JP2014188712A - Method for manufacturing a printed matter, method for manufacturing an electronic component-packaged structure, mask, and electronic component-packaged structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed matter wherein a pasty material is printed at multiple positions of a printing target at thicknesses corresponding respectively to multiple thicknesses of a mask.SOLUTION: The printing target 11 includes a printing target surface 12 including a lower-stage printing target surface 12a and an upper-stage printing target surface 12b bordered via a step portion 13. The mask 14 includes: a stepped surface 16 including an upper-stage surface 16a and a lower-stage surface 16b bordered via a step portion 15 corresponding to the step portion 13; a flat surface 17; and first second and holes 18 and 19. The mask 14 is positioned atop the printing target 11 in such a way that the upper-stage surface 16a will be contacted with the lower-stage printing target surface 12a and that the lower-stage surface 16b will be contacted with the upper-stage printing target surface 12b. A pasty material 20 is supplied onto the flat surface 17. The pasty material 20 becomes filled into the first and second holes 18 and 19 by mobilizing a squeegee 21 atop the flat surface 17. The mask 14 is subsequently released from the printing target 11.

Description

  The present invention relates to a method of manufacturing a printed material in which a paste-like material is printed on a substrate, a structure in which an electronic component is mounted on a circuit board on which the paste-like material is printed (hereinafter referred to as “electronic component mounting”). The present invention relates to a method of manufacturing a “structure”. The present invention also relates to a mask used in a printed material manufacturing method and an electronic component mounting structure manufacturing method, and an electronic component mounting structure including a conductive bonding material printed using the mask.

  A screen printing method is known in which a paste-like material is printed on a substrate. In the screen printing method, first, a mask is arranged on a printing surface of a printing material. The mask includes a first surface in contact with the printing medium, a second surface located on the opposite side of the first surface, and a hole penetrating between the first surface and the second surface. Have.

  The paste-like material is supplied onto the second surface of the mask when the mask is disposed on the substrate. Subsequently, the squeegee moves on the second surface so as to rub the second surface of the mask, and the paste material is filled in the holes of the mask.

  Thereafter, the mask is separated from the substrate to be printed, and the paste-like material filled in the holes of the mask remains on the surface to be printed. As a result, the paste-like material is printed at a desired position on the printing surface with a thickness corresponding to the thickness of the mask (referred to as a dimension between the first and second surfaces).

  A method of manufacturing an electronic component mounting structure using such a screen printing method has been proposed (for example, Patent Document 1).

  In the method for manufacturing an electronic component mounting structure disclosed in Patent Document 1, paste solder is printed using a mask and a squeegee at a desired position on a circuit board as a substrate to be printed. Thereafter, solder on the circuit board is welded to the electrodes of the electronic component. As a result, the electronic component is fixed to the circuit board using solder, and the electrodes of the electronic component are electrically connected to the conductor pattern of the circuit board via the solder.

  Incidentally, in recent years, electronic parts have been diversified, and electronic parts of various sizes have been proposed. And the electronic component mounting structure by which several electronic components are mounted in one board | substrate is proposed (for example, patent document 2).

  When the size of the electronic component is different, the size of the electrode of each electronic component is often different. In such a case, it is desirable that the paste-like solder printed on the circuit board has a thickness corresponding to the size of each electrode (which means a dimension in a direction intersecting with the printed surface).

  For example, if the thickness of the paste-like solder is too large with respect to the size of the electrode, the paste-like material protrudes from the electrode, and the solder adheres to a part of the electronic component other than the electrode. If the solder adheres to parts other than the electrodes of the electronic component, a short circuit may occur and the electronic component may be damaged.

  If the thickness of the paste-like solder is too thin with respect to the size of the electrodes, the bonding strength between the electronic component and the circuit board is insufficient, and the electronic component is easily detached from the circuit board. In addition, the solder surface that contacts the electrode of the electronic component or the solder surface that contacts the circuit board may not be secured sufficiently, and the electrical resistance value between the electrode of the electronic component and the circuit board may increase.

  For these reasons, there is a demand for a method for manufacturing a printed material in which paste-like materials such as solder are printed at different thicknesses on a plurality of positions of a printed substrate such as a circuit board.

  A related printed material manufacturing method will be described with reference to FIGS. FIG. 6 is a cross-sectional view of a printing medium and a mask used in the related printed material manufacturing method, and FIG. 7 is a cross-sectional view for explaining the related printed material manufacturing method.

  As shown in FIG. 6, the printing surface 2 of the printing material 1 has a flat shape. The mask 3 includes a first surface 4, a second surface 5 that is located on the opposite side of the first surface 4, and a first that penetrates between the first surface 4 and the second surface 5. And second holes 6 and 7.

  The first surface 4 has a flat shape corresponding to the printing surface 2. A step portion 8 is formed on the second surface 5, and the second surface 5 is divided into an upper step surface 5 a and a lower step surface 5 b with the step portion 8 as a boundary. The first hole 6 penetrates between the first surface 4 and the upper step surface 5a, and the second hole 7 penetrates between the first surface 4 and the lower step surface 5b.

  As shown in FIG. 7, first, the mask 3 is disposed on the printing medium 1 so that the first surface 4 is in contact with the printing surface 2, and the paste-like material 9 is supplied onto the second surface 5. The Subsequently, the squeegee 10 moves so as to rub the second surface 5, and the paste-like material 9 is filled in the first and second holes 6 and 7.

  Thereafter, the mask 3 is separated from the printing medium 1, and the paste-like material 9 filled in the first and second holes 6 and 7 remains on the printing surface 2. Since the second hole 7 is shallower than the first hole 6, the paste-like material 9 filled in the second hole 7 is thinner than the paste-like material 9 filled in the first hole 6. Become.

JP 2003-2111862 A JP 2002-321337 A

  6 and 7, the squeegee 10 moves along the thickness direction X of the mask 3 around the step portion 8. FIG. 8 is a view for explaining a moving route of the squeegee 10. In FIG. 8, the movement path of the squeegee 10 is indicated by a dotted line. FIG. 9 is a cross-sectional view of the printed material when the squeegee 10 moves along the movement path shown in FIG.

  As shown in FIG. 8, since the squeegee 10 is separated from the second surface 5 around the step portion 8, the pasty material 9 is separated from the second surface 5 together with the squeegee 10. As a result, the first and second holes 6 and 7 may not be filled with the paste-like material 9, and a paste-like material insufficient portion 9a may be formed (see FIG. 9). That is, the paste-like material 9 may not be printed on the substrate 1 with a thickness corresponding to the thickness of the mask 3.

  Accordingly, an example of the object of the present invention is to provide a method for producing a printed material in which a paste-like material is printed at a plurality of positions on a substrate to be printed at a thickness corresponding to a plurality of thicknesses of a mask.

  Another example of the object of the present invention is to provide a mask capable of printing a paste-like material with different desired thicknesses at a plurality of positions on a printing surface.

  In order to achieve the above object, one aspect of the present invention is a method for producing a printed material, comprising: preparing a paste-like material, a printing material, a mask, and a squeegee; and placing the mask on the printing material. An arranging step of arranging, a supplying step of supplying a paste-like material on the mask, a moving step of moving the squeegee on the mask, and a separating step of separating the mask from the printing medium. The printing medium prepared in the preparation step includes a printing surface having at least one step portion, and includes a lower printing surface and an upper printing surface separated from each other by the printing surface. The mask has a stepped portion corresponding to the stepped portion of the printing surface, and has a stepped surface including an upper stepped surface and a lower stepped surface separated by the stepped portion, and is located on the side opposite to the stepped surface. A flat surface, a first hole penetrating between the upper surface and the flat surface, and a second hole penetrating between the lower surface and the flat surface. In the arranging step, the mask is arranged on the printing medium such that the upper surface is in contact with the lower printing surface and the lower surface is in contact with the upper printing surface. In the supplying step, the paste-like material is supplied on the flat surface. In the moving process, the squeegee moves on the flat surface, and as a result, the pasty material is filled into the first and second holes.

  Another aspect of the present invention relates to a mask used for printing a paste-like material using a squeegee on a printing surface having at least one step. The mask includes a stepped surface, a flat surface, a first hole, and a second hole. The stepped surface has a step portion corresponding to the step portion of the printing surface, and includes an upper step surface and a lower step surface separated by the step portion. The flat surface is located on the side opposite to the stepped surface. The pasty material is supplied on the flat surface, and the squeegee moves on the flat surface. The first hole penetrates between the upper step surface and the flat surface. The second hole penetrates between the lower step surface and the flat surface.

  According to the manufacturing method according to the present invention, a printed material is manufactured in which a paste-like material is printed at a plurality of positions on a substrate to be printed with a thickness corresponding to a plurality of thicknesses of the mask. Moreover, according to the mask which concerns on this invention, a paste-form material can be printed by the desired thickness which differs in several positions of a to-be-printed surface.

It is sectional drawing of the to-be-printed body used by the 1st Embodiment of this invention. It is sectional drawing of the mask used in the 1st Embodiment of this invention. It is sectional drawing for demonstrating the manufacturing method of the printed matter which concerns on the 1st Embodiment of this invention. It is sectional drawing of the electronic component mounting structure manufactured by using the 2nd Embodiment of this invention. It is sectional drawing of the circuit board shown in FIG. It is sectional drawing of the to-be-printed body and mask used with the related printed matter manufacturing method. It is sectional drawing for demonstrating the related printed matter manufacturing method. It is a figure for demonstrating the movement path | route of the squeegee in the printed matter manufacturing method shown by FIG. It is sectional drawing of printed matter when a squeegee moves along the movement path | route shown by FIG.

  Hereinafter, a printed material manufacturing method and an electronic component mounting structure manufacturing method according to the present invention will be described in detail with reference to the drawings.

(First embodiment)
First, a method for producing a printed material according to the present invention will be described using FIGS. In the manufacturing method according to this embodiment, first, a paste-like material, a printing medium, a mask, and a squeegee are prepared.

  FIG. 1 is a cross-sectional view of a printing medium used in this embodiment, and FIG. 2 is a cross-sectional view of a mask used in this embodiment.

  As shown in FIG. 1, the printing medium 11 includes a printing surface 12. A stepped portion 13 is formed on the printed surface 12, and the printed surface 12 includes a lower printed surface 12 a and an upper printed surface 12 b that are divided by the stepped portion 13.

  In the example shown in FIG. 1, the step portion 13 is provided so that the printing medium 11 has a convex portion, but the step portion 13 is not limited to this form. For example, the step portion 13 may be formed by cutting out one corner of a rectangular parallelepiped. Further, the stepped portion 8 may be formed in a stepped shape on the printing surface 12, and the printed surface 12 may be divided into three or more with the stepped stepped portion 8 as a boundary.

  As shown in FIG. 2, the mask 14 includes a stepped surface 16 on which the stepped portion 15 is formed, and a flat surface 17 located on the opposite side of the stepped surface 16. The step portion 15 is formed corresponding to the step portion 13, and the stepped surface 16 includes an upper step surface 16 a and a lower step surface 16 b that are divided by the step portion 15.

  The mask 14 includes first and second holes 18 and 19. The first hole 18 passes between the upper step surface 16 a and the flat surface 17, and the second hole 19 passes between the lower step surface 16 b and the flat surface 17.

  FIGS. 3A to 3C are cross-sectional views for explaining the method for manufacturing a printed material according to the first embodiment. As shown in FIG. 3A, the mask 14 is disposed on the printing medium 11. At this time, the upper stage surface 16a is in contact with the lower stage printing surface 12a, and the lower stage surface 16b is in contact with the upper stage printing surface 12b.

  Subsequently, as illustrated in FIG. 3B, the paste-like material 20 is supplied onto the flat surface 17. Then, the squeegee 21 moves on the flat surface 17, and the paste material 20 is filled into the first and second holes 18 and 19.

  Thereafter, as shown in FIG. 3C, the mask 14 is separated from the printing medium 11. The paste-like material 20 filled in the first and second holes 18 and 19 remains on the lower printing surface 12a and the upper printing surface 12b, thereby completing the printed matter.

  According to this embodiment, since the squeegee 21 moves on the flat surface 17, the squeegee 21 does not move in the thickness direction X of the mask 3. Therefore, the squeegee 21 does not leave the flat surface 17 when the paste material 20 is filled in the first and second holes 18 and 19. Therefore, the paste-like material 20 does not protrude from the first and second holes 18 and 19, and the first and second holes 18 and 19 are sufficiently filled with the paste-like material 20. As a result, the paste-like material 20 is printed on the substrate 11 with a thickness corresponding to the thickness of the mask 14.

  In particular, in the printed matter manufacturing method shown in FIGS. 6 and 7, the paste-like material deficient portion 9 a (see FIG. 9) is more likely to be formed as the first hole 6 and the second hole 7 are closer to the stepped portion 8. Therefore, the 1st hole 6 and the 2nd hole 7 cannot fully approach the step part 8, and paste-like materials from which thickness differs cannot mutually approach.

  According to this embodiment shown in FIG. 3, the squeegee 21 does not move in the thickness direction X of the mask 14, and the squeegee 21 does not move away from the flat surface 17. Therefore, the first hole 18 and the second hole 19 can be sufficiently brought close to the step portion 15 (see FIG. 2), and paste materials having different thicknesses can be made closer to each other.

  Further, when the squeegee moves on the surface on which the step portion is formed, the squeegee may hit the step portion and damage the squeegee. According to this embodiment, the squeegee 21 does not hit the mask 14 because it moves on the flat surface 17. As a result, the squeegee 21 is not easily damaged and the life of the squeegee 21 is extended.

(Second Embodiment)
Next, the manufacturing method of the electronic component mounting structure according to the present invention will be described with reference to FIGS.

  FIG. 4 is a cross-sectional view of an electronic component mounting structure manufactured using this embodiment. As shown in FIG. 4, the electronic component mounting structure 22 includes a circuit board 23 and first and second electronic components 24 and 25 mounted on the circuit board 23.

  First and second solders 26 a and 26 b as conductive bonding materials are printed on the printed surface 27 of the circuit board 23. The first and second electronic components 24 and 25 are mounted on the circuit board 23 via first and second solders 26a and 26b.

  FIG. 5 is a cross-sectional view of the circuit board 23 shown in FIG.

  As shown in FIG. 5, the circuit board 23 includes a board body 28, first and second conductor patterns 29a and 29b formed on the board body 28, and first and second conductor patterns 29a and 29b. And a protective layer (also referred to as “solder resist”) 30 for protecting a part thereof. And the to-be-printed surface 27 is formed with the protective layer 30 and the part which is not covered with the protective layer 30 among the 1st and 2nd conductor patterns 29a and 29b.

  A step 31 is formed on the printing surface 27, and the printing surface 27 includes a lower printing surface 27 a and an upper printing surface 27 b that are separated by the step 31. A first conductor pattern 29a is formed on the lower printing surface 27a, and a second conductor pattern 29b is formed on the upper printing surface 27b.

  The first and second conductor patterns 29 a and 29 b are electrically connected to each other through an interlayer conductor (also referred to as “via”) 32. Of course, the first and second conductor patterns 29a and 29b may be electrically connected to each other using other means, for example, a conductive wire passed through a hole extending from the upper printing surface 27b to the lower printing surface 27a. Good.

  As shown in FIGS. 4 and 5, the first solder 26a is printed on the lower printing surface 27a, and the first electronic component 24 is mounted on the circuit board 23 using the first solder 26a. . Specifically, the first electronic component 24 has a first electrode 33, and the first solder 26 a is fixed to the first electrode 33. That is, the first electronic component 24 is fixed to the lower printing surface 27a through the first solder 26a, and the first electrode 33 is electrically connected to the first conductor pattern 29a.

  The second solder 26b is printed on the upper printed surface 27b, and the second electronic component 25 is mounted on the circuit board 23 using the second solder 26b. Similar to the first electronic component 24, the second electronic component 25 has a second electrode 34, and a second solder 26 b is fixed to the second electrode 34. That is, the second electronic component 25 is fixed to the upper printing surface 27b and the second electrode 34 is electrically connected to the second conductor pattern 29b via the second solder 26b.

  In the example shown in FIG. 4, the second electrode 34 is smaller than the first electrode 33. In such a case, it is preferable that the thickness of the second solder 26b (refers to the dimension in the direction Y intersecting the printing surface 27; hereinafter the same) is smaller than the thickness of the first solder 26a.

  When the thickness of the second solder 26 b is equal to or greater than the thickness of the first solder 26 a, the second solder 26 b may protrude from the second electrode 34 when the second electronic component 25 is mounted on the circuit board 23. . As a result, there is a possibility that the second solder 26b adheres to a part other than the second electrode 34, for example, the main body of the second electronic component 25, and the second electronic component 25 is damaged.

  By making the thickness of the second solder 26 b smaller than the thickness of the first solder 26 a, the second solder 26 b is difficult to protrude from the second electrode 34. As a result, the second solder 26b is unlikely to adhere to parts other than the second electrode 34, and the second electronic component 25 is less likely to be damaged.

  In the example shown in FIG. 4, the first electronic component 24 has a plurality of first electrodes 33, and the second electronic component 25 has a plurality of second electrodes 34. The first solder 26 a is printed at a plurality of positions on the lower printing surface 27 a corresponding to the positions of the plurality of first electrodes 33, and the second solder 26 b is formed on the plurality of second electrodes 34. It is printed at a plurality of positions on the lower printing surface 27a corresponding to the positions.

  The interval between the second electrodes 34 is narrower than the interval between the first electrodes 33. In this case, the cross section of the second solder 26b is preferably smaller than the cross section of the first solder 26a. Note that “the cross section of the second solder 26 b” and “the cross section of the first solder 26 a” are cut when the second solder 26 b and the first solder 26 a are cut along a virtual surface along the printed surface 27. Say the face.

  When the cross section of the second solder 26b is relatively large, when the second electronic component 25 is mounted on the circuit board 23, the second solder 26b spreads in the lateral direction (refers to the direction along the upper printing surface 27b). Cheap. As a result, the adjacent second solders 26b may come into contact with each other and a short circuit may occur.

  By making the cross section of the second solder 26b smaller than the cross section of the first solder 26a, the adjacent second solders 26b are less likely to contact each other. As a result, a short circuit is less likely to occur and the second electronic component 25 is less likely to be damaged.

  Furthermore, in the example shown in FIG. 4, the dimension of the second electronic component 25 is smaller than the dimension of the first electronic component 24 in the direction Y. Therefore, the dimension in the direction Y of the electronic component mounting structure 22 can be further reduced.

  The first electronic component 24 is, for example, a chip component having a dimension larger than 0.6 mm × 0.3 mm, or a BGA (Ball Grid Array) or QFP (Quad Flat) in which the distance between adjacent electrodes is larger than 0.4 mm. Package). The second electronic component 25 is, for example, a chip component having a dimension of 0.6 mm × 0.3 mm or less, or a BGA or QFP in which an interval between adjacent electrodes is 0.4 mm or less. Of course, the first and second electronic components 24 and 25 are not limited to such components.

  Then, the manufacturing method of the electronic component mounting structure 22 is demonstrated. First, the first and second solders 26 a and 26 b are printed on the circuit board 23. By using the printed material manufacturing method described in the first embodiment, a printed material in which the first and second solders 26a and 26b are printed on the circuit board 23 is completed.

  Specifically, paste solder is used as the paste material 20 (see FIG. 3B), and the circuit board 23 is used as the substrate 11 (see FIG. 3). At this time, the mask 14 having the step portion 15 (see FIG. 2) corresponding to the step portion 31 of the circuit board 23 is used.

  The process until the first and second solders 26a and 26b are printed on the circuit board 23 is substantially the same as the contents described in the first embodiment, and thus the description thereof is omitted here.

  When the paste-like first and second solders 26 a and 26 b are printed on the circuit board 23, the first and second electronic components 24 and 25 are arranged on the circuit board 23. Specifically, the first electrode 33 is embedded in the paste-like first solder 26a, and the second electrode 34 is embedded in the paste-like second solder 26b.

  Thereafter, the first and second solders 26a and 26b are cooled by applying heat to the paste-like first and second solders 26a and 26b to cool the paste-like first and second solders 26a and 26b. The first and second electrodes 33 and 34 are fixed. As a result, the first and second electronic components 24 and 25 are mounted on the circuit board 23.

  According to the present embodiment, the paste-like first and second solders 26 a and 26 b are printed on the circuit board 23 with a thickness corresponding to the thickness of the mask 14. That is, the thickness of the second solder 26b can be made smaller than the thickness of the first solder 26a, and solder shortage can be suppressed.

  By suppressing the solder shortage, the bonding strength between the first electronic component 24 and the circuit board 23 and the bonding strength between the second electronic component 25 and the circuit board 23 are sufficiently ensured. In addition, it is possible to sufficiently ensure a solder surface that contacts the first electrode 33 and a solder surface that contacts the second electrode 34. As a result, an increase in the electrical resistance value between the first electronic component 24 and the circuit board 23 and the increase in the battery resistance value between the second electronic component 25 and the circuit board 23 can be suppressed.

  In this way, by suppressing the shortage of solder, the electronic component mounting structure 22 with higher reliability can be obtained.

  Further, according to the present embodiment, the squeegee 21 does not move in the thickness direction X of the mask 14, and the squeegee 21 does not move away from the flat surface 17. Therefore, the first hole 18 and the second hole 19 can be sufficiently brought close to the step portion 15 (see FIG. 2), and the first and second solders 26a and 26b can be made closer.

  By printing the first and second solders 26a and 26b closer to each other, the first and second electronic components 24 and 25 can be arranged closer to each other. As a result, the electronic component mounting structure 22 can be made smaller.

  When the interval between the second electrodes 34 is narrower than the interval between the first electrodes 33, the cross section of the second hole 19 is preferably smaller than the cross section of the first hole 18. By doing so, the cross section of the second solder 26b becomes smaller than the cross section of the first solder 26a. As a result, when the second electronic component 25 is mounted on the circuit board 23, the second solder 26b does not easily spread in the lateral direction, and the adjacent second solders 26b do not easily contact each other. Therefore, a short circuit does not easily occur and the second electronic component 25 is not easily damaged.

  The “cross section of the second hole 19” and the “cross section of the first hole 18” are cut surfaces when the second hole 19 and the first hole 18 are cut along a virtual plane along the flat surface 17. Say.

  When the dimension of the second electronic component 25 is smaller than the dimension of the first electronic component 24 in the direction Y, the first electronic component 24 is arranged on the lower printing surface 27a and the second electronic component 25 is placed on the upper packaging. It is desirable to arrange on the printing surface 27b. By doing in this way, the dimension in the direction Y of the electronic component mounting structure 22 can be made smaller.

  A part or all of the above embodiment can be described as in the following supplementary notes, but is not limited to the following.

(Appendix 1)
A method of manufacturing a printed material,
Paste-like material;
A printing medium including a printing surface having at least one step portion, and the printing surface includes a lower printing surface and an upper printing surface separated by the step portion;
A stepped surface including a stepped portion corresponding to the stepped portion of the printing surface and including an upper stepped surface and a lower stepped surface separated by the stepped portion, and a flat surface located on the opposite side of the stepped surface A mask including: a first hole penetrating between the upper step surface and the flat surface; and a second hole penetrating between the lower step surface and the flat surface;
With squeegee,
The process of preparing
Disposing the mask on the printing medium such that the upper surface is in contact with the lower printing surface and the lower surface is in contact with the upper printing surface;
Supplying the paste-like material on the flat surface;
Moving the squeegee on the flat surface to fill the first and second holes with the paste-like material;
Separating the mask from the substrate to be printed.

(Appendix 2)
A method of manufacturing an electronic component mounting structure,
First and second electronic components;
In the manufacturing method according to appendix 1, a printed material manufactured using a paste-like conductive bonding material as the paste-like material and using a circuit board as the printed body;
The process of preparing
The first electronic component is mounted on the circuit board via the paste conductive bonding material printed on the lower printing surface, and the paste conductive printed on the upper printing surface. A mounting step of mounting the second electronic component on the circuit board via a conductive bonding material.

(Appendix 3)
The first electronic component has a first electrode, and the second electronic component has a second electrode smaller than the first electrode;
In the mounting step, the first electrode is attached to the paste-like conductive bonding material printed on the lower printing surface and the paste-like conductive bonding printed on the upper printing surface. The manufacturing method according to appendix 2, wherein the second electrode is attached to a material.

(Appendix 4)
The first electronic component has a plurality of the first electrodes, and the second electronic component has a plurality of the second electrodes;
An interval between the second electrodes is narrower than an interval between the first electrodes;
The manufacturing method according to appendix 3, wherein a cross section of the second hole in the virtual plane along the flat surface is smaller than a cross section of the first hole in the virtual plane.

(Appendix 5)
Regarding the direction intersecting the printing surface, the second electronic component is smaller than the first electronic component,
In the mounting step, the first electronic component is disposed on the lower printing surface, and the second electronic component is disposed on the upper printing surface, according to any one of appendices 2 to 4. Production method.

(Appendix 6)
A mask used for printing a paste-like material using a squeegee on a printing surface having at least one step,
A stepped surface having a stepped portion corresponding to the stepped portion of the printed surface, and including an upper stepped surface and a lower stepped surface separated by the stepped portion;
A flat surface on the opposite side of the stepped surface to which the paste-like material is supplied and the squeegee moves;
A first hole penetrating between the upper surface and the flat surface;
And a second hole penetrating between the lower surface and the flat surface.

(Appendix 7)
The mask according to appendix 6, wherein a cross section of the second hole in the virtual plane along the flat surface is smaller than a cross section of the first hole in the virtual plane.

(Appendix 8)
A circuit board including a printed surface having at least one step portion, the printed surface including a lower printed surface and an upper printed surface separated by the step portion;
First and second conductive bonding materials printed on the lower printing surface and the upper printing surface, respectively, using the mask according to appendix 6 or 7,
A first electronic component mounted on the circuit board via the first conductive bonding material;
An electronic component mounting structure comprising: a second electronic component that is smaller than the first electronic component and is mounted on the circuit board via the second conductive bonding material.

(Appendix 9)
The first electronic component has a first electrode, and the second electronic component has a second electrode smaller than the first electrode;
The first electrode is attached to the first conductive bonding material;
The electronic component mounting structure according to appendix 8, wherein the second electrode is attached to the second conductive bonding material.

(Appendix 10)
The first electronic component has a plurality of the first electrodes, and the second electronic component has a plurality of the second electrodes;
An interval between the second electrodes is narrower than an interval between the first electrodes;
The electronic component mounting structure according to appendix 9, wherein a cross section of the second conductive bonding material on a virtual surface along the printed surface is smaller than a cross section of the first conductive bonding material on the virtual surface.

(Appendix 11)
Regarding the direction intersecting the printing surface, the second electronic component is smaller than the first electronic component,
The first electronic component is disposed on the lower printing surface;
The electronic component mounting structure according to any one of appendices 8 to 10, wherein the second electronic component is disposed on the upper printed surface.

11 Printed body 12 Printed surface 12a Lower printed surface 12b Upper printed surface 13 Stepped portion 14 Mask 15 Stepped portion 16 Stepped surface 16a Upper stepped surface 16b Lower stepped surface 17 Flat surface 18 First hole 19 Second hole 20 Paste material 21 Squeegee 22 Electronic component mounting structure 23 Circuit board 24 First electronic component 25 Second electronic component 26a First solder 26b Second solder 27 Printing surface 27a Lower printing surface 27b Upper printing surface 28 substrate body 29a first conductor pattern 29b second conductor pattern 30 protective layer 31 step 32 interlayer conductor 33 first electrode 34 second electrode

Claims (10)

A method of manufacturing a printed material,
Paste-like material;
A printing medium including a printing surface having at least one step portion, and the printing surface includes a lower printing surface and an upper printing surface separated by the step portion;
A stepped surface including a stepped portion corresponding to the stepped portion of the printing surface and including an upper stepped surface and a lower stepped surface separated by the stepped portion, and a flat surface located on the opposite side of the stepped surface A mask including: a first hole penetrating between the upper step surface and the flat surface; and a second hole penetrating between the lower step surface and the flat surface;
With squeegee,
The process of preparing
Disposing the mask on the printing medium such that the upper surface is in contact with the lower printing surface and the lower surface is in contact with the upper printing surface;
Supplying the paste-like material on the flat surface;
Moving the squeegee on the flat surface to fill the first and second holes with the paste-like material;
Separating the mask from the substrate to be printed. A method of manufacturing an electronic component mounting structure,
First and second electronic components;
A printed matter manufactured using a circuit board as the substrate to be printed using a paste-like conductive bonding material as the paste material in the manufacturing method according to claim 1;
The process of preparing
The first electronic component is mounted on the circuit board via the paste conductive bonding material printed on the lower printing surface, and the paste conductive printed on the upper printing surface. A mounting step of mounting the second electronic component on the circuit board via a conductive bonding material. The first electronic component has a first electrode, and the second electronic component has a second electrode smaller than the first electrode;
In the mounting step, the first electrode is attached to the paste-like conductive bonding material printed on the lower printing surface and the paste-like conductive bonding printed on the upper printing surface. The manufacturing method according to claim 2, wherein the second electrode is attached to a material. The first electronic component has a plurality of the first electrodes, and the second electronic component has a plurality of the second electrodes;
An interval between the second electrodes is narrower than an interval between the first electrodes;
The manufacturing method according to claim 3, wherein a cross section of the second hole in the virtual plane along the flat surface is smaller than a cross section of the first hole in the virtual plane. Regarding the direction intersecting the printing surface, the second electronic component is smaller than the first electronic component,
The said mounting process WHEREIN: A said 1st electronic component is arrange | positioned on the said lower stage printing surface, and a said 2nd electronic component is arrange | positioned on the said upper stage printing surface. Manufacturing method. A mask used for printing a paste-like material using a squeegee on a printing surface having at least one step,
A stepped surface having a stepped portion corresponding to the stepped portion of the printed surface, and including an upper stepped surface and a lower stepped surface separated by the stepped portion;
A flat surface on the opposite side of the stepped surface to which the paste-like material is supplied and the squeegee moves;
A first hole penetrating between the upper surface and the flat surface;
And a second hole penetrating between the lower surface and the flat surface.   The mask according to claim 6, wherein a cross section of the second hole in a virtual surface along the flat surface is smaller than a cross section of the first hole in the virtual surface. A circuit board including a printed surface having at least one step portion, the printed surface including a lower printed surface and an upper printed surface separated by the step portion;
First and second conductive bonding materials printed on the lower print surface and the upper print surface, respectively, using the mask according to claim 6 or 7,
A first electronic component mounted on the circuit board via the first conductive bonding material;
An electronic component mounting structure comprising: a second electronic component that is smaller than the first electronic component and is mounted on the circuit board via the second conductive bonding material. The first electronic component has a first electrode, and the second electronic component has a second electrode smaller than the first electrode;
The first electrode is attached to the first conductive bonding material;
The electronic component mounting structure according to claim 8, wherein the second electrode is attached to the second conductive bonding material. The first electronic component has a plurality of the first electrodes, and the second electronic component has a plurality of the second electrodes;
An interval between the second electrodes is narrower than an interval between the first electrodes;
The electronic component mounting structure according to claim 9, wherein a cross section of the second conductive bonding material on a virtual surface along the printed surface is smaller than a cross section of the first conductive bonding material on the virtual surface.