JP2018520517A5 - - Google Patents

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Publication number
JP2018520517A5
JP2018520517A5 JP2017566357A JP2017566357A JP2018520517A5 JP 2018520517 A5 JP2018520517 A5 JP 2018520517A5 JP 2017566357 A JP2017566357 A JP 2017566357A JP 2017566357 A JP2017566357 A JP 2017566357A JP 2018520517 A5 JP2018520517 A5 JP 2018520517A5
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JP
Japan
Prior art keywords
contact
portions
straight portion
contact portion
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2017566357A
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English (en)
Japanese (ja)
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JP6860510B2 (ja
JP2018520517A (ja
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Publication date
Application filed filed Critical
Priority claimed from PCT/EP2016/064223 external-priority patent/WO2016207118A1/en
Publication of JP2018520517A publication Critical patent/JP2018520517A/ja
Publication of JP2018520517A5 publication Critical patent/JP2018520517A5/ja
Application granted granted Critical
Publication of JP6860510B2 publication Critical patent/JP6860510B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2017566357A 2015-06-22 2016-06-20 パワー半導体モジュール用のばね要素 Active JP6860510B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP15173145.2 2015-06-22
EP15173145 2015-06-22
PCT/EP2016/064223 WO2016207118A1 (en) 2015-06-22 2016-06-20 Spring element for a power semiconductor module

Publications (3)

Publication Number Publication Date
JP2018520517A JP2018520517A (ja) 2018-07-26
JP2018520517A5 true JP2018520517A5 (enExample) 2019-07-04
JP6860510B2 JP6860510B2 (ja) 2021-04-14

Family

ID=53476749

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017566357A Active JP6860510B2 (ja) 2015-06-22 2016-06-20 パワー半導体モジュール用のばね要素

Country Status (5)

Country Link
US (1) US10573620B2 (enExample)
EP (1) EP3311406B1 (enExample)
JP (1) JP6860510B2 (enExample)
CN (1) CN107949908B (enExample)
WO (1) WO2016207118A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113097764B (zh) * 2020-01-08 2022-06-24 富士康(昆山)电脑接插件有限公司 导电端子
DE102020111526B3 (de) * 2020-04-28 2021-06-02 Semikron Elektronik Gmbh & Co. Kg Leistungshalbleitermodul mit Einpresskontaktelement
US11877937B2 (en) * 2020-10-16 2024-01-23 Accenture Global Solutions Limited Springs with strain feedback
US12442425B2 (en) * 2020-10-28 2025-10-14 Nhk Spring Co., Ltd. Spring member
EP4071791A1 (en) 2021-04-09 2022-10-12 Hitachi Energy Switzerland AG Spring element for a press contact in a power semiconductor module, and method for manufacturing the same

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2725847C3 (de) * 1977-06-08 1980-05-29 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Anordnung zur Druckkontaktierung einer Halbleiterscheibe
DE19843309A1 (de) 1998-09-22 2000-03-23 Asea Brown Boveri Kurzschlussfestes IGBT Modul
DE19903245A1 (de) * 1999-01-27 2000-08-03 Asea Brown Boveri Leistungshalbleitermodul
TW547797U (en) * 2002-01-11 2003-08-11 Hon Hai Prec Ind Co Ltd Socket connector
US7264481B2 (en) * 2003-08-22 2007-09-04 Abb Schweiz Ag Pressure contract spring for contact arrangement in power semiconductor module
JP2007173198A (ja) * 2005-11-25 2007-07-05 Hitachi Cable Ltd 電気コンタクト及びメス端子
US20090179315A1 (en) * 2008-01-14 2009-07-16 Armand Vincent Jereza Semiconductor Die Packages Having Solder-free Connections, Systems Using the Same, and Methods of Making the Same
EP2503595A1 (en) 2011-02-18 2012-09-26 ABB Research Ltd. Power semiconductor module and method of manufacturing a power semiconductor module
JP5529208B2 (ja) * 2011-08-25 2014-06-25 トヨタ自動車株式会社 パワーモジュールの構造及び成形方法
JP2013102065A (ja) * 2011-11-09 2013-05-23 Meidensha Corp 半導体モジュール及び電極部材
KR101443980B1 (ko) * 2012-11-27 2014-09-23 삼성전기주식회사 접속핀 및 이를 갖는 전력 모듈 패키지
EP2827366A1 (en) 2013-07-18 2015-01-21 ABB Technology AG Power semiconductor module
JP6372997B2 (ja) * 2013-12-03 2018-08-15 株式会社エンプラス 電気部品用ソケット

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