JP2018066743A - 照射サブシステム - Google Patents
照射サブシステム Download PDFInfo
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- JP2018066743A JP2018066743A JP2017219850A JP2017219850A JP2018066743A JP 2018066743 A JP2018066743 A JP 2018066743A JP 2017219850 A JP2017219850 A JP 2017219850A JP 2017219850 A JP2017219850 A JP 2017219850A JP 2018066743 A JP2018066743 A JP 2018066743A
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- doe
- light beams
- illumination
- illumination subsystem
- subsystem
- Prior art date
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- 238000005286 illumination Methods 0.000 title claims abstract description 88
- 230000003287 optical effect Effects 0.000 claims abstract description 31
- 238000007689 inspection Methods 0.000 claims abstract description 29
- 239000012141 concentrate Substances 0.000 claims 1
- 239000011295 pitch Substances 0.000 description 14
- 238000010586 diagram Methods 0.000 description 11
- 239000006185 dispersion Substances 0.000 description 9
- 210000001747 pupil Anatomy 0.000 description 8
- 230000005540 biological transmission Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 230000007547 defect Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000002310 reflectometry Methods 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000004364 calculation method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/008—Combination of two or more successive refractors along an optical axis
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
- G01N21/9505—Wafer internal defects, e.g. microcracks
Landscapes
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Pathology (AREA)
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Diffracting Gratings Or Hologram Optical Elements (AREA)
Abstract
Description
本出願は、「Multi−Spot Illumination Using Broadband Lasers」という名称の、2010年7月30日に出願された米国特許出願番号第61/369,638号に対して優先権を主張し、参照によりその全体が本明細書に組み込まれる。
M0の反射率は以下から得られる。
Claims (7)
- ウエハ検査用照射を提供する照射サブシステムであって、
1つの照射光ビームを複数の光ビームに分離し、前記複数の光ビームを焦点面上の複数の空間的に分離したスポットに個別におよび同時に当てる1組のビームスプリッタと、
前記複数の光ビームのそれぞれの焦点を前記焦点面から検査用ウエハに個別におよび同時に合わせる1つまたは複数の屈折光学素子と、を含み、前記ビームスプリッタの傾斜角度は、前記複数の光ビームのそれぞれが、前記照射サブシステムの光軸に向かって集中するように設定された、照射サブシステム。 - 前記照射光ビームは、パルスレーザによって提供され、中心波長266nmを有する、請求項1に記載の照射サブシステム。
- 前記照射光ビームの帯域幅は、10pm以上である、請求項1に記載の照射サブシステム。
- 前記複数の光ビームは、同じ帯域幅を有する、請求項1に記載の照射サブシステム。
- 前記複数の光ビームの数はNであり、前記組に含まれた前記ビームスプリッタの数はN+1である、請求項1に記載の照射サブシステム。
- ビームスプリッタの前記組は、直列に配置された第1および第2のビームスプリッタ、すなわち第1のビームスプリッタと直列に配置された前記ビームスプリッタの第1のサブセット、および前記第2のビームスプリッタと直列に配置された前記ビームスプリッタの第2のサブセットを含み、前記照射光ビームは、前記第1のビームスプリッタに当てられる、請求項1に記載の照射サブシステム。
- 前記照射光ビームの電力は、前記複数の光ビーム全域に実質的に均一に分配される、請求項1に記載の照射サブシステム。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US36963810P | 2010-07-30 | 2010-07-30 | |
US61/369,638 | 2010-07-30 | ||
US13/187,375 US8462329B2 (en) | 2010-07-30 | 2011-07-20 | Multi-spot illumination for wafer inspection |
US13/187,375 | 2011-07-20 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016008429A Division JP6261627B2 (ja) | 2010-07-30 | 2016-01-20 | 照射サブシステム |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018066743A true JP2018066743A (ja) | 2018-04-26 |
JP6440804B2 JP6440804B2 (ja) | 2018-12-19 |
Family
ID=45526421
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011165590A Active JP5875793B2 (ja) | 2010-07-30 | 2011-07-28 | ウエハ検査用マルチスポット照射 |
JP2016008429A Active JP6261627B2 (ja) | 2010-07-30 | 2016-01-20 | 照射サブシステム |
JP2017219850A Active JP6440804B2 (ja) | 2010-07-30 | 2017-11-15 | 照射サブシステム |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011165590A Active JP5875793B2 (ja) | 2010-07-30 | 2011-07-28 | ウエハ検査用マルチスポット照射 |
JP2016008429A Active JP6261627B2 (ja) | 2010-07-30 | 2016-01-20 | 照射サブシステム |
Country Status (2)
Country | Link |
---|---|
US (2) | US8462329B2 (ja) |
JP (3) | JP5875793B2 (ja) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9945792B2 (en) * | 2012-12-19 | 2018-04-17 | Kla-Tencor Corporation | Generating an array of spots on inclined surfaces |
US9182358B2 (en) | 2013-03-15 | 2015-11-10 | Kla-Tencor Corporation | Multi-spot defect inspection system |
US9546962B2 (en) | 2014-02-12 | 2017-01-17 | Kla-Tencor Corporation | Multi-spot scanning collection optics |
US9885671B2 (en) | 2014-06-09 | 2018-02-06 | Kla-Tencor Corporation | Miniaturized imaging apparatus for wafer edge |
US9645097B2 (en) * | 2014-06-20 | 2017-05-09 | Kla-Tencor Corporation | In-line wafer edge inspection, wafer pre-alignment, and wafer cleaning |
US9606069B2 (en) | 2014-06-25 | 2017-03-28 | Kla-Tencor Corporation | Method, apparatus and system for generating multiple spatially separated inspection regions on a substrate |
WO2016015734A1 (en) * | 2014-08-01 | 2016-02-04 | Dfm A/S | A scatterometer apparatus |
US9891175B2 (en) * | 2015-05-08 | 2018-02-13 | Kla-Tencor Corporation | System and method for oblique incidence scanning with 2D array of spots |
US10380728B2 (en) * | 2015-08-31 | 2019-08-13 | Kla-Tencor Corporation | Model-based metrology using images |
US10330835B2 (en) * | 2015-11-03 | 2019-06-25 | Materion Corporation | Filter array with reduced stray focused light |
EP3847446A4 (en) * | 2018-09-06 | 2022-06-01 | Orbotech Ltd. | MULTIMODAL MULTIPLEXED LIGHTING FOR OPTICAL INSPECTION SYSTEMS |
KR20210044955A (ko) * | 2019-10-15 | 2021-04-26 | 삼성디스플레이 주식회사 | 전자장치 |
EP4160623A1 (en) * | 2021-10-01 | 2023-04-05 | Deutsches Elektronen-Synchrotron DESY | Multi beam splitting and redirecting apparatus for a tomoscopic inspection apparatus, tomoscopic inspection apparatus and method for creating a three dimensional tomoscopic image of a sample |
Citations (7)
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JPS6378011A (ja) * | 1986-09-20 | 1988-04-08 | Fujitsu Ltd | パタ−ン検査装置 |
JP2003057192A (ja) * | 2001-08-10 | 2003-02-26 | Dainippon Screen Mfg Co Ltd | 画像取得装置 |
US20030227618A1 (en) * | 2002-05-06 | 2003-12-11 | Applied Materials Israel Ltd | High speed laser scanning inspection system |
JP2004222870A (ja) * | 2003-01-21 | 2004-08-12 | Pentax Corp | 内視鏡用プローブ |
US6795199B2 (en) * | 2001-07-18 | 2004-09-21 | Avraham Suhami | Method and apparatus for dispersion compensated reflected time-of-flight tomography |
JP2006258739A (ja) * | 2005-03-18 | 2006-09-28 | Fujinon Corp | 光束分岐出力装置および複数光束出力型の測定装置 |
JP2008076377A (ja) * | 2006-08-25 | 2008-04-03 | Hitachi High-Technologies Corp | 欠陥検査装置 |
Family Cites Families (11)
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JPS5248031B2 (ja) * | 1974-05-13 | 1977-12-07 | ||
US4435041A (en) * | 1982-05-28 | 1984-03-06 | Sperry Corporation | Chromatic aberration correction in a multiwavelength light beam deflection system |
JPS59129854A (ja) * | 1983-01-18 | 1984-07-26 | Dainippon Screen Mfg Co Ltd | 画像走査記録時における光量補正方法 |
JP3623250B2 (ja) * | 1993-06-23 | 2005-02-23 | オリンパス株式会社 | 映像表示装置 |
US5930045A (en) * | 1995-07-26 | 1999-07-27 | Fujitsu, Ltd. | Optical apparatus which uses a virtually imaged phased array to produce chromatic dispersion |
JP3411780B2 (ja) * | 1997-04-07 | 2003-06-03 | レーザーテック株式会社 | レーザ顕微鏡及びこのレーザ顕微鏡を用いたパターン検査装置 |
US6208411B1 (en) * | 1998-09-28 | 2001-03-27 | Kla-Tencor Corporation | Massively parallel inspection and imaging system |
JP3965504B2 (ja) * | 1999-06-11 | 2007-08-29 | 株式会社オーク製作所 | マルチビーム光学系 |
US7319229B2 (en) * | 2003-12-29 | 2008-01-15 | Kla-Tencor Technologies Corporation | Illumination apparatus and methods |
JP4965275B2 (ja) * | 2007-02-13 | 2012-07-04 | 株式会社リコー | ホログラム光学素子の製造方法 |
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-
2011
- 2011-07-20 US US13/187,375 patent/US8462329B2/en active Active
- 2011-07-28 JP JP2011165590A patent/JP5875793B2/ja active Active
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2013
- 2013-05-21 US US13/898,470 patent/US8879056B2/en active Active
-
2016
- 2016-01-20 JP JP2016008429A patent/JP6261627B2/ja active Active
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2017
- 2017-11-15 JP JP2017219850A patent/JP6440804B2/ja active Active
Patent Citations (7)
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JPS6378011A (ja) * | 1986-09-20 | 1988-04-08 | Fujitsu Ltd | パタ−ン検査装置 |
US6795199B2 (en) * | 2001-07-18 | 2004-09-21 | Avraham Suhami | Method and apparatus for dispersion compensated reflected time-of-flight tomography |
JP2003057192A (ja) * | 2001-08-10 | 2003-02-26 | Dainippon Screen Mfg Co Ltd | 画像取得装置 |
US20030227618A1 (en) * | 2002-05-06 | 2003-12-11 | Applied Materials Israel Ltd | High speed laser scanning inspection system |
JP2004222870A (ja) * | 2003-01-21 | 2004-08-12 | Pentax Corp | 内視鏡用プローブ |
JP2006258739A (ja) * | 2005-03-18 | 2006-09-28 | Fujinon Corp | 光束分岐出力装置および複数光束出力型の測定装置 |
JP2008076377A (ja) * | 2006-08-25 | 2008-04-03 | Hitachi High-Technologies Corp | 欠陥検査装置 |
Also Published As
Publication number | Publication date |
---|---|
US20130250582A1 (en) | 2013-09-26 |
JP2012068232A (ja) | 2012-04-05 |
JP2016085228A (ja) | 2016-05-19 |
US8462329B2 (en) | 2013-06-11 |
JP6261627B2 (ja) | 2018-01-17 |
JP6440804B2 (ja) | 2018-12-19 |
US20120026489A1 (en) | 2012-02-02 |
JP5875793B2 (ja) | 2016-03-02 |
US8879056B2 (en) | 2014-11-04 |
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