JP2018044242A5 - - Google Patents

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Publication number
JP2018044242A5
JP2018044242A5 JP2017172733A JP2017172733A JP2018044242A5 JP 2018044242 A5 JP2018044242 A5 JP 2018044242A5 JP 2017172733 A JP2017172733 A JP 2017172733A JP 2017172733 A JP2017172733 A JP 2017172733A JP 2018044242 A5 JP2018044242 A5 JP 2018044242A5
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JP
Japan
Prior art keywords
copper
plating
term
polymer
deposition
Prior art date
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Granted
Application number
JP2017172733A
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English (en)
Japanese (ja)
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JP2018044242A (ja
JP6525386B2 (ja
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Publication date
Priority claimed from US15/263,655 external-priority patent/US9970114B2/en
Application filed filed Critical
Publication of JP2018044242A publication Critical patent/JP2018044242A/ja
Publication of JP2018044242A5 publication Critical patent/JP2018044242A5/ja
Application granted granted Critical
Publication of JP6525386B2 publication Critical patent/JP6525386B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2017172733A 2016-09-13 2017-09-08 選択的な金属被覆のための遮断コーティング Expired - Fee Related JP6525386B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/263,655 2016-09-13
US15/263,655 US9970114B2 (en) 2016-09-13 2016-09-13 Shielding coating for selective metallization

Publications (3)

Publication Number Publication Date
JP2018044242A JP2018044242A (ja) 2018-03-22
JP2018044242A5 true JP2018044242A5 (enExample) 2018-12-13
JP6525386B2 JP6525386B2 (ja) 2019-06-05

Family

ID=59846447

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017172733A Expired - Fee Related JP6525386B2 (ja) 2016-09-13 2017-09-08 選択的な金属被覆のための遮断コーティング

Country Status (6)

Country Link
US (1) US9970114B2 (enExample)
EP (1) EP3296429B1 (enExample)
JP (1) JP6525386B2 (enExample)
KR (1) KR101975218B1 (enExample)
CN (1) CN107814961A (enExample)
TW (1) TWI627306B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018104739A (ja) * 2016-12-22 2018-07-05 ローム・アンド・ハース電子材料株式会社 無電解めっき方法
JP7381232B2 (ja) * 2019-07-16 2023-11-15 Ｍｃｐｐイノベーション合同会社 レーザーダイレクトストラクチャリング用熱可塑性樹脂組成物及び成形体
SE543833C2 (en) * 2020-01-24 2021-08-03 Mercene Coatings Ab Coating including primer
US12281391B2 (en) * 2020-09-08 2025-04-22 Nanyang Technological University Surface conditioner for electroless deposition
KR102499773B1 (ko) 2020-10-08 2023-02-15 한국과학기술연구원 발 특성 정보 및 균형 특성 정보를 이용한 노인성 질환 예측 방법 및 시스템

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0260514B1 (en) * 1986-09-15 1991-06-19 General Electric Company Photoselective metal deposition process
EP0729293B1 (en) * 1994-12-19 2002-04-03 Gary S. Calabrese Selective metallization process
US6909018B1 (en) 1996-05-20 2005-06-21 Basf Aktiengesellschaft Preparation of polyalkeneamines
JP4463345B2 (ja) 1999-06-18 2010-05-19 関西ペイント株式会社 塗料組成物
US6899829B2 (en) * 2000-11-30 2005-05-31 Shipley Company, L.L.C. Conductive polymer colloidal compositions with selectivity for non-conductive surfaces
DE10132092A1 (de) 2001-07-05 2003-01-23 Lpkf Laser & Electronics Ag Leiterbahnstrukturen und Verfahren zu ihrer Herstellung
JP3541360B2 (ja) * 2002-05-17 2004-07-07 独立行政法人 科学技術振興機構 多層回路構造の形成方法及び多層回路構造を有する基体
EP1652891B1 (en) * 2003-07-18 2012-06-13 Konishi Co., Ltd. Curable resin composition and cold-setting adhesive
US6946232B2 (en) * 2003-11-17 2005-09-20 Polaroid Corporation Image-receiving element
DE102004017440A1 (de) 2004-04-08 2005-11-03 Enthone Inc., West Haven Verfahren zur Behandlung von laserstrukturierten Kunststoffoberflächen
US7291380B2 (en) * 2004-07-09 2007-11-06 Hewlett-Packard Development Company, L.P. Laser enhanced plating for forming wiring patterns
JP4850487B2 (ja) * 2005-11-07 2012-01-11 富士フイルム株式会社 プリント配線板用積層体、それを用いたプリント配線板、プリント配線基板の作製方法、電気部品、電子部品、および、電気機器
US7972655B2 (en) 2007-11-21 2011-07-05 Enthone Inc. Anti-tarnish coatings
EP2231844B1 (en) 2007-12-18 2015-08-05 Colgate-Palmolive Company Alkaline cleaning compositions
US8974869B2 (en) 2010-01-26 2015-03-10 Robert Hamilton Method for improving plating on non-conductive substrates
JP5022501B2 (ja) 2010-11-04 2012-09-12 株式会社日本表面処理研究所 成形回路部品の製造方法
JP6049757B2 (ja) 2012-01-11 2016-12-21 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ 液相中での第二級アミンの製造法
JP5902853B2 (ja) 2014-07-24 2016-04-13 日立マクセル株式会社 メッキ部品の製造方法
US9797043B1 (en) * 2016-09-13 2017-10-24 Rohm And Haas Electronic Materials Llc Shielding coating for selective metallization
US9850578B1 (en) * 2016-09-13 2017-12-26 Rohm And Haas Electronic Materials Llc Shielding coating for selective metallization

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