JP2018129439A - Liquid processing device and liquid processing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technique capable of suppressing the problem of discharge of a resist liquid nozzle when a resist liquid is discharged from the resist liquid nozzle toward a wafer.SOLUTION: In a resist coating apparatus for supplying and coating a resist liquid to a wafer W that is held horizontally, sealing jigs 4 are individually and detachably provided to resist liquid nozzles 3a-3c provided to a common nozzle unit 5. The sealing jig 4 mounted to the resist liquid nozzle 3a supplying a resist liquid to the wafer W that is held by a cup module 2 is removed by a nozzle bus 6, and the resist liquid nozzle 3a is moved above the wafer W to supply a resist liquid therethrough. After finishing the supply of a resist liquid, the sealing jig 4 is mounted to the resist liquid nozzle 3a by the nozzle bus 6.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a technique for supplying a processing liquid from a nozzle to a horizontally held substrate and performing liquid processing on the substrate.

  In a liquid processing unit for applying a resist solution used in a photoresist process, which is one of semiconductor manufacturing processes, and a coating solution for an antireflection film, for example, a coating solution is applied from a coating solution nozzle to a substrate held by a spin chuck. Is used to apply spin coating.

  With the recent diversification of semiconductor circuits, a resist solution having a high viscosity may be used. However, when the viscosity of the resist solution increases, there is a problem that the resist solution tends to remain on the inner surface of the nozzle after completion of the discharge of the resist solution, and the remaining resist solution is dried and fixed when the tip of the nozzle touches the outside air. This causes generation of coating spots on the resist film and adhesion of particles.

  For this reason, conventionally, by increasing the frequency of dummy dispensing for discharging the resist solution on the standby bus before discharging the coating solution from the coating solution nozzle, the adhering portion is dissolved and removed to suppress adhesion. In addition, by supplying a solvent to the tip of the coating liquid nozzle at the standby position of the nozzle head and cleaning the tip of the coating liquid nozzle, the adhesion of the resist solution is suppressed, or a solvent such as thinner from the tip into the coating liquid nozzle. It has also been studied to suppress the drying of the resist solution by forming a thinner layer between the tip surface of the resist solution and the discharge port. However, in such a configuration, there is a problem that consumption of the resist solution and the solvent increases. Patent Documents 1 and 2 describe techniques for preventing nozzle drying. However, it is limited to prevention of drying at the standby position of the nozzle.

Further, as described in Patent Document 3, a technique for performing liquid processing by providing a processing liquid nozzle common to a plurality of liquid processing modules and moving the processing liquid nozzle to a liquid processing module for processing is known. . In such a liquid processing apparatus, when the nozzle moves, the resist liquid may fall off from the tip of the nozzle, which may cause adhesion to the wafer and contamination of the liquid processing module.
As described above, conventionally, the processing liquid at the tip of the nozzle is dried and cannot be discharged normally, or there is a problem in discharging the processing liquid from the nozzle, such as discharging when the liquid does not need to be discharged (bottom drop). There was concern.

JP 2005-279616 A JP 2009-117529 A Japanese Patent Publication No. 5672204

  The present invention has been made under such circumstances, and an object of the present invention is to provide a technique capable of suppressing the discharge failure of the processing liquid nozzle when discharging the processing liquid from the processing liquid nozzle toward the substrate. It is to provide.

The liquid processing apparatus of the present invention includes a cup module configured by providing a substrate holding part for holding the substrate horizontally in the cup body,
A treatment liquid nozzle provided on the arm portion for supplying a treatment liquid to the substrate;
A sealing jig for closing the discharge port of the processing liquid nozzle;
An attachment / detachment mechanism for attaching / detaching the sealing jig to / from the treatment liquid nozzle;
And a moving mechanism for moving the treatment liquid nozzle through the arm portion.

The liquid processing method of the present invention includes a step of horizontally holding a substrate on the substrate holding portion of a cup module configured by providing a substrate holding portion in a cup body,
A process liquid nozzle for supplying a process liquid to the substrate is positioned in a jig holding part in a state where a sealing jig for closing the discharge port of the process liquid nozzle is mounted,
Next, a step of removing the sealing jig by an attaching / detaching mechanism that attaches / detaches the sealing jig at the jig holding portion;
Subsequently, the process liquid nozzle is moved to a position where the process liquid is supplied to the substrate, and a liquid process is performed.
And a step of moving the processing liquid nozzle to a jig holding portion and mounting the sealing jig by the attachment / detachment mechanism.

  The present invention provides a sealing jig for closing the discharge port of the processing liquid nozzle when supplying the processing liquid to the horizontally held substrate. Before supplying the processing liquid to the substrate, the sealing jig is removed and the processing liquid is supplied, and the sealing jig is mounted after the processing liquid is supplied. Therefore, when the processing liquid nozzle is not used, drying and solidification of the liquid at the tip of the nozzle can be suppressed, and the dropping of the processing liquid can be suppressed.

1 is a perspective view showing a resist coating apparatus according to an embodiment of the present invention. 1 is a longitudinal sectional view showing a resist coating apparatus according to an embodiment of the present invention. It is sectional drawing of the nozzle head in a resist liquid supply apparatus, and a perspective view of a sealing jig. It is a longitudinal cross-sectional view which shows the nozzle bath in a resist coating device. It is explanatory drawing which shows the effect | action of a resist coating apparatus. It is explanatory drawing which shows attachment / detachment of a sealing jig. It is explanatory drawing which shows attachment / detachment of a sealing jig. It is explanatory drawing which shows the effect | action of a resist coating apparatus. It is explanatory drawing which shows the effect | action of a resist coating apparatus. It is explanatory drawing which shows the washing | cleaning of the process liquid nozzle in a nozzle bath. It is explanatory drawing which shows the dummy dispense in a nozzle bath. It is explanatory drawing which shows washing | cleaning of the sealing jig in a nozzle bath. It is explanatory drawing which shows the effect | action of the resist coating apparatus which concerns on the other example of embodiment of this invention. It is explanatory drawing which shows the effect | action of the resist coating apparatus which concerns on the other example of embodiment of this invention. It is explanatory drawing which shows the effect | action of the resist coating apparatus which concerns on the other example of embodiment of this invention. It is explanatory drawing which shows the effect | action of the resist coating apparatus which concerns on the other example of embodiment of this invention.

  An embodiment in which the liquid processing apparatus of the present invention is applied to a resist coating apparatus that supplies and applies a resist solution, which is a processing liquid, to a wafer W will be described. As shown in FIGS. 1 and 2, the resist coating apparatus includes a cup module 2, a nozzle unit 5, and a nozzle bath 6 on a base 100. The cup module 2 includes a spin chuck 11 that is a substrate holding unit that holds the wafer W horizontally by vacuum-sucking the central portion of the back surface of the wafer W having a diameter of 300 mm, for example. The spin chuck 11 is connected to a rotating mechanism 13 from below through a shaft portion 12, and can be rotated around the vertical axis by the rotating mechanism 13.

  A circular plate 14 is provided below the spin chuck 11 so as to surround the shaft portion 12 with a gap. Three elevating pins 15 are provided at equal intervals in the circumferential direction so as to penetrate the circular plate 14, and these elevating pins 15 are moved up and down between the transfer arm outside the resist coating apparatus and the spin chuck 11. Has the role of handing over W. In the figure, 16 is an elevating mechanism for elevating the elevating pins 15.

  A cup body 20 is provided so as to surround the spin chuck 11. The cup body 20 is configured to receive the drained liquid splashed or spilled from the rotating wafer W and to discharge the drained liquid to the outside of the resist coating apparatus. The cup body 20 includes a mountain-shaped guide portion 21 having a mountain-shaped cross section around the circular plate 14, and an annular vertical wall extending downward from the outer peripheral end of the mountain-shaped guide portion 21. 23 is provided. The chevron guide portion 21 guides the liquid spilled from the wafer W to the lower side outside the wafer W.

  Further, a vertical cylindrical portion 22 is provided so as to surround the outer side of the mountain-shaped guide portion 21, and an upper guide portion 24 that extends obliquely from the upper edge of the cylindrical portion 22 toward the inner upper side. The upper guide portion 24 is provided with a plurality of openings 25 in the circumferential direction. Further, on the lower side of the cylindrical portion 22, a ring-shaped liquid receiving portion 26 whose cross section is a concave shape is formed below the mountain-shaped guide portion 21 and the vertical wall 23. In the liquid receiving portion 26, a drainage passage 27 is connected to the outer peripheral side, and an exhaust pipe 28 is provided on the inner peripheral side of the drainage passage 27 so as to protrude from below.

  Further, a cylindrical portion 31 is provided so as to extend upward from the peripheral edge on the proximal end side of the upper guide portion 24, and an inclined wall 32 is provided so as to extend from the upper edge of the cylindrical portion 31 to the inside and upward. The liquid scattered by the rotation of the wafer W is received by the inclined wall 32, the upper guide part 24, and the cylindrical parts 23, 31 and introduced into the liquid discharge path 27.

  The nozzle unit 5 will be described with reference to FIG. 3 as well. The nozzle unit 5 includes, for example, a nozzle head 50 formed of a casing, and three openings 51 arranged in a line on the lower surface of the nozzle head 50 are formed. The resist solution nozzles 3a to 3c are respectively arranged corresponding to the respective openings 51. Each of the resist solution nozzles 3a to 3c has a discharge port 30 formed at the lower end, and is configured to discharge the resist solution downward.

  As shown in FIGS. 1 to 3, the base end side of each of the resist solution nozzles 3 a to 3 c is fixed to the lower surface of the nozzle head 50, and the resist solution supply pipe 31 that extends in the nozzle head 50 through each opening 51. The downstream end is connected. A resist solution supply source 32 is connected to the upstream end portion of the resist solution supply pipe 31, and a flow rate adjusting unit 33 and a valve 34 are provided from the upstream side. The resist solution stored in each resist solution supply source 32 has a resist component dissolved in a solvent as a solvent, and is adjusted to have a different viscosity for each resist solution supply source 32 depending on, for example, the content of the solvent.

  Further, as shown in FIG. 3, each of the resist solution nozzles 3 a to 3 c is provided with a sealing jig 4 that closes the discharge port 30 of the resist solution nozzles 3 a to 3 c. The sealing jig 4 is individually provided for each of the resist solution nozzles 3a to 3c, and is configured to be detachable from each of the resist solution nozzles 3a to 3c. FIG. 3 shows a state in which the sealing jig 4 of one resist solution nozzle 3a is removed and the sealing jig is attached to the other two resist solution nozzles 3b and 3c. Furthermore, the perspective view of the sealing jig 4 is shown in the figure.

  The sealing jig 4 includes a spherical sealing member 40 that closes the discharge ports 30 of the resist solution nozzles 3a to 3c. The sealing member 40 is supported by two support columns 41 extending vertically corresponding to the support member, and is made of a metal that is a magnetic material such as nickel and surrounds the base end portions of the resist solution nozzles 3a to 3c. It is fixed to an annular ring member 42. The ring member 42 may be an annular shape or a square shape. Further, the magnetic body may be provided in a part of the ring member 42. Further, for example, an annular electromagnet 44 along the edge of each opening 51 is disposed inside the nozzle head 50. Each electromagnet 44 is connected to a power supply unit 45, and each electromagnet 44 is configured to be individually switched on and off by a switch unit 46 provided correspondingly.

By applying an exciting current to the electromagnet 44, each electromagnet 44 attracts and fixes the ring member 42 of the sealing jig 4 by magnetic force. As a result, the sealing member 40 is positioned at the discharge port 30 of the resist solution nozzles 3a to 3c, and the tips of the resist solution nozzles 3a to 3c are closed. Further, by stopping the current supplied to the electromagnet 44, the magnetic force between the electromagnet 44 and the ring member 42 disappears, and the sealing jig 4 can be removed from the resist solution nozzles 3a to 3c. In this example, the electromagnet 44 and the ring member 42 constitute an attachment / detachment mechanism for attaching / detaching the sealing member 40 to / from the resist solution nozzles 3a to 3c.
Further, each post 41 of the sealing jig 4 is provided with a claw portion 43 that forms a locking portion protruding toward the outside of the sealing jig 4. As will be described later, the claw portion 43 is a holding portion that restricts the sealing jig 4 from falling into the nozzle bath 6 when the sealing jig 4 is held by the nozzle bath 6. The claw portions 43 of the respective sealing members 4 are locked so that the height positions of the ring members 42 are aligned.

  Returning to FIG. 1, the nozzle unit 5 is supported by a support arm 57 extending horizontally in a direction orthogonal to the direction in which the resist solution nozzles 3a to 3c are arranged (X-axis direction in FIG. 1). 57 is provided on the moving body 58 so as to be lifted and lowered by a lifting mechanism (not shown). Further, the support arm 57 is configured to be extendable and contractable so that the position of the nozzle head 5 moves in the X-axis direction. In this example, the support arm 57 and the nozzle head 50 correspond to the arm portion. The moving body 58 is configured to be guided on a guide rail 59 provided on the base 100 so as to extend in the direction in which the resist solution nozzles 3a to 3c are arranged (Y-axis direction in FIG. 1). The moving body 58 is guided and moved by a guide rail 59 by a ball screw mechanism or the like (not shown), whereby the nozzle unit 5 is connected to an upper region of the wafer W held by the cup module 2 and a nozzle provided outside the cup body 20. It moves between the nozzle bath 6 that is the standby position of the unit 5.

  As shown in FIGS. 1 and 4, the nozzle bath 6 includes a rectangular base 60, and the base 60 is formed with holes 61 that open to the upper surface side corresponding to the resist nozzles 3 a to 3 c. . The nozzle bath 6 also serves as a jig holding portion for holding the removed sealing jig 4, and the claw portion 43 of the sealing jig 4 is locked to the opening edge of the hole 61 as shown in FIG. 4. As a result, the sealing jig 4 is held.

A cleaning liquid discharge nozzle 62 for discharging a cleaning liquid into the hole 61 is provided on the inner surface of each hole 61. In FIG. 4, in order to avoid complicated description, the cleaning liquid discharge nozzle 62 is described only in the hole 61 described as holding the sealing jig 4, and is provided in the other hole 61. The description of the cleaning liquid discharge nozzle 62 is omitted.
Each cleaning liquid discharge nozzle 62 is connected to a cleaning liquid supply section 64 via a cleaning liquid supply path 63 and is configured to supply the cleaning liquid into each hole 61.

  One end of each drainage path 65 is opened at the bottom of each hole 61, and the other end of each drainage path 65 is configured by, for example, a pump for draining the liquid in the hole 61. It is connected to the drainage part 66. Each drainage passage 65 is provided with a valve 67, and is configured to store the above-described cleaning liquid in each hole 61 by closing the valve 67. By opening the valve 67, the inside of the hole 61 is provided. The liquid is drained.

  As shown in FIG. 2, the resist coating apparatus is provided with a control unit 10 which is a computer. For example, a program stored in a storage medium such as a flexible disk, a compact disk, a hard disk, an MO (magneto-optical disk), and a memory card is installed in the control unit 10. The installed program controls the operation of the resist coating apparatus by transmitting control signals such as movement of the nozzle unit 5 in the resist coating apparatus, attachment / detachment of the sealing jig 4 by switching the switch unit 46, and discharge of the resist solution to each unit. Instructions (each step) are embedded in

Next, the operation of the resist coating apparatus will be described. First, the wafer W is loaded into the resist coating apparatus by a transfer arm (not shown) provided outside the resist coating apparatus. The wafer W is placed on the spin chuck 11 by the cooperative action of the transfer arm and the lift pins 15. At this time, in the nozzle unit 5, the sealing jig 4 is mounted on all the resist solution nozzles 3a to 3c.
Next, as shown in FIG. 5, the nozzle unit 5 is moved from the standby position to the position of the nozzle bus 6, for example. In addition, you may make the nozzle unit 5 stand by in the position remove | deviated from the nozzle bath. Subsequently, the nozzle unit 5 is lowered, and the resist solution nozzles 3 a to 3 c each equipped with the sealing jig 4 are inserted into the respective holes 61 of the nozzle bath 6. At this time, as shown in FIG. 6, the claw portion 43 provided in each sealing jig 4 is locked to the opening edge of each hole 61. In this state, the resist solution nozzle that discharges the resist solution supplied to the wafer W, for example, the switch unit 46 corresponding to the resist solution nozzle 3a is turned off to stop the power supply to the electromagnet 44. As a result, the magnetic force between the sealing jig 4 for sealing the resist solution nozzle 3a and the electromagnet 44 disappears.

  Further, the nozzle unit 5 is raised as shown in FIG. At this time, the resist solution nozzle 3 a is pulled out from the sealing jig 4, and the claw 43 is inserted into the hole 61 while the sealing jig 4 that has sealed the resist solution nozzle 3 a is inserted into the hole 61. Locked and held at the opening edge. The other resist solution nozzles 3 b and 3 c are pulled out from the hole 61 in a state of being integrated with the sealing jig 4.

  Next, the nozzle unit 5 is moved above the wafer W as shown in FIG. At this time, the resist solution nozzles 3b and 3c move in a state of being sealed by the sealing jig 4, and the resist solution nozzle 3a moves in a state where the sealing jig 4 is not mounted. Subsequently, the resist solution nozzle 3a from which the sealing jig 4 has been removed is positioned above the center of the wafer W, and the resist solution is supplied to the center of the wafer W while rotating the wafer W, so that the resist solution is applied to the wafer W. A coating process is performed.

When the supply of the resist solution is finished, as shown in FIG. 9, the nozzle unit 5 is moved so that the resist solution nozzle 3a is positioned above the sealing jig 4 removed from the resist solution nozzle 3a. When the nozzle unit 5 is further lowered, the resist solution nozzle 3a is inserted into the sealing jig 4 held by the nozzle bus 6, and is in the same position as in FIG. In this state, when the switch unit 46 corresponding to the resist solution nozzle 3a is turned on, the corresponding electromagnet 44 is driven, and a magnetic force is generated between the electromagnet 44 and the sealing member 4, and is held in the nozzle bus 6. The sealing jig 4 is fixed. As a result, the sealing jig 4 is mounted on the resist solution nozzle 3 a, and the discharge port 30 is blocked by the sealing member 40.
Thereafter, after applying the resist solution to the wafer W, the wafer W is unloaded by an external transfer arm. Then, when supplying the resist solution to another wafer W, the sealing jig 4 attached to the resist solution nozzles 3a to 3c corresponding to the resist solution supplied to the wafer W is removed by the nozzle bath 6 and the same. A resist solution is supplied. At this time, for example, when using the resist solution nozzle 3b, the sealing jig 4 attached to the resist solution nozzle 3b is removed and the sealing jig 4 is attached to the other two resist solution nozzles 3a and 3c. Then, the resist solution is supplied in the same manner as in the example described above.

  According to the above-described embodiment, in the resist coating apparatus that supplies and coats the resist solution to the horizontally held wafer W, the resist solution nozzles 3a to 3c provided in the common nozzle unit 5 are individually sealed. The jig 4 is detachably provided by an attachment / detachment mechanism. Then, the sealing jig 4 attached to the resist solution nozzle 3a for supplying the resist solution to the wafer W held by the cup module 2 is removed by the nozzle bath 6 and moved above the wafer W, and the resist solution nozzle 3a is used to remove the resist. Liquid is being discharged. Further, after the supply of the resist solution is completed, the sealing jig 4 is attached to the resist solution nozzle 3 a by the nozzle bath 6.

When the resist solution is discharged from the resist solution nozzles 3a to 3c, the resist solution may remain on the inner surfaces of the resist solution nozzles 3a to 3c. When the remaining resist solution is dried, generation of particles or smearing of the resist solution may occur. It becomes a factor of. In the above-described embodiment, when the resist solution is not supplied, the discharge ports 30 of the resist solution nozzles 3a to 3c are sealed by the sealing jig 4, so that they adhere to the inside of the resist solution nozzles 3a to 3c. The drying of the resist solution can be suppressed.
Also, depending on the type of clogged resist solution, such as when the viscosity of the processing solution is as high as 10 cP to 500 cP, or depending on the type of clogged resist solution, such as the volatility of the solvent and the type of solid component, the resist solution is easy to dry and stick. Therefore, a larger effect can be obtained by applying the liquid processing apparatus of the present invention.

  Further, in the resist solution nozzles 3b and 3c other than the resist solution nozzle 3a for supplying the resist solution to the wafer W, the resist solution can be supplied in a state where the discharge port 30 is sealed. Therefore, when the nozzle unit 5 is moved over the wafer W, it is possible to prevent the resist solution from dropping from the resist solution nozzles 3b and 3c.

Further, for example, the present invention may be used in a developing device that supplies a developing solution to the wafer W to perform development, or a cleaning device that supplies a cleaning solution to the wafer W. Even in such an apparatus, it is possible to suppress the dropping of the treatment liquid, and the same effect is obtained. Also, for example, in an apparatus for applying a silicon oxide film, the same effect can be obtained because solidification of the coating solution remaining at the nozzle tip becomes a problem.
Further, since it is not necessary to suck the thinner at the tips of the resist solution nozzles 3a to 3c in order to prevent the tip of the resist solution nozzles 3a to 3c from being dried, the amount of thinner consumption can be reduced. Moreover, the film thickness fall by the resist solution in resist solution nozzle 3a-3c being exposed to a thinner atmosphere can be prevented. Furthermore, it is not necessary to perform dummy dispensing at high frequency in order to prevent drying of the tips in the resist solution nozzles 3a to 3c. Moreover, the number of processing liquid nozzles may be one.

  Further, for example, when the resist solution is not supplied, the nozzle unit 5 may be positioned in the nozzle bath 6 and the resist solution nozzles 3a to 3c may be washed and waited. For example, as shown in FIG. 10, each of the resist solution nozzles 3 a to 3 c is inserted into the corresponding hole 61 with the sealing jig 4 being mounted. Then, the valve 67 corresponding to each hole 61 may be closed so that the cleaning liquid is supplied and stored in the hole 61. Since the sealing jig 4 supports the sealing member 40 with the support column 41, the periphery of the resist solution nozzle is substantially open. Therefore, the resist liquid nozzles 3 a to 3 c are cleaned by being immersed in the cleaning liquid stored in the hole 61.

  After performing the dummy dispensing for discharging the resist solution after removing the sealing jig 4 from the resist solution nozzles 3a to 3c, the sealing jig 4 was removed and the nozzle unit 5 was raised as shown in FIG. Thereafter, the resist solution may be discharged toward the hole 61 that holds the sealing jig 4. Since the sealing jig 4 is in a state in which the periphery of the sealing member 40 is substantially open, the resist solution discharged toward the sealing member 40 is removed from the periphery of the sealing member 40 to the bottom of the hole 61. And drained through the drainage path 65.

Further, the sealing jig 4 held in the nozzle bath 6 may be cleaned as shown in FIG. For example, after the sealing jig 4 is removed from the resist solution nozzles 3a to 3c, the cleaning solution is stored in the hole 61, so that the sealing jig 4 is supplied while the resist solution is being supplied from the resist solution nozzles 3a to 3c. Can be washed.
Further, the attachment / detachment mechanism may be configured to fix the sealing jig 4 to the processing liquid nozzle by vacuum suction, for example. In such an example, for example, suction is performed by a vacuum pump. The sealing jig 4 can be attached and detached by switching between generation and disappearance of the suction force. In the embodiment described above, the electromagnet 44 is provided in the arm portion. However, the electromagnet 44 may be provided in the treatment liquid nozzle.

  The attaching / detaching mechanism is a jig moving mechanism that moves the sealing jig 4 up and down and horizontally moves the sealing jig 4 to a position that is out of the flow of the resist solution discharged from the resist solution nozzles 3a to 3c. Also good. In this example, for example, the resist solution nozzles 3a to 3c are moved to the resist solution supply position above the wafer W while the sealing jig 4 is mounted, and then the sealing jig 4 is lowered and horizontally moved. The sealing jig 4 is removed from the resist solution nozzle 3a that discharges the resist solution. Further, after the supply of the resist solution toward the wafer W is finished, the sealing jig 4 is moved horizontally and raised, and the sealing jig 4 is mounted on the resist liquid nozzle 3a. Even in such a configuration, since the resist solution nozzles 3a to 3c that are not used can be sealed by the sealing jig 4, the same effect can be obtained.

  In the present invention, the nozzle unit 5 common to the plurality of cup modules 2 may be provided. As shown in FIG. 13, for example, three cup modules 2A to 2C configured in the same manner as the cup module 2 shown in FIG. It is configured to move along a guide rail (not shown) extending in the direction in which the modules 2A to 2C are arranged. Further, each of the cup modules 2A to 2C is provided with nozzle buses 6A to 6C on one end side in the arrangement direction of the cup modules 2A to 2C, and in FIG. 13, on the left side of each cup module 2A to 2C when viewed from the front. Yes. The same effect can be obtained with a plurality of resist solution nozzles provided in the nozzle unit 5, but here, the resist solution nozzle is described as one example, and the reference numeral is 3.

As shown in FIG. 13, for example, the resist solution nozzle 3 is moved to the nozzle bath 6A corresponding to the cup module 2A that performs the liquid treatment first, and sealed from the resist solution nozzle 3 as shown in FIG. Remove the jig 4. Further, the nozzle unit 5 is moved above the wafer W held by the cup module 2 </ b> A, and a resist solution is supplied to the wafer W.
Next, as shown in FIG. 15, the resist solution nozzle 3 is returned to the nozzle bath 6 </ b> A that holds the sealing jig 4, and the sealing jig 4 is mounted. Subsequently, as shown in FIG. 16, the resist solution nozzle 3 having the sealing jig 4 mounted thereon is moved to the nozzle bath 6B corresponding to the cup module 2B that supplies the resist solution.

As described above, the nozzle buses 6A to 6C and the cup modules 2A to 2C are alternately arranged in a line, and the resist solution nozzle 3 is used for the wafers W held by the cup modules 2A to 2C and the cup modules 2A to 2C. Pass above. At this time, since the discharge port 30 of the resist solution nozzle 3 is sealed by the sealing jig 4, the resist solution adheres to the wafer W and the cup modules 2 </ b> A to 2 </ b> C are prevented from being contaminated due to the dropping of the resist solution. Can do.
Moreover, since the front end of the resist solution nozzle 3 can be sealed when the resist solution nozzle 3 moves between the nozzle baths 6A to 6C, drying of the resist solution in the resist solution nozzle 3 can be prevented.

  Further, one nozzle bath 6 is configured to clean the dummy dispense and resist solution nozzle 3 or the sealing jig 4, and the other nozzle bath 6 is configured to only hold the sealing jig 4. Also good.

2 (2A to 2C) Cup modules 3a to 3c Resist liquid nozzle 4 Sealing jig 5 Nozzle unit 6 (6A to 6C) Nozzle bus 10 Control unit 30 Discharge port 40 Sealing member 42 Ring member 44 Electromagnet W Wafer

Claims (11)

In the cup body, a cup module configured by providing a substrate holding portion for horizontally holding the substrate, and
A treatment liquid nozzle provided on the arm portion for supplying a treatment liquid to the substrate;
A sealing jig for closing the discharge port of the processing liquid nozzle;
An attachment / detachment mechanism for attaching / detaching the sealing jig to / from the treatment liquid nozzle;
A liquid processing apparatus comprising: a moving mechanism that moves the processing liquid nozzle through the arm portion. A plurality of the treatment liquid nozzles are provided in a common arm part,
The liquid processing apparatus according to claim 1, wherein the sealing jig is individually provided for each processing liquid nozzle. Provided outside the cup body, provided with a jig holding part for holding the sealing jig removed from the treatment liquid nozzle,
The liquid processing apparatus according to claim 1, wherein the moving mechanism moves the processing liquid nozzle between a supply position for supplying a processing liquid to the substrate and a jig holding unit. A plurality of the cup modules are provided,
The liquid processing apparatus according to claim 3, wherein the jig holding portion is individually provided for each cup module.   The liquid processing apparatus according to claim 3, wherein the jig holding portion is provided in a nozzle bath that performs dummy dispensing of the processing liquid. The sealing jig is
A sealing member for closing the discharge port of the treatment liquid nozzle;
An annular body including a part of the attachment / detachment mechanism and surrounding a base end of the treatment liquid nozzle;
The liquid processing apparatus according to claim 1, further comprising a support member that fixes the sealing member to the annular body.   The attachment / detachment mechanism includes an electromagnet provided in the arm part or the treatment liquid nozzle and a magnetic body provided in the sealing jig, and attaches / detaches the sealing jig by switching generation and disappearance of magnetic force of the electromagnet. The liquid processing apparatus according to claim 1, wherein the apparatus is a liquid processing apparatus. A step of horizontally holding the substrate on the substrate holding portion of the cup module configured by providing a substrate holding portion in the cup body;
A process liquid nozzle for supplying a process liquid to the substrate is positioned in a jig holding part in a state where a sealing jig for closing the discharge port of the process liquid nozzle is mounted,
Next, a step of removing the sealing jig by an attaching / detaching mechanism that attaches / detaches the sealing jig at the jig holding portion;
Subsequently, the process liquid nozzle is moved above the substrate, the process liquid is discharged from the process liquid nozzle onto the substrate, and a liquid process is performed.
And a step of moving the processing liquid nozzle to a jig holding part and mounting the sealing jig by the attachment / detachment mechanism. A plurality of the treatment liquid nozzles are provided in a common arm part,
The sealing jig is individually provided for each treatment liquid nozzle,
The step of positioning the processing liquid nozzle in the jig holding portion is positioned in a state in which sealing jigs are attached to all the processing liquid nozzles,
The step of removing the sealing jig is a step of selectively removing the sealing jig attached to the processing liquid nozzle for supplying the processing liquid to the substrate held by the substrate holding portion among the plurality of sealing jigs. And
The step of mounting the sealing jig is a step of mounting the sealing jig removed in the step of removing the sealing jig to a processing liquid nozzle that has discharged the processing liquid. The liquid processing method according to 8. A plurality of the cup modules are provided,
The jig holding part is individually provided for each cup module,
The step of positioning the processing liquid nozzle in the jig holding portion is a step of positioning the processing liquid nozzle in the jig holding portion corresponding to the cup module that performs liquid processing,
The step of removing the sealing jig is a step of removing the sealing jig attached to the processing liquid nozzle for performing liquid processing in the cup module.
10. The liquid processing method according to claim 7, wherein, after the step of mounting the sealing jig, the processing liquid nozzle is positioned on a jig holding portion corresponding to a cup module that performs liquid processing next. . The plurality of cup modules and the plurality of jig holding portions are arranged in a line,
The processing liquid nozzle moves so as to cross over the substrate held by the substrate holding part when moving from the position of one jig holding part to the position of another jig holding part. The liquid processing method according to claim 10.

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