JP2018501119A5 - - Google Patents

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Publication number
JP2018501119A5
JP2018501119A5 JP2017552006A JP2017552006A JP2018501119A5 JP 2018501119 A5 JP2018501119 A5 JP 2018501119A5 JP 2017552006 A JP2017552006 A JP 2017552006A JP 2017552006 A JP2017552006 A JP 2017552006A JP 2018501119 A5 JP2018501119 A5 JP 2018501119A5
Authority
JP
Japan
Prior art keywords
abrasive article
magnetic
magnetic member
main surface
abrasive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2017552006A
Other languages
English (en)
Japanese (ja)
Other versions
JP2018501119A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2015/065772 external-priority patent/WO2016106020A1/en
Publication of JP2018501119A publication Critical patent/JP2018501119A/ja
Publication of JP2018501119A5 publication Critical patent/JP2018501119A5/ja
Pending legal-status Critical Current

Links

JP2017552006A 2014-12-22 2015-12-15 取り外し可能な研磨部材を有する研磨物品並びに取り外し可能な研磨部材を分離する方法及び交換する方法 Pending JP2018501119A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201462095090P 2014-12-22 2014-12-22
US62/095,090 2014-12-22
PCT/US2015/065772 WO2016106020A1 (en) 2014-12-22 2015-12-15 Abrasive articles with removable abrasive member and methods of separating and replacing thereof

Publications (2)

Publication Number Publication Date
JP2018501119A JP2018501119A (ja) 2018-01-18
JP2018501119A5 true JP2018501119A5 (enExample) 2019-01-17

Family

ID=55178322

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017552006A Pending JP2018501119A (ja) 2014-12-22 2015-12-15 取り外し可能な研磨部材を有する研磨物品並びに取り外し可能な研磨部材を分離する方法及び交換する方法

Country Status (8)

Country Link
US (1) US20180001441A1 (enExample)
EP (1) EP3237146A1 (enExample)
JP (1) JP2018501119A (enExample)
KR (1) KR20170096025A (enExample)
CN (1) CN107257721A (enExample)
SG (1) SG11201704838TA (enExample)
TW (1) TW201700218A (enExample)
WO (1) WO2016106020A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017177072A1 (en) * 2016-04-06 2017-10-12 M Cubed Technologies, Inc. Diamond composite cmp pad conditioner
WO2019123335A1 (en) 2017-12-20 2019-06-27 3M Innovative Properties Company Abrasive articles including an anti-loading size layer
KR102674027B1 (ko) * 2019-01-29 2024-06-12 삼성전자주식회사 재생 연마패드
US20220388116A1 (en) * 2021-06-04 2022-12-08 Applied Materials, Inc. Method of detecting chemical mechanical polishing conditioning disk orientation
CN113618620A (zh) * 2021-09-07 2021-11-09 玉溪精工数控机床有限公司 一种数控车床主轴箱铲刮面研磨专用工装
JP2024535447A (ja) * 2021-09-29 2024-09-30 インテグリス・インコーポレーテッド 両面パッドコンディショナー
WO2023055663A1 (en) * 2021-09-29 2023-04-06 Entegris, Inc. Pad conditioner with polymer backing plate
US20230264319A1 (en) * 2022-02-21 2023-08-24 Applied Materials, Inc. Pad carrier assembly for horizontal pre-clean module

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1058502A (en) 1965-05-06 1967-02-15 Merit Products Inc Mounting abrasive disks on a drive member
US4222204A (en) * 1979-06-18 1980-09-16 Benner Robert L Holder for an abrasive plate
JPS5698554U (enExample) * 1979-12-27 1981-08-04
JPS5815089Y2 (ja) * 1980-06-30 1983-03-26 東洋研磨材工業株式会社 研削といし
JPH0771788B2 (ja) * 1986-07-29 1995-08-02 三菱マテリアル株式会社 砥 石
CN1105698C (zh) * 1993-11-12 2003-04-16 美国3M公司 磨料颗粒及其制造方法
JPH0929633A (ja) * 1995-07-18 1997-02-04 Toshiba Mach Co Ltd ポリッシング研磨布用ドレッシング工具
JP3981199B2 (ja) * 1998-02-10 2007-09-26 八千代マイクロサイエンス株式会社 両面ラップ盤用回転定盤
US6123612A (en) * 1998-04-15 2000-09-26 3M Innovative Properties Company Corrosion resistant abrasive article and method of making
US6224474B1 (en) * 1999-01-06 2001-05-01 Buehler, Ltd. Magnetic disc system for grinding or polishing specimens
JP2001071273A (ja) * 1999-09-01 2001-03-21 Hitachi Maxell Ltd 研磨シ―ト
US7377836B1 (en) * 2000-10-10 2008-05-27 Beaver Creek Concepts Inc Versatile wafer refining
US6815052B2 (en) * 2000-12-01 2004-11-09 P1 Diamond, Inc. Filled diamond foam material and method for forming same
JP2002254316A (ja) * 2001-02-28 2002-09-10 Hitachi Maxell Ltd 研磨シ―ト
JP2006205316A (ja) * 2005-01-28 2006-08-10 Hitachi Maxell Ltd 磁性層研磨用ラッピングテープ
KR101279819B1 (ko) * 2005-04-12 2013-06-28 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드 방사-편향 연마 패드
US8377158B2 (en) * 2006-08-30 2013-02-19 3M Innovative Properties Company Extended life abrasive article and method
TW201350267A (zh) * 2012-05-04 2013-12-16 Saint Gobain Abrasives Inc 用於同雙側化學機械平坦化墊修整器一起使用之工具
JP5919157B2 (ja) * 2012-10-01 2016-05-18 株式会社荏原製作所 ドレッサー

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