JP2019001912A5 - - Google Patents

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Publication number
JP2019001912A5
JP2019001912A5 JP2017117814A JP2017117814A JP2019001912A5 JP 2019001912 A5 JP2019001912 A5 JP 2019001912A5 JP 2017117814 A JP2017117814 A JP 2017117814A JP 2017117814 A JP2017117814 A JP 2017117814A JP 2019001912 A5 JP2019001912 A5 JP 2019001912A5
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JP
Japan
Prior art keywords
resin composition
compound
conductive resin
package
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2017117814A
Other languages
English (en)
Japanese (ja)
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JP2019001912A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2017117814A priority Critical patent/JP2019001912A/ja
Priority claimed from JP2017117814A external-priority patent/JP2019001912A/ja
Priority to CN201880017919.8A priority patent/CN110382620A/zh
Priority to PCT/JP2018/014287 priority patent/WO2018230109A1/ja
Priority to KR1020197025414A priority patent/KR20200019593A/ko
Priority to TW107113043A priority patent/TW201904764A/zh
Publication of JP2019001912A publication Critical patent/JP2019001912A/ja
Publication of JP2019001912A5 publication Critical patent/JP2019001912A5/ja
Pending legal-status Critical Current

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JP2017117814A 2017-06-15 2017-06-15 導電性樹脂組成物及びそれを用いたシールドパッケージの製造方法 Pending JP2019001912A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2017117814A JP2019001912A (ja) 2017-06-15 2017-06-15 導電性樹脂組成物及びそれを用いたシールドパッケージの製造方法
CN201880017919.8A CN110382620A (zh) 2017-06-15 2018-04-03 导电性树脂组合物及使用该导电性树脂组合物的屏蔽封装体的制造方法
PCT/JP2018/014287 WO2018230109A1 (ja) 2017-06-15 2018-04-03 導電性樹脂組成物及びそれを用いたシールドパッケージの製造方法
KR1020197025414A KR20200019593A (ko) 2017-06-15 2018-04-03 도전성 수지 조성물 및 그것을 사용한 차폐 패키지의 제조 방법
TW107113043A TW201904764A (zh) 2017-06-15 2018-04-17 導電性樹脂組成物及使用其之屏蔽封裝體之製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017117814A JP2019001912A (ja) 2017-06-15 2017-06-15 導電性樹脂組成物及びそれを用いたシールドパッケージの製造方法

Publications (2)

Publication Number Publication Date
JP2019001912A JP2019001912A (ja) 2019-01-10
JP2019001912A5 true JP2019001912A5 (https=) 2020-05-28

Family

ID=64660003

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017117814A Pending JP2019001912A (ja) 2017-06-15 2017-06-15 導電性樹脂組成物及びそれを用いたシールドパッケージの製造方法

Country Status (5)

Country Link
JP (1) JP2019001912A (https=)
KR (1) KR20200019593A (https=)
CN (1) CN110382620A (https=)
TW (1) TW201904764A (https=)
WO (1) WO2018230109A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7272284B2 (ja) * 2020-01-15 2023-05-12 信越化学工業株式会社 低誘電樹脂組成物
CN111508911B (zh) * 2020-04-30 2022-03-25 青岛歌尔微电子研究院有限公司 分腔电磁屏蔽封装方法及封装结构
TW202444786A (zh) * 2023-03-09 2024-11-16 日商拓自達電線股份有限公司 導電性組成物

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003258137A (ja) 2002-02-28 2003-09-12 Mitsubishi Electric Corp 半導体装置
JP4996182B2 (ja) * 2006-09-07 2012-08-08 株式会社日立製作所 ポリマーナノコンポジット材料、その製造方法電子部品装置およびその製造方法
JP5266774B2 (ja) * 2008-01-31 2013-08-21 住友ベークライト株式会社 樹脂組成物およびそれを用いて作製した半導体装置または回路基板
JP5266719B2 (ja) * 2007-10-29 2013-08-21 住友ベークライト株式会社 樹脂組成物及び樹脂組成物を使用して作製した半導体装置
CN106232745B (zh) * 2014-09-30 2018-05-11 拓自达电线株式会社 用于屏蔽电子部件的封装体的导电性涂料及使用其的屏蔽封装体的制造方法
JP2017008160A (ja) * 2015-06-18 2017-01-12 京セラ株式会社 ダイボンディングペーストの製造方法およびダイボンディングペースト

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