JP2018516451A5 - - Google Patents

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Publication number
JP2018516451A5
JP2018516451A5 JP2017548970A JP2017548970A JP2018516451A5 JP 2018516451 A5 JP2018516451 A5 JP 2018516451A5 JP 2017548970 A JP2017548970 A JP 2017548970A JP 2017548970 A JP2017548970 A JP 2017548970A JP 2018516451 A5 JP2018516451 A5 JP 2018516451A5
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JP
Japan
Prior art keywords
wafer
grayscale image
images
processor
image set
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JP2017548970A
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English (en)
Japanese (ja)
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JP6807324B2 (ja
JP2018516451A (ja
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Priority claimed from US15/068,320 external-priority patent/US9747520B2/en
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Publication of JP2018516451A5 publication Critical patent/JP2018516451A5/ja
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JP2017548970A 2015-03-16 2016-03-15 検査ツールの検査感度を高めるシステム及び方法 Active JP6807324B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201562133959P 2015-03-16 2015-03-16
US62/133,959 2015-03-16
US15/068,320 US9747520B2 (en) 2015-03-16 2016-03-11 Systems and methods for enhancing inspection sensitivity of an inspection tool
US15/068,320 2016-03-11
PCT/US2016/022497 WO2016149285A1 (en) 2015-03-16 2016-03-15 Systems and methods for enhancing inspection sensitivity of an inspection tool

Publications (3)

Publication Number Publication Date
JP2018516451A JP2018516451A (ja) 2018-06-21
JP2018516451A5 true JP2018516451A5 (https=) 2019-04-18
JP6807324B2 JP6807324B2 (ja) 2021-01-06

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ID=56919431

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JP2017548970A Active JP6807324B2 (ja) 2015-03-16 2016-03-15 検査ツールの検査感度を高めるシステム及び方法

Country Status (7)

Country Link
US (1) US9747520B2 (https=)
EP (1) EP3271939B1 (https=)
JP (1) JP6807324B2 (https=)
KR (1) KR102364951B1 (https=)
CN (1) CN107580710B (https=)
TW (1) TWI668436B (https=)
WO (1) WO2016149285A1 (https=)

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JP6233824B1 (ja) * 2017-04-25 2017-11-22 合同会社ウイングビジョン 画像検査装置、生産システム、画像検査方法、プログラム及び記憶媒体
US11346882B2 (en) * 2017-11-03 2022-05-31 Tokyo Electron Limited Enhancement of yield of functional microelectronic devices
US11244873B2 (en) * 2018-10-31 2022-02-08 Tokyo Electron Limited Systems and methods for manufacturing microelectronic devices
US11953448B2 (en) * 2019-09-27 2024-04-09 Taiwan Semiconductor Manufacturing Company Ltd. Method for defect inspection
US11221300B2 (en) 2020-03-20 2022-01-11 KLA Corp. Determining metrology-like information for a specimen using an inspection tool
US11774371B2 (en) * 2020-05-22 2023-10-03 Kla Corporation Defect size measurement using deep learning methods
US11935244B2 (en) 2020-10-29 2024-03-19 Changxin Memory Technologies, Inc. Method and apparatus for improving sensitivity of wafer detection, and storage medium
US11868119B2 (en) 2021-09-24 2024-01-09 Tokyo Electron Limited Method and process using fingerprint based semiconductor manufacturing process fault detection
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CN116107154B (zh) * 2023-04-13 2023-09-05 长鑫存储技术有限公司 掩膜版数据生成方法、装置、设备及介质
TWI900897B (zh) * 2023-09-28 2025-10-11 聯策科技股份有限公司 晶圓檢測方法
CN117269197B (zh) * 2023-11-21 2024-02-02 昆明理工大学 多晶硅原料表面质量检测方法及检测装置
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