JP2018069614A - 基板分断装置 - Google Patents

基板分断装置 Download PDF

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Publication number
JP2018069614A
JP2018069614A JP2016213409A JP2016213409A JP2018069614A JP 2018069614 A JP2018069614 A JP 2018069614A JP 2016213409 A JP2016213409 A JP 2016213409A JP 2016213409 A JP2016213409 A JP 2016213409A JP 2018069614 A JP2018069614 A JP 2018069614A
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JP
Japan
Prior art keywords
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Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016213409A
Other languages
English (en)
Japanese (ja)
Inventor
勉 上野
Tsutomu Ueno
勉 上野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Priority to JP2016213409A priority Critical patent/JP2018069614A/ja
Priority to TW106122000A priority patent/TW201834106A/zh
Priority to KR1020170084216A priority patent/KR20180048275A/ko
Priority to CN201710611481.3A priority patent/CN108022858A/zh
Publication of JP2018069614A publication Critical patent/JP2018069614A/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67715—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
JP2016213409A 2016-10-31 2016-10-31 基板分断装置 Pending JP2018069614A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2016213409A JP2018069614A (ja) 2016-10-31 2016-10-31 基板分断装置
TW106122000A TW201834106A (zh) 2016-10-31 2017-06-30 基板分斷裝置
KR1020170084216A KR20180048275A (ko) 2016-10-31 2017-07-03 기판 분단 장치
CN201710611481.3A CN108022858A (zh) 2016-10-31 2017-07-25 基板切断装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016213409A JP2018069614A (ja) 2016-10-31 2016-10-31 基板分断装置

Publications (1)

Publication Number Publication Date
JP2018069614A true JP2018069614A (ja) 2018-05-10

Family

ID=62079275

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016213409A Pending JP2018069614A (ja) 2016-10-31 2016-10-31 基板分断装置

Country Status (4)

Country Link
JP (1) JP2018069614A (zh)
KR (1) KR20180048275A (zh)
CN (1) CN108022858A (zh)
TW (1) TW201834106A (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6851067B2 (ja) * 2016-11-22 2021-03-31 三星ダイヤモンド工業株式会社 基板分断装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003313036A (ja) * 2002-04-17 2003-11-06 Sharp Corp ガラス分断方法とその装置
JP2006289625A (ja) * 2005-04-05 2006-10-26 Sony Corp 貼り合わせ基板の基板ブレイク装置及びその基板ブレイク方法
JP2015013782A (ja) * 2013-07-08 2015-01-22 三星ダイヤモンド工業株式会社 貼り合わせ基板のブレイク装置
JP2016003146A (ja) * 2014-06-13 2016-01-12 三星ダイヤモンド工業株式会社 脆性材料基板のブレイク装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4996703B2 (ja) * 2010-02-09 2012-08-08 三星ダイヤモンド工業株式会社 基板分断装置
JP6163341B2 (ja) * 2013-04-02 2017-07-12 三星ダイヤモンド工業株式会社 ブレイク装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003313036A (ja) * 2002-04-17 2003-11-06 Sharp Corp ガラス分断方法とその装置
JP2006289625A (ja) * 2005-04-05 2006-10-26 Sony Corp 貼り合わせ基板の基板ブレイク装置及びその基板ブレイク方法
JP2015013782A (ja) * 2013-07-08 2015-01-22 三星ダイヤモンド工業株式会社 貼り合わせ基板のブレイク装置
JP2016003146A (ja) * 2014-06-13 2016-01-12 三星ダイヤモンド工業株式会社 脆性材料基板のブレイク装置

Also Published As

Publication number Publication date
TW201834106A (zh) 2018-09-16
CN108022858A (zh) 2018-05-11
KR20180048275A (ko) 2018-05-10

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