JP2018186080A5 - - Google Patents

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Publication number
JP2018186080A5
JP2018186080A5 JP2018072205A JP2018072205A JP2018186080A5 JP 2018186080 A5 JP2018186080 A5 JP 2018186080A5 JP 2018072205 A JP2018072205 A JP 2018072205A JP 2018072205 A JP2018072205 A JP 2018072205A JP 2018186080 A5 JP2018186080 A5 JP 2018186080A5
Authority
JP
Japan
Prior art keywords
printed memory
conductive pad
conductive
subset
grid connector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2018072205A
Other languages
English (en)
Japanese (ja)
Other versions
JP2018186080A (ja
JP6978372B2 (ja
Filing date
Publication date
Priority claimed from US15/498,219 external-priority patent/US10319415B2/en
Application filed filed Critical
Publication of JP2018186080A publication Critical patent/JP2018186080A/ja
Publication of JP2018186080A5 publication Critical patent/JP2018186080A5/ja
Application granted granted Critical
Publication of JP6978372B2 publication Critical patent/JP6978372B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2018072205A 2017-04-26 2018-04-04 プリンテッドメモリのグリッドコネクタ Active JP6978372B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/498,219 2017-04-26
US15/498,219 US10319415B2 (en) 2017-04-26 2017-04-26 Printed memory grid connector

Publications (3)

Publication Number Publication Date
JP2018186080A JP2018186080A (ja) 2018-11-22
JP2018186080A5 true JP2018186080A5 (enExample) 2021-05-20
JP6978372B2 JP6978372B2 (ja) 2021-12-08

Family

ID=62062796

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018072205A Active JP6978372B2 (ja) 2017-04-26 2018-04-04 プリンテッドメモリのグリッドコネクタ

Country Status (5)

Country Link
US (1) US10319415B2 (enExample)
EP (1) EP3422021B1 (enExample)
JP (1) JP6978372B2 (enExample)
KR (1) KR102319948B1 (enExample)
CN (1) CN108804049B (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070093157A1 (en) 2005-10-20 2007-04-26 Kimberly-Clark Worldwide, Inc. High speed, pressure bonded, thin sheet laminate

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6174175B1 (en) * 1999-04-29 2001-01-16 International Business Machines Corporation High density Z-axis connector
US20080225476A1 (en) * 2006-01-11 2008-09-18 Chris Karabatsos Tab wrap foldable electronic assembly module and method of manufacture
US8381601B2 (en) * 2008-05-05 2013-02-26 John F. Stumpf Transducer matrix film
US20110208895A1 (en) * 2010-02-22 2011-08-25 Garmin Ltd. Methods for memory programming during product assembly
KR101467469B1 (ko) * 2013-04-03 2014-12-02 (주) 파루 인쇄 메모리 회로 장치 및 이를 이용한 rfid 태그
CN105659255B (zh) * 2013-08-28 2019-09-20 惠普发展公司，有限责任合伙企业 包括自动自毁特征的盒体
KR102218743B1 (ko) * 2014-08-01 2021-02-22 삼성전자주식회사 집적 회로 카드 소켓
CN105788642A (zh) * 2015-01-11 2016-07-20 杭州海存信息技术有限公司 固态光盘和固态存储服务器
KR102257031B1 (ko) * 2015-03-13 2021-05-27 삼성전자주식회사 반도체 집적 회로 설계 방법
US10114984B2 (en) * 2015-09-04 2018-10-30 Xerox Corporation Symmetric bit coding for printed memory devices

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