JP2018200205A - Method and device for measuring curvature of chip - Google Patents

Abstract

To measure the curvature of a chip when it is destroyed in estimating deflective strength of the chip.SOLUTION: A method for measuring the curvature of a chip when the chip is destroyed in a bending test of the chip, includes: a chip holding step of holding a first area on one end of the chip on a support surface of first holding means and holding a second area on the other end of the chip on a support surface of second holding means; a first moving step of relatively moving the first holding means and the second holding means such that the cross-sectional shape of a measurement area between the first area and second area of the chip becomes an arc shape, and bringing the support surface of the first holding means and the support surface of the second holding means to face each other; a second moving step of moving the first holding means and the second holding means relatively in a direction in which both the holding means approach each other; a chip destruction detection step of detecting that the chip is destroyed; and a curvature detection step of detecting the curvature of the measurement area when the destruction of the chip is detected.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a method for measuring the curvature of a chip when evaluating the bending strength of the chip, and an apparatus for measuring the curvature of the chip when evaluating the bending strength of the chip.

  A plurality of division lines are set on the surface of the semiconductor wafer so as to be arranged in a lattice pattern, and devices such as ICs and LSIs are formed in the respective regions partitioned by the division lines. When the semiconductor wafer is divided along the division line, individual chips having devices are formed.

  When a large impact is applied to a semiconductor wafer or chip, damage such as cracks or cracks may occur and the function of the device may be lost. Therefore, in order to develop a chip having a predetermined level of bending strength, the bending strength of a semiconductor wafer or a prototype chip is measured. As a method for evaluating the bending strength, for example, there is a 3-point bending method defined by SEMI (Semiconductor Equipment and Materials International) standard G86-0303.

  For example, when measuring the bending strength of a semiconductor wafer by a three-point bending method, two cylindrical supports are tilted and arranged parallel to each other, and the semiconductor wafer to be measured is placed on the side of the support. Put it on without fixing. Then, a cylindrical indenter is disposed above the semiconductor wafer between the two supports and parallel to the two supports. Then, the semiconductor wafer is pressed and broken from above by the indenter, and the load applied to the semiconductor wafer at that time is measured as the strength (see Patent Document 1).

JP 2014-222714 A

  In recent years, the tendency of downsizing and thinning of electronic devices has been remarkable. Along with this, the tendency of miniaturization and thinning of chips mounted on the electronic devices and the like is remarkable, and for example, ultrathin chips having a thickness of 30 μm or less are manufactured. In order to evaluate the bending strength of the ultra-thin chip, if the measurement is performed by the three-point bending method, even if the chip is pressed with an indenter at the time of measurement, the chip is bent and the bending strength cannot be broken. The problem of being unable to measure occurs.

  The present invention has been made in view of such a problem, and an object of the present invention is to provide a method capable of measuring the curvature at the time of breaking the chip when evaluating the bending strength of the chip and an apparatus capable of measuring the curvature. Is to provide.

  According to an aspect of the present invention, there is provided a method for measuring a curvature of a chip when the chip is broken in a chip bending test, wherein the upper surface supports a first region on one end side of the chip before being bent. A first holding means including a first supporting body serving as a surface is held on the supporting surface, and the second region on the other end side of the chip includes a second supporting body whose upper surface serves as a supporting surface. A chip holding step to be held on the support surface of the holding means, and after performing the holding step, the measurement area between the first area and the second area of the chip is bent while bending the measurement area. The first support body of the first holding means and the second support body of the second holding means are relatively moved so that the cross-sectional shape of the measurement region becomes an arc shape, and the first support body A first moving step for causing the support surface of the holding means and the support surface of the second holding means to face each other. And after the first moving step is performed, the first holding means first surface with the support surface of the first holding means and the support surface of the second holding means facing each other. A second movement step of relatively moving the support body of the second support body and the second support body of the second holding means toward each other, and the first movement step or the second movement step. A chip breakage detecting step for detecting that the chip was broken during the execution, and a curvature detecting step for detecting the curvature of the measurement area when the chip breakage was detected in the chip breakage detecting step. A method for measuring the curvature of a chip is provided.

  According to another aspect of the present invention, there is provided an apparatus for measuring the curvature of a chip when the chip is broken in a chip bending test, wherein the first region on one end side of the chip before being bent is The first holding means for holding the first support surface on the first support surface and the second region on the other end side of the chip are held on the second support surface on the second support surface. Bending a measurement area between the second holding means, the first holding means, the second holding means, the first area of the chip held by the second holding means, and the second area The first support body of the first holding means and the second support body of the second holding means are moved relative to each other so that the cross-sectional shape of the measurement region becomes an arc shape. The first support surface and the second support surface face each other, and then the first support body of the first holding means and the second holding hand A second support body, a moving means for relatively moving the second support bodies in a direction approaching each other, a first support body of the first holding means by the moving means, and a second of the second holding means Chip breakage detecting means for detecting that the chip is broken during relative movement with the support, and curvature detecting means for detecting the curvature of the measurement area when the chip breakage detecting means detects the breakage of the chip A device for measuring the curvature of a chip is provided.

  In one aspect of the present invention, a first holding unit that holds the first region on one end side of the chip and a second holding unit that holds the second region on the other end side of the chip are used. . First, the chip to be measured is held on the support surface on the upper surface of the first support of the first holding means and on the support surface of the upper surface of the second support of the second holding means. Then, the first support body of the first holding means, and the second support body is moved relative to the second support means to move the first area of the chip and the second area. The measurement region to be sandwiched is bent to cause breakage in the measurement region.

  To bend the measurement area of the chip, first, the first support of the first holding means and the second support of the second holding means so that the cross-sectional shape of the measurement area is an arc shape Are moved relative to each other so that the support surface of the first holding means and the support surface of the second holding means face each other. If the chip breaks during this process, the curvature of the measurement area when the break occurs is measured.

  If the chip is not broken until the support surface of the first holding means and the support surface of the second holding means face each other, the first support body of the first holding means, and the second The curvature of the measurement region is increased by decreasing the distance by bringing the second support of the holding means closer to each other. When it is detected that the chip is broken, the curvature of the measurement region when the break occurs is measured.

  Thus, if the chip is bent using the first holding means and the second holding means, the curvature of the chip can be made larger than when the above-described three-point bending method is performed. Therefore, even when the bending strength of the ultrathin chip is evaluated, the curvature can be increased to the extent that the chip is broken. The bending strength of the ultrathin chip can be evaluated by measuring the curvature of the chip when breakage occurs.

  Therefore, according to the present invention, there are provided a method capable of measuring the curvature at the time of breaking the chip when evaluating the bending strength of the chip, and an apparatus capable of measuring the curvature.

It is a side view which shows typically the apparatus which measures a curvature. It is a perspective view which shows typically the press unit of the apparatus which measures a curvature. It is a perspective view which shows typically the table of the apparatus which measures a curvature. It is a perspective view which shows typically the holding | maintenance unit of the apparatus which measures a curvature. It is a cross-sectional schematic diagram of a holding unit. FIG. 6A is a side view schematically showing the holding unit and the chip in the chip holding step, and FIG. 6B is a schematic view of the holding unit and the chip in the first moving step. FIG. It is a side view which shows typically the holding | maintenance unit in a 2nd movement step.

  First, an apparatus for measuring the curvature of a chip according to this embodiment will be described. FIG. 1 is a side view schematically showing the apparatus. The device 2 includes a pressing unit 2a, a table 2b, and a holding unit 2c, and has a function of bending the chip 1 and gradually increasing the curvature of the chip 1.

  FIG. 2 schematically shows the pressing unit 2 a of the device 2. The pressing unit 2a has a rectangular pedestal 6 whose upper surface is substantially flat. In the vicinity of the four corners of the upper surface of the pedestal 6, columnar pillars 8 each having substantially the same height are erected. A flat plate 4 is attached to the upper end of each column 8. That is, the top plate 4 is supported by the support column 8.

  An elevator 10 is disposed on the upper surface of the base 6. The elevator 10 has a fixed plate 10 a that is fixed to the upper surface of the base 6. An expansion / contraction mechanism 10b that expands and contracts in the vertical direction is disposed on the upper surface of the fixed plate 10a, and a flat plate stage 12 is provided at the upper end of the expansion / contraction mechanism 10b.

  A height adjustment screw 14 is provided on the side of the expansion / contraction mechanism 10b. By rotating the height adjustment screw 14, the expansion / contraction mechanism 10b can be expanded and contracted to change the height of the stage 12. For example, by raising the stage 12, an object placed between the top 4 and the stage 12 can be sandwiched and pressed between the top 4 and the stage 12.

  A main body 16 a of a digital gauge 16 for measuring the height of the stage 12 is disposed on the upper surface side of the top plate 4. A shaft 16b that moves in the vertical direction is inserted in the lower portion of the main body 16a. The shaft 16b is passed through a through hole penetrating the top plate 4 in the vertical direction. Further, the lower end of the shaft 16 b is in contact with the upper surface of the stage 12.

  With this digital gauge 16, the height of the lower end of the shaft 16b corresponding to the height of the stage 12 can be measured. A display unit 18 is connected to the main body 16a of the digital gauge 16 via a signal line 16c. The display unit 18 displays the height of the lower end of the shaft 16b measured by the digital gauge 16 (that is, the height of the stage 12).

  A table 2 b is installed on the upper surface of the stage 12. FIG. 3 is a perspective view schematically showing the table 2b. As shown in FIG. 3, the table 2 b is configured in a flat plate shape having a substantially rectangular upper surface 20. Near the center of the upper surface 20 side of the table 2b, a groove 22 is formed so as to divide the upper surface 20 of the table 2b into two rectangular regions 20a and 20b.

  The lower end side of the four springs 24 extending and contracting in the vertical direction is attached to a region 20 a on one side of the upper surface 20 divided into two by the groove 22. A sprung plate 26 is provided at the upper end of each spring 24. A holding unit 2c is disposed on the upper surface 20 of the table 2b.

  FIG. 4 is a perspective view schematically showing the holding unit 2c. As shown in FIG. 4, the holding unit 2c includes a first holding means 28 arranged in a region surrounded by the four springs 24 in the region 20a, and a second holding means 30 arranged in the region 20b. . The first holding means 28 and the second holding means 30 are connected by a belt-like rubber 38. In a state where the first holding means 28 and the second holding means 30 are arranged on the upper surface 20 of the table 2 b, a part of the belt-like rubber 38 is accommodated in the groove 22.

  A schematic cross-sectional view of the holding unit 2c is shown in FIG. For example, an electrostatic holding part 32 a is provided on the upper part of the first holding means 28, and an electrostatic holding part 32 b is provided on the upper part of the second holding means 30. The electrostatic holding portion 32a includes an electrode 44a and an electrode 44b separated from the electrode 44a. The electrode 44a and the electrode 44b are insulated from each other by being surrounded by an insulator 46a. The electrostatic holding portion 32b includes an electrode 44c and an electrode 44d separated from the electrode 44c. The electrode 44c and the electrode 44d are insulated from each other by being surrounded by an insulator 46b.

  One end of a conducting wire 42a (see FIG. 4) is connected to the electrode 44a, and one end of a conducting wire 42b (see FIG. 4) is connected to the electrode 44b. A high voltage applying unit 40a (see FIG. 4) is connected to the other end of each of the conducting wire 42a and the conducting wire 42b. The high voltage applying unit 40a can apply a high voltage to the electrode 44a and the electrode 44b through the conducting wire 42a and the conducting wire 42b.

  One end of a conducting wire 42c (see FIG. 4) is connected to the electrode 44c, and one end of a conducting wire 42d (see FIG. 4) is connected to the electrode 44d. A high voltage applying unit 40b (see FIG. 4) is connected to the other end of each of the conducting wire 42c and the conducting wire 42d. The high voltage applying unit 40b can apply a high voltage to the electrode 44c and the electrode 44d through the conductor 42c and the conductor 42d.

  The high voltage application unit 40a can apply a high voltage to the electrode 44a and the electrode 44b individually. The high voltage application unit 40b can individually apply a high voltage to the electrode 44c and the electrode 44d. The high voltage application unit 40a and the high voltage application unit 40b can apply a high voltage of, for example, plus or minus 2 kV.

  A first area on one end side of the chip 1 is placed on the first holding means 28, and the first area of the chip 1 is held by the first holding means 28. That is, the first electrostatic holding portion 32a serves as a first support, and the upper surface of the first support serves as the first support surface 28a. Each of the electrodes 44a and 44b has a predetermined shape, and a high voltage is applied by the high voltage application unit 40a (see FIG. 4), and the chip 1 is electrostatically adsorbed by Coulomb force or gradient force.

  A second area on the other end side of the chip 1 is placed on the second holding means 30, and the second area of the chip 1 is held by the second holding means 30. That is, the second electrostatic holding portion 32b serves as a second support, and the upper surface of the second support serves as the second support surface 30a. Each of the electrodes 44c and 44d has a predetermined shape, and a high voltage is applied by the high voltage applying unit 40b (see FIG. 4), and the chip 1 is electrostatically adsorbed by Coulomb force or gradient force.

  An insulator 34a is provided below the electrostatic holding portion 32a, and an insulator 34b is provided below the electrostatic holding portion 32b. A band-shaped rubber container 36a is provided below the insulator 34a, and a band-shaped rubber container 36b is provided below the insulator 34b. One end of the belt-like rubber 38 is housed and fixed in the belt-like rubber container 36a, and the other end is housed and fixed in the belt-like rubber 36b. In FIG. 5, the internal structure of the belt-like rubber 38 and the belt-like rubber containers 36a and 36b accommodated in the belt-like rubber containers 36a and 36b is omitted.

  Note that the first holding unit 28 and the second holding unit 30 may hold the chip 1 by a method other than electrostatic attraction by Coulomb force or gradient force. For example, the first support body of the first holding means 28 and the second support body of the second holding means 30 respectively communicate with the first support surface 28a and the second support surface 28b. A suction path may be provided inside to hold the chip 1 by suction. Furthermore, the first holding means 28 and the second holding means 30 may hold the chip 1 with a clamp that can hold the chip 1 between the respective support surfaces.

  The first holding means 28 and the second holding means 30 are held by the second holding means 30 and the area of the chip 1 held by the first holding means 28 while holding the chip 1. It is relatively moved by a face-to-face moving means (not shown) so as to curve the area between the area and the area. That is, the facing movement means relatively moves the first support body of the first holding means 28 and the second support body of the second holding means 30 so that the support surfaces face each other.

  For example, the facing moving means is connected to the second support of the second holding means 30 and the second support of the second holding means 30 so as to curve the area between the chips 1. Move. Then, the first support surface of the first holding means 28 and the second support surface of the second holding means 30 face each other.

  Further, the first holding means 28 and the second holding means 30 are pressed by the pressing unit 2a shown in FIG. 2 with their supporting surfaces facing each other, and are moved so as to approach each other relatively. .

  The facing moving means and the pressing unit 2a move to relatively move the first holding means 28 and the second holding means 30 so as to bend the held chip 1 and increase the curvature of the chip 1. Configure the means. According to the moving means, the chip 1 can be bent to greatly increase the curvature, so that the chip 1 can be destroyed.

  The moving means may not be a combination of two different mechanisms, and may be realized by a single moving mechanism. In this case, for example, the support body of the second holding means 30 is moved by one moving mechanism connected to the second holding means 30, and the support surface of the first holding means 28 and the second holding means. The 30 support surfaces face each other. Further, the moving mechanism causes the support of the first holding means 28 and the support of the second holding means 30 to approach each other.

  Next, the chip 1 whose bending strength is evaluated by the apparatus 2 (see FIG. 1) for measuring the curvature according to the present embodiment will be described. The chip 1 is manufactured from, for example, a semiconductor wafer such as silicon or sapphire, or a substrate such as glass or quartz.

  On the surface of the semiconductor wafer or the substrate, for example, devices such as ICs and LSIs are formed in each of a plurality of regions defined by division lines set in a lattice shape. When the workpiece is cut along the division line, and the workpiece is divided, a plurality of chips 1 having devices are formed.

  The formed chip 1 is thinned by grinding the back side. Alternatively, the semiconductor wafer or the substrate is thinned in advance, and then the thinned chip 1 is formed by dividing the semiconductor wafer or the substrate.

  For example, when trying to evaluate the bending strength of a very thin chip 1 having a thickness of 30 μm or less by a three-point bending method, even if the chip is pressed with an indenter, the chip is bent and the chip 1 cannot be destroyed. The bending strength cannot be evaluated. Therefore, the bending strength is evaluated by measuring the curvature using the apparatus 2 for measuring the curvature according to the present embodiment.

  Next, a method for measuring the curvature of the chip 1 implemented using the apparatus 2 for measuring curvature according to the present embodiment will be described. In this method, first, a chip holding step for holding the chip 1 is performed. The chip holding step will be described with reference to FIG. FIG. 6A is a schematic side view showing the chip 1, the first holding means 28 of the holding unit 2c, and the second holding means 30 of the holding unit 2c in the chip holding step.

  In the chip holding step, first, the chip 1 is placed on the first holding means 28 and the second holding means 30 so as to straddle the first holding means 28 and the second holding means 30. Put on. That is, the first region on the one end 3a side of the chip 1 is placed on the first support surface 28a on the upper surface of the first support body of the first holding means 28, and the second support body of the second holding means 30 is placed. The second region on the other end 3b side of the chip 1 is placed on the second support surface 30a on the upper surface.

  Then, the high voltage application unit 40a (see FIG. 4) is operated, a high voltage is applied to the electrodes 44a and 44b, the high voltage application unit 40b (see FIG. 4) is operated, and the high voltage is applied to the electrodes 44c and 44d. Apply. Then, the first area of the chip 1 is electrostatically held by the first holding means 28, and the second area of the chip 1 is electrostatically held by the second holding means 30.

  A portion between the first area electrostatically held by the first holding means 28 of the chip 1 and the second area electrostatically held by the second holding means 30 is the measurement area 9. Become. In the apparatus 2 for measuring the curvature, the measurement region 9 is then bent by relative movement between the first support of the first holding means 28 and the second support of the second holding means 30. The curvature of the measurement area 9 when the measurement area 9 is destroyed is measured.

  Next, the first movement step will be described. The first moving step is performed after the holding step. In the first moving step, the moving means (not shown) moves the first holding means 28 and the second holding means so that the cross-sectional shape of the measurement area 9 becomes an arc shape while the measurement area 9 is bent. 30 and relative movement. Then, the first support surface 28 a of the first holding means 28 and the second support surface 30 a of the second holding means 30 are made to face each other.

  FIG. 6B is a side view schematically showing the movement of the second holding means 30 in the first movement step. FIG. 6B shows the second holding means 30 and the chip 1 before movement, the second holding means 30 and the chip 1 that are in the process of movement in the first movement step, and the first movement step. The second holding means 30 and the chip 1 at the time of completion are shown. In the first moving step, for example, as shown in FIG. 6B, the second holding means 30 is moved.

  When the second holding means 30b is moved by the moving means so that the cross-sectional shape of the measurement region 9 of the chip 1 becomes an arc, the radius of curvature of the arc gradually decreases. That is, the curvature of the measurement region 9 gradually increases. As shown in FIG. 6B, when the first holding means 28 and the second holding means 30 face each other, the first moving step is completed.

  After performing the first movement step, the second movement step is performed. FIG. 7 is a side view schematically showing the first holding means 28, the second holding means 30, and the chip 1 in the second moving step. In the second moving step, the first holding means with the first support surface 28a of the first holding means 28 and the second support surface 30a of the second holding means 30 facing each other. 28 and the second holding means 30 are moved relative to each other in the direction approaching each other to increase the curvature of the measurement region 9.

  The second moving step will be further described in detail. FIG. 1 schematically shows a device 2 for measuring the curvature in the second movement step. In FIG. 1, some springs 24 are omitted. The second moving step is performed in a state where the holding unit 2c that holds the chip 1 is sandwiched between the table 2b mounted on the elevator 10 of the pressing unit 2a and the top plate 4. That is, in the second moving step, the pressing unit 2a functions as a moving unit.

  In the second moving step, the sprung plate 26 of the spring 24 mounted on the table 2 b is brought into contact with the second holding means 30, and the second holding means 30 is supported by the spring 24. The state in which the holding unit 28 and the second holding unit 30 face each other is maintained. In the second movement step, the height adjustment screw 14 of the elevator 10 is rotated to operate the telescopic mechanism 10b to raise the stage 12, and the first holding means 28, the second holding means 30, Reduce the distance.

  Next, a chip breakage detection step for detecting occurrence of chip breakage during the execution of the first moving step or the second moving step will be described. As the curvature of the measurement region 9 of the chip 1 gradually increases through the first movement step and the second movement step, the stress applied to the chip 1 gradually increases and eventually the measurement region 9 of the chip 1 is destroyed. Is done.

  The chip breakage detecting means for detecting occurrence of breakage of the chip 1 is, for example, an AE (acoustic emission) sensor. When the chip 1 breaks down, the strain energy stored in the chip 1 is released as an elastic wave. Therefore, the chip 1 is broken by providing an AE sensor on the surface of the chip 1 and detecting the elastic wave. Can be detected. Detection of the occurrence of breakage of the chip 1 may be performed by visual inspection of an operator or detection by a captured image.

  Next, the curvature detection step performed after the chip breakage detection step will be described. In the curvature detection step, when the destruction of the chip 1 is detected in the chip destruction detection step, the curvature of the chip 1 used for evaluating the bending strength of the chip 1 is obtained.

  The curvature detection means used in the curvature detection step is, for example, an imaging camera. The chip 1 is imaged from the imaging camera capable of imaging from the side of the chip 1 where an arc is formed in the measurement area 9 and the fracture occurs, and the curvature of the measurement area 9 of the chip 1 is obtained from the obtained captured image.

  Further, a non-contact type length measuring device may be used as the curvature detection means. For example, the measurement region 9 of the chip 1 may be profile measured using a laser length measuring device, and the curvature may be detected from the obtained three-dimensional shape of the measurement region 9. For the laser length measuring device, for example, an image processing system “XG-8000 series” manufactured by Keyence Corporation is used.

  Further, when the measurement area 9 of the chip 1 is broken in the first moving step, the curvature detecting means may be an angle meter provided at a portion electrostatically attracted to the second holding means 30 of the chip 1. In this case, the curvature of the measurement region 9 of the chip 1 is calculated from the angle indicated by the goniometer.

  When the breakage occurs in the measurement region 9 of the chip 1 in the second movement step, the digital gauge 16 provided in the device 2 can be used as the curvature detection means. The detection of curvature by the digital gauge 16 will be described with reference to FIG. According to the digital gauge 16 provided in the pressing unit 2a, the height of the stage 12 is measured.

  First, the height of the stage 12 at the start of the second movement step is set as an initial value. Further, the value at the start of the second movement step of the distance between the first holding means 28 and the second holding means 30 is measured in advance. When it is detected that the measurement area 9 of the chip 1 is broken, the height of the stage 12 is measured using the digital gauge 16, and the height of the stage 12 in the second moving step is measured from the measured value. Get the amount of increase.

  The amount of increase is the same as the amount of decrease in the distance between the first holding means 28 and the second holding means 30 from the start of the second moving step. Then, from the distance between the first holding means 28 and the second holding means 30 at the start of the second movement step, the first holding means 28 when the chip 1 is broken, The distance between the two holding means 30 is obtained.

  In the second moving step, when the distance is gradually reduced, the portion of the measurement region 9 of the chip 1 that is close to the first holding means 28 or the second holding means 30 is successively changed to the first. It comes into contact with the holding means 28 or the second holding means 30. Therefore, the measurement region 9 sandwiched between the first holding means 28 and the second holding means 30 has a semicircular shape with the distance as a diameter.

  That is, the radius of curvature of the measurement region 9 is the radius of the semicircle, and is a value obtained by dividing the distance into two equal parts. That is, the curvature of the measurement region 9 when the chip 1 is broken can be obtained from the value indicated by the digital gauge 16.

  When the curvature detection step is performed as described above, the curvature of the measurement region 9 when the chip 1 is broken is detected. As the bending strength of the chip 1 is higher, the curvature at which the chip 1 is broken increases. Therefore, the bending strength of the chip 1 can be evaluated by detecting the curvature of the measurement region 9 when the chip 1 is broken. Furthermore, when the curvature at the time of occurrence of breakage is obtained for a plurality of different chips and the respective curvatures are compared, superiority or inferiority of the bending strength can be determined.

  According to the method for measuring the curvature of the chip and the apparatus for measuring the curvature according to this embodiment, the curvature of the chip can be made to be a size that is difficult with the conventional three-point bending method. Also, the chip can be broken, and the bending strength of the chip can be evaluated.

  In particular, when the first holding means 28 and the second holding means 30 face each other and are moved relatively close to each other, the curvature of the measurement region 9 of the chip 1 can be extremely increased. Finally, when the portion held by the first holding means 28 of the chip 1 and the portion held by the second holding means 30 are brought into contact with each other, the chip 1 can be bent. The bending strength can be evaluated in a wide range.

  In addition, this invention is not limited to description of said embodiment, A various change can be implemented. For example, in the method of measuring the curvature of the chip and the apparatus for measuring the curvature according to one aspect of the present invention, the bending is further determined from the curvature of the chip at the time of occurrence of the failure, the material of the chip, and the thickness of the chip. The intensity may be calculated.

  Furthermore, by preparing a plurality of different sample chips with known bending strength and measuring the curvature at the time of occurrence of each breakage, the relationship between the bending strength and the curvature is obtained in advance, and the relationship is used. The bending strength may be obtained from the curvature at the time of occurrence of breakage of a chip whose bending strength is unknown.

  In addition, the structure, method, and the like according to the above-described embodiment can be appropriately modified and implemented without departing from the scope of the object of the present invention.

2 Device 2a Press unit 2b Table 2c Holding unit 4 Top plate 6 Base 8 Post 10 Elevator 10a Fixing plate 10b Telescopic mechanism 12 Stage 14 Height adjusting screw 16 Digital gauge 16a Body 16b Shaft 16c Signal line 18 Display unit 20 Upper surface 20a, 20b Region 22 Groove 24 Spring 26 Spring top plate 28, 30 Holding means 28a, 30a Support surface 32a, 32b Electrostatic holding portion 34a, 32b Insulator 36a, 36b Band-shaped rubber container 38 Band-shaped rubber 40a, 40b High voltage application unit 42a, 42b, 42c, 42d Conductor 44a, 44b, 44c, 44d Electrode 46a, 46b Insulator 1 Chip 3a, 3b End 9 Measurement area

Claims (2)

A method of measuring the curvature of a chip when the chip is broken in a chip bending test,
The first region on one end side of the chip before being bent is held on the support surface of the first holding means including the first support body whose upper surface is the support surface, and the first region on the other end side of the chip is held. A chip holding step of holding the second region on the support surface of the second holding means including a second support body whose upper surface is a support surface;
After performing the holding step, the first measurement area is bent so that the cross-sectional shape of the measurement area becomes an arc shape while bending the measurement area between the first area and the second area of the chip. The first support body of the holding means and the second support body of the second holding means are relatively moved so that the support surface of the first holding means and the support surface of the second holding means And a first movement step for facing each other,
After carrying out the first moving step, the first support of the first holding means with the support surface of the first holding means and the support surface of the second holding means facing each other And a second moving step for relatively moving the second support of the second holding means in a direction approaching each other,
A chip breakage detecting step for detecting that the chip is broken during the execution of the first moving step or the second moving step;
A curvature detection step for detecting a curvature of the measurement region when chip breakage is detected in the chip breakage detection step;
A method for measuring the curvature of a chip, comprising: An apparatus for measuring the curvature of a chip when the chip is broken in a chip bending test,
First holding means for holding the first region on one end side of the chip in a state before bending on the first support surface on the upper surface of the first support, and the second region on the other end side of the chip Second holding means for holding on the second support surface of the upper surface of the two support bodies;
A cross section of the measurement area while bending the measurement area between the first area and the second area of the chip held by the first holding means and the second holding means. The first support surface of the first holding means and the second support body of the second holding means are moved relative to each other so that the shape becomes an arc shape, and the first support surface, The second support surface is made to face, and then the first support body of the first holding means and the second support body of the second holding means are relatively moved in a direction approaching each other. Moving means to cause
Chip breakage detecting means for detecting breakage of the chip during relative movement between the first support body of the first holding means and the second support body of the second holding means by the moving means When,
Curvature detecting means for detecting the curvature of the measurement region when chip breakage is detected by the chip breakage detecting means;
A device for measuring the curvature of a chip, comprising: