JP2018032689A - 発光装置、及び照明装置 - Google Patents
発光装置、及び照明装置 Download PDFInfo
- Publication number
- JP2018032689A JP2018032689A JP2016162955A JP2016162955A JP2018032689A JP 2018032689 A JP2018032689 A JP 2018032689A JP 2016162955 A JP2016162955 A JP 2016162955A JP 2016162955 A JP2016162955 A JP 2016162955A JP 2018032689 A JP2018032689 A JP 2018032689A
- Authority
- JP
- Japan
- Prior art keywords
- sealing member
- emitting device
- light emitting
- light
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 62
- 239000011521 glass Substances 0.000 claims abstract description 52
- 238000007789 sealing Methods 0.000 claims description 134
- 229910052751 metal Inorganic materials 0.000 claims description 24
- 239000002184 metal Substances 0.000 claims description 24
- 229920002050 silicone resin Polymers 0.000 claims description 15
- 239000010931 gold Substances 0.000 claims description 11
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 8
- 229910052737 gold Inorganic materials 0.000 claims description 8
- 229910052723 transition metal Inorganic materials 0.000 claims description 7
- 238000007259 addition reaction Methods 0.000 claims description 6
- 238000007747 plating Methods 0.000 abstract description 40
- 239000000463 material Substances 0.000 abstract description 31
- 230000004888 barrier function Effects 0.000 abstract description 24
- 239000011248 coating agent Substances 0.000 abstract 2
- 238000000576 coating method Methods 0.000 abstract 2
- 239000010410 layer Substances 0.000 description 140
- 239000007789 gas Substances 0.000 description 36
- 229920005989 resin Polymers 0.000 description 17
- 239000011347 resin Substances 0.000 description 17
- 239000002245 particle Substances 0.000 description 16
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 14
- 239000007769 metal material Substances 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 5
- 239000003463 adsorbent Substances 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 5
- 239000000470 constituent Substances 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 238000005286 illumination Methods 0.000 description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 238000005401 electroluminescence Methods 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000000605 extraction Methods 0.000 description 3
- 230000001965 increasing effect Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000000344 soap Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000004954 Polyphthalamide Substances 0.000 description 2
- 229910021536 Zeolite Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical group O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000001579 optical reflectometry Methods 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920006375 polyphtalamide Polymers 0.000 description 2
- 229910052761 rare earth metal Inorganic materials 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 239000010457 zeolite Substances 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- MGWGWNFMUOTEHG-UHFFFAOYSA-N 4-(3,5-dimethylphenyl)-1,3-thiazol-2-amine Chemical compound CC1=CC(C)=CC(C=2N=C(N)SC=2)=C1 MGWGWNFMUOTEHG-UHFFFAOYSA-N 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical compound S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- GEIAQOFPUVMAGM-UHFFFAOYSA-N ZrO Inorganic materials [Zr]=O GEIAQOFPUVMAGM-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000000295 emission spectrum Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 229910000037 hydrogen sulfide Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- JCXJVPUVTGWSNB-UHFFFAOYSA-N nitrogen dioxide Inorganic materials O=[N]=O JCXJVPUVTGWSNB-UHFFFAOYSA-N 0.000 description 1
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000012463 white pigment Substances 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V13/00—Producing particular characteristics or distribution of the light emitted by means of a combination of elements specified in two or more of main groups F21V1/00 - F21V11/00
- F21V13/02—Combinations of only two kinds of elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/81—Anodes
- H10K50/814—Anodes combined with auxiliary electrodes, e.g. ITO layer combined with metal lines
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/82—Cathodes
- H10K50/824—Cathodes combined with auxiliary electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/854—Arrangements for extracting light from the devices comprising scattering means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
- H10K59/8051—Anodes
- H10K59/80516—Anodes combined with auxiliary electrodes, e.g. ITO layer combined with metal lines
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
- H10K59/8052—Cathodes
- H10K59/80522—Cathodes combined with auxiliary electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/875—Arrangements for extracting light from the devices
- H10K59/877—Arrangements for extracting light from the devices comprising scattering means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Optics & Photonics (AREA)
- Manufacturing & Machinery (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
Description
[発光装置の構成]
まず、実施の形態1に係る発光装置の構成について主として図1〜図3を参照しながら説明する。図1は、実施の形態1に係る発光装置の外観斜視図である。図2は、実施の形態1に係る発光装置の平面図である。図3は、図2のIII−III線における断面図である。
基板11は、基材11aと、配線層11bと、めっき層11cと、ガラスコート層11dとを含み、複数のLEDチップ12が配置される板材である。基板11は、例えば、金属を基材11aとするメタルベース基板、または、セラミックを基材11aとするセラミック基板である。また、基板11は、樹脂を基材11aとする樹脂基板であってもよい。
LEDチップ12は、発光素子の一例であって、青色光を発する青色LEDチップである。LEDチップ12としては、例えばInGaN系の材料によって構成された、中心波長(発光スペクトルのピーク波長)が430nm以上480nm以下の窒化ガリウム系のLEDチップが採用される。
第一封止部材13は、複数のLEDチップ12、ボンディングワイヤ17、及び、めっき層11cの一部を封止する封止部材である。平面視において、第一封止部材13は、円環状の第二封止部材15にせき止められることによって円形状に形成される。なお、平面視とは、基板11の主面に垂直な方向から見ることを意味する。
第二封止部材15は、主としてガラスコート層11dの上に配置された、第一封止部材13とは別の部材であって、硬化される前の第一封止部材13をせき止めるための部材である。第二封止部材15は、言い換えれば、ダム材であり、第一封止部材13に隣接する。
発光装置10においては、第二封止部材15は、めっき層11c及びガラスコート層11dの境界部においてガスバリア性が低いことが課題である。図7は、めっき層11c及びガラスコート層11dの境界部の拡大断面図(図3の領域VIIを拡大した図)である。なお、図7では、めっき層11cは、下から順にニッケル11e、パラジウム11f、金11gが積層された3層構造であるとして説明される。つまり、めっき層11cは、Ni/Pd/Auめっき層である。
以上説明したように、発光装置10は、基板11と、基板11上に配置されたLEDチップ12と、LEDチップ12を封止する第一封止部材13と、第二封止部材15とを備える。基板11は、基材11aと、基材11a上に配置された、LEDチップ12に電気的に接続される配線層11bと、配線層11bの一部を覆うめっき層11cと、配線層11bの他の一部を覆うガラスコート層11dとを含む。第二封止部材15は、めっき層11c及びガラスコート層11dの境界部14を封止する。LEDチップ12は、発光素子の一例であり、めっき層11cは、金属層の一例であり、ガラスコート層11dは、絶縁層の一例である。
実施の形態2では、発光装置10を備える照明装置について、図9及び図10を用いて説明する。図9は、実施の形態2に係る照明装置の断面図である。図10は、実施の形態2に係る照明装置及びその周辺部材の外観斜視図である。
以上、実施の形態に係る発光装置及び照明装置について説明したが、本発明は、上記実施の形態に限定されるものではない。
11 基板
11a 基材
11b 配線層
11c めっき層(金属層)
11d ガラスコート層(絶縁層)
11g 金
12 LEDチップ(発光素子)
13 第一封止部材
14 境界部
15 第二封止部材
200 照明装置
250 点灯装置
Claims (8)
- 基板と、
前記基板上に配置された発光素子と、
前記発光素子を封止する第一封止部材と、
第二封止部材とを備え、
前記基板は、
基材と、
前記基材上に配置された、前記発光素子に電気的に接続される配線層と、
前記配線層の一部を覆う金属層と、
前記配線層の他の一部を覆う絶縁層とを含み、
前記第二封止部材は、前記金属層及び前記絶縁層の境界部を封止する
発光装置。 - 前記第二封止部材は、前記第一封止部材よりも硬い
請求項1に記載の発光装置。 - 前記第二封止部材のタイプAデュロメータ硬さは、45以上である
請求項1または2に記載の発光装置。 - 前記第一封止部材及び前記第二封止部材は、付加反応型のシリコーン樹脂により形成される
請求項1〜3のいずれか1項に記載の発光装置。 - 前記第一封止部材及び前記第二封止部材の少なくとも一方は、遷移金属元素を含む
請求項1〜4のいずれか1項に記載の発光装置。 - 前記境界部は、平面視において円弧状である、前記金属層及び前記絶縁層の境界線に沿って形成され、
平面視において、前記第二封止部材は、前記境界部を前記境界線に沿って封止する円環状であり、前記第一封止部材を囲む
請求項1〜5のいずれか1項に記載の発光装置。 - 前記金属層は、金を含み、
前記絶縁層は、ガラスにより形成される
請求項1〜6のいずれか1項に記載の発光装置。 - 請求項1〜7のいずれか1項に記載の発光装置と、
前記発光装置に、当該発光装置を点灯させるための電力を供給する点灯装置とを備える
照明装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016162955A JP6788860B2 (ja) | 2016-08-23 | 2016-08-23 | 発光装置、及び照明装置 |
US15/671,270 US10199597B2 (en) | 2016-08-23 | 2017-08-08 | Light-emitting apparatus and illumination apparatus |
DE102017118479.1A DE102017118479A1 (de) | 2016-08-23 | 2017-08-14 | Lichtemittierende Vorrichtung und Beleuchtungsvorrichtung |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016162955A JP6788860B2 (ja) | 2016-08-23 | 2016-08-23 | 発光装置、及び照明装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018032689A true JP2018032689A (ja) | 2018-03-01 |
JP6788860B2 JP6788860B2 (ja) | 2020-11-25 |
Family
ID=61166968
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016162955A Active JP6788860B2 (ja) | 2016-08-23 | 2016-08-23 | 発光装置、及び照明装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US10199597B2 (ja) |
JP (1) | JP6788860B2 (ja) |
DE (1) | DE102017118479A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019186505A (ja) * | 2018-04-17 | 2019-10-24 | パナソニックIpマネジメント株式会社 | 発光装置、照明装置、及び、シリコーン樹脂 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112289753B (zh) * | 2019-07-25 | 2023-12-22 | 松山湖材料实验室 | 用于紫外led封装的围坝陶瓷基板制作方法及其制品 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012074474A (ja) * | 2010-09-28 | 2012-04-12 | Kyocera Corp | 発光素子搭載用基板 |
US20120273954A1 (en) * | 2011-04-28 | 2012-11-01 | Higgins Iii Leo M | Semiconductor device with protective material and method for encapsulating |
JP2012227369A (ja) * | 2011-04-20 | 2012-11-15 | Sharp Corp | 線状光源および線状光源の製造方法 |
JP2014187081A (ja) * | 2013-03-22 | 2014-10-02 | Nichia Chem Ind Ltd | 発光装置 |
JP2014192270A (ja) * | 2013-03-26 | 2014-10-06 | Toshiba Lighting & Technology Corp | 発光装置および照明装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5119917B2 (ja) | 2007-12-28 | 2013-01-16 | 日亜化学工業株式会社 | 発光装置 |
US8049237B2 (en) | 2007-12-28 | 2011-11-01 | Nichia Corporation | Light emitting device |
JP2012049519A (ja) | 2010-07-26 | 2012-03-08 | Mitsubishi Chemicals Corp | 半導体発光装置用パッケージ及び発光装置 |
US8624271B2 (en) * | 2010-11-22 | 2014-01-07 | Cree, Inc. | Light emitting devices |
JP5793685B2 (ja) | 2011-04-18 | 2015-10-14 | パナソニックIpマネジメント株式会社 | 発光装置、バックライトユニット、液晶表示装置及び照明装置 |
JP2013191667A (ja) | 2012-03-13 | 2013-09-26 | Panasonic Corp | 発光装置及び照明装置 |
JP5948666B2 (ja) | 2012-11-22 | 2016-07-06 | パナソニックIpマネジメント株式会社 | 照明用光源及び照明装置 |
US9179511B2 (en) | 2013-07-08 | 2015-11-03 | Panasonic Intellectual Property Management Co., Ltd. | Light-emitting device, and light source for lighting and lighting apparatus using the same |
-
2016
- 2016-08-23 JP JP2016162955A patent/JP6788860B2/ja active Active
-
2017
- 2017-08-08 US US15/671,270 patent/US10199597B2/en not_active Expired - Fee Related
- 2017-08-14 DE DE102017118479.1A patent/DE102017118479A1/de not_active Withdrawn
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012074474A (ja) * | 2010-09-28 | 2012-04-12 | Kyocera Corp | 発光素子搭載用基板 |
JP2012227369A (ja) * | 2011-04-20 | 2012-11-15 | Sharp Corp | 線状光源および線状光源の製造方法 |
US20120273954A1 (en) * | 2011-04-28 | 2012-11-01 | Higgins Iii Leo M | Semiconductor device with protective material and method for encapsulating |
JP2014187081A (ja) * | 2013-03-22 | 2014-10-02 | Nichia Chem Ind Ltd | 発光装置 |
JP2014192270A (ja) * | 2013-03-26 | 2014-10-06 | Toshiba Lighting & Technology Corp | 発光装置および照明装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019186505A (ja) * | 2018-04-17 | 2019-10-24 | パナソニックIpマネジメント株式会社 | 発光装置、照明装置、及び、シリコーン樹脂 |
Also Published As
Publication number | Publication date |
---|---|
US10199597B2 (en) | 2019-02-05 |
JP6788860B2 (ja) | 2020-11-25 |
DE102017118479A1 (de) | 2018-03-01 |
US20180062110A1 (en) | 2018-03-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9420642B2 (en) | Light emitting apparatus and lighting apparatus | |
US9261246B2 (en) | Light-emitting module, light source device, liquid crystal display device, and method of manufacturing light-emitting module | |
US9966509B2 (en) | Light emitting apparatus and lighting apparatus | |
JP2014067846A (ja) | Led照明器具 | |
JP2006013087A (ja) | 半導体発光装置 | |
US9746145B2 (en) | Light-emitting device with non-successive placement of light-emitting elements of one color, illumination light source having the same, and illumination device having the same | |
US10490721B2 (en) | Light-emitting device and illuminating apparatus | |
JP2014192407A (ja) | 半導体発光装置 | |
JP2013012694A (ja) | 発光装置及び照明装置 | |
JP2018129492A (ja) | 発光装置、及び、照明装置 | |
JP2014082481A (ja) | 発光装置 | |
JP2017034134A (ja) | 発光装置、及び、照明装置 | |
JP6788860B2 (ja) | 発光装置、及び照明装置 | |
JP2009071090A (ja) | 発光装置 | |
JP2012069302A (ja) | ランプ及び照明装置 | |
JP2015133455A (ja) | 発光装置、照明用光源、および照明装置 | |
US20190013449A1 (en) | Light-emitting device, illuminating apparatus, and mounting board | |
US20180062058A1 (en) | Light-emitting apparatus and illumination apparatus | |
JP5351365B1 (ja) | 発光装置及びランプ | |
JP2019186505A (ja) | 発光装置、照明装置、及び、シリコーン樹脂 | |
JP2013073983A (ja) | 発光装置及び照明装置 | |
JP5234363B2 (ja) | 発光装置及び照明装置 | |
JP2019021742A (ja) | 発光装置、及び、照明装置 | |
JP2017162941A (ja) | 発光装置、及び、照明装置 | |
JP2017050433A (ja) | 発光装置、及び、照明装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20190520 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20200317 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20200318 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20200507 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20200609 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20200730 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20200929 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20201019 |
|
R151 | Written notification of patent or utility model registration |
Ref document number: 6788860 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |