JP2018090326A5 - - Google Patents
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- JP2018090326A5 JP2018090326A5 JP2017231401A JP2017231401A JP2018090326A5 JP 2018090326 A5 JP2018090326 A5 JP 2018090326A5 JP 2017231401 A JP2017231401 A JP 2017231401A JP 2017231401 A JP2017231401 A JP 2017231401A JP 2018090326 A5 JP2018090326 A5 JP 2018090326A5
- Authority
- JP
- Japan
- Prior art keywords
- intermediate layer
- layer
- transparent conductive
- cover tape
- conductive cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Claims (4)
基材フィルム、接着剤層、第一の中間層、第二の中間層、及び、ヒートシール層を順に積層してなり、
該第一の中間層は、ポリエチレン系樹脂からなる層であり、該第二の中間層は、エチレン・α−オレフィン共重合体及びスチレン・ブタジエンブロック共重合体を含む樹脂組成物からなる層であり、該第一の中間層と第二の中間層とは、共押出法により製膜された層であり、
該ヒートシール層は、アクリル系樹脂中に導電性微粒子が分散されてなる透明導電性ヒートシール材からなる層であって、
該導電性微粒子は、アンチモンをドーピングした酸化錫の針状粒子であり、
全光線透過率が70%以上であり、かつ、ヘイズが30%以下である、
上記透明導電性カバーテープ。 A transparent conductive cover tape for heat-sealing the carrier tape.
The base film, the adhesive layer, the first intermediate layer, the second intermediate layer, and the heat seal layer are laminated in this order.
The first intermediate layer is a layer made of a polyethylene-based resin, and the second intermediate layer is a layer made of a resin composition containing an ethylene / α-olefin copolymer and a styrene / butadiene block copolymer. Yes, the first intermediate layer and the second intermediate layer are layers formed by a coextrusion method.
The heat seal layer is a layer made of a transparent conductive heat seal material in which conductive fine particles are dispersed in an acrylic resin.
The conductive fine particles are antimony-doped tin oxide acicular particles.
The total light transmittance is 70% or more and the haze is 30% or less.
The transparent conductive cover tape.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2022021798A JP7331970B2 (en) | 2016-12-02 | 2022-02-16 | transparent conductive cover tape |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016234762 | 2016-12-02 | ||
JP2016234762 | 2016-12-02 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022021798A Division JP7331970B2 (en) | 2016-12-02 | 2022-02-16 | transparent conductive cover tape |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2018090326A JP2018090326A (en) | 2018-06-14 |
JP2018090326A5 true JP2018090326A5 (en) | 2020-09-10 |
JP7261537B2 JP7261537B2 (en) | 2023-04-20 |
Family
ID=62563585
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017231401A Active JP7261537B2 (en) | 2016-12-02 | 2017-12-01 | transparent conductive cover tape |
JP2022021798A Active JP7331970B2 (en) | 2016-12-02 | 2022-02-16 | transparent conductive cover tape |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022021798A Active JP7331970B2 (en) | 2016-12-02 | 2022-02-16 | transparent conductive cover tape |
Country Status (1)
Country | Link |
---|---|
JP (2) | JP7261537B2 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7256020B2 (en) * | 2019-01-31 | 2023-04-11 | 旭化成株式会社 | Multilayer film with peeling function and package thereof |
WO2021095638A1 (en) * | 2019-11-15 | 2021-05-20 | 住友ベークライト株式会社 | Cover tape and electronic part package |
JP2021080024A (en) * | 2019-11-15 | 2021-05-27 | 住友ベークライト株式会社 | Cover tape and electronic component package |
JP6930625B1 (en) * | 2020-03-30 | 2021-09-01 | 住友ベークライト株式会社 | Cover tape and electronic component packaging |
CN114834123A (en) * | 2022-05-18 | 2022-08-02 | 东莞市综研航天涂布科技有限公司 | Prevent explosion-proof high protection film that makes a video recording camera lens of cell-phone scraped |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4826018B2 (en) | 2000-04-03 | 2011-11-30 | 大日本印刷株式会社 | Carrier tape lid |
JP4334858B2 (en) | 2001-12-19 | 2009-09-30 | 大日本印刷株式会社 | Cover tape for taping packaging of electronic parts |
TW200426030A (en) | 2003-04-24 | 2004-12-01 | Dainippon Printing Co Ltd | Electronic part taping packaging cover tape |
CN102119108B (en) | 2008-08-12 | 2012-07-04 | 住友电木株式会社 | Cover tape for packaging electronic part and electronic-part package |
JP5683096B2 (en) | 2009-12-09 | 2015-03-11 | 電気化学工業株式会社 | Method for reducing the amount of electrification of carrier tape |
KR101954467B1 (en) | 2011-04-01 | 2019-03-05 | 덴카 주식회사 | Cover film |
-
2017
- 2017-12-01 JP JP2017231401A patent/JP7261537B2/en active Active
-
2022
- 2022-02-16 JP JP2022021798A patent/JP7331970B2/en active Active
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