JP2018198275A - コイル内蔵基板及びその製造方法 - Google Patents

コイル内蔵基板及びその製造方法 Download PDF

Info

Publication number
JP2018198275A
JP2018198275A JP2017102816A JP2017102816A JP2018198275A JP 2018198275 A JP2018198275 A JP 2018198275A JP 2017102816 A JP2017102816 A JP 2017102816A JP 2017102816 A JP2017102816 A JP 2017102816A JP 2018198275 A JP2018198275 A JP 2018198275A
Authority
JP
Japan
Prior art keywords
coil
conductor
substrate
layers
built
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2017102816A
Other languages
English (en)
Japanese (ja)
Other versions
JP2018198275A5 (https=
Inventor
普崇 谷口
Hirotaka Taniguchi
普崇 谷口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ibiden Co Ltd
Original Assignee
Ibiden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibiden Co Ltd filed Critical Ibiden Co Ltd
Priority to JP2017102816A priority Critical patent/JP2018198275A/ja
Priority to US15/988,034 priority patent/US20180342342A1/en
Publication of JP2018198275A publication Critical patent/JP2018198275A/ja
Publication of JP2018198275A5 publication Critical patent/JP2018198275A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0033—Printed inductances with the coil helically wound around a magnetic core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F5/00—Coils
    • H01F5/04—Arrangements of electric connections to coils, e.g. leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H01F2017/002—Details of via holes for interconnecting the layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
JP2017102816A 2017-05-24 2017-05-24 コイル内蔵基板及びその製造方法 Pending JP2018198275A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2017102816A JP2018198275A (ja) 2017-05-24 2017-05-24 コイル内蔵基板及びその製造方法
US15/988,034 US20180342342A1 (en) 2017-05-24 2018-05-24 Coil built-in substrate and method for manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017102816A JP2018198275A (ja) 2017-05-24 2017-05-24 コイル内蔵基板及びその製造方法

Publications (2)

Publication Number Publication Date
JP2018198275A true JP2018198275A (ja) 2018-12-13
JP2018198275A5 JP2018198275A5 (https=) 2019-03-22

Family

ID=64401123

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017102816A Pending JP2018198275A (ja) 2017-05-24 2017-05-24 コイル内蔵基板及びその製造方法

Country Status (2)

Country Link
US (1) US20180342342A1 (https=)
JP (1) JP2018198275A (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020188150A (ja) * 2019-05-15 2020-11-19 株式会社デンソー インダクタおよびその製造方法
JP2024048463A (ja) * 2022-09-28 2024-04-09 Tdk株式会社 コイル部品及びその製造方法

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI655884B (zh) * 2017-09-15 2019-04-01 欣興電子股份有限公司 載板結構
KR102029582B1 (ko) * 2018-04-19 2019-10-08 삼성전기주식회사 코일부품 및 그 제조방법
KR102662853B1 (ko) * 2019-09-30 2024-05-03 삼성전기주식회사 인쇄회로기판
KR102789046B1 (ko) * 2019-10-29 2025-04-01 삼성전기주식회사 인쇄회로기판
JP2021097129A (ja) * 2019-12-17 2021-06-24 イビデン株式会社 インダクタ内蔵基板
KR102867852B1 (ko) * 2020-11-19 2025-10-01 삼성전기주식회사 인쇄회로기판
JP2022175770A (ja) * 2021-05-14 2022-11-25 株式会社東芝 絶縁素子

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10139707A1 (de) * 2001-08-11 2003-02-20 Philips Corp Intellectual Pty Leiterplatte
US7212094B2 (en) * 2002-10-31 2007-05-01 Matsushita Electric Industrial Co., Ltd. Inductive components and electronic devices using the same
JP2006032587A (ja) * 2004-07-15 2006-02-02 Matsushita Electric Ind Co Ltd インダクタンス部品およびその製造方法
TWI305479B (en) * 2006-02-13 2009-01-11 Advanced Semiconductor Eng Method of fabricating substrate with embedded component therein
KR101296996B1 (ko) * 2011-07-25 2013-08-14 니혼도꾸슈도교 가부시키가이샤 배선기판
US9101072B2 (en) * 2011-10-31 2015-08-04 Tripod Technology Corporation Method of embedding magnetic component in substrate
JP2014154813A (ja) * 2013-02-13 2014-08-25 Ibiden Co Ltd プリント配線板
JP2014232837A (ja) * 2013-05-30 2014-12-11 イビデン株式会社 配線板

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020188150A (ja) * 2019-05-15 2020-11-19 株式会社デンソー インダクタおよびその製造方法
JP2024048463A (ja) * 2022-09-28 2024-04-09 Tdk株式会社 コイル部品及びその製造方法

Also Published As

Publication number Publication date
US20180342342A1 (en) 2018-11-29

Similar Documents

Publication Publication Date Title
JP2018198275A (ja) コイル内蔵基板及びその製造方法
US9287034B2 (en) Printed wiring board, inductor component, and method for manufacturing inductor component
JP3760101B2 (ja) 多層プリント配線板およびその製造方法
US10674608B2 (en) Printed circuit board and manufacturing method thereof
US20160042861A1 (en) Printed wiring board
US20090095509A1 (en) Core substrate and method of producing the same
US10586650B2 (en) Coil substrate and method for manufacturing the same
KR20140047953A (ko) 다층 인쇄회로기판 및 그 제조 방법
JP2017220502A (ja) インダクタ部品、インダクタ部品の製造方法
US10674615B2 (en) Method for manufacturing wiring board
TW201637522A (zh) 具有輪廓化導電層的印刷電路板及其製造方法
JP2018198277A (ja) コイル内蔵基板
JP2018160491A (ja) コイル基板
JP2022119655A (ja) 配線基板
US11871515B2 (en) Wiring substrate
JPH07135114A (ja) 積層形プリントコイル及びその製造方法
US20190200465A1 (en) Multilayer wiring board
JP2018018934A (ja) プリント配線板及びその製造方法
JP3290510B2 (ja) 積層形モールドコイル及びその製造方法
EP1631134B1 (en) Multilayer circuit board and method of producing the same
US11122686B2 (en) Wiring substrate
JPWO2013171847A1 (ja) 円盤状コイルおよび円盤状コイルの製造方法
JP2018152512A (ja) プリント配線板の製造方法
JP2016054186A (ja) プリント配線板
JP2024058997A (ja) 多層配線基板及びその製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20190206

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20190315