process side of the substrate holding and moving mechanism 12 on the base 11, a carry-in conveyor 14 is provided that receives the substrate 2 put in from the outside of the screen printing apparatus 4 and transports it to the substrate holding and moving mechanism 12. On the downstream process side of the substrate holding / moving mechanism 12 on the base 11, a carry-out conveyor 15 that receives the substrate 2 from the substrate holding / moving mechanism 12 and conveys it to the downstream process side apparatus (here, the component mounting apparatus 5) is provided. ing. A camera 16 is provided below the mask 13, and a print head 17 is provided above the mask 13.

図4において、基板保持移動機構12は、基板保持部21と移動テーブル部22から成る。基板保持部21は位置決めコンベア31(図3も参照)と、下受け部32と、一対のクランパ33(図3も参照)を備える。位置決めコンベア31は搬入コンベア14から送られてきた基板2を所定のクランプ位置に位置決めする。下受け部32は位置決めコンベア31がクランプ位置に位置決めした基板2を下方から支持し、クランパ33は基板2をY軸方向からクランプする。このように基板2は下受け部32とクランパ33によって保持される。基板保持部21が備える2つのクランパ33のうち、作業者OPの側に位置するものを前方クランパ33Fと称し、作業者OPとは反対の側に位置するものを後方クランパ33Rと称する。移動テーブル部22は多段積みのテーブル機構から成り、基板2を保持した基板保持部21を水平面内方向及び上下方向に移動させる。   In FIG. 4, the substrate holding and moving mechanism 12 includes a substrate holding unit 21 and a moving table unit 22. The substrate holding part 21 includes a positioning conveyor 31 (see also FIG. 3), a lower receiving part 32, and a pair of clampers 33 (see also FIG. 3). The positioning conveyor 31 positions the substrate 2 sent from the carry-in conveyor 14 at a predetermined clamp position. The lower receiving portion 32 supports the substrate 2 positioned by the positioning conveyor 31 at the clamp position from below, and the clamper 33 clamps the substrate 2 from the Y-axis direction. Thus, the substrate 2 is held by the lower receiving portion 32 and the clamper 33. Of the two clampers 33 provided in the substrate holding unit 21, the one located on the worker OP side is referred to as a front clamper 33F, and the one located on the opposite side of the worker OP is referred to as a rear clamper 33R. The moving table unit 22 includes a multi-layered table mechanism, and moves the substrate holding unit 21 holding the substrate 2 in the horizontal plane direction and the vertical direction.

図5において、マスク13はXY平面に広がった矩形平板形状を有している。マスク13の外周は枠部材13wによって支持されている。マスク13の前方側の領域と後方側の領域とでは厚さが異なり、後方側の領域の厚さは前方側の領域の厚さよりも大きくなっている。   In FIG. 5, the mask 13 has a rectangular flat plate shape extending in the XY plane. The outer periphery of the mask 13 is supported by a frame member 13w. The thickness of the front region and the rear region of the mask 13 is different, and the thickness of the rear region is larger than the thickness of the front region.

図4及び図5に示すように、マスク13の前方側の領域には基板2と接触する領域としての前方マスキング領域R1(第1の領域)を有しており、マスク13の後方側の領域には基板2と接触する領域としての後方マスキング領域R2(第2の領域)を有している。前方マスキング領域R1と後方マスキング領域R2の間の領域は前方マスキング領域R1と後方マスキング領域R2との厚さの差(段差)を有する中間領域Rmとなっている。本第1実施形態では、前方マスキング領域R1の下面と後方マスキング領域R2の下面は同一平面であり、前方マスキング領域R1の下面高さと後方マスキング領域R2の下面高さは等しくなっている(図6)。   As shown in FIGS. 4 and 5, the region on the front side of the mask 13 has a front masking region R <b> 1 (first region) as a region in contact with the substrate 2, and the region on the rear side of the mask 13. Has a rear masking region R2 (second region) as a region in contact with the substrate 2. A region between the front masking region R1 and the rear masking region R2 is an intermediate region Rm having a thickness difference (step) between the front masking region R1 and the rear masking region R2. In the first embodiment, the lower surface of the front masking region R1 and the lower surface of the rear masking region R2 are the same plane, and the lower surface height of the front masking region R1 and the lower surface height of the rear masking region R2 are equal (FIG. 6). ).

前方マスキング領域R1内には第1種開口K1(第1の開口)が設けられており、後方マスキング領域R2内には第2種開口K2(第2の開口)が設けられている。第1種開口K1は第1種電極2aの配置に応じた第1のパターンで設けられており、第2種開口K2は第2種電極2bの配置に応じた第2のパターンで設けられている。すなわちマスク13は、前方マスキング領域R1に第1種開口K1を有するとともに、前方マスキング領域R1よりも厚さの大きい後方マスキング領域R2に第2種開口K2を有したものとなっている。   A first type opening K1 (first opening) is provided in the front masking region R1, and a second type opening K2 (second opening) is provided in the rear masking region R2. The first type opening K1 is provided in a first pattern according to the arrangement of the first type electrode 2a, and the second type opening K2 is provided in a second pattern according to the arrangement of the second type electrode 2b. Yes. That is, the mask 13 has the first type opening K1 in the front masking region R1 and the second type opening K2 in the rear masking region R2 having a thickness larger than that of the front masking region R1.

図3及び図4において、カメラ16は、撮像視野を上方に向けた上方撮像部16aと、撮像視野を下方に向けた下方撮像部16bを備える。カメラ16はカメラ移動機構16Kに駆動されてXY面内で移動する。カメラ16の上方撮像部16aはマスク13の前方マスキング領域R1と後方マスキング領域R2のそれぞれに設けられたマスク側マーク13m(図5)を下方から撮像する。カメラ16の下方撮像部16bは基板保持部21に保持された基板2の基板側マーク2m(図3)を上方から撮像する。   3 and 4, the camera 16 includes an upper imaging unit 16a with the imaging field of view facing upward and a lower imaging unit 16b with the imaging field of view facing downward. The camera 16 is driven by the camera moving mechanism 16K and moves in the XY plane. The upper imaging unit 16a of the camera 16 images the mask side mark 13m (FIG. 5) provided in each of the front masking area R1 and the rear masking area R2 of the mask 13 from below. The lower imaging unit 16b of the camera 16 images the substrate side mark 2m (FIG. 3) of the substrate 2 held by the substrate holding unit 21 from above.

基板保持移動機構12は、カメラ16が撮像したマスク側マーク13mと基板側マーク2mの相対位置を参照することによって基板2をマスク13に対して位置合わせしたうえで、基板2を上昇させてマスク13の下面に接触させる。第1種電極2aにペーストPstを印刷するときには基板2を前方マスキング領域R1に接触させ(図7(a))、第2種電極2bにペーストPstを印刷するときには基板2を後方マスキング領域R2に接触させる(図7(b))。   The substrate holding / moving mechanism 12 aligns the substrate 2 with respect to the mask 13 by referring to the relative positions of the mask side mark 13m and the substrate side mark 2m captured by the camera 16, and then raises the substrate 2 to mask it. 13 is brought into contact with the lower surface. When the paste Pst is printed on the first type electrode 2a, the substrate 2 is brought into contact with the front masking region R1 (FIG. 7A), and when the paste Pst is printed on the second type electrode 2b, the substrate 2 is placed in the rear masking region R2. Contact is made (FIG. 7B).

基板保持部21において保持した基板2を前方マスキング領域R1に接触させた場合、前方クランパ33Fは前方マスキング領域R1の前方に位置し、後方クランパ33Rは前方マスキング領域R1の後方の中間領域Rmに位置する(図7(a))。一方、基板保持部21において保持した基板2を後方マスキング領域R2に接触させた場合、後方クランパ33Rは後方マスキング領域R2の後方に位置し、前方クランパ33Fは後方マスキング領域R2の前方の中間領域Rmに位置する(図7(b))。中間領域Rmには印刷開始時にペーストPstが供給される(図5)。   When the substrate 2 held by the substrate holder 21 is brought into contact with the front masking region R1, the front clamper 33F is positioned in front of the front masking region R1, and the rear clamper 33R is positioned in the intermediate region Rm behind the front masking region R1. (FIG. 7A). On the other hand, when the substrate 2 held by the substrate holder 21 is brought into contact with the rear masking region R2, the rear clamper 33R is positioned behind the rear masking region R2, and the front clamper 33F is an intermediate region Rm in front of the rear masking region R2. (FIG. 7B). The paste Pst is supplied to the intermediate region Rm at the start of printing (FIG. 5).

基板2を前方マスキング領域R1に接触させると、基板2の第1種電極2aはマスク13の第1種開口K1と合致し、第1種開口K1を通じてマスク13の上面側に露出する(図8(a))。前方マスキング領域R1におけるマスク13の厚さT1は、そのまま第1種電極2aにペーストPstを印刷した場合のペーストPstの厚さとなる。一方、基板2を後方マスキング領域R2に接触させると、第2種電極2bはマスク13の第2種開口K2と合致し、第2種開口K2を通じてマスク13の上面側に露出する(図8(b))。後方マスキング領域R2におけるマスク13の厚さT2は、そのまま第2種電極2bにペーストPstを印刷したときのペーストPstの厚さとなる。   When the substrate 2 is brought into contact with the front masking region R1, the first type electrode 2a of the substrate 2 matches the first type opening K1 of the mask 13, and is exposed to the upper surface side of the mask 13 through the first type opening K1 (FIG. 8). (A)). The thickness T1 of the mask 13 in the front masking region R1 is the thickness of the paste Pst when the paste Pst is printed on the first type electrode 2a as it is. On the other hand, when the substrate 2 is brought into contact with the rear masking region R2, the second type electrode 2b matches the second type opening K2 of the mask 13, and is exposed to the upper surface side of the mask 13 through the second type opening K2 (FIG. 8 ( b)). The thickness T2 of the mask 13 in the rear masking region R2 is the thickness of the paste Pst when the paste Pst is printed on the second type electrode 2b as it is.

図3及び図4において、印刷ヘッド17は、X軸方向に延びた移動ベース41と、移動ベース41の下方にY軸方向に対向配置された2つのスキージ42と、移動ベース41に設けられて各スキージ42を移動ベース41に対して昇降させる2つの2つのスキージ昇降シリンダ43から成る。移動ベース41は印刷ヘッド移動機構17Kに駆動されてY軸方向に移動し、これにより各スキージ42がY軸方向に移動される。Y軸方向に並んで設けられた2つのスキージ42のうち、前方(図4の紙面右側)に位置するものを前方スキージ42Fと称し、後方(図4の紙面左側)に位置するものを後方スキージ42Rと称する。   3 and 4, the print head 17 is provided on the moving base 41, the moving base 41 extending in the X-axis direction, the two squeegees 42 disposed below the moving base 41 in the Y-axis direction, and the moving base 41. The squeegee 42 is composed of two squeegee lifting cylinders 43 that lift and lower the squeegee 42 with respect to the moving base 41. The moving base 41 is driven by the print head moving mechanism 17K to move in the Y-axis direction, whereby each squeegee 42 is moved in the Y-axis direction. Of the two squeegees 42 arranged side by side in the Y-axis direction, the one located on the front (right side in FIG. 4) is referred to as the front squeegee 42F, and the one located on the rear (left side in FIG. 4) is the rear squeegee. It is called 42R.

搬入コンベア14による基板2の搬送動作、基板保持移動機構12による基板2の保持及び移動動作、搬出コンベア15による基板2の搬送動作の各制御は、スクリーン印刷装置4が備える制御装置50(図9)が行う。また、カメラ移動機構16Kによるカメラ16の移動動作、印刷ヘッド移動機構17Kによる印刷ヘッド17の移動動作、スキージ昇降シリンダ43による各スキージ42の昇降動作及びカメラ16の撮像動作の各制御も制御装置50が行う。カメラ16の撮像によって得られた画像データは制御装置50に送られ、制御装置50の画像処理部50a(図9)において画像認識処理される。   The control device 50 (see FIG. 9) provided in the screen printing apparatus 4 controls each of the transfer operation of the substrate 2 by the carry-in conveyor 14, the holding and moving operation of the substrate 2 by the substrate holding and moving mechanism 12, and the transfer operation of the substrate 2 by the carry-out conveyor 15. ) Do. The control device 50 also controls the movement of the camera 16 by the camera movement mechanism 16K, the movement of the print head 17 by the print head movement mechanism 17K, the movement of the squeegee 42 by the squeegee lifting cylinder 43, and the imaging operation of the camera 16. Do. Image data obtained by imaging by the camera 16 is sent to the control device 50, and image recognition processing is performed in the image processing unit 50a (FIG. 9) of the control device 50.

次に、上記構成のスクリーン印刷装置4の動作を説明する。スクリーン印刷装置4は、前方マスキング領域R1の第1種開口K1を用いて第1種電極2aにペーストPstを印刷(1次印刷)した後、後方マスキング領域R2の第2種開口K2を用いて第2種電極2bにペーストPstを印刷(2次印刷)する。   Next, the operation of the screen printing apparatus 4 configured as described above will be described. The screen printing apparatus 4 uses the first type opening K1 in the front masking region R1 to print the paste Pst on the first type electrode 2a (primary printing), and then uses the second type opening K2 in the rear masking region R2. The paste Pst is printed (secondary printing) on the second type electrode 2b.

上流工程側から基板2が投入されると、その基板2を搬入コンベア14が受け取り、基板保持部21に受け渡す。基板保持部21は、搬入コンベア14から受け取った基板2を位置決めコンベア31によって所定のクランプ位置に位置決めし、下受け部32により下方から支持したうえで、クランパ33によってクランプする(図10(a)。図中に示す矢印A)。このようにして基板保持部21が基板2を保持したら、基板保持移動機構12は基板保持部21を移動させ、基板2を前方マスキング領域R1の下方に位置させる(図10(b)。図中に示す矢印B1)。   When the substrate 2 is loaded from the upstream process side, the carry-in conveyor 14 receives the substrate 2 and delivers it to the substrate holding unit 21. The substrate holding unit 21 positions the substrate 2 received from the carry-in conveyor 14 at a predetermined clamping position by the positioning conveyor 31, supports it from below by the lower receiving unit 32, and clamps it by the clamper 33 (FIG. 10A). Arrow A) shown in the figure. When the substrate holding unit 21 holds the substrate 2 in this way, the substrate holding / moving mechanism 12 moves the substrate holding unit 21 to position the substrate 2 below the front masking region R1 (FIG. 10B). Arrow B1).

基板2が前方マスキング領域R1の下方に位置したらカメラ16が移動し、上方撮像部16aによって前方マスキング領域R1内のマスク側マーク13mを撮像し、下方撮像部16bによって基板側マーク2mを撮像する(図11(a))。カメラ16による撮像が終了したら、基板保持移動機構12は、得られたマスク側マーク13mと基板側マーク2mが平面視において一致するように基板2を移動させたうえで上昇させ、前方マスキング領域R1に基板2を接触させる(図11(b)。図中に示す矢印C1)。これにより各第1種電極2aは対応する第1種開口K1内と合致してマスク13の上面側に露出する。一方、各第2種電極2bはマスク13に覆われた状態となる(図12(a)→図12(b))。   When the substrate 2 is positioned below the front masking region R1, the camera 16 moves, the upper imaging unit 16a images the mask side mark 13m in the front masking region R1, and the lower imaging unit 16b images the substrate side mark 2m ( FIG. 11 (a)). When the imaging by the camera 16 is completed, the substrate holding / moving mechanism 12 moves the substrate 2 so that the obtained mask side mark 13m and the obtained substrate side mark 2m coincide with each other in plan view, and then lifts the substrate 2 to move the front masking region R1. The substrate 2 is brought into contact with (FIG. 11 (b), arrow C1 shown in the figure). As a result, each first type electrode 2a is exposed on the upper surface side of the mask 13 in alignment with the corresponding first type opening K1. On the other hand, each second-type electrode 2b is covered with the mask 13 (FIG. 12 (a) → FIG. 12 (b)).

基板2が前方マスキング領域R1に接触したら、印刷ヘッド17は後方スキージ42Rを下降させて、その下端をマスク13の中間領域Rmに当接させる。そして、後方スキージ42Rを中間領域Rmから前方マスキング領域R1の前方の領域まで移動させることによって後方スキージ42Rを前方マスキング領域R1上で摺動させる(図13(a)及び図14(a)中に示す矢印D1)。後方スキージ42Rが前方マスキング領域R1の前方の領域まで移動したら、印刷ヘッド17は後方スキージ42Rを上昇させた後、今度は前方スキージ42Fを下降させて、その下端をマスク13に当接させる。そして、前方スキージ42Fを前方マスキング領域R1の前方の領域から中間領域Rmまで移動させることによって、前方スキージ42Fを前方マスキング領域R1上で摺動させる(図13(b)中に示す矢印D2)。スキージ42の摺動によって各第1種開口K1内にペーストPstが充填されたら(図14(a))、基板保持移動機構12は基板保持部21を下降させて(図15(a)中に示す矢印C2)、版離れを行う。これにより基板2の各第1種電極2a上に前方マスキング領域R1のマスク13の厚さT1に対応した厚さのペーストPstの層が形成され(図14(b))、1次印刷が終了する。   When the substrate 2 comes into contact with the front masking region R1, the print head 17 lowers the rear squeegee 42R so that the lower end thereof contacts the intermediate region Rm of the mask 13. Then, the rear squeegee 42R is slid on the front masking region R1 by moving the rear squeegee 42R from the intermediate region Rm to the region in front of the front masking region R1 (in FIGS. 13 (a) and 14 (a)). Arrow D1) shown. When the rear squeegee 42R moves to the area in front of the front masking area R1, the print head 17 raises the rear squeegee 42R, and then lowers the front squeegee 42F and makes its lower end contact the mask 13. Then, the front squeegee 42F is slid on the front masking region R1 by moving the front squeegee 42F from the region in front of the front masking region R1 to the intermediate region Rm (arrow D2 shown in FIG. 13B). When the paste Pst is filled in each first type opening K1 by sliding the squeegee 42 (FIG. 14A), the substrate holding and moving mechanism 12 lowers the substrate holding portion 21 (FIG. 15A). The arrow C2) shown in FIG. As a result, a layer of paste Pst having a thickness corresponding to the thickness T1 of the mask 13 in the front masking region R1 is formed on each first type electrode 2a of the substrate 2 (FIG. 14B), and the primary printing is completed. To do.

1次印刷が終了したら、基板保持移動機構12は基板保持部21を移動させ、基板2を後方マスキング領域R2の下方に位置させる(図15(b)中に示す矢印B2)。基板2が後方マスキング領域R2の下方に位置したらカメラ16が移動し、上方撮像部16aによって後方マスキング領域R2内のマスク側マーク13mを撮像し、下方撮像部16bによって基板側マーク2mを撮像する(図16(a))。カメラ16による撮像が終了したら、基板保持移動機構12は、得られたマスク側マーク13mと基板側マーク2mが平面視において一致するように基板2を移動させたうえで上昇させ、後方マスキング領域R2に基板2を接触させる(図16(b)。図中に示す矢印C1)。これにより各第2種電極2bは対応する第2種開口K2と合致してマスク13の上面側に露出する。一方、第1種電極2aに印刷されたペーストPstは後方マスキング領域R2に設けられた干渉回避用の窪みHの内部に収容される(図17(a)→図17(b))。なお、1次印刷の終了後、前方スキージ42Fは中間領域Rmに下端を当接させて停止したままである。   When the primary printing is completed, the substrate holding and moving mechanism 12 moves the substrate holding unit 21 to position the substrate 2 below the rear masking region R2 (arrow B2 shown in FIG. 15B). When the substrate 2 is positioned below the rear masking region R2, the camera 16 moves, the upper imaging unit 16a images the mask side mark 13m in the rear masking region R2, and the lower imaging unit 16b images the substrate side mark 2m ( FIG. 16 (a)). When the imaging by the camera 16 is completed, the substrate holding / moving mechanism 12 moves the substrate 2 so that the obtained mask side mark 13m and the obtained substrate side mark 2m coincide with each other in plan view, and then lifts the substrate 2 to move the rear masking region R2. The substrate 2 is brought into contact with (FIG. 16B, arrow C1 shown in the figure). As a result, each second type electrode 2b is exposed to the upper surface side of the mask 13 in alignment with the corresponding second type opening K2. On the other hand, the paste Pst printed on the first-type electrode 2a is accommodated in a recess H for avoiding interference provided in the rear masking region R2 (FIG. 17 (a) → FIG. 17 (b)). In addition, after the end of the primary printing, the front squeegee 42F remains stopped with the lower end abutting against the intermediate region Rm.

上記窪みHは、後方マスキング領域R2に、第1種電極2aの配置に応じたパターンで(すなわち第1のパターンで)設けられており、基板2が後方マスキング領域R2に接触した際、第1種電極2aの上面に印刷されたペーストPstをすっぽりと収容する。このため2次印刷の際、1次印刷で第1種電極2aに印刷されたペーストPstがマスク13の下面に接触してしまうことが回避される。   The depression H is provided in the rear masking region R2 in a pattern corresponding to the arrangement of the first type electrode 2a (that is, in the first pattern). When the substrate 2 comes into contact with the rear masking region R2, the first recess H is formed. The paste Pst printed on the upper surface of the seed electrode 2a is completely accommodated. For this reason, during the secondary printing, it is avoided that the paste Pst printed on the first type electrode 2a by the primary printing contacts the lower surface of the mask 13.

基板2がマスク13の後方マスキング領域R2に接触したら、印刷ヘッド17は、前方スキージ42Fを中間領域Rmから後方マスキング領域R2の後方の領域まで移動させることによって前方スキージ42Fを後方マスキング領域R2上で摺動させる(図18(a)中に示す矢印E1)。前方スキージ42Fが後方マスキング領域R2の後方の領域まで移動したら、印刷ヘッド17は前方スキージ42Fを上昇させた後、今度は後方スキージ42Rを下降させて、その下端をマスク13に当接させる。そして、後方スキージ42Rを後方マスキング領域R2の後方の領域から中間領域Rmまで移動させることによって、後方スキージ42Rを後方マスキング領域R2上で摺動させる(図18(b)及び図19(a)中に示す矢印E2)。スキージ42の摺動によって各第2種開口K2内にペーストPstが充填されたら(図19(a))、基板保持移動機構12は基板保持部21を下降させて、版離れを行う。これにより基板2の各第2種電極2b上に後方マスキング領域R2のマスク13の厚さT2に応じた厚さのペーストPstの層が形成され(図19(b))、2次印刷が終了する。   When the substrate 2 comes into contact with the rear masking region R2 of the mask 13, the print head 17 moves the front squeegee 42F over the rear masking region R2 by moving the front squeegee 42F from the intermediate region Rm to the region behind the rear masking region R2. Slide (arrow E1 shown in FIG. 18A). When the front squeegee 42F has moved to the area behind the rear masking area R2, the print head 17 raises the front squeegee 42F, and then lowers the rear squeegee 42R so that the lower end of the squeegee 42 abuts against the mask 13. Then, the rear squeegee 42R is slid on the rear masking region R2 by moving the rear squeegee 42R from the rear region of the rear masking region R2 to the intermediate region Rm (in FIGS. 18B and 19A). Arrow E2). When the paste Pst is filled in each of the second type openings K2 by sliding the squeegee 42 (FIG. 19A), the substrate holding and moving mechanism 12 lowers the substrate holding portion 21 to release the plate. As a result, a layer of paste Pst having a thickness corresponding to the thickness T2 of the mask 13 in the rear masking region R2 is formed on each second type electrode 2b of the substrate 2 (FIG. 19B), and the secondary printing is completed. To do.

このようにスキージ42は、マスク13の前方マスキング領域R1を摺動して第1種開口K1にペーストPstを充填した後、前方マスキング領域R1と後方マスキング領域R2の間の中間領域Rmに停止し、その後、中間領域Rmから移動を開始して後方マスキング領域R2を摺動することによって、第2種開口K2にペーストPstを充填するようになっている。すなわち、スキージ42(詳細には前方スキージ42F)は、前方マスキング領域R1上での摺動動作と後方マスキング領域R2上での摺動動作との間でマスク13から離間しない。このためスムーズかつ効率よく、厚さの異なる2種の(2種の厚さの)ペーストPstを印刷できる。   As described above, the squeegee 42 slides on the front masking region R1 of the mask 13 to fill the first type opening K1 with the paste Pst, and then stops at the intermediate region Rm between the front masking region R1 and the rear masking region R2. Thereafter, the movement from the intermediate region Rm is started and the rear masking region R2 is slid to fill the second type opening K2 with the paste Pst. That is, the squeegee 42 (specifically, the front squeegee 42F) is not separated from the mask 13 between the sliding operation on the front masking region R1 and the sliding operation on the rear masking region R2. For this reason, it is possible to print two types (two types of thickness) of pastes Pst having different thicknesses smoothly and efficiently.

上記のようにして基板2上の各電極2D(第1種電極2a及び第2種電極2b)にペーストPstを印刷し、基板2の1枚当たりのスクリーン印刷が終了したら、基板保持移動機構12はクランパ33を開いて基板2の保持を解除する。そして、位置決めコンベア31を作動させて搬出コンベア15に受け渡し、搬出コンベア15は受け取った基板2を下流工程側の部品実装装置5に搬出する。   When the paste Pst is printed on each electrode 2D (first-type electrode 2a and second-type electrode 2b) on the substrate 2 as described above and the screen printing per one substrate 2 is completed, the substrate holding and moving mechanism 12 Opens the clamper 33 to release the holding of the substrate 2. Then, the positioning conveyor 31 is operated and delivered to the carry-out conveyor 15, and the carry-out conveyor 15 carries the received board 2 to the component mounting apparatus 5 on the downstream process side.

図1において、部品実装装置5は、基板2を搬送して位置決めする基板搬送コンベア71、部品3を供給するパーツフィーダ72、パーツフィーダ72が供給する部品3を装着ヘッド73によってピックアップして基板搬送コンベア71により位置決めされた基板2に装着する装着機構74を備えている。部品実装装置5は、第1種電極2aにはチップ部品等の小型部品を装着し、第2種電極2bにはコネクタ等の大型の部品を装着する。部品実装装置5は、基板2に対する部品3の装着作業が終了したら、基板搬送コンベア71を作動させて、基板2を下流工程側に搬出する。このようにして部品実装ライン1により実装基板2Jが製造される。   In FIG. 1, the component mounting apparatus 5 picks up a substrate conveying conveyor 71 that conveys and positions a substrate 2, a parts feeder 72 that supplies components 3, and a component 3 that is supplied by the parts feeder 72 by a mounting head 73 to convey the substrate. A mounting mechanism 74 for mounting on the substrate 2 positioned by the conveyor 71 is provided. In the component mounting apparatus 5, a small component such as a chip component is mounted on the first type electrode 2a, and a large component such as a connector is mounted on the second type electrode 2b. When the mounting operation of the component 3 on the board 2 is completed, the component mounting apparatus 5 operates the board transport conveyor 71 to carry the board 2 to the downstream process side. In this way, the mounting board 2J is manufactured by the component mounting line 1.

(第2実施形態)
図20は、本発明の第2実施形態におけるスクリーン印刷装置4を示している。第2実施形態におけるスクリーン印刷装置4は第1実施形態におけるスクリーン印刷装置4とスクリーン印刷時の動作とほぼ同じであるが、マスク13の構成が異なる。すなわち、第2実施形態におけるスクリーン印刷装置4のマスク13は、第1実施形態におけるマスク13において、中間領域Rmの上面が、前方マスキング領域R1の上面と後方マスキング領域R2の上面を接続する傾斜面13Sを備えたものとなっている(図21も参照)。これにより前方マスキング領域R1の上面と後方マスキング領域R2の上面が滑らかに連接され、マスク13上におけるペーストPstの移動が滑らかとなるので、ペーストPstの掻き寄せ動作がスムーズになる。
(Second Embodiment)
FIG. 20 shows the screen printing apparatus 4 according to the second embodiment of the present invention. The screen printing apparatus 4 in the second embodiment is substantially the same as the screen printing apparatus 4 in the first embodiment and operates at the time of screen printing, but the configuration of the mask 13 is different. That is, the mask 13 of the screen printing apparatus 4 in the second embodiment is the inclined surface in which the upper surface of the intermediate region Rm connects the upper surface of the front masking region R1 and the upper surface of the rear masking region R2 in the mask 13 of the first embodiment. 13S (see also FIG. 21). As a result, the upper surface of the front masking region R1 and the upper surface of the rear masking region R2 are smoothly connected, and the movement of the paste Pst on the mask 13 becomes smooth, so that the scraping operation of the paste Pst becomes smooth.

(第3実施形態)
図22は、本発明の第3実施形態におけるスクリーン印刷装置4を示している。第3実施形態におけるスクリーン印刷装置4も第1実施形態におけるスクリーン印刷装置4とスクリーン印刷時の動作とほぼ同じであるが、マスク13の構成が異なる。すなわち、第3実施形態におけるスクリーン印刷装置4では、前方マスキング領域R1の上面と後方マスキング領域R2の上面は同一平面であり、前方マスキング領域R1の上面高さと後方マスキング領域R2の上面高さは等しくなっている(図23も参照)。このため第2実施形態の場合と同様、マスク13上におけるペーストPstの移動が滑らかとなり、ペーストPstの掻き寄せ動作がスムーズになる。
(Third embodiment)
FIG. 22 shows the screen printing apparatus 4 according to the third embodiment of the present invention. The screen printing apparatus 4 in the third embodiment is substantially the same as the screen printing apparatus 4 in the first embodiment and operates at the time of screen printing, but the configuration of the mask 13 is different. That is, in the screen printing apparatus 4 according to the third embodiment, the upper surface of the front masking region R1 and the upper surface of the rear masking region R2 are the same plane, and the upper surface height of the front masking region R1 and the upper surface height of the rear masking region R2 are equal. (See also FIG. 23). For this reason, as in the second embodiment, the movement of the paste Pst on the mask 13 becomes smooth, and the scraping operation of the paste Pst becomes smooth.

図22及び図23から分かるように、第3実施形態では、後方マスキング領域R2の下面高さは前方マスキング領域R1の下面高さよりも低く、両領域の段差はマスク13の下面側に形成されている。このため、基板2を前方マスキング領域R1に接触させるときには、後方クランパ33Rが前方マスキング領域R1内で接触するようにする(図24(a))。また、基板2を後方マスキング領域R2に接触させるときには、前方クランパ33Fが後方マスキング領域R2内で接触するようにする(図24(b))。第1実施形態及び第2実施形態では、基板2が前方マスキング領域R1に接触するときの高さと基板2が後方マスキング領域R2に接触するときの高さは同じであるが、第3実施形態では、基板2が前方マスキング領域R1に接触するときの高さと基板2が後方マスキング領域R2に接触するときの高さは段差の分だけ異なる。   As can be seen from FIGS. 22 and 23, in the third embodiment, the lower surface height of the rear masking region R2 is lower than the lower surface height of the front masking region R1, and the step in both regions is formed on the lower surface side of the mask 13. Yes. Therefore, when the substrate 2 is brought into contact with the front masking region R1, the rear clamper 33R is brought into contact with the front masking region R1 (FIG. 24A). Further, when the substrate 2 is brought into contact with the rear masking region R2, the front clamper 33F is brought into contact with the rear masking region R2 (FIG. 24B). In the first embodiment and the second embodiment, the height when the substrate 2 contacts the front masking region R1 and the height when the substrate 2 contacts the rear masking region R2 are the same, but in the third embodiment, The height when the substrate 2 contacts the front masking region R1 and the height when the substrate 2 contacts the rear masking region R2 differ by the level difference.

以上説明したように、前述の第1〜第3実施形態におけるスクリーン印刷装置4は、前方マスキング領域R1(第1の領域)に第1種開口K1(第1の開口)を有するとともに後方マスキング領域R2(第2の領域)に第2種開口K2(第2の開口)を有したマスク13を備えている。そして、基板2を前方マスキング領域R1に接触させた状態で第1種開口K1にペーストPstを充填し、次いで、基板2を後方マスキング領域R2に接触させた状態で、第2種開口K2にペーストPstを充填することによって、基板2に厚さの異なる2種のペーストPstを印刷することができる。すなわち1枚のマスク13が2枚のマスク相当の機能を有しており、用意するマスク13は1枚のみでよい。このため第1〜第3実施形態におけるスクリーン印刷装置4によれば、装置を大型化させることなく、厚さの異なる2種のペーストPstを印刷することができる。   As described above, the screen printing apparatus 4 in the first to third embodiments described above has the first type opening K1 (first opening) in the front masking region R1 (first region) and the rear masking region. A mask 13 having a second type opening K2 (second opening) is provided in R2 (second region). The first type opening K1 is filled with the paste Pst while the substrate 2 is in contact with the front masking region R1, and then the paste is applied to the second type opening K2 while the substrate 2 is in contact with the rear masking region R2. By filling Pst, two types of pastes Pst having different thicknesses can be printed on the substrate 2. That is, one mask 13 has a function equivalent to two masks, and only one mask 13 is prepared. For this reason, according to the screen printing apparatus 4 in the first to third embodiments, two types of pastes Pst having different thicknesses can be printed without increasing the size of the apparatus.

また、前述の第1〜第3実施形態では、印刷ヘッド17はマスク13上を摺動して第1種開口K1及び第2種開口K2にペーストPstを充填するスキージ42を備えたものであったが、印刷ヘッド17は必ずしもスキージ42を備えたものでなくてもよい。例えば、カートリッジに封入したペーストPstを吐出しながらマスク13上を移動して第1種開口K1及び第2種開口K2にペーストPstを充填するもの等であってもよい。この場合には、第1種開口K1へのペーストPstの充填の次に第2種開口K2へのペーストPstの充填を行うのであれば、印刷ヘッド17の移動方向は任意となる。更に、前述の第1〜第3実施形態では、厚さの異なる2つの領域(第1の領域と第2の領域)はマスク13の前後方向に並んで設けられていたが、これは一例であり、マスク13の前後方向以外の方向に並んで設けられているのであってもよい。   In the first to third embodiments described above, the print head 17 includes the squeegee 42 that slides on the mask 13 and fills the first type opening K1 and the second type opening K2 with the paste Pst. However, the print head 17 is not necessarily provided with the squeegee 42. For example, the first type opening K1 and the second type opening K2 may be filled with the paste Pst by moving on the mask 13 while discharging the paste Pst enclosed in the cartridge. In this case, if the paste Pst is filled into the second type opening K2 after the first type opening K1 is filled with the paste Pst, the moving direction of the print head 17 is arbitrary. Furthermore, in the above-described first to third embodiments, two regions (first region and second region) having different thicknesses are provided side by side in the front-rear direction of the mask 13, but this is an example. Yes, it may be provided side by side in a direction other than the front-rear direction of the mask 13.

装置全体を大型化させることなく、効率よく厚さの異なる2種のペーストを印刷することができるスクリーン印刷方法、スクリーン印刷装置及び部品実装ラインを提供する。   Provided are a screen printing method, a screen printing apparatus, and a component mounting line capable of efficiently printing two types of pastes having different thicknesses without increasing the size of the entire apparatus.

1 部品実装ライン
2 基板
3 部品
4 スクリーン印刷装置
5 部品実装装置
13 マスク
13S 傾斜面
17 印刷ヘッド
42 スキージ
R1 前方マスキング領域(第1の領域)
R2 後方マスキング領域(第2の領域)
Rm 中間領域
K1 第1種開口(第1の開口)
K2 第2種開口(第2の開口)
Pst ペースト
DESCRIPTION OF SYMBOLS 1 Component mounting line 2 Board | substrate 3 Component 4 Screen printing apparatus 5 Component mounting apparatus 13 Mask 13S Inclined surface 17 Print head 42 Squeegee R1 Front masking area | region (1st area | region)
R2 Back masking area (second area)
Rm Intermediate region K1 First kind opening (first opening)
K2 Second kind opening (second opening)
Pst paste

Claims (12)

第1の領域に第1の開口を有するとともに前記第1の領域よりも厚さの大きい第2の領域に第2の開口を有し、更に、前記第1の領域と前記第2の領域との間に中間領域を有したマスクを介して、印刷ヘッドにより、基板にペーストを印刷するスクリーン印刷方法であって、
前記基板が前記第1の領域に接触した状態で前記印刷ヘッドを前記中間領域に当接させた後、前記印刷ヘッドを第1の領域の前記中間領域とは反対側の領域まで移動させ、更に前記印刷ヘッドを前記中間領域まで移動させることによって前記基板に対する1次印刷を行い、前記基板を前記マスクから版離れさせた後、前記基板が前記第2の領域に接触した状態で前記印刷ヘッドを前記中間領域から前記第2の領域の前記中間領域とは反対側の領域まで移動させ、更に前記印刷ヘッドを前記中間領域まで移動させることによって前記基板に対する2次印刷を行い、
前記1次印刷の終了後、前記印刷ヘッドを前記中間領域に当接させたまま前記2次印刷を開始することを特徴とするスクリーン印刷方法。
The first region has a first opening and has a second opening in a second region having a thickness larger than that of the first region. Further, the first region, the second region, A screen printing method for printing a paste on a substrate by a print head through a mask having an intermediate region between,
After the print head is brought into contact with the intermediate region in a state where the substrate is in contact with the first region, the print head is moved to a region of the first region opposite to the intermediate region, and First printing is performed on the substrate by moving the print head to the intermediate region, and after the substrate is separated from the mask, the print head is moved in a state where the substrate is in contact with the second region. Moving the intermediate region from the second region to the region opposite to the intermediate region, and further performing the secondary printing on the substrate by moving the print head to the intermediate region;
The screen printing method, wherein after the primary printing is finished, the secondary printing is started while the print head is in contact with the intermediate region.
前記印刷ヘッドは前記マスク上を摺動して前記第1の開口及び前記第2の開口にペーストを充填するスキージを備えたことを特徴とする請求項1に記載のスクリーン印刷方法。   The screen printing method according to claim 1, wherein the print head includes a squeegee that slides on the mask and fills the first opening and the second opening with paste. 前記第1の領域の下面高さと前記第2の領域の下面高さは等しいことを特徴とする請求項1又は2に記載のスクリーン印刷方法。   The screen printing method according to claim 1, wherein the lower surface height of the first region is equal to the lower surface height of the second region. 前記中間領域は、前記第1の領域の上面と前記第2の領域の上面を接続する傾斜面を備えたことを特徴とする請求項3に記載のスクリーン印刷方法。   The screen printing method according to claim 3, wherein the intermediate area includes an inclined surface that connects an upper surface of the first area and an upper surface of the second area. 前記第1の領域の上面高さと前記第2の領域の上面高さは等しいことを特徴とする請求項1〜4のいずれかに記載のスクリーン印刷方法。   The screen printing method according to claim 1, wherein a top surface height of the first region is equal to a top surface height of the second region. 前記1次印刷の後、前記基板を前記マスクから版離れさせ、前記基板を前記第2の領域に接触させることを特徴とする請求項1〜5のいずれかに記載のスクリーン印刷方法。   The screen printing method according to claim 1, wherein after the primary printing, the substrate is released from the mask and the substrate is brought into contact with the second region. 第1の領域に第1の開口を有するとともに前記第1の領域よりも厚さの大きい第2の領域に第2の開口を有し、更に、前記第1の領域と前記第2の領域との間に中間領域を有したマスクと、
基板が前記第1の領域に接触した状態で前記第1の開口にペーストを充填し、前記基板が前記第2の領域に接触した状態で前記第2の開口にペーストを充填する印刷ヘッドと、
前記基板を保持するとともに、前記基板を前記第1の領域又は前記第2の領域に接触させる基板保持部とを備え、
前記印刷ヘッドは、前記基板が前記第1の領域に接触した状態で前記中間領域に当接した後、第1の領域の前記中間領域とは反対側の領域まで移動し、更に前記中間領域まで移動することによって前記基板に対する1次印刷を行い、前記基板が前記マスクから版離れした後、前記第2の領域に接触した状態で前記中間領域から前記第2の領域の前記中間領域とは反対側の領域まで移動し、更に前記中間領域まで移動することによって前記基板に対する2次印刷を行うようになっており、前記1次印刷の終了後、前記中間領域に当接したまま前記2次印刷を開始し、
前記基板保持部は、前記1次印刷の後に前記第1の領域に接触している基板を版離れさせ、前記第2の領域に接触させることを特徴とするスクリーン印刷装置。
The first region has a first opening and has a second opening in a second region having a thickness larger than that of the first region. Further, the first region, the second region, A mask having an intermediate region between,
A print head that fills the first opening with a substrate in contact with the first region, and fills the second opening with the substrate in contact with the second region;
A substrate holding unit for holding the substrate and bringing the substrate into contact with the first region or the second region;
The print head contacts the intermediate region in a state where the substrate is in contact with the first region, and then moves to a region opposite to the intermediate region of the first region, and further to the intermediate region. The primary printing is performed on the substrate by moving, and after the substrate is released from the mask, the intermediate region is opposite to the intermediate region from the intermediate region in contact with the second region. The secondary printing is performed on the substrate by moving to the intermediate area and further to the intermediate area, and after the primary printing is finished, the secondary printing remains in contact with the intermediate area. Start
The screen printing apparatus, wherein the substrate holding unit separates the substrate in contact with the first region after the primary printing and contacts the second region.
前記印刷ヘッドは前記マスク上を摺動して前記第1の開口及び前記第2の開口にペーストを充填するスキージを備えたことを特徴とする請求項7に記載のスクリーン印刷装置。   The screen printing apparatus according to claim 7, wherein the print head includes a squeegee that slides on the mask and fills the first opening and the second opening with paste. 前記第1の領域の下面高さと前記第2の領域の下面高さは等しいことを特徴とする請求項7又は8に記載のスクリーン印刷装置。   9. The screen printing apparatus according to claim 7, wherein a lower surface height of the first region is equal to a lower surface height of the second region. 前記中間領域は、前記第1の領域の上面と前記第2の領域の上面を接続する傾斜面を備えたことを特徴とする請求項9に記載のスクリーン印刷装置。   The screen printing apparatus according to claim 9, wherein the intermediate region includes an inclined surface that connects an upper surface of the first region and an upper surface of the second region. 前記第1の領域の上面高さと前記第2の領域の上面高さは等しいことを特徴とする請求項7〜10のいずれかに記載のスクリーン印刷装置。   11. The screen printing apparatus according to claim 7, wherein an upper surface height of the first region is equal to an upper surface height of the second region. 前記請求項7〜11のいずれかに記載のスクリーン印刷装置と、前記スクリーン印刷装置によりペーストが印刷された基板に部品を装着する部品実装装置とを備えたことを特徴とする部品実装ライン。   12. A component mounting line comprising: the screen printing apparatus according to claim 7; and a component mounting apparatus for mounting a component on a substrate on which a paste is printed by the screen printing apparatus.
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