JP2018098415A - 配線部品 - Google Patents
配線部品 Download PDFInfo
- Publication number
- JP2018098415A JP2018098415A JP2016243524A JP2016243524A JP2018098415A JP 2018098415 A JP2018098415 A JP 2018098415A JP 2016243524 A JP2016243524 A JP 2016243524A JP 2016243524 A JP2016243524 A JP 2016243524A JP 2018098415 A JP2018098415 A JP 2018098415A
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- coil
- wiring portion
- conductor layer
- connection position
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims abstract description 82
- 239000011347 resin Substances 0.000 claims abstract description 45
- 229920005989 resin Polymers 0.000 claims abstract description 45
- 238000009713 electroplating Methods 0.000 claims abstract description 29
- 239000000463 material Substances 0.000 claims abstract description 29
- 239000002184 metal Substances 0.000 claims abstract description 16
- 229910052751 metal Inorganic materials 0.000 claims abstract description 16
- 230000002093 peripheral effect Effects 0.000 claims description 88
- 238000007772 electroless plating Methods 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 11
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 229910052737 gold Inorganic materials 0.000 claims description 8
- 229910052709 silver Inorganic materials 0.000 claims description 8
- 238000004804 winding Methods 0.000 claims description 5
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910052763 palladium Inorganic materials 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 20
- 238000004519 manufacturing process Methods 0.000 abstract description 19
- 238000005530 etching Methods 0.000 abstract description 12
- 238000000059 patterning Methods 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 112
- 230000000052 comparative effect Effects 0.000 description 18
- 238000007747 plating Methods 0.000 description 13
- 239000010949 copper Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 7
- 239000003054 catalyst Substances 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 238000009826 distribution Methods 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 230000002349 favourable effect Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000002243 precursor Substances 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000004904 shortening Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 108091032995 L1Base Proteins 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2823—Wires
- H01F27/2828—Construction of conductive connections, of leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B5/00—Near-field transmission systems, e.g. inductive or capacitive transmission systems
- H04B5/20—Near-field transmission systems, e.g. inductive or capacitive transmission systems characterised by the transmission technique; characterised by the transmission medium
- H04B5/24—Inductive coupling
- H04B5/26—Inductive coupling using coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B5/00—Near-field transmission systems, e.g. inductive or capacitive transmission systems
- H04B5/70—Near-field transmission systems, e.g. inductive or capacitive transmission systems specially adapted for specific purposes
- H04B5/72—Near-field transmission systems, e.g. inductive or capacitive transmission systems specially adapted for specific purposes for local intradevice communication
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
- H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
- Coils Or Transformers For Communication (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
5A,5B,5C 配線部品
10 基材
11 平面コイルパターン
11a コイル配線部
11a1コイル配線部の外周端(一端)
11a2 コイル配線部の内周端(他端)
11b,11c パッド
11d 給電配線部
11d 給電配線部
11e 接続配線部
30 給電配線部の主配線
50 外部電源
51 めっき槽
52 めっき液
L0 下地樹脂層
L1 下地導体層
L2 配線導体層
LB 下地層
LL 導体層
P1 第1の接続位置
P2 第2の接続位置
P3 第3の接続位置
R1 外周端側の配線抵抗
R2 内周端側の配線抵抗
R2/R1 抵抗比
T1 外周端の膜厚
T2 内周端の膜厚
T2/T1 膜厚比
Claims (9)
- 基材と、
前記基材上に形成された平面コイルパターンとを備え、
前記平面コイルパターンが、
一端及び他端を有するコイル配線部と、
前記コイル配線部の第1の接続位置に設けられた給電配線部と、
前記第1の接続位置よりも前記他端側である前記コイル配線部の第2の接続位置と前記第2の接続位置よりも前記一端側である前記コイル配線部の第3の接続位置とを短絡する接続配線部とを含み、
前記平面コイルパターンの断面構造が、前記基材上に形成された下地樹脂層と、前記下地樹脂層上に形成された導体層とを有することを特徴とする配線部品。 - 前記コイル配線部がスパイラルパターンを含み、
前記コイル配線部の一端及び他端がそれぞれ前記スパイラルパターンの外周端及び内周端である、請求項1に記載の配線部品。 - 前記第2の接続位置が、前記スパイラルパターンの前記内周端である、請求項2に記載の配線部品。
- 前記第3の接続位置が、前記スパイラルパターンの最内周ターンの範囲内であって、前記内周端を通過して、前記外周端から前記内周端に向かう巻回方向の延長線上にある、請求項2又は3に記載の配線部品。
- 前記第1の接続位置が、前記スパイラルパターンの最外周ターンの範囲内であって、前記外周端よりも前記内周端側にある、請求項2乃至4のいずれか一項に記載の配線部品。
- 前記基材が樹脂フィルムである、請求項1乃至5のいずれか一項に記載の配線部品。
- 前記下地樹脂層がPd、Cu、Ni、Ag、Pt及びAuから選ばれた少なくとも一種の金属を含む樹脂からなる、請求項1乃至6のいずれか一項に記載の配線部品。
- 前記導体層が、前記下地樹脂層上に無電解めっきにより形成された下地導体層と、前記下地導体層上に電解めっきにより形成された前記下地導体層よりも厚い配線導体層とを有する、請求項1乃至7のいずれか一項に記載の配線部品。
- 前記下地導体層及び前記配線導体層が、それぞれCu、Ag及びAuから選ばれた少なくとも一種の金属からなる、請求項8に記載の配線部品。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016243524A JP6776867B2 (ja) | 2016-12-15 | 2016-12-15 | 配線部品 |
TW106143750A TWI639368B (zh) | 2016-12-15 | 2017-12-13 | 佈線零件 |
US15/840,192 US10374301B2 (en) | 2016-12-15 | 2017-12-13 | Wiring component |
DE102017129834.7A DE102017129834A1 (de) | 2016-12-15 | 2017-12-13 | Verdrahtungskomponente |
KR1020170172222A KR102034357B1 (ko) | 2016-12-15 | 2017-12-14 | 배선 부품 |
CN201711352356.1A CN108235570B (zh) | 2016-12-15 | 2017-12-15 | 配线部件 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016243524A JP6776867B2 (ja) | 2016-12-15 | 2016-12-15 | 配線部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018098415A true JP2018098415A (ja) | 2018-06-21 |
JP6776867B2 JP6776867B2 (ja) | 2020-10-28 |
Family
ID=62251011
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016243524A Active JP6776867B2 (ja) | 2016-12-15 | 2016-12-15 | 配線部品 |
Country Status (6)
Country | Link |
---|---|
US (1) | US10374301B2 (ja) |
JP (1) | JP6776867B2 (ja) |
KR (1) | KR102034357B1 (ja) |
CN (1) | CN108235570B (ja) |
DE (1) | DE102017129834A1 (ja) |
TW (1) | TWI639368B (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023276817A1 (ja) * | 2021-06-28 | 2023-01-05 | 住友電気工業株式会社 | プリント配線板 |
WO2023276818A1 (ja) * | 2021-06-28 | 2023-01-05 | 住友電気工業株式会社 | プリント配線板 |
US11935683B2 (en) | 2018-12-07 | 2024-03-19 | Samsung Electro-Mechanics Co., Ltd. | Coil electronic component |
WO2024111208A1 (ja) * | 2022-11-24 | 2024-05-30 | 株式会社フジクラ | 配線板の製造方法、及び、配線板 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD761736S1 (en) * | 2012-08-09 | 2016-07-19 | Sony Corporation | Non-contact type data carrier |
USD917434S1 (en) * | 2018-04-25 | 2021-04-27 | Dentsply Sirona Inc. | Dental tool with transponder |
CN109930184B (zh) * | 2019-03-22 | 2020-06-30 | 苏州昕皓新材料科技有限公司 | 线圈的制备方法及线圈 |
US20210249168A1 (en) * | 2020-02-11 | 2021-08-12 | Dupont Electronics, Inc. | Plated copper conductor structures for self-resonant sensor and manufacture thereof |
US20210249169A1 (en) * | 2020-02-11 | 2021-08-12 | Dupont Electronics, Inc. | Plated copper conductor structures and manufacture thereof |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2005051050A (ja) * | 2003-07-29 | 2005-02-24 | Matsushita Electric Ind Co Ltd | ボイスコイルとその製造方法 |
US20070262471A1 (en) * | 2006-05-15 | 2007-11-15 | James Montague Cleeves | Plated antenna for high frequency devices |
JP2009246363A (ja) * | 2008-03-28 | 2009-10-22 | Ibiden Co Ltd | 導体回路の製造方法、コイルシート及び積層コイル |
JP2015220719A (ja) * | 2014-05-21 | 2015-12-07 | Tdk株式会社 | アンテナ装置及びその製造方法 |
CN106211561A (zh) * | 2016-08-29 | 2016-12-07 | 广州兴森快捷电路科技有限公司 | Pcb外层图形电镀分流结构及其分流方法 |
Family Cites Families (11)
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US4560445A (en) | 1984-12-24 | 1985-12-24 | Polyonics Corporation | Continuous process for fabricating metallic patterns on a thin film substrate |
US7268740B2 (en) * | 2000-03-13 | 2007-09-11 | Rcd Technology Inc. | Method for forming radio frequency antenna |
US6476775B1 (en) | 2000-03-13 | 2002-11-05 | Rcd Technology Corporation | Method for forming radio frequency antenna |
US7255782B2 (en) * | 2004-04-30 | 2007-08-14 | Kenneth Crouse | Selective catalytic activation of non-conductive substrates |
US7308669B2 (en) | 2005-05-18 | 2007-12-11 | International Business Machines Corporation | Use of redundant routes to increase the yield and reliability of a VLSI layout |
US7646305B2 (en) * | 2005-10-25 | 2010-01-12 | Checkpoint Systems, Inc. | Capacitor strap |
JP4704194B2 (ja) | 2005-11-22 | 2011-06-15 | 藤森工業株式会社 | アンテナ回路装置ならびにそれを備えた非接触icカード及び無線タグ、ならびにアンテナ回路装置の製造方法 |
JP5396871B2 (ja) | 2009-01-20 | 2014-01-22 | コニカミノルタ株式会社 | インクジェットインクおよび金属パターン形成方法 |
CN102782937B (zh) | 2010-03-03 | 2016-02-17 | 株式会社村田制作所 | 无线通信器件及无线通信终端 |
JP5195876B2 (ja) * | 2010-11-10 | 2013-05-15 | Tdk株式会社 | コイル部品及びその製造方法 |
US9671478B2 (en) * | 2011-07-22 | 2017-06-06 | Max-Planck-Gesellschaft Zur Foerderung Der Wissenschaften E.V. | Antenna and antenna arrangement for magnetic resonance applications |
-
2016
- 2016-12-15 JP JP2016243524A patent/JP6776867B2/ja active Active
-
2017
- 2017-12-13 DE DE102017129834.7A patent/DE102017129834A1/de active Pending
- 2017-12-13 US US15/840,192 patent/US10374301B2/en active Active
- 2017-12-13 TW TW106143750A patent/TWI639368B/zh active
- 2017-12-14 KR KR1020170172222A patent/KR102034357B1/ko active IP Right Grant
- 2017-12-15 CN CN201711352356.1A patent/CN108235570B/zh active Active
Patent Citations (5)
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JP2005051050A (ja) * | 2003-07-29 | 2005-02-24 | Matsushita Electric Ind Co Ltd | ボイスコイルとその製造方法 |
US20070262471A1 (en) * | 2006-05-15 | 2007-11-15 | James Montague Cleeves | Plated antenna for high frequency devices |
JP2009246363A (ja) * | 2008-03-28 | 2009-10-22 | Ibiden Co Ltd | 導体回路の製造方法、コイルシート及び積層コイル |
JP2015220719A (ja) * | 2014-05-21 | 2015-12-07 | Tdk株式会社 | アンテナ装置及びその製造方法 |
CN106211561A (zh) * | 2016-08-29 | 2016-12-07 | 广州兴森快捷电路科技有限公司 | Pcb外层图形电镀分流结构及其分流方法 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11935683B2 (en) | 2018-12-07 | 2024-03-19 | Samsung Electro-Mechanics Co., Ltd. | Coil electronic component |
WO2023276817A1 (ja) * | 2021-06-28 | 2023-01-05 | 住友電気工業株式会社 | プリント配線板 |
WO2023276818A1 (ja) * | 2021-06-28 | 2023-01-05 | 住友電気工業株式会社 | プリント配線板 |
WO2024111208A1 (ja) * | 2022-11-24 | 2024-05-30 | 株式会社フジクラ | 配線板の製造方法、及び、配線板 |
Also Published As
Publication number | Publication date |
---|---|
CN108235570A (zh) | 2018-06-29 |
TW201831063A (zh) | 2018-08-16 |
TWI639368B (zh) | 2018-10-21 |
DE102017129834A1 (de) | 2018-06-21 |
US20180175494A1 (en) | 2018-06-21 |
KR102034357B1 (ko) | 2019-10-18 |
JP6776867B2 (ja) | 2020-10-28 |
CN108235570B (zh) | 2020-08-04 |
KR20180069734A (ko) | 2018-06-25 |
US10374301B2 (en) | 2019-08-06 |
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