JP7426614B2 - printing device - Google Patents

Description

The present disclosure relates to printing devices.

Patent Document 1 discloses a printing device that uses a syringe to supply solder to an area outside the opening area of a mask, fills the opening of the mask with the supplied solder using a squeegee, and prints the solder on a substrate. is disclosed.

Japanese Patent Application Publication No. 2009-226776

When a printing device uses solder paste to print on a board, the solder paste left over from printing on a board of a certain model is collected by a recovery device and reused for printing on boards of other models to be produced next. Ru. The collection device moves to the position of the solder paste remaining at the print end position and collects the solder paste. However, if the print end position is outside the movable area of the collection device, the collection device moves to the position of the solder paste remaining at the printing end position and collects the solder paste. It is not possible to move to the position and collect the solder paste.

The present disclosure was devised in view of the conventional circumstances described above, and an object of the present disclosure is to provide a printing device that can appropriately collect solder paste regardless of the printing end position.

The present disclosure is a printing device that prints solder paste on a board using a mask, the squeegee sliding on the mask and printing the solder paste on the board through an opening provided in the mask. a collection device that collects the solder paste scraped up to the print end position by the squeegee; a positioning unit that positions the mask at the printing position; and a positioning unit that uses the positioning unit to move the mask toward the collection device. Provided is a printing device having a control unit that controls the printing process.

According to the present disclosure, solder paste can be appropriately collected regardless of the printing end position.

A perspective view of a screen printing device according to an embodiment of the present disclosure A side view of a screen printing device according to an embodiment of the present disclosure A partial perspective view of a screen printing device according to an embodiment of the present disclosure A partial plan view of a screen printing device according to an embodiment of the present disclosure A side view of a squeegee head included in a screen printing apparatus according to an embodiment of the present disclosure A block diagram showing a control system of a screen printing device according to an embodiment of the present disclosure An explanatory diagram showing a first example of a solder paste collection operation and a supply operation performed by a screen printing apparatus according to an embodiment of the present disclosure An explanatory diagram showing a first example of a solder paste collection operation and a supply operation performed by a screen printing apparatus according to an embodiment of the present disclosure An explanatory diagram showing a first example of a solder paste collection operation and a supply operation performed by a screen printing apparatus according to an embodiment of the present disclosure An explanatory diagram showing a first example of a solder paste collection operation and a supply operation performed by a screen printing apparatus according to an embodiment of the present disclosure An explanatory diagram showing a first example of a solder paste collection operation and a supply operation performed by a screen printing apparatus according to an embodiment of the present disclosure An explanatory diagram showing a first example of a solder paste collection operation and a supply operation performed by a screen printing apparatus according to an embodiment of the present disclosure An explanatory diagram showing a second example of a solder paste collection operation and a supply operation performed by a screen printing apparatus according to an embodiment of the present disclosure An explanatory diagram showing a second example of a solder paste collection operation and a supply operation performed by a screen printing apparatus according to an embodiment of the present disclosure An explanatory diagram showing a second example of a solder paste collection operation and a supply operation performed by a screen printing apparatus according to an embodiment of the present disclosure An explanatory diagram showing a second example of a solder paste collection operation and a supply operation performed by a screen printing apparatus according to an embodiment of the present disclosure An explanatory diagram showing a third example of a solder paste collection operation and a supply operation performed by a screen printing apparatus according to an embodiment of the present disclosure An explanatory diagram showing a third example of a solder paste collection operation and a supply operation performed by a screen printing apparatus according to an embodiment of the present disclosure An explanatory diagram showing a third example of a solder paste collection operation and a supply operation performed by a screen printing apparatus according to an embodiment of the present disclosure An explanatory diagram showing a third example of a solder paste collection operation and a supply operation performed by a screen printing apparatus according to an embodiment of the present disclosure An explanatory diagram showing a third example of a solder paste collection operation and a supply operation performed by a screen printing apparatus according to an embodiment of the present disclosure An explanatory diagram showing a fourth example of a solder paste collection operation and a supply operation performed by a screen printing apparatus according to an embodiment of the present disclosure An explanatory diagram showing a fourth example of a solder paste collection operation and a supply operation performed by a screen printing apparatus according to an embodiment of the present disclosure An explanatory diagram showing a fourth example of a solder paste collection operation and a supply operation performed by a screen printing apparatus according to an embodiment of the present disclosure An explanatory diagram showing a fourth example of a solder paste collection operation and a supply operation performed by a screen printing apparatus according to an embodiment of the present disclosure

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments specifically disclosing the configuration and operation of a printing apparatus according to the present disclosure will be described in detail with reference to the drawings as appropriate. However, more detailed explanation than necessary may be omitted. For example, detailed explanations of well-known matters or redundant explanations of substantially the same configurations may be omitted. This is to avoid unnecessary redundancy in the following description and to facilitate understanding by those skilled in the art. The accompanying drawings and the following description are provided to enable those skilled in the art to fully understand the present disclosure, and are not intended to limit the subject matter recited in the claims.

FIG. 1 is a perspective view of a screen printing apparatus 1 according to an embodiment of the present disclosure. FIG. 2 is a side view of the screen printing apparatus 1 in an embodiment of the present disclosure. FIG. 3 is a partial perspective view of the screen printing apparatus 1 in an embodiment of the present disclosure. FIG. 4 is a partial plan view of the screen printing apparatus 1 according to an embodiment of the present disclosure.

A screen printing device 1, which is an example of a printing device, receives a board 2 (an example of a circuit board) inputted from an upstream process side, and screen prints paste Pst (an example of a solder paste) on each electrode 2d of the board 2. , a screen printing operation is repeatedly performed to be transferred to a device on the downstream side (for example, a component mounting device not shown). In the following embodiments, for convenience of explanation, the left-right direction as seen from a worker (an example of an operator) is the X-axis direction, and the left side is the upstream process side and the right side is the downstream process side. Further, the front and back direction with the worker OP in front and the direction away from the worker OP as the back is the Y-axis direction, and the up-down direction is the Z-axis direction.

1 and 2, the screen printing apparatus 1 includes a substrate holding and moving mechanism 12 on a base 11, and a screen mask 13 is provided above the substrate holding and moving mechanism 12.

As shown in FIGS. 3 and 4, on the left side of the substrate holding and moving mechanism 12, there is a carry-in conveyor 14 that receives the substrate 2 inputted from the upstream process side of the screen printing apparatus 1 and conveys it to the substrate holding and moving mechanism 12. It is provided. Further, on the right side of the substrate holding and moving mechanism 12, there is provided a carry-out conveyor 15 that receives the substrate 2 from the substrate holding and moving mechanism 12 and conveys it to the downstream process side. A camera 16 is movably provided in an area below the screen mask 13, and a squeegee head 17 is movably provided in an area above the screen mask 13.

In FIGS. 2 and 3, the substrate holding and moving mechanism 12 as an example of a table includes a substrate holding section 21 and a moving table section 22. As shown in FIG. The substrate holding section 21 includes a positioning conveyor 31 (see FIG. 4), a lower receiving section 32, and a pair of front and rear clampers 33 (see FIG. 4). The positioning conveyor 31 positions the substrate 2 received from the carry-in conveyor 14 at a predetermined clamping position. The lower receiving part 32 supports the substrate 2 positioned at the clamp position by the positioning conveyor 31 from below, and the clamper 33 clamps and holds the substrate 2 from the side (Y-axis direction). Of the two clampers 33 that the board holding section 21 has, the one located on the side of the operator OP is referred to as a front clamper 33F, and the one located on the side opposite to the operator OP is referred to as a rear clamper 33R. The moving table section 22 is composed of an XYθ table mechanism in which a plurality of table mechanisms are stacked in multiple stages, and moves the substrate holding section 21 in the horizontal plane and in the vertical direction.

In FIGS. 1 and 2, a screen mask 13 as an example of a mask includes a rectangular flat metal member extending in the XY plane. In FIG. 4, the rectangular area at the center of the screen mask 13 is a substrate contact area R where the lower surface is in contact with the substrate 2. In the substrate contact region R, pattern openings (an example of openings) 13h are provided corresponding to the arrangement of the electrodes 2d on the substrate 2. The outer periphery of the screen mask 13 is supported by a frame member 13W. An L-shaped rail-shaped mask support section 19 that supports the screen mask 13 is provided above the substrate holding and moving mechanism 12 to face the screen mask 13 . The screen mask 13 is supported by mask support portions 19 at both ends of the frame member 13W in the front-rear direction (Y-axis direction), and is arranged to be movable in the left-right direction (Y-axis direction).

In FIG. 2, the camera 16 has an upper imaging section 16a whose imaging field of view is directed upward, and a lower imaging section 16b whose imaging field of view is directed downward. The camera 16 is driven by a camera movement mechanism 16K (see FIG. 1) that uses a ball screw mechanism as an actuator to move within the XY plane.

1 and 2, the squeegee head 17 includes a moving base 41, two squeegees 42, and two squeegee lifting cylinders 43. The moving base 41 is a member extending in the X-axis direction, and is driven by a print head moving mechanism 17K having a ball screw mechanism as an actuator to move in the Y-axis direction. The two squeegees 42 are disposed on the movable base 41 one behind the other and facing each other, and as the movable base 41 moves in the Y-axis direction, the two squeegees 42 integrally move back and forth in the Y-axis direction. Of the two front and rear squeegees 42, the one located at the front (on the right side of the paper in FIG. 2) is referred to as a front squeegee 42F, and the one located at the rear (on the left side of the paper in FIG. 2) is referred to as a rear squeegee 42R. The two squeegees 42 each consist of a "spatula"-shaped member extending in the X-axis direction, and extend diagonally downward in a downwardly extending attitude. The rear surface of the front squeegee 42F is a paste scraping surface, and the front surface of the rear squeegee 42R is a paste scraping surface.

The two squeegee lifting cylinders 43 are provided on the movable base 41 in correspondence with the two squeegees 42 in the front-rear direction. The two squeegee lifting cylinders 43 operate individually to raise and lower the two squeegees 42 with respect to the moving base 41 independently. Each squeegee lifting cylinder 43 moves the corresponding squeegee 42 to a standby height position where the lower end of the squeegee 42 is spaced a predetermined distance from the upper surface of the screen mask 13 (see squeegee 42 shown in FIG. It can be raised and lowered between the abutting height position and the abutting height position.

In FIG. 2, the screen printing apparatus 1 includes a solder paste recovery device 71 (an example of a recovery device or a recovery/supply device). The solder paste recovery device 71 recovers the paste Pst on the screen mask 13 when one printing operation is completed in the screen printing device 1. Further, when the screen printing apparatus 1 is replaced with a screen mask 13 to be used for the next printing operation, the solder paste recovery device 71 supplies the collected paste Pst onto the replaced screen mask 13.

FIG. 5 is a side view of the squeegee head 17 included in the screen printing apparatus 1 according to an embodiment of the present disclosure. The squeegee head 17 slides on the screen mask 13 and vertically moves a squeegee 42 for printing paste Pst on the substrate 2. The squeegee head 17 is equipped with a mask automatic positioning unit (an example of a positioning unit) 91 for positioning the screen mask 13 using a movement mechanism for the squeegee head 17 to slide on the screen mask 13. ing. The screen mask 13 is framed by a rectangular frame member 13W. The mask automatic positioning unit 91 moves the screen mask 13 using the frame member 13W of the screen mask 13, and positions the screen mask 13.

At this time, the mask automatic positioning unit 91 mounted on the squeegee head 17 moves further rearward than the frame member 13W. This movement position of the squeegee head 17 is the rearmost movement position. When adding a new solder paste recovery device 71 to the screen printing device 1, it is desirable to mount the solder paste recovery device 71 on the squeegee head 17 that moves over the screen mask 13 because it can also serve as a moving mechanism. Therefore, in the screen printing apparatus 1, a solder paste recovery device 71 is installed between the squeegee head 17 and the mask automatic positioning unit 91 so that the squeegee head 17 moved to the rearmost end does not interfere with the equipment frame 113. ing. With this configuration, it is possible to mount the solder paste recovery device 71 while achieving compactness in the front-rear direction without changing the depth of the equipment.

The mask automatic positioning unit 91 has a solder collection and attachment unit 93. The solder paste recovery device 71 is detachably attached to the solder recovery attachment unit 93. The solder recovery attachment unit 93 includes a rod 97 for mask positioning, a cylinder 99 that drives the rod 97 in the Z-axis direction, and a recovery unit support rod 105 that supports the solder paste recovery device 71. A plurality of cylinders 99 are arranged along the left-right direction (X-axis direction) and are attached to the casing of the solder recovery and attachment unit 93. Further, in the solder recovery and attachment unit 93, a recovery unit support rod 105 is provided between the plurality of cylinders 99 arranged. An elevating cylinder and an elevating rod for elevating the solder paste recovery device 71 are attached to the recovery unit support rod 105, and the solder paste recovery device 71 is attached to the elevating rod.

The solder paste recovery device 71 has a contact portion 73 that comes into contact with the screen mask 13 and holds the recovered paste Pst. The contact portion 73 is made of a strip-shaped thin plate extending along the longitudinal direction of the squeegee 42 . The contact portion 73 is attached such that one long side is fixed to the housing 89 of the solder paste recovery device 71 and the other long side is inclined downward.

FIG. 6 is a block diagram showing a control system of the screen printing apparatus 1 according to an embodiment of the present disclosure. The screen printing device 1 includes a control device 60 as an example of a control section that controls operations of each part of the device. In the screen printing apparatus 1 , the control device 60 controls each operation regarding the transport operation of the substrate 2 by the carry-in conveyor 14 , the holding and moving operation of the substrate 2 by the substrate holding and moving mechanism 12 , and the transport operation of the substrate 2 by the carry-out conveyor 15 . Execute. The control device 60 also controls the movement of the camera 16 and the imaging operation of the camera 16 by the camera movement mechanism 16K, the movement of the squeegee head 17 by the print head movement mechanism 17K, and the lifting and lowering of each squeegee 42 by the squeegee lifting cylinder 43. , executes control of each operation. Further, the control device 60 executes control of each operation regarding the solder paste recovery operation and the supply operation by the solder paste recovery device 71. Image data obtained by imaging with the camera 16 is sent to the control device 60, and image recognition is performed in the image processing section 60a of the control device 60.

In the screen printing apparatus 1 in this embodiment, necessary inputs are performed from an input device 61 connected to a control device 60. Thereby, the contact points of each of the pair of front and rear squeegees 42 can be set arbitrarily. Furthermore, by performing necessary input from the input device 61, the sliding speed of the squeegee 42 on the screen mask 13 and the printing pressure of the squeegee 42 against the screen mask 13 can be set arbitrarily. Further, the screen printing device 1 can arbitrarily set the start position and end position of the printing operation based on input from the input device 61. Here, the side closest to the worker OP is the front side (front side), and the direction opposite to the front side is the rear side (rear side).

The input device 61 functions as an example of a selection section, and can arbitrarily select at least one of a print start position and a print end position, either on the front side or the rear side, and instructs the control device 60 to select the selected position. Notice. The input device 61 may be configured with various input devices such as a touch panel, push buttons, and switches. The control device 60 sets the solder paste collection position according to the print end position, and sets the solder paste supply position according to the print start position. Therefore, the control device 60 enables the solder paste recovery device 71 to perform the solder paste recovery operation at any position before or after the printing operation, regardless of the end position of the printing operation. Furthermore, the control device 60 enables the solder paste recovery device 71 to perform the solder paste supply operation at any position, regardless of the solder paste recovery position. As a result, solder paste can be collected from either the front or rear positions, the collected solder paste can be supplied to either the front or rear positions, and the next print operation can be started at any print start position regardless of the print end position of the previous print operation. Allow you to start.

Next, the operation of collecting and supplying the paste Pst by the screen printing apparatus 1 described above will be explained.

As shown in FIGS. 1 to 4, when a substrate 2 is input from the upstream process side, the carry-in conveyor 14 receives the substrate 2 and delivers it to the substrate holding section 21. The substrate holding section 21 positions the substrate 2 received from the carry-in conveyor 14 at a predetermined clamping position by a positioning conveyor 31, supports it from below with a lower receiving section 32, and then clamps it with a clamper 33. Once the substrate holder 21 holds the substrate 2, the moving table 22 moves the substrate holder 21 to position the substrate 2 below the substrate contact area R of the screen mask 13.

When the substrate 2 is located below the substrate contact area R, the camera 16 moves, and the upper imaging section 16a images the mask side mark 13m (FIG. 4) provided in the substrate contact area R from below, and the lower imaging section 16b The board-side mark 2m (FIG. 3) of the board 2 held by the board holder is imaged from above. After the camera 16 finishes capturing the image, the substrate holding and moving mechanism 12 moves the substrate 2 so that the mask-side mark 13m and the substrate-side mark 2m match in a plan view, and then raises the substrate 2 in the substrate contact area R. contact. As a result, each electrode 2d matches the corresponding pattern opening 13h and is exposed on the upper surface side of the mask plate.

When the substrate 2 contacts the substrate contact area R as described above, the front clamper 33F contacts the lower surface of the screen mask 13 in the area in front of the substrate contact area R, and the rear clamper 33R contacts the screen mask 13 in the area behind the substrate contact area R. Contact the bottom surface of 13. In this embodiment, the upper surface area of the portion where the front clamper 33F contacts the screen mask 13 is referred to as the front standby area TF, and the upper surface area of the portion where the rear clamper 33R contacts the screen mask 13 is referred to as the rear standby area TR. (See Figure 4). The front standby area TF and the rear standby area TR are areas where the paste Pst is made to stand by before the printing operation starts. In this embodiment, the paste Pst is first supplied to the front standby area TF (see FIG. 4).

The outline of the printing operation by the screen printing apparatus 1 is as follows: First, the supplied paste Pst is scraped up with a squeegee 42 to fill the pattern opening 13h of the screen mask 13 with the paste Pst. Next, the squeegee 42 is lowered to the contact height position so that the paste scraping surface of the squeegee 42 comes into contact with the paste Pst. Then, the moving base 41 is moved backward and the squeegee 42 is slid on the screen mask 13 to scrape up the paste Pst. As a result, the paste Pst passes through the pattern opening 13h and is printed on the electrode 2d of the substrate 2.

7, FIG. 8, FIG. 9, FIG. 10, FIG. 11, and FIG. 12 are explanatory diagrams each showing a first example of a paste collection operation and a paste supply operation performed by the screen printing apparatus 1 according to an embodiment of the present disclosure. . In the paste collection operation and supply operation of the first example, the state changes to each state of [A1] to [A18] in FIGS. 7 to 12. In the first example, when the printing end position is the front side and the next printing start position is the front side, the paste Pst is collected on the front side of the first screen mask (an example of the first mask) 13F. This is an example of an operation in which the paste Pst is supplied to the front side of the second screen mask (an example of the second mask) 13R.

In FIG. 7, in state [A1], the screen printing apparatus 1 executes a printing operation on the first screen mask 13F, moves the squeegee head 17 forward, and scrapes the paste Pst forward with the rear squeegee 42R to print on the front surface. This indicates that the printing operation has been completed on the side. Here, upon receiving an instruction to switch the model in order to print on a different type of substrate 2, the control device 60 controls execution of the paste collection operation and supply operation described below. At this time, the control device 60 controls the substrate holding and moving mechanism 12 and the print head moving mechanism 17K, moves the moving table section 22, the squeegee head 17, and the mask automatic positioning unit 91, and operates the solder paste recovery device 71. . At the time of model switching, the screen printing apparatus 1 collects the paste Pst remaining at the print end position on the front side of the first screen mask 13F, and then prints the paste Pst corresponding to the next model that is waiting at the rear. The screen mask 13R is transported from the rear to the front. Then, the paste Pst is supplied to the print start position on the front side of the second screen mask 13R to prepare for the next printing operation.

First, as shown in FIG. 7, from state [A1], the screen printing apparatus 1 raises the rear squeegee 42R of the squeegee head 17 to separate the squeegee 42 from the first screen mask 13F. Further, the screen printing apparatus 1 lowers the substrate holding part 21 and the moving table part 22 of the substrate holding and moving mechanism 12, and separates the front clamper 33F and the rear clamper 33R from the first screen mask 13F (state [A2]). . Then, the screen printing apparatus 1 moves the squeegee head 17 and the mask automatic positioning unit 91 backward. At this time, the screen printing apparatus 1 positions the mask so that the rod 97 of the cylinder 99 provided in the automatic mask positioning unit 91 is located above the inner side of the frame member 13W on the rear end side of the first screen mask 13F. The automatic positioning unit 91 is driven (state [A3]).

Then, as shown in FIG. 8, the screen printing apparatus 1 lowers the rod 97 of the mask automatic positioning unit 91, and brings the rod 97 into contact with the frame member 13W on the rear end side of the first screen mask 13F (state [A4]). Subsequently, the screen printing apparatus 1 moves the squeegee head 17 and the mask automatic positioning unit 91 backward, and moves the first screen mask 13F backward by a predetermined distance (for example, about 10 mm). As a result, the paste Pst remaining at the printing end position on the front side of the first screen mask 13F is brought into the movable range of the solder paste recovery device 71, and the paste Pst is pasted at a position where it can be recovered by the solder paste recovery device 71. Position Pst. At this time, the screen printing apparatus 1 moves the substrate holding and moving mechanism 12 located below the first screen mask 13F backward together with the first screen mask 13F (state [A5]).

For example, in states [A1] and [A2], if the position near the front end of the squeegee head 17 is at the squeegee movable limit, the configuration in which the solder paste recovery device 71 is provided between the squeegee head 17 and the mask automatic positioning unit 91 , the solder paste recovery device 71 cannot be moved further forward. In this case, there is a possibility that the solder paste recovery device 71 will not reach the print end position on the front side. Therefore, by moving the screen mask 13 toward the rear solder paste collection device 71 as in state [A5], it is possible to collect the paste Pst at the print end position on the front side. In addition, as the squeegee head 17 and the mask automatic positioning unit 91 move the screen mask 13, the substrate holding and moving mechanism 12 is also moved to the solder paste recovery device 71 side, so that the screen mask 13 can be used as the substrate holding and moving mechanism. The upper surface of 12 is always covered. The control device 60 determines whether or not it is necessary to move the screen mask 13 based on the print end position and the position of the squeegee head 17, and moves the squeegee head 17 and the substrate holding and moving mechanism 12 only when movement is necessary. You can also do this.

In state [A5], the squeegee head 17 and the substrate holding and moving mechanism 12 may be moved in conjunction with each other, or may be moved individually and independently. Further, regarding the moving distance, both may be moved by the same distance, or may be moved individually by different distances within a predetermined range. Regarding the movement timing, both may be moved simultaneously, the substrate holding and moving mechanism 12 may be moved first within a predetermined time, or the squeegee head 17 may be moved first within a predetermined time. The substrate holding and moving mechanism 12 only needs to be able to maintain a state in which it overlaps the first screen mask 13F in the vertical direction (Z-axis direction) and is hidden under the first screen mask 13F and not exposed. The squeegee head 17 and the substrate holding and moving mechanism 12 may be moved rearward as appropriate under the conditions. That is, when the screen printing apparatus 1 moves the screen mask 13 and the substrate holding and moving mechanism 12, the screen printing apparatus 1 maintains a state in which the substrate holding and moving mechanism 12 is covered with the screen mask 13. Then, the screen printing apparatus 1 raises the rod 97 of the cylinder 99 of the automatic mask positioning unit 91 (state [A6]).

Next, as shown in FIG. 9, the screen printing apparatus 1 moves the squeegee head 17 and the automatic mask positioning unit 91 forward, and moves the solder paste recovery device 71 forward. At this time, in the screen printing apparatus 1, the abutment part 73 of the solder paste recovery device 71 attached to the mask automatic positioning unit 91 is configured to remove the remaining paste Pst at the print end position on the front side of the first screen mask 13F. The mask automatic positioning unit 91 is driven so as to be positioned above the rear side (state [A7]).

Subsequently, the screen printing device 1 lowers the lifting rod 103 of the recovery unit support rod 105 attached to the solder recovery attachment unit 93 of the mask automatic positioning unit 91, and moves the contact portion 73 of the solder paste recovery device 71 to the first position. The screen mask 13F is brought into contact with the screen mask 13F. Further, the screen printing apparatus 1 raises the substrate holding section 21 and the moving table section 22 of the substrate holding and moving mechanism 12, and brings the front clamper 33F and the rear clamper 33R into contact with the first screen mask 13F. At this time, the solder paste recovery device 71 is located above the front clamper 33F with the first screen mask 13F in between (state [A8]). Then, the screen printing device 1 moves the squeegee head 17 and the mask automatic positioning unit 91 forward, slides the contact portion 73 of the solder paste recovery device 71 forward on the first screen mask 13F, and then removes the paste Pst. (Status [A9]).

Next, as shown in FIG. 10, the screen printing apparatus 1 raises the lifting rod 103 of the collection unit support rod 105 to raise the solder paste collection device 71 and separate it from the first screen mask 13F. Further, the screen printing apparatus 1 lowers the substrate holding part 21 and the moving table part 22 of the substrate holding and moving mechanism 12, and separates the front clamper 33F and the rear clamper 33R from the first screen mask 13F (state [A10]). . The steps up to this point correspond to the paste collection operation of the first example.

Then, the screen printing apparatus 1 moves the squeegee head 17 and the mask automatic positioning unit 91 backward. At this time, the screen printing apparatus 1 adjusts the mask so that the rod 97 of the cylinder 99 provided in the automatic mask positioning unit 91 is located above the outer vicinity of the frame member 13W on the rear end side of the second screen mask 13R. The automatic positioning unit 91 is largely driven to the rear end of the second screen mask 13R (state [A11]). Then, the screen printing apparatus 1 lowers the rod 97 of the automatic mask positioning unit 91, and brings the rod 97 into contact with the frame member 13W on the rear end side of the second screen mask 13R (state [A12]).

Subsequently, as shown in FIG. 11, the screen printing apparatus 1 moves the squeegee head 17 and the mask automatic positioning unit 91 forward, and moves the second screen mask 13R forward together with the first screen mask 13F. Thereby, the second screen mask 13R is positioned above the substrate holding and moving mechanism 12 (state [A13]). Then, the screen printing apparatus 1 raises the rod 97 of the cylinder 99 of the mask automatic positioning unit 91 (state [A14]). Next, the screen printing apparatus 1 moves the squeegee head 17 and the automatic mask positioning unit 91 forward, and moves the solder paste recovery device 71 forward. At this time, the screen printing device 1 drives the mask automatic positioning unit 91 so that the contact portion 73 of the solder paste recovery device 71 is located above the front standby area TF on the front side of the second screen mask 13R. (state [A15]).

Next, as shown in FIG. 12, the screen printing device 1 lowers the lifting rod 103 of the recovery unit support rod 105 attached to the solder recovery attachment unit 93 of the mask automatic positioning unit 91, and moves the solder paste recovery device 71 down. The contact portion 73 is brought into contact with the second screen mask 13R. Further, the screen printing apparatus 1 raises the substrate holding part 21 and the moving table part 22 of the substrate holding and moving mechanism 12, and brings the front clamper 33F and the rear clamper 33R into contact with the second screen mask 13R. At this time, the solder paste recovery device 71 is located above the front clamper 33F with the second screen mask 13R in between (state [A16]).

Subsequently, the screen printing device 1 moves the squeegee head 17 and the mask automatic positioning unit 91 backward, and slides the contact portion 73 of the solder paste recovery device 71 backward on the second screen mask 13R to print. The paste Pst is placed in the front standby area TF, which is the starting position (state [A17]). Then, the screen printing apparatus 1 raises the elevating rod 103 of the collection unit support rod 105 to raise the solder paste collection device 71 and separate it from the second screen mask 13R. (Status [A18]). The steps up to this point correspond to the paste supply operation of the first example.

Thereafter, the screen printing apparatus 1 moves the squeegee head 17 and the automatic mask positioning unit 91, and lowers the rod 97 of the automatic mask positioning unit 91 to contact the frame member 13W of the second screen mask 13R. Subsequently, the screen printing apparatus 1 moves the squeegee head 17 and the mask automatic positioning unit 91 to a predetermined position, and positions the second screen mask 13R at a predetermined printing position. Then, the screen printing apparatus 1 starts printing using the front squeegee 42F from the selected front print start position.

As described above, in the first example, when the printing operation ends on the front side of the screen mask 13 and the model is switched, the printing end position on the front side of the first screen mask 13F that has been used until now is changed. The remaining paste Pst is collected. Then, the screen mask 13 is replaced, and the paste Pst is supplied to the print start position on the front side of the second screen mask 13R to be used next. In this way, after the paste collection operation on the front side of the screen mask 13, the paste supply operation on the front side is possible.

Note that the movement of the screen mask 13 and the substrate holding and moving mechanism 12 performed in order to cause the solder paste recovery device 71 to reach the print end position in the paste recovery operation may be applied in the paste supply operation. In this case, during the paste supply operation, the screen mask 13 and the substrate holding and moving mechanism 12 are moved to the solder paste recovery device 71 side, the solder paste recovery device 71 is sufficiently reached the printing start position, and the paste Pst is supplied. This allows for proper paste supply.

13, FIG. 14, FIG. 15, and FIG. 16 are explanatory diagrams each showing a second example of a paste collection operation and a paste supply operation performed by the screen printing apparatus 1 according to an embodiment of the present disclosure. In the paste collection operation and supply operation of the second example, the state changes to [B1] to [B18] in FIGS. 13 to 16. In the second example, when the printing end position is the front side and the next printing start position is the rear side, the paste Pst is collected on the front side of the first screen mask 13F, and the paste Pst is collected on the front side of the first screen mask 13F. This is an example of an operation in which paste Pst is supplied to the rear side of the vehicle.

In FIG. 13, in state [B1], the screen printing apparatus 1 executes a printing operation on the first screen mask 13F, moves the squeegee head 17 forward, and scrapes the paste Pst forward with the rear squeegee 42R to print on the first screen mask 13F. This indicates that the printing operation has been completed on the side. Here, upon receiving an instruction to switch the model in order to print on a different type of substrate 2, the control device 60 controls execution of the paste collection operation and supply operation described below. At the time of model switching, the screen printing apparatus 1 collects the paste Pst remaining at the print end position on the front side of the first screen mask 13F, and then prints the paste Pst corresponding to the next model that is waiting at the rear. The screen mask 13R is transported from the rear to the front. Then, the paste Pst is supplied to the printing start position on the rear side of the second screen mask 13R to prepare for the next printing operation.

Here, the paste collection operation in the second example is similar to the paste collection operation in the first example. Therefore, the states of [A1] to [A14] in the first example and [B1] to [B14] in the second example are the same. Therefore, in the second example, the explanation will focus on the parts that are different from the first example.

First, as shown in FIG. 13, from state [B1], the screen printing apparatus 1 raises the squeegee head 17 and separates the squeegee 42 from the first screen mask 13F. Further, the screen printing apparatus 1 lowers the substrate holding and moving mechanism 12 to separate the front clamper 33F and the rear clamper 33R from the first screen mask 13F (state [B2]). Then, the screen printing apparatus 1 moves the squeegee head 17 and the mask automatic positioning unit 91 backward, and the rod 97 is lowered and brought into contact with the frame member 13W on the rear end side of the first screen mask 13F. , the squeegee head 17 and the mask automatic positioning unit 91 are moved rearward, and the first screen mask 13F is moved rearward a predetermined distance. Further, the screen printing apparatus 1 moves the substrate holding and moving mechanism 12 backward together with the first screen mask 13F (state [B5]). As a result, the paste Pst remaining at the print end position on the front side of the first screen mask 13F is within the movable range of the solder paste recovery device 71 and is placed at a position where it can be recovered by the solder paste recovery device 71.

Then, as shown in FIG. 14, the screen printing apparatus 1 raises the rod 97 of the automatic mask positioning unit 91, moves the squeegee head 17 and the automatic mask positioning unit 91 forward, and moves the solder paste recovery apparatus 71 forward. move it. Subsequently, the screen printing apparatus 1 lowers the lifting rod 103 attached to the mask automatic positioning unit 91, and brings the contact portion 73 of the solder paste recovery device 71 into contact with the first screen mask 13F. In addition, the screen printing apparatus 1 raises the substrate holding part 21 and the moving table part 22 of the substrate holding and moving mechanism 12, and brings the front clamper 33F and the rear clamper 33R into contact with the first screen mask 13F (state [B8]). ).

Next, the screen printing device 1 moves the squeegee head 17 and the mask automatic positioning unit 91 forward, and slides the contact portion 73 of the solder paste recovery device 71 forward on the first screen mask 13F to paste the paste. Scoop out Pst. Then, the screen printing device 1 raises the lifting rod 103 of the collection unit support rod 105, and raises the solder paste collection device 71 to separate it from the first screen mask 13F. Further, the screen printing apparatus 1 lowers the substrate holding and moving mechanism 12 to separate the front clamper 33F and the rear clamper 33R from the first screen mask 13F (state [B10]). The steps up to this point correspond to the paste collection operation of the second example.

Then, the screen printing apparatus 1 moves the squeegee head 17 and the mask automatic positioning unit 91 largely backward to the rear end of the second screen mask 13R, and lowers the rod 97 to move the second screen mask 13R toward the rear end. (state [B12]).

Subsequently, as shown in FIG. 15, the screen printing apparatus 1 moves the squeegee head 17 and the mask automatic positioning unit 91 forward, and moves the second screen mask 13R forward together with the first screen mask 13F. Thereby, the second screen mask 13R is positioned above the substrate holding and moving mechanism 12 (state [B13]). Then, the screen printing apparatus 1 raises the rod 97 of the automatic mask positioning unit 91 (state [B14]).

Next, the screen printing apparatus 1 moves the squeegee head 17 and the automatic mask positioning unit 91 a predetermined distance forward, and moves the solder paste recovery device 71 forward. At this time, the screen printing device 1 drives the mask automatic positioning unit 91 so that the contact portion 73 of the solder paste recovery device 71 is located above the rear standby area TR on the rear side of the second screen mask 13R. (state [B15]).

Next, as shown in FIG. 16, the screen printing device 1 lowers the lifting rod 103 attached to the automatic mask positioning unit 91, and moves the contact portion 73 of the solder paste recovery device 71 to the second screen mask 13R. bring it into contact. Further, the screen printing apparatus 1 raises the substrate holding and moving mechanism 12, and brings the front clamper 33F and the rear clamper 33R into contact with the second screen mask 13R. At this time, the solder paste recovery device 71 is located above the rear clamper 33R with the second screen mask 13R in between (state [B16]).

Subsequently, the screen printing device 1 moves the squeegee head 17 and the mask automatic positioning unit 91 backward, and slides the contact portion 73 of the solder paste recovery device 71 backward on the second screen mask 13R to print. The paste Pst is placed in the rear standby area TR, which is the starting position (state [B17]). Then, the screen printing apparatus 1 raises the elevating rod 103 of the collection unit support rod 105 to raise the solder paste collection device 71 and separate it from the second screen mask 13R. (Status [B18]). The steps up to this point correspond to the paste supply operation of the second example.

Thereafter, the screen printing apparatus 1 moves the squeegee head 17 and the automatic mask positioning unit 91, and lowers the rod 97 of the automatic mask positioning unit 91 to contact the frame member 13W of the second screen mask 13R. Subsequently, the screen printing apparatus 1 moves the squeegee head 17 and the mask automatic positioning unit 91 to a predetermined position, and positions the second screen mask 13R at a predetermined printing position. Then, the screen printing device 1 starts printing using the rear squeegee 42R from the selected rear printing start position.

As described above, in the second example, when the printing operation ends on the front side of the screen mask 13 and the model is switched, the printing end position on the front side of the first screen mask 13F that has been used until now is changed. The remaining paste Pst is collected. Then, the screen mask 13 is replaced, and the paste Pst is supplied to the printing start position on the rear side of the second screen mask 13R to be used next. In this way, after the paste collection operation on the front side of the screen mask 13, the paste supply operation on the rear side is possible.

17, FIG. 18, FIG. 19, FIG. 20, and FIG. 21 are explanatory diagrams showing a third example of the paste collection operation and supply operation performed by the screen printing apparatus 1 according to an embodiment of the present disclosure, respectively. In the paste collection operation and supply operation of the third example, the state changes to each state of [C1] to [C14] in FIGS. 17 to 21. In the third example, when the printing end position is on the rear side and the next printing start position is on the front side, the paste Pst is collected on the rear side of the first screen mask 13F, and the paste Pst is collected on the rear side of the first screen mask 13F. This is an example of an operation in which paste Pst is supplied to the front side of the machine.

In FIG. 17, in state [C1], the screen printing apparatus 1 executes a printing operation on the first screen mask 13F, moves the squeegee head 17 rearward, scrapes the paste Pst rearward with the front squeegee 42F, and rearranges the paste Pst. This indicates that the printing operation has been completed on the side. Here, upon receiving an instruction to switch the model in order to print on a different type of substrate 2, the control device 60 controls execution of the paste collection operation and supply operation described below. At the time of model switching, the screen printing apparatus 1 collects the paste Pst remaining at the printing end position on the rear side of the first screen mask 13F, and then prints the paste Pst corresponding to the next model, which is kept on standby at the rear. The screen mask 13R is transported from the rear to the front. Then, the paste Pst is supplied to the print start position on the front side of the second screen mask 13R to prepare for the next printing operation.

First, as shown in FIG. 17, from state [C1], the screen printing apparatus 1 raises the front squeegee 42F of the squeegee head 17 to separate the squeegee 42 from the first screen mask 13F. In addition, the screen printing apparatus 1 lowers the substrate holding part 21 and the moving table part 22 of the substrate holding and moving mechanism 12, and separates the front clamper 33F and the rear clamper 33R from the first screen mask 13F (state [C2]). . Then, the screen printing apparatus 1 moves the squeegee head 17 and the automatic mask positioning unit 91 forward, and moves the solder paste recovery device 71 forward. At this time, in the screen printing apparatus 1, the abutment part 73 of the solder paste recovery device 71 attached to the mask automatic positioning unit 91 is configured to remove the remaining paste Pst at the printing end position on the rear side of the first screen mask 13F. The mask automatic positioning unit 91 is driven so as to be positioned above the rear side (state [C3]).

Next, as shown in FIG. 18, the screen printing device 1 lowers the lifting rod 103 of the recovery unit support rod 105 attached to the solder recovery attachment unit 93 of the mask automatic positioning unit 91, and moves the solder paste recovery device 71 down. The contact portion 73 is brought into contact with the first screen mask 13F. Further, the screen printing apparatus 1 raises the substrate holding section 21 and the moving table section 22 of the substrate holding and moving mechanism 12, and brings the front clamper 33F and the rear clamper 33R into contact with the first screen mask 13F. At this time, the solder paste recovery device 71 is located above the rear clamper 33R with the first screen mask 13F in between (state [C4]). Then, the screen printing device 1 moves the squeegee head 17 and the mask automatic positioning unit 91 forward, slides the contact portion 73 of the solder paste recovery device 71 forward on the first screen mask 13F, and then removes the paste Pst. (state [C5]).

Subsequently, the screen printing apparatus 1 raises the lifting rod 103 of the collection unit support rod 105 to raise the solder paste collection device 71 and separate it from the first screen mask 13F. Further, the screen printing apparatus 1 lowers the substrate holding part 21 and the moving table part 22 of the substrate holding and moving mechanism 12, and separates the front clamper 33F and the rear clamper 33R from the first screen mask 13F (state [C6]). . The steps up to this point correspond to the paste collection operation of the third example.

Next, as shown in FIG. 19, the screen printing apparatus 1 moves the squeegee head 17 and the mask automatic positioning unit 91 backward. At this time, the screen printing apparatus 1 adjusts the mask so that the rod 97 of the cylinder 99 provided in the automatic mask positioning unit 91 is located above the outer vicinity of the frame member 13W on the rear end side of the second screen mask 13R. The automatic positioning unit 91 is largely driven to the rear end of the second screen mask 13R (state [C7]). Then, the screen printing apparatus 1 lowers the rod 97 of the mask automatic positioning unit 91, and brings the rod 97 into contact with the frame member 13W on the rear end side of the second screen mask 13R (state [C8]).

Subsequently, the screen printing apparatus 1 moves the squeegee head 17 and the mask automatic positioning unit 91 forward, and moves the second screen mask 13R forward together with the first screen mask 13F. Thereby, the second screen mask 13R is positioned above the substrate holding and moving mechanism 12 (state [C9]).

Then, as shown in FIG. 20, the screen printing apparatus 1 raises the rod 97 of the cylinder 99 of the automatic mask positioning unit 91 (state [C10]). Subsequently, the screen printing apparatus 1 moves the squeegee head 17 and the automatic mask positioning unit 91 forward, and moves the solder paste recovery device 71 forward. At this time, the screen printing device 1 drives the mask automatic positioning unit 91 so that the contact portion 73 of the solder paste recovery device 71 is located above the front standby area TF on the front side of the second screen mask 13R. (state [C11]).

Next, the screen printing device 1 lowers the lifting rod 103 of the recovery unit support rod 105 attached to the solder recovery attachment unit 93 of the mask automatic positioning unit 91, and moves the contact portion 73 of the solder paste recovery device 71 to the second position. The screen mask 13R is brought into contact with the screen mask 13R. Further, the screen printing apparatus 1 raises the substrate holding part 21 and the moving table part 22 of the substrate holding and moving mechanism 12, and brings the front clamper 33F and the rear clamper 33R into contact with the second screen mask 13R. At this time, the solder paste recovery device 71 is located above the front clamper 33F with the second screen mask 13R in between (state [C12]).

Subsequently, as shown in FIG. 21, the screen printing apparatus 1 moves the squeegee head 17 and the automatic mask positioning unit 91 backward, and places the contact part 73 of the solder paste recovery device 71 on the second screen mask 13R. The paste Pst is slid backward and placed in the front standby area TF, which is the printing start position (state [C13]). Then, the screen printing apparatus 1 raises the elevating rod 103 of the collection unit support rod 105 to raise the solder paste collection device 71 and separate it from the second screen mask 13R. (Status [C14]). The steps up to this point correspond to the paste supply operation of the third example.

Thereafter, the screen printing apparatus 1 moves the squeegee head 17 and the automatic mask positioning unit 91, and lowers the rod 97 of the automatic mask positioning unit 91 to contact the frame member 13W of the second screen mask 13R. Subsequently, the screen printing apparatus 1 moves the squeegee head 17 and the mask automatic positioning unit 91 to a predetermined position, and positions the second screen mask 13R at a predetermined printing position. Then, the screen printing apparatus 1 starts printing using the front squeegee 42F from the selected front print start position.

As described above, in the third example, when the printing operation ends on the rear side of the screen mask 13 and the model is switched, the printing end position on the rear side of the first screen mask 13F that has been used until now is changed. The remaining paste Pst is collected. Then, the screen mask 13 is replaced, and the paste Pst is supplied to the print start position on the front side of the second screen mask 13R to be used next. In this way, after the paste collection operation on the rear side of the screen mask 13, the paste supply operation on the front side is possible.

22, FIG. 23, FIG. 24, and FIG. 25 are explanatory diagrams showing a fourth example of a paste collection operation and a paste supply operation, respectively, performed by the screen printing apparatus 1 according to an embodiment of the present disclosure. In the paste collection operation and supply operation of the fourth example, the state changes to each state of [D1] to [D14] in FIGS. 22 to 25. In the fourth example, when the printing end position is on the rear side and the next printing start position is on the rear side, the paste Pst is collected on the rear side of the first screen mask 13F, and the paste Pst is collected on the rear side of the first screen mask 13F. This is an example of an operation in which paste Pst is supplied to the rear side of the vehicle.

In FIG. 22, in state [D1], the screen printing apparatus 1 executes a printing operation on the first screen mask 13F, moves the squeegee head 17 backward, scrapes the paste Pst backward with the front squeegee 42F, and This indicates that the printing operation has been completed on the side. Here, upon receiving an instruction to switch the model in order to print on a different type of substrate 2, the control device 60 controls execution of the paste collection operation and supply operation described below. At the time of model switching, the screen printing apparatus 1 collects the paste Pst remaining at the printing end position on the rear side of the first screen mask 13F, and then prints the paste Pst corresponding to the next model, which is kept on standby at the rear. The screen mask 13R is transported from the rear to the front. Then, paste Pst is supplied to the rear side of the second screen mask 13R to prepare for the next printing operation.

Here, the paste collection operation in the fourth example is similar to the paste collection operation in the third example. Therefore, the states [C1] to [C10] in the third example and [D1] to [D10] in the fourth example are the same. Therefore, in the fourth example, the explanation will focus on parts that are different from the third example.

First, as shown in FIG. 22, from state [D1], the screen printing apparatus 1 raises the squeegee head 17 and separates the squeegee 42 from the first screen mask 13F. Further, the screen printing apparatus 1 lowers the substrate holding and moving mechanism 12 to separate the front clamper 33F and the rear clamper 33R from the first screen mask 13F (state [D2]). Then, the screen printing apparatus 1 moves the squeegee head 17 and the automatic mask positioning unit 91 forward, and moves the solder paste recovery device 71 forward. Subsequently, the screen printing apparatus 1 lowers the lifting rod 103 attached to the mask automatic positioning unit 91, and brings the contact portion 73 of the solder paste recovery device 71 into contact with the first screen mask 13F. Further, the screen printing apparatus 1 raises the substrate holding section 21 and the moving table section 22 of the substrate holding and moving mechanism 12, and brings the front clamper 33F and the rear clamper 33R into contact with the first screen mask 13F (state [D4]). ).

Then, as shown in FIG. 23, the screen printing apparatus 1 moves the squeegee head 17 and the mask automatic positioning unit 91 forward, and moves the contact part 73 of the solder paste recovery device 71 forward on the first screen mask 13F. to scoop out the paste Pst. Then, the screen printing device 1 raises the lifting rod 103 of the collection unit support rod 105, and raises the solder paste collection device 71 to separate it from the first screen mask 13F. Further, the screen printing apparatus 1 lowers the substrate holding and moving mechanism 12 to separate the front clamper 33F and the rear clamper 33R from the first screen mask 13F (state [D6]). The steps up to this point correspond to the paste collection operation of the fourth example.

Next, the screen printing apparatus 1 moves the squeegee head 17 and the mask automatic positioning unit 91 significantly backward to the rear end of the second screen mask 13R, and lowers the rod 97 to move the rear end of the second screen mask 13R. It is brought into contact with the side frame member 13W (state [D8]). Subsequently, the screen printing apparatus 1 moves the squeegee head 17 and the mask automatic positioning unit 91 forward, and moves the second screen mask 13R forward together with the first screen mask 13F. Thereby, the second screen mask 13R is positioned above the substrate holding and moving mechanism 12 (state [D9]).

Then, as shown in FIG. 24, the screen printing apparatus 1 raises the rod 97 of the automatic mask positioning unit 91 (state [D10]). Subsequently, the screen printing apparatus 1 moves the squeegee head 17 and the automatic mask positioning unit 91 a predetermined distance forward, and moves the solder paste recovery device 71 forward. At this time, the screen printing device 1 drives the mask automatic positioning unit 91 so that the contact portion 73 of the solder paste recovery device 71 is located above the rear standby area TR on the rear side of the second screen mask 13R. (state [D11]).

Next, the screen printing apparatus 1 lowers the lifting rod 103 attached to the mask automatic positioning unit 91, and brings the contact portion 73 of the solder paste recovery device 71 into contact with the second screen mask 13R. Further, the screen printing apparatus 1 raises the substrate holding and moving mechanism 12, and brings the front clamper 33F and the rear clamper 33R into contact with the second screen mask 13R. At this time, the solder paste recovery device 71 is located above the rear clamper 33R with the second screen mask 13R in between (state [D12]).

Subsequently, as shown in FIG. 25, the screen printing apparatus 1 moves the squeegee head 17 and the mask automatic positioning unit 91 backward, and places the contact part 73 of the solder paste recovery device 71 on the second screen mask 13R. The paste Pst is placed in the rear standby area TR by sliding it backward (state [D13]). Then, the screen printing apparatus 1 raises the elevating rod 103 of the collection unit support rod 105 to raise the solder paste collection device 71 and separate it from the second screen mask 13R. (Status [D14]). The steps up to this point correspond to the paste supply operation of the fourth example.

Thereafter, the screen printing apparatus 1 moves the squeegee head 17 and the automatic mask positioning unit 91, and lowers the rod 97 of the automatic mask positioning unit 91 to contact the frame member 13W of the second screen mask 13R. Subsequently, the screen printing apparatus 1 moves the squeegee head 17 and the mask automatic positioning unit 91 to a predetermined position, and positions the second screen mask 13R at a predetermined printing position. Then, the screen printing device 1 starts printing using the rear squeegee 42R from the selected rear printing start position.

As described above, in the fourth example, when the printing operation ends on the rear side of the screen mask 13 and the model is switched, the printing end position on the rear side of the first screen mask 13F that has been used until now is changed. The remaining paste Pst is collected. Then, the screen mask 13 is replaced, and the paste Pst is supplied to the printing start position on the rear side of the second screen mask 13R to be used next. In this way, after the paste collection operation on the rear side of the screen mask 13, the paste supply operation on the rear side is possible.

The screen printing apparatus 1 in this embodiment prints the paste Pst on the substrate 2 using the screen mask 13. The screen printing device 1 includes a squeegee 42 that slides on the screen mask 13 and prints the paste Pst on the substrate 2 through a pattern opening 13h provided in the screen mask 13, and a squeegee 42 that holds the substrate 2 and prints the paste Pst on the substrate 2. a substrate holding and moving mechanism 12 that aligns the screen mask 13 with respect to the screen mask 13, a solder paste recovery device 71 that recovers the paste Pst scraped up to the printing end position by the squeegee 42, and a mask that positions the screen mask 13 at the printing position. If the automatic positioning unit 91 and the solder paste recovery device 71 cannot reach the printing end position, the mask automatic positioning unit 91 is used to move the screen mask 13 to the solder paste recovery device 71 side, and the board holding and moving mechanism 12 is moved to the solder paste recovery device 71 side. and a control device 60 for moving the paste to the paste recovery device 71 side.

In this screen printing device 1, when the solder paste recovery device 71 does not reach the printing end position, the screen mask 13 is moved to the solder paste recovery device 71 side using the mask automatic positioning unit 91, and together with this, the substrate holding and moving mechanism 12 to the solder paste recovery device 71 side. Therefore, even if the solder paste collecting device 71 cannot reach the printing end position due to the arrangement of the solder paste collecting device 71, the position of the paste Pst is changed to the position of the solder paste collecting device by moving the screen mask 13. 71 within the range of motion. Thereby, the solder paste recovery device 71 can sufficiently reach the paste Pst remaining at the print end position, and the paste Pst can be appropriately recovered.

Further, by moving the substrate holding and moving mechanism 12 to the solder paste recovery device 71 side in conjunction with moving the screen mask 13 to the solder paste recovery device 71 side, the upper part of the substrate holding and moving mechanism 12 is no longer exposed. , and is covered by the screen mask 13. As a result, when the paste Pst attached to the squeegee 42 drips down due to gravity, the paste Pst falls and adheres to the clamper 33 and lower receiving part 32 of the substrate holding and moving mechanism 12, and the substrate 2 etc. held there. This can be prevented. Therefore, it is possible to prevent the substrate holding and moving mechanism 12 from getting dirty with the paste Pst, and to suppress print quality defects due to the substrate holding and moving mechanism 12 being dirty.

The control device 60 moves the screen mask 13 and the substrate holding and moving mechanism 12 toward the solder paste recovery device 71 based on the printing end position. In this configuration, the control device 60 determines whether or not it is necessary to move the screen mask 13 without the solder paste recovery device 71 reaching the print end position, depending on the print end position, and moves the screen mask 13 if necessary. becomes possible.

Further, the screen printing apparatus 1 has a squeegee head 17 that moves the squeegee 42 in the vertical direction, a mask automatic positioning unit 91 is connected to the squeegee head 17, and a solder paste recovery device 71 is connected to the squeegee head 17. and the mask automatic positioning unit 91. In this configuration, due to the arrangement relationship between the squeegee head 17 and the solder paste recovery device 71, the printing end position at one end of the movable range of the squeegee head 17 may deviate from the movable range of the solder paste recovery device 71. It can happen. Therefore, when the solder paste recovery device 71 does not reach the printing end position, the paste Pst can be appropriately recovered by moving the screen mask 13 toward the solder paste recovery device 71 side.

Further, in the screen printing apparatus 1, the side closest to the operator OP is the front side, and the side opposite to the front side is the rear side, and the mask automatic positioning unit 91 is connected to the rear side of the squeegee head 17. There is. In this case, the solder paste recovery device 71 is arranged between the mask automatic positioning unit 91 on the rear side of the squeegee head 17. When the control device 60 finishes printing at the printing end position where the squeegee head 17 is on the front side, the control device 60 moves the screen mask 13 and the substrate holding and moving mechanism 12 to the rear side. Thereby, the solder paste recovery device 71 can sufficiently reach the paste Pst remaining at the printing end position, and the paste Pst can be appropriately recovered.

Furthermore, when moving the screen mask 13 and the substrate holding and moving mechanism 12, the control device 60 maintains a state in which the substrate holding and moving mechanism 12 is covered with the screen mask 13. As a result, the substrate holding and moving mechanism 12 is always covered by the screen mask 13, and it is possible to prevent the paste Pst from falling and adhering to the substrate holding and moving mechanism 12, resulting in poor printing quality due to dirt on the substrate holding and moving mechanism 12. can be suppressed.

The screen printing apparatus 1 in this embodiment prints the paste Pst on the first circuit board using the first screen mask 13F, and then prints the paste Pst on the first circuit board using the second screen mask 13R, which is different from the first screen mask 13F. Print the paste Pst on the circuit board No. 2. The screen printing device 1 collects the paste Pst on the first screen mask 13F on one side or the other side of the device, and also prints the recovered paste Pst on the second screen mask 13F on one side or the other side of the device. The solder paste recovery device 71 that can be supplied onto the second screen mask 13R and the side where the solder paste recovery device 71 supplies the paste Pst onto the second screen mask 13R are set to either one side or the other side. and a control device 60 that moves the solder paste recovery device 71 to the side selected by the input device 61 and supplies the paste Pst onto the second screen mask 13R.

In this screen printing device 1, the side to which the paste Pst is supplied is arbitrarily selected from either one side or the other side and instructed through the input device 61, and the second screen mask 13R is applied from the selected side. Printing on the second circuit board using the second circuit board can be started. In this case, after printing on the first circuit board is finished, when printing on a second circuit board of a different type, the paste supply position is selected according to the next printing start position, and the paste is supplied to the selected side. The paste Pst can be supplied to the supply position, and printing can be executed from the print start position. Therefore, the print start position is not limited, and printing can be started from any position and direction regardless of the print end position, and various printing processes can be flexibly handled.

The screen printing apparatus 1 also includes a clamper 33 that holds the substrate 2 from both sides and brings the substrate 2 into contact with the lower surface of the second screen mask 13R, and a clamper 33 that holds the substrate 2 from both sides and presses the paste Pst supplied onto the second screen mask 13R. It has a squeegee 42 that prints on the substrate 2 through the pattern opening 13h of the second screen mask 13R. The control device 60 starts printing using the squeegee 42 from the side selected by the input device 61. In this configuration, the lower surface of the second screen mask 13R is supported by the clamper 33, and the paste Pst supplied to the printing start position is scraped out by the squeegee 42 on the selected side, and the paste Pst is slid over the second screen mask 13R. By moving the printer, printing can be executed from any selected position.

Further, in the screen printing apparatus 1, one side is the front side near the worker OP, and the other side is the rear side in the opposite direction to the front side. In this case, regardless of whether the print end position is the front side or the rear side, the paste supply position can be selected arbitrarily regardless of the print end position, and the paste Pst can be supplied to the selected front side or rear side. You can start printing.

Further, the input device 61 is a touch panel provided on the front side of the screen printing device 1. With this configuration, the operator OP can arbitrarily select and instruct a printing start position using the touch panel, supply the paste Pst to the selected supply position, and start printing. Further, the operator OP can easily select and input the print start position by inputting using the touch panel.

Furthermore, if the solder paste recovery device 71 does not reach the printing start position on the selected side, the control device 60 moves the second screen mask 13R to the solder paste recovery device 71 side. In this configuration, even if the solder paste recovery device 71 cannot reach the printing start position due to the arrangement of the solder paste recovery device 71, the printing start position can be moved to the solder by moving the second screen mask 13R. It comes within the movable range of the paste recovery device 71. Thereby, the solder paste recovery device 71 can sufficiently reach the printing start position, and the paste Pst can be appropriately supplied.

The screen printing apparatus 1 in this embodiment prints the paste Pst on the substrate 2 using the screen mask 13. The screen printing device 1 includes a squeegee 42 that slides on the screen mask 13 and prints the paste Pst on the substrate 2 through a pattern opening 13h provided in the screen mask 13, and a squeegee 42 that scrapes the paste Pst to the printing end position. A solder paste recovery device 71 that collects the solder paste Pst, a mask automatic positioning unit 91 that positions the screen mask 13 at the printing position, and a mask automatic positioning unit 91 that and a control device 60 that moves the screen mask 13 toward the solder paste recovery device 71 using the control device 60 .

In this screen printing apparatus 1, when the solder paste recovery device 71 does not reach the print end position, the screen mask 13 is moved toward the solder paste recovery device 71 using the mask automatic positioning unit 91. Therefore, even if the solder paste collecting device 71 cannot reach the printing end position due to the arrangement of the solder paste collecting device 71, the position of the paste Pst is changed to the position of the solder paste collecting device by moving the screen mask 13. 71 within the range of motion. Thereby, the solder paste recovery device 71 can sufficiently reach the paste Pst remaining at the print end position, and the paste Pst can be appropriately recovered.

The control device 60 uses the mask automatic positioning unit 91 to move the screen mask 13 toward the solder paste recovery device 71 based on the printing end position. In this configuration, the control device 60 determines whether or not it is necessary to move the screen mask 13 without the solder paste recovery device 71 reaching the print end position, depending on the print end position, and moves the screen mask 13 if necessary. becomes possible.

Further, the screen printing apparatus 1 has a squeegee head 17 that moves the squeegee 42 in the vertical direction, a mask automatic positioning unit 91 is connected to the squeegee head 17, and a solder paste recovery device 71 is connected to the squeegee head 17. and the mask automatic positioning unit 91. In this configuration, due to the arrangement relationship between the squeegee head 17 and the solder paste recovery device 71, the printing end position at one end of the movable range of the squeegee head 17 may deviate from the movable range of the solder paste recovery device 71. It can happen. Therefore, when the solder paste recovery device 71 does not reach the printing end position, the paste Pst can be appropriately recovered by moving the screen mask 13 toward the solder paste recovery device 71 side.

Further, in the screen printing apparatus 1, if the side closest to the worker OP is the front side and the side opposite to the front side is the rear side, the mask automatic positioning unit 91 is connected to the rear side of the squeegee head 17. There is. In this case, the solder paste recovery device 71 is arranged between the mask automatic positioning unit 91 on the rear side of the squeegee head 17. When the control device 60 finishes printing at the printing end position where the squeegee head 17 is on the front side, the control device 60 uses the mask automatic positioning unit 91 to move the screen mask 13 to the rear side. Thereby, the solder paste recovery device 71 can sufficiently reach the paste Pst remaining at the print end position, and the paste Pst can be appropriately recovered.

Moreover, after printing using the first screen mask 13F, the screen printing apparatus 1 prints using a second screen mask 13R different from the first screen mask 13F. In this case, the solder paste recovery device 71 can supply the recovered paste Pst onto the second screen mask 13R on one side or the other side of the device, and the solder paste recovery device 71 can supply the recovered paste Pst onto the second screen mask 13R. It has an input device 61 that can select the side for supplying the paste Pst onto the mask 13R from either one side or the other side. The control device 60 moves the solder paste recovery device 71 to the side selected by the input device 61, and supplies the paste Pst onto the second screen mask 13R. With this, after printing using the first screen mask is completed, when printing using a different type of second screen mask, the paste supply position is selected according to the next printing start position, The paste Pst can be supplied to the supply position on the selected side, and printing can be executed from the print start position. Therefore, the print start position is not limited, and printing can be started from any position and direction regardless of the print end position, and various printing processes can be flexibly handled.

Although the embodiments have been described above with reference to the accompanying drawings, it goes without saying that the present disclosure is not limited to such examples. It is clear that those skilled in the art can come up with various changes, modifications, substitutions, additions, deletions, and equivalents within the scope of the claims, and It is understood that it naturally falls within the technical scope of the present disclosure. Further, each of the constituent elements in the above embodiments may be arbitrarily combined without departing from the spirit of the invention.

The present disclosure is useful as a printing device that can appropriately collect solder paste regardless of the printing end position.

1 Screen printing device 2 Substrate 12 Substrate holding and moving mechanism 13 Screen mask 13F First screen mask 13R Second screen mask 13W Frame member 13h Pattern opening 17 Squeegee head 17K Print head moving mechanism 19 Mask support section 21 Substrate holding section 22 Movement Table section 33 Clamper 33F Front clamper 33R Rear clamper 42 Squeegee 42F Front squeegee 42R Rear squeegee 60 Control device 71 Solder paste recovery device 73 Contact section 91 Mask automatic positioning unit 93 Solder recovery mounting unit 97 Rod 103 Lifting rod 105 Recovery unit support rod Pst Paste TF Front standby area TR Rear standby area

Claims (6)

A printing device that prints solder paste on a board using a mask,
a squeegee that slides on the mask and prints the solder paste on the substrate through an opening provided in the mask;
a collection device that collects the solder paste scraped up to the printing end position by the squeegee;
a positioning unit that positions the mask at a printing position;
a control unit that uses the positioning unit to move the mask toward the collection device;
A printing device having a The printing device according to claim 1,
The control unit is a printing device that moves the mask toward the collecting device using the positioning unit based on the printing end position. 3. The printing device according to claim 1, further comprising a squeegee head that moves the squeegee in an up-down direction.
The positioning part is connected to the squeegee head, and
The recovery device is a printing device provided between the squeegee head and the positioning section. 4. The printing device according to claim 3,
If the side of the printing device closest to the operator is the front side, and the side opposite to the front side is the rear side,
The positioning part is connected to the rear side of the squeegee head, and
The control unit is a printing device that moves the mask to the rear side using the positioning unit when printing is finished at the print end position where the squeegee head is on the front side. The printing device according to any one of claims 1 to 4,
When printing using a first mask and then using a second mask different from the first mask,
The collecting device is capable of supplying the collected solder paste onto the second mask on one side or the other side of the printing device,
The recovery device has a selection unit that can select a side for supplying the solder paste onto the mask from either the one side or the other side,
The control unit is a printing device that moves the recovery device to the side selected by the selection unit and supplies the solder paste onto the second mask. A printing method for printing solder paste on a board using a mask, the method comprising:
printing the solder paste on the substrate through an opening provided in the mask using a squeegee;
Collecting the solder paste scraped up to the printing end position by the squeegee using a collecting device ,
moving the mask toward the collection device using a positioning unit that positions the mask at a printing position;
Printing method.

Images