JP6905923B2 - 冷却インサート - Google Patents

冷却インサート Download PDF

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Publication number
JP6905923B2
JP6905923B2 JP2017226522A JP2017226522A JP6905923B2 JP 6905923 B2 JP6905923 B2 JP 6905923B2 JP 2017226522 A JP2017226522 A JP 2017226522A JP 2017226522 A JP2017226522 A JP 2017226522A JP 6905923 B2 JP6905923 B2 JP 6905923B2
Authority
JP
Japan
Prior art keywords
cooling
temperature control
base
heat source
cooling block
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2017226522A
Other languages
English (en)
Japanese (ja)
Other versions
JP2018101778A (ja
JP2018101778A5 (https=
Inventor
ポール・ジェイ・マコンビル
ジェイソン・エム・ルフェーブル
スティーヴン・アール・ムーア
ダグラス・ケイ・ハーマン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xerox Corp
Original Assignee
Xerox Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xerox Corp filed Critical Xerox Corp
Publication of JP2018101778A publication Critical patent/JP2018101778A/ja
Publication of JP2018101778A5 publication Critical patent/JP2018101778A5/ja
Application granted granted Critical
Publication of JP6905923B2 publication Critical patent/JP6905923B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J29/00—Details of, or accessories for, typewriters or selective printing mechanisms not otherwise provided for
    • B41J29/377—Cooling or ventilating arrangements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F7/00—Elements not covered by group F28F1/00, F28F3/00 or F28F5/00
    • F28F7/02—Blocks traversed by passages for heat-exchange media
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F2013/005—Thermal joints
    • F28F2013/006—Heat conductive materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2265/00—Safety or protection arrangements; Arrangements for preventing malfunction
    • F28F2265/24—Safety or protection arrangements; Arrangements for preventing malfunction for electrical insulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2017226522A 2016-12-20 2017-11-27 冷却インサート Expired - Fee Related JP6905923B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/384,425 US10279610B2 (en) 2016-12-20 2016-12-20 Cooling insert
US15/384,425 2016-12-20

Publications (3)

Publication Number Publication Date
JP2018101778A JP2018101778A (ja) 2018-06-28
JP2018101778A5 JP2018101778A5 (https=) 2021-01-14
JP6905923B2 true JP6905923B2 (ja) 2021-07-21

Family

ID=62557157

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017226522A Expired - Fee Related JP6905923B2 (ja) 2016-12-20 2017-11-27 冷却インサート

Country Status (2)

Country Link
US (1) US10279610B2 (https=)
JP (1) JP6905923B2 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108957920B (zh) * 2018-08-08 2020-03-17 四川长虹电器股份有限公司 一种高功率照明dmd芯片循环泡沫材料液冷却装置

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3609471A (en) 1969-07-22 1971-09-28 Gen Electric Semiconductor device with thermally conductive dielectric barrier
JPH0673364B2 (ja) * 1983-10-28 1994-09-14 株式会社日立製作所 集積回路チップ冷却装置
US4848090A (en) * 1988-01-27 1989-07-18 Texas Instruments Incorporated Apparatus for controlling the temperature of an integrated circuit package
JPH02224265A (ja) * 1988-10-19 1990-09-06 Hitachi Ltd 半導体チップの冷却装置及びその製造方法
US5829516A (en) * 1993-12-15 1998-11-03 Aavid Thermal Products, Inc. Liquid cooled heat sink for cooling electronic components
US6054198A (en) * 1996-04-29 2000-04-25 Parker-Hannifin Corporation Conformal thermal interface material for electronic components
US5866953A (en) 1996-05-24 1999-02-02 Micron Technology, Inc. Packaged die on PCB with heat sink encapsulant
US5940271A (en) 1997-05-02 1999-08-17 Lsi Logic Corporation Stiffener with integrated heat sink attachment
US6430934B2 (en) * 2000-02-10 2002-08-13 Light And Sound Design Ltd. Super cooler for a heat producing device
US6814445B2 (en) * 2001-06-30 2004-11-09 Texas Instruments Incorporated DMD heat sink socket assembly
JP2003027080A (ja) * 2001-07-11 2003-01-29 Hitachi Ltd 熱伝導性グリース、その実装方法、電子部品の冷却方法、電子装置及び情報処理装置
US6816375B2 (en) * 2001-08-03 2004-11-09 Texas Instruments Incorporated Heat sink attachment
US6545352B1 (en) 2002-02-15 2003-04-08 Ericsson Inc. Assembly for mounting power semiconductive modules to heat dissipators
KR100646243B1 (ko) * 2004-09-07 2006-11-23 엘지전자 주식회사 커버를 이용한 프로젝터용 냉각판
JP2008202880A (ja) * 2007-02-21 2008-09-04 Nomura Unison Co Ltd 冷却システム
JP5046378B2 (ja) * 2007-03-30 2012-10-10 ニチコン株式会社 パワー半導体モジュール、および該モジュールを搭載したパワー半導体デバイス
TWI345127B (en) 2007-11-27 2011-07-11 Coretronic Corp Dmd module
US8872875B2 (en) 2011-08-24 2014-10-28 Palo Alto Research Center Incorporated Single-pass imaging system with anamorphic optical system
JP2013084800A (ja) * 2011-10-11 2013-05-09 Panasonic Corp 電力変換装置
KR101344866B1 (ko) * 2012-03-09 2013-12-24 삼성전기주식회사 Ｄｍｄ 모듈 냉각장치
KR102089310B1 (ko) * 2013-01-25 2020-03-16 엘지디스플레이 주식회사 마스크리스 노광장치
WO2016187131A1 (en) * 2015-05-15 2016-11-24 Wolverine Tube, Inc. Liquid cooled coldplate

Also Published As

Publication number Publication date
US20180170081A1 (en) 2018-06-21
JP2018101778A (ja) 2018-06-28
US10279610B2 (en) 2019-05-07

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