JP2018090326A5 - - Google Patents
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- Publication number
- JP2018090326A5 JP2018090326A5 JP2017231401A JP2017231401A JP2018090326A5 JP 2018090326 A5 JP2018090326 A5 JP 2018090326A5 JP 2017231401 A JP2017231401 A JP 2017231401A JP 2017231401 A JP2017231401 A JP 2017231401A JP 2018090326 A5 JP2018090326 A5 JP 2018090326A5
- Authority
- JP
- Japan
- Prior art keywords
- intermediate layer
- layer
- transparent conductive
- cover tape
- conductive cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000010410 layer Substances 0.000 claims 15
- 239000004925 Acrylic resin Substances 0.000 claims 2
- 229920000178 Acrylic resin Polymers 0.000 claims 2
- 229920000089 Cyclic olefin copolymer Polymers 0.000 claims 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims 2
- 239000005977 Ethylene Substances 0.000 claims 2
- 229920001400 block copolymer Polymers 0.000 claims 2
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 claims 2
- 239000010419 fine particle Substances 0.000 claims 2
- 229920005678 polyethylene based resin Polymers 0.000 claims 2
- 239000011342 resin composition Substances 0.000 claims 2
- 239000004711 α-olefin Substances 0.000 claims 2
- 239000012790 adhesive layer Substances 0.000 claims 1
- 230000009477 glass transition Effects 0.000 claims 1
- 229920000092 linear low density polyethylene Polymers 0.000 claims 1
- 239000004707 linear low-density polyethylene Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims 1
- 229910001887 tin oxide Inorganic materials 0.000 claims 1
- 238000002834 transmittance Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022021798A JP7331970B2 (ja) | 2016-12-02 | 2022-02-16 | 透明導電性カバーテープ |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016234762 | 2016-12-02 | ||
| JP2016234762 | 2016-12-02 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022021798A Division JP7331970B2 (ja) | 2016-12-02 | 2022-02-16 | 透明導電性カバーテープ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018090326A JP2018090326A (ja) | 2018-06-14 |
| JP2018090326A5 true JP2018090326A5 (enrdf_load_stackoverflow) | 2020-09-10 |
| JP7261537B2 JP7261537B2 (ja) | 2023-04-20 |
Family
ID=62563585
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017231401A Active JP7261537B2 (ja) | 2016-12-02 | 2017-12-01 | 透明導電性カバーテープ |
| JP2022021798A Active JP7331970B2 (ja) | 2016-12-02 | 2022-02-16 | 透明導電性カバーテープ |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022021798A Active JP7331970B2 (ja) | 2016-12-02 | 2022-02-16 | 透明導電性カバーテープ |
Country Status (1)
| Country | Link |
|---|---|
| JP (2) | JP7261537B2 (enrdf_load_stackoverflow) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7256020B2 (ja) * | 2019-01-31 | 2023-04-11 | 旭化成株式会社 | 剥離機能付き多層フィルム及びその包装体 |
| CN114728741B (zh) * | 2019-11-15 | 2025-04-08 | 住友电木株式会社 | 盖带及电子部件包装体 |
| JP2021080024A (ja) * | 2019-11-15 | 2021-05-27 | 住友ベークライト株式会社 | カバーテープおよび電子部品包装体 |
| JP6930625B1 (ja) * | 2020-03-30 | 2021-09-01 | 住友ベークライト株式会社 | カバーテープおよび電子部品包装体 |
| CN114834123A (zh) * | 2022-05-18 | 2022-08-02 | 东莞市综研航天涂布科技有限公司 | 一种防止手机摄像镜头刮蹭的防爆高透保护膜 |
| WO2025173758A1 (ja) * | 2024-02-16 | 2025-08-21 | デンカ株式会社 | カバーテープ及びそれを含む電子部品包装体 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4826018B2 (ja) * | 2000-04-03 | 2011-11-30 | 大日本印刷株式会社 | キャリアテープ蓋体 |
| JP4334858B2 (ja) * | 2001-12-19 | 2009-09-30 | 大日本印刷株式会社 | 電子部品のテーピング包装用カバーテープ |
| US20060199005A1 (en) * | 2003-04-24 | 2006-09-07 | Dai Nippon Painting Co., Ltd. | Electronic part taping packaging cover tape |
| KR100966985B1 (ko) | 2008-08-12 | 2010-06-30 | 스미토모 베이클리트 컴퍼니 리미티드 | 전자 부품 포장용 커버 테이프 및 전자 부품 포장체 |
| JP5683096B2 (ja) * | 2009-12-09 | 2015-03-11 | 電気化学工業株式会社 | キャリアテープ体の剥離帯電量低減方法 |
| SG194062A1 (en) * | 2011-04-01 | 2013-11-29 | Denki Kagaku Kogyo Kk | Cover film |
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2017
- 2017-12-01 JP JP2017231401A patent/JP7261537B2/ja active Active
-
2022
- 2022-02-16 JP JP2022021798A patent/JP7331970B2/ja active Active