JP2018145524A - 電気メッキのための幅広リップシール - Google Patents

電気メッキのための幅広リップシール Download PDF

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Publication number
JP2018145524A
JP2018145524A JP2018034439A JP2018034439A JP2018145524A JP 2018145524 A JP2018145524 A JP 2018145524A JP 2018034439 A JP2018034439 A JP 2018034439A JP 2018034439 A JP2018034439 A JP 2018034439A JP 2018145524 A JP2018145524 A JP 2018145524A
Authority
JP
Japan
Prior art keywords
lip seal
electroplating
wafer
semiconductor substrate
protrusion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2018034439A
Other languages
English (en)
Japanese (ja)
Inventor
カリ・ソルケルソン
Thorkelsson Kari
アーロン・バーク
Aaron Burke
サントシュ・クマル
Kumar Santosh
ロバート・ラッシュ
Rash Robert
リー・ペン・チュア
Lee Peng Chua
ブライアン・バカレウ
Buckalew Bryan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of JP2018145524A publication Critical patent/JP2018145524A/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/004—Sealing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/007—Current directing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
    • H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrodes Of Semiconductors (AREA)
JP2018034439A 2017-03-01 2018-02-28 電気メッキのための幅広リップシール Pending JP2018145524A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/446,631 US20180251907A1 (en) 2017-03-01 2017-03-01 Wide lipseal for electroplating
US15/446,631 2017-03-01

Publications (1)

Publication Number Publication Date
JP2018145524A true JP2018145524A (ja) 2018-09-20

Family

ID=63357279

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018034439A Pending JP2018145524A (ja) 2017-03-01 2018-02-28 電気メッキのための幅広リップシール

Country Status (6)

Country Link
US (1) US20180251907A1 (ko)
JP (1) JP2018145524A (ko)
KR (2) KR20180100488A (ko)
CN (1) CN108531953B (ko)
SG (1) SG10201801584QA (ko)
TW (1) TW201841301A (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7081063B1 (ja) * 2021-10-18 2022-06-06 株式会社荏原製作所 めっき方法及びめっき装置
TWI803026B (zh) * 2021-10-25 2023-05-21 日商荏原製作所股份有限公司 鍍覆方法及鍍覆裝置

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7132135B2 (ja) * 2019-01-23 2022-09-06 上村工業株式会社 ワーク保持治具及び電気めっき装置
JP7132136B2 (ja) * 2019-01-23 2022-09-06 上村工業株式会社 ワーク保持治具及び電気めっき装置
JP7132134B2 (ja) * 2019-01-23 2022-09-06 上村工業株式会社 ワーク保持治具及び電気めっき装置
WO2020236497A1 (en) * 2019-05-17 2020-11-26 Lam Research Corporation Substrate sticking and breakage mitigation
US11352711B2 (en) * 2019-07-16 2022-06-07 Applied Materials, Inc. Fluid recovery in semiconductor processing
US20230012414A1 (en) * 2019-11-27 2023-01-12 Lam Research Corporation Edge removal for through-resist plating

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013040404A (ja) * 2011-08-15 2013-02-28 Novellus Systems Inc 半導体電気メッキ装置用のリップシールおよびコンタクト部

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7033465B1 (en) * 2001-11-30 2006-04-25 Novellus Systems, Inc. Clamshell apparatus with crystal shielding and in-situ rinse-dry
US7985325B2 (en) * 2007-10-30 2011-07-26 Novellus Systems, Inc. Closed contact electroplating cup assembly
US8172992B2 (en) * 2008-12-10 2012-05-08 Novellus Systems, Inc. Wafer electroplating apparatus for reducing edge defects
JP6745103B2 (ja) * 2014-11-26 2020-08-26 ノベラス・システムズ・インコーポレーテッドＮｏｖｅｌｌｕｓ Ｓｙｓｔｅｍｓ Ｉｎｃｏｒｐｏｒａｔｅｄ 半導体電気メッキ装置用のリップシールおよび接触要素

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013040404A (ja) * 2011-08-15 2013-02-28 Novellus Systems Inc 半導体電気メッキ装置用のリップシールおよびコンタクト部

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7081063B1 (ja) * 2021-10-18 2022-06-06 株式会社荏原製作所 めっき方法及びめっき装置
CN115135618A (zh) * 2021-10-18 2022-09-30 株式会社荏原制作所 镀覆方法及镀覆装置
WO2023067650A1 (ja) * 2021-10-18 2023-04-27 株式会社荏原製作所 めっき方法及びめっき装置
TWI803026B (zh) * 2021-10-25 2023-05-21 日商荏原製作所股份有限公司 鍍覆方法及鍍覆裝置

Also Published As

Publication number Publication date
TW201841301A (zh) 2018-11-16
CN108531953B (zh) 2022-07-12
CN108531953A (zh) 2018-09-14
US20180251907A1 (en) 2018-09-06
KR20230153982A (ko) 2023-11-07
SG10201801584QA (en) 2018-10-30
KR20180100488A (ko) 2018-09-11

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