JP2018506175A5 - 加工物を保持及び加熱する装置、加工物を加熱する方法及びリングヒータアセンブリ - Google Patents

加工物を保持及び加熱する装置、加工物を加熱する方法及びリングヒータアセンブリ Download PDF

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JP2018506175A5
JP2018506175A5 JP2017531856A JP2017531856A JP2018506175A5 JP 2018506175 A5 JP2018506175 A5 JP 2018506175A5 JP 2017531856 A JP2017531856 A JP 2017531856A JP 2017531856 A JP2017531856 A JP 2017531856A JP 2018506175 A5 JP2018506175 A5 JP 2018506175A5
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Prior art keywords
workpiece
heating
holding
heater assembly
ring heater
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JP2017531856A
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JP2018506175A (ja
JP6783235B2 (ja
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JP2017531856A 2014-12-18 2015-11-23 加工物を保持及び加熱する装置、加工物を加熱する方法及びリングヒータアセンブリ Active JP6783235B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/575,651 2014-12-18
US14/575,651 US10109510B2 (en) 2014-12-18 2014-12-18 Apparatus for improving temperature uniformity of a workpiece
PCT/US2015/062182 WO2016099817A1 (en) 2014-12-18 2015-11-23 Apparatus for improving temperature uniformity of a workpiece

Publications (3)

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JP2018506175A JP2018506175A (ja) 2018-03-01
JP2018506175A5 true JP2018506175A5 (ja) 2018-11-29
JP6783235B2 JP6783235B2 (ja) 2020-11-11

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US (1) US10109510B2 (ja)
JP (1) JP6783235B2 (ja)
KR (1) KR102411023B1 (ja)
CN (1) CN107078058A (ja)
TW (1) TWI704835B (ja)
WO (1) WO2016099817A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9633875B2 (en) * 2015-03-13 2017-04-25 Varian Semiconductor Equipment Associates, Inc. Apparatus for improving temperature uniformity of a workpiece
EP3928593A4 (en) 2019-03-28 2022-12-07 MKS Instruments, Inc. LOW PROFILE HEATER AND METHOD OF MANUFACTURE
US11646213B2 (en) 2020-05-04 2023-05-09 Applied Materials, Inc. Multi-zone platen temperature control
US11664193B2 (en) * 2021-02-04 2023-05-30 Applied Materials, Inc. Temperature controlled/electrically biased wafer surround
US20230132307A1 (en) * 2021-10-26 2023-04-27 Applied Materials, Inc. Chuck For Processing Semiconductor Workpieces At High Temperatures

Family Cites Families (23)

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Publication number Priority date Publication date Assignee Title
US6084213A (en) 1998-05-18 2000-07-04 Steag C.V.D. Sytems, Ltd. Method and apparatus for increasing temperature uniformity of heated wafers
JP4151749B2 (ja) * 1998-07-16 2008-09-17 東京エレクトロンＡｔ株式会社 プラズマ処理装置およびその方法
JP4203206B2 (ja) * 2000-03-24 2008-12-24 株式会社日立国際電気 基板処理装置
US6475336B1 (en) * 2000-10-06 2002-11-05 Lam Research Corporation Electrostatically clamped edge ring for plasma processing
US6795292B2 (en) 2001-05-15 2004-09-21 Dennis Grimard Apparatus for regulating temperature of a process kit in a semiconductor wafer-processing chamber
KR100443122B1 (ko) 2001-10-19 2004-08-04 삼성전자주식회사 반도체 소자 제조장치용 히터 어셈블리
JP2003213421A (ja) * 2002-01-21 2003-07-30 Hitachi Kokusai Electric Inc 基板処理装置
US6768084B2 (en) 2002-09-30 2004-07-27 Axcelis Technologies, Inc. Advanced rapid thermal processing (RTP) using a linearly-moving heating assembly with an axisymmetric and radially-tunable thermal radiation profile
JP4540953B2 (ja) 2003-08-28 2010-09-08 キヤノンアネルバ株式会社 基板加熱装置及びマルチチャンバー基板処理装置
US20050133165A1 (en) * 2003-12-23 2005-06-23 Taiwan Semiconductor Manufacturing Co. Apparatus for the prevention of arcing in a CVD-TiN chamber
KR100811389B1 (ko) * 2006-03-24 2008-03-07 가부시키가이샤 뉴플레어 테크놀로지 반도체 제조 장치와 히터
JP5039076B2 (ja) * 2008-03-24 2012-10-03 株式会社東芝 エピタキシャルウェーハの製造装置及び製造方法
US8206552B2 (en) * 2008-06-25 2012-06-26 Applied Materials, Inc. RF power delivery system in a semiconductor apparatus
JP5274918B2 (ja) * 2008-07-07 2013-08-28 東京エレクトロン株式会社 プラズマ処理装置のチャンバー内部材の温度制御方法、チャンバー内部材及び基板載置台、並びにそれを備えたプラズマ処理装置
JP2010232476A (ja) * 2009-03-27 2010-10-14 Tokyo Electron Ltd プラズマ処理装置
JP5357639B2 (ja) * 2009-06-24 2013-12-04 株式会社日立ハイテクノロジーズ プラズマ処理装置およびプラズマ処理方法
KR101559913B1 (ko) * 2009-06-25 2015-10-27 삼성전자주식회사 플라즈마 건식 식각 장치
JP5275935B2 (ja) * 2009-07-15 2013-08-28 株式会社ニューフレアテクノロジー 半導体製造装置および半導体製造方法
JP5496630B2 (ja) * 2009-12-10 2014-05-21 東京エレクトロン株式会社 静電チャック装置
JP5802052B2 (ja) * 2011-05-19 2015-10-28 株式会社ニューフレアテクノロジー 半導体製造装置及び半導体製造方法
US20130164948A1 (en) 2011-12-22 2013-06-27 Intermolecular, Inc. Methods for improving wafer temperature uniformity
KR20140119726A (ko) 2012-01-06 2014-10-10 노벨러스 시스템즈, 인코포레이티드 적응형 열 교환 방법 및 균일한 열 교환을 위한 시스템
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