KR102319948B1 - 인쇄 메모리 그리드 커넥터 - Google Patents

인쇄 메모리 그리드 커넥터 Download PDF

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Publication number
KR102319948B1
KR102319948B1 KR1020180041049A KR20180041049A KR102319948B1 KR 102319948 B1 KR102319948 B1 KR 102319948B1 KR 1020180041049 A KR1020180041049 A KR 1020180041049A KR 20180041049 A KR20180041049 A KR 20180041049A KR 102319948 B1 KR102319948 B1 KR 102319948B1
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KR
South Korea
Prior art keywords
conductive pads
memory
conductive
grid connector
subset
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020180041049A
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English (en)
Korean (ko)
Other versions
KR20180120082A (ko
Inventor
에이. 두디 마이클
이. 컬즈 칼
Original Assignee
제록스 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 제록스 코포레이션 filed Critical 제록스 코포레이션
Publication of KR20180120082A publication Critical patent/KR20180120082A/ko
Application granted granted Critical
Publication of KR102319948B1 publication Critical patent/KR102319948B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/12—Digital output to print unit, e.g. line printer, chain printer
    • G06F3/1201—Dedicated interfaces to print systems
    • G06F3/1223—Dedicated interfaces to print systems specifically adapted to use a particular technique
    • G06F3/1236—Connection management
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/12—Digital output to print unit, e.g. line printer, chain printer
    • G06F3/1201—Dedicated interfaces to print systems
    • G06F3/1278—Dedicated interfaces to print systems specifically adapted to adopt a particular infrastructure
    • G06F3/1279—Controller construction, e.g. aspects of the interface hardware
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C5/00—Details of stores covered by group G11C11/00
    • G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
    • G11C5/025—Geometric lay-out considerations of storage- and peripheral-blocks in a semiconductor storage device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/07—Structure, shape, material or disposition of the bonding areas after the connecting process
    • H01L24/09—Structure, shape, material or disposition of the bonding areas after the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Credit Cards Or The Like (AREA)
KR1020180041049A 2017-04-26 2018-04-09 인쇄 메모리 그리드 커넥터 Expired - Fee Related KR102319948B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/498,219 2017-04-26
US15/498,219 US10319415B2 (en) 2017-04-26 2017-04-26 Printed memory grid connector

Publications (2)

Publication Number Publication Date
KR20180120082A KR20180120082A (ko) 2018-11-05
KR102319948B1 true KR102319948B1 (ko) 2021-10-29

Family

ID=62062796

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020180041049A Expired - Fee Related KR102319948B1 (ko) 2017-04-26 2018-04-09 인쇄 메모리 그리드 커넥터

Country Status (5)

Country Link
US (1) US10319415B2 (enExample)
EP (1) EP3422021B1 (enExample)
JP (1) JP6978372B2 (enExample)
KR (1) KR102319948B1 (enExample)
CN (1) CN108804049B (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070093157A1 (en) 2005-10-20 2007-04-26 Kimberly-Clark Worldwide, Inc. High speed, pressure bonded, thin sheet laminate

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080225476A1 (en) 2006-01-11 2008-09-18 Chris Karabatsos Tab wrap foldable electronic assembly module and method of manufacture
US20160036144A1 (en) 2014-08-01 2016-02-04 Samsung Electronics Co., Ltd. Integrated circuit card socket
US20170068830A1 (en) 2015-09-04 2017-03-09 Xerox Corporation Symmetric bit coding for printed memory devices

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6174175B1 (en) * 1999-04-29 2001-01-16 International Business Machines Corporation High density Z-axis connector
US8381601B2 (en) * 2008-05-05 2013-02-26 John F. Stumpf Transducer matrix film
US20110208895A1 (en) * 2010-02-22 2011-08-25 Garmin Ltd. Methods for memory programming during product assembly
KR101467469B1 (ko) * 2013-04-03 2014-12-02 (주) 파루 인쇄 메모리 회로 장치 및 이를 이용한 rfid 태그
CN105659255B (zh) * 2013-08-28 2019-09-20 惠普发展公司，有限责任合伙企业 包括自动自毁特征的盒体
CN105788642A (zh) * 2015-01-11 2016-07-20 杭州海存信息技术有限公司 固态光盘和固态存储服务器
KR102257031B1 (ko) * 2015-03-13 2021-05-27 삼성전자주식회사 반도체 집적 회로 설계 방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080225476A1 (en) 2006-01-11 2008-09-18 Chris Karabatsos Tab wrap foldable electronic assembly module and method of manufacture
US20160036144A1 (en) 2014-08-01 2016-02-04 Samsung Electronics Co., Ltd. Integrated circuit card socket
US20170068830A1 (en) 2015-09-04 2017-03-09 Xerox Corporation Symmetric bit coding for printed memory devices

Also Published As

Publication number Publication date
EP3422021A1 (en) 2019-01-02
JP2018186080A (ja) 2018-11-22
CN108804049B (zh) 2021-01-05
KR20180120082A (ko) 2018-11-05
CN108804049A (zh) 2018-11-13
JP6978372B2 (ja) 2021-12-08
US20180315456A1 (en) 2018-11-01
EP3422021B1 (en) 2020-06-10
US10319415B2 (en) 2019-06-11

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