JP2018107337A5 - - Google Patents

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Publication number
JP2018107337A5
JP2018107337A5 JP2016253933A JP2016253933A JP2018107337A5 JP 2018107337 A5 JP2018107337 A5 JP 2018107337A5 JP 2016253933 A JP2016253933 A JP 2016253933A JP 2016253933 A JP2016253933 A JP 2016253933A JP 2018107337 A5 JP2018107337 A5 JP 2018107337A5
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JP
Japan
Prior art keywords
conductive layer
electrode
electronic component
layer
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016253933A
Other languages
English (en)
Japanese (ja)
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JP2018107337A (ja
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Publication date
Application filed filed Critical
Priority to JP2016253933A priority Critical patent/JP2018107337A/ja
Priority claimed from JP2016253933A external-priority patent/JP2018107337A/ja
Publication of JP2018107337A publication Critical patent/JP2018107337A/ja
Publication of JP2018107337A5 publication Critical patent/JP2018107337A5/ja
Priority to JP2021016828A priority patent/JP2021145125A/ja
Pending legal-status Critical Current

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JP2016253933A 2016-12-27 2016-12-27 電子部品およびその製造方法 Pending JP2018107337A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2016253933A JP2018107337A (ja) 2016-12-27 2016-12-27 電子部品およびその製造方法
JP2021016828A JP2021145125A (ja) 2016-12-27 2021-02-04 電子部品およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016253933A JP2018107337A (ja) 2016-12-27 2016-12-27 電子部品およびその製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2021016828A Division JP2021145125A (ja) 2016-12-27 2021-02-04 電子部品およびその製造方法

Publications (2)

Publication Number Publication Date
JP2018107337A JP2018107337A (ja) 2018-07-05
JP2018107337A5 true JP2018107337A5 (enExample) 2019-10-17

Family

ID=62788230

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2016253933A Pending JP2018107337A (ja) 2016-12-27 2016-12-27 電子部品およびその製造方法
JP2021016828A Pending JP2021145125A (ja) 2016-12-27 2021-02-04 電子部品およびその製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2021016828A Pending JP2021145125A (ja) 2016-12-27 2021-02-04 電子部品およびその製造方法

Country Status (1)

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JP (2) JP2018107337A (enExample)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07283077A (ja) * 1994-04-11 1995-10-27 Ngk Spark Plug Co Ltd 薄膜コンデンサ
JPH08115851A (ja) * 1994-10-14 1996-05-07 Ngk Spark Plug Co Ltd 薄膜コンデンサ付きセラミック基板および その製造方法
JP3838827B2 (ja) * 1999-10-05 2006-10-25 新光電気工業株式会社 薄膜コンデンサ素子及びプリント回路基板の製造方法
JP2003142590A (ja) * 2001-11-06 2003-05-16 Matsushita Electric Ind Co Ltd 容量素子
JP2006114760A (ja) * 2004-10-15 2006-04-27 Alps Electric Co Ltd 薄膜キャパシタ素子およびその製造方法
JP4548262B2 (ja) * 2005-07-29 2010-09-22 Ｔｄｋ株式会社 下部電極構造
KR100649742B1 (ko) * 2005-10-19 2006-11-27 삼성전기주식회사 박막 커패시터가 내장된 인쇄회로기판 및 그 제조방법
JP4461386B2 (ja) * 2005-10-31 2010-05-12 Ｔｄｋ株式会社 薄膜デバイスおよびその製造方法
JP2007180093A (ja) * 2005-12-27 2007-07-12 Tdk Corp 薄膜デバイスおよびその製造方法
KR100878414B1 (ko) * 2006-10-27 2009-01-13 삼성전기주식회사 캐패시터 내장형 인쇄회로기판 및 제조방법
JP2016039512A (ja) * 2014-08-08 2016-03-22 キヤノン株式会社 電極が貫通配線と繋がったデバイス、及びその製造方法

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