JP2018101778A5 - - Google Patents

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Publication number
JP2018101778A5
JP2018101778A5 JP2017226522A JP2017226522A JP2018101778A5 JP 2018101778 A5 JP2018101778 A5 JP 2018101778A5 JP 2017226522 A JP2017226522 A JP 2017226522A JP 2017226522 A JP2017226522 A JP 2017226522A JP 2018101778 A5 JP2018101778 A5 JP 2018101778A5
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JP
Japan
Prior art keywords
temperature control
cooling
base
heat source
cooling fluid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2017226522A
Other languages
English (en)
Japanese (ja)
Other versions
JP6905923B2 (ja
JP2018101778A (ja
Filing date
Publication date
Priority claimed from US15/384,425 external-priority patent/US10279610B2/en
Application filed filed Critical
Publication of JP2018101778A publication Critical patent/JP2018101778A/ja
Publication of JP2018101778A5 publication Critical patent/JP2018101778A5/ja
Application granted granted Critical
Publication of JP6905923B2 publication Critical patent/JP6905923B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2017226522A 2016-12-20 2017-11-27 冷却インサート Expired - Fee Related JP6905923B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/384,425 US10279610B2 (en) 2016-12-20 2016-12-20 Cooling insert
US15/384,425 2016-12-20

Publications (3)

Publication Number Publication Date
JP2018101778A JP2018101778A (ja) 2018-06-28
JP2018101778A5 true JP2018101778A5 (https=) 2021-01-14
JP6905923B2 JP6905923B2 (ja) 2021-07-21

Family

ID=62557157

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017226522A Expired - Fee Related JP6905923B2 (ja) 2016-12-20 2017-11-27 冷却インサート

Country Status (2)

Country Link
US (1) US10279610B2 (https=)
JP (1) JP6905923B2 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108957920B (zh) * 2018-08-08 2020-03-17 四川长虹电器股份有限公司 一种高功率照明dmd芯片循环泡沫材料液冷却装置

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3609471A (en) 1969-07-22 1971-09-28 Gen Electric Semiconductor device with thermally conductive dielectric barrier
JPH0673364B2 (ja) * 1983-10-28 1994-09-14 株式会社日立製作所 集積回路チップ冷却装置
US4848090A (en) * 1988-01-27 1989-07-18 Texas Instruments Incorporated Apparatus for controlling the temperature of an integrated circuit package
JPH02224265A (ja) * 1988-10-19 1990-09-06 Hitachi Ltd 半導体チップの冷却装置及びその製造方法
US5829516A (en) * 1993-12-15 1998-11-03 Aavid Thermal Products, Inc. Liquid cooled heat sink for cooling electronic components
US6054198A (en) * 1996-04-29 2000-04-25 Parker-Hannifin Corporation Conformal thermal interface material for electronic components
US5866953A (en) 1996-05-24 1999-02-02 Micron Technology, Inc. Packaged die on PCB with heat sink encapsulant
US5940271A (en) 1997-05-02 1999-08-17 Lsi Logic Corporation Stiffener with integrated heat sink attachment
US6430934B2 (en) * 2000-02-10 2002-08-13 Light And Sound Design Ltd. Super cooler for a heat producing device
US6814445B2 (en) * 2001-06-30 2004-11-09 Texas Instruments Incorporated DMD heat sink socket assembly
JP2003027080A (ja) * 2001-07-11 2003-01-29 Hitachi Ltd 熱伝導性グリース、その実装方法、電子部品の冷却方法、電子装置及び情報処理装置
US6816375B2 (en) * 2001-08-03 2004-11-09 Texas Instruments Incorporated Heat sink attachment
US6545352B1 (en) 2002-02-15 2003-04-08 Ericsson Inc. Assembly for mounting power semiconductive modules to heat dissipators
KR100646243B1 (ko) * 2004-09-07 2006-11-23 엘지전자 주식회사 커버를 이용한 프로젝터용 냉각판
JP2008202880A (ja) * 2007-02-21 2008-09-04 Nomura Unison Co Ltd 冷却システム
JP5046378B2 (ja) * 2007-03-30 2012-10-10 ニチコン株式会社 パワー半導体モジュール、および該モジュールを搭載したパワー半導体デバイス
TWI345127B (en) 2007-11-27 2011-07-11 Coretronic Corp Dmd module
US8872875B2 (en) 2011-08-24 2014-10-28 Palo Alto Research Center Incorporated Single-pass imaging system with anamorphic optical system
JP2013084800A (ja) * 2011-10-11 2013-05-09 Panasonic Corp 電力変換装置
KR101344866B1 (ko) * 2012-03-09 2013-12-24 삼성전기주식회사 Ｄｍｄ 모듈 냉각장치
KR102089310B1 (ko) * 2013-01-25 2020-03-16 엘지디스플레이 주식회사 마스크리스 노광장치
WO2016187131A1 (en) * 2015-05-15 2016-11-24 Wolverine Tube, Inc. Liquid cooled coldplate

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