JP2013012694A - 発光装置及び照明装置 - Google Patents
発光装置及び照明装置 Download PDFInfo
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- 229920005989 resin Polymers 0.000 claims abstract description 214
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- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 20
- 239000001301 oxygen Substances 0.000 claims abstract description 20
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 20
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- 239000010949 copper Substances 0.000 description 6
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- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 6
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
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- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 description 2
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- 239000000919 ceramic Substances 0.000 description 1
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S8/00—Lighting devices intended for fixed installation
- F21S8/04—Lighting devices intended for fixed installation intended only for mounting on a ceiling or the like overhead structures
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
- F21V19/0055—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
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- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
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- H05K2201/0162—Silicon containing polymer, e.g. silicone
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/099—Coating over pads, e.g. solder resist partly over pads
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
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- H05K2201/10106—Light emitting diode [LED]
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
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- Manufacturing & Machinery (AREA)
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Abstract
【解決手段】発光装置1は、樹脂基板10と、樹脂基板10上に形成された反射層18と、反射層18の周囲に形成された保護層45と、反射層18上に載置された発光素子11と、反射層18、保護層45及び発光素子11を覆う、蛍光体及び熱硬化性樹脂を含む封止樹脂層12を具備する。該発光装置1において、熱硬化性樹脂の酸素透過性は1200cm3/(m2・day・atm)以下であり、封止樹脂層12に被覆された基板10上の領域の面積に対する反射層18の面積の割合が、30%以上75%以下の範囲である。
【選択図】図6
Description
封止樹脂層を構成する熱硬化性樹脂の酸素透過性と、光束維持率の関係を調査した。
幅27mm、長さ200mmのFR−4基板を用い、発光装置を製造した。同じ封止樹脂層内に4個の発光素子を3mm間隔で一列に配置した。ドーム形状の封止樹脂層の直径は29mmとした。発光素子は約3V−30mAのものを用いた。封止樹脂層の材料として、酸素透過性が1200cm3/(m2・day・atm)のフェニル系シリコーン樹脂を用いた。封止樹脂層により被覆された領域の面積に対する反射層の面積の割合は50%とした。
封止樹脂層の材料として、表1に示した酸素透過性を有する熱硬化性樹脂を用いた以外は、実施例1と同様に発光装置を製造した。
(実施例3〜4及び比較例3〜5)
封止樹脂層に被覆された領域の面積に対する反射層の面積の割合を、表2に記載したとおりにした以外は、実施例1と同様に発光装置を製造した。
実施例3〜4及び比較例3〜5の発光装置を、製品製造直後に点灯させ発光効率を測定した。その結果を、反射層の面積が100%である時の発光効率を100%とした相対値で表2に示した。また、温度差160℃の条件でヒートサイクル試験を行い、封止樹脂層の剥離が生じたサイクル数を観察した。その結果を表2及び図10に示した。
(実施例5〜8)
封止樹脂層の材料として、デュロメータ(タイプA)で測定した硬さが表3に示したとおりであり、酸素透過性が1200cm3/(m2・day・atm)であるフェニル系シリコーン樹脂を用いた以外は、実施例1と同様に発光装置を製造した。
実施例5〜8の発光装置を用いて、温度差160℃の条件でヒートサイクル試験を行い、ボンディングワイヤの断線が生じたサイクル数を観察した。また、各発光装置の封止樹脂層に外部応力を印加し、ボンディングワイヤの断線が生じる応力を測定した。その結果を表3及び図11に示した。
(実施例9〜10)
封止樹脂層の材料として、屈折率が表4に示したとおりであり、酸素透過性が1200cm3/(m2・day・atm)であるフェニル系シリコーン樹脂を用いた以外は、実施例1と同様に発光装置を製造した。
Claims (6)
- 樹脂基板と;
前記樹脂基板上に形成された反射層と;
前記反射層の周囲に形成された保護層と;
前記反射層上に載置された発光素子と;
前記反射層、前記保護層及び前記発光素子を覆う蛍光体及び熱硬化性樹脂を含む封止樹脂層と;
を具備し、
前記封止樹脂層に含まれた前記熱硬化性樹脂の酸素透過性が1200cm3/(m2・day・atm)以下であり、
前記封止樹脂層に被覆された保護層及び反射層を含む基板上の領域の面積に対する前記反射層の面積の割合は、30%以上75%以下の範囲であることを特徴とする発光装置。 - 前記封止樹脂層は、デュロメータ(タイプA)で測定された前記熱硬化性樹脂の硬さが45以上89以下の範囲であることを特徴とする請求項1に記載の発光装置。
- 前記封止樹脂層は、前記樹脂基板の表面に対して水平方向に強制的応力を印加すると前記樹脂基板から界面剥離することを特徴とする請求項1又は2に記載の発光装置。
- 前記封止樹脂層に含まれた前記熱硬化性樹脂は、35g/m2以下の水蒸気透過性を更に有していることを特徴とする請求項1から3のうちのいずれか一項に記載の発光装置。
- 前記熱硬化性樹脂が、レジン系シリコーン樹脂であることを特徴とする請求項4に記載の発光装置。
- 器具本体と;
前記器具本体に配設された請求項1から5のうちのいずれか一項に記載の発光装置と;
を具備することを特徴とする照明装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011167518A JP5817297B2 (ja) | 2011-06-03 | 2011-07-29 | 発光装置及び照明装置 |
EP12158298.5A EP2531010A3 (en) | 2011-06-03 | 2012-03-06 | Light-emitting device and luminaire |
US13/414,458 US8643047B2 (en) | 2011-06-03 | 2012-03-07 | Light-emitting device and luminaire |
CN2012201150182U CN202503034U (zh) | 2011-06-03 | 2012-03-23 | 发光装置以及照明装置 |
TW101109996A TW201251122A (en) | 2011-06-03 | 2012-03-23 | Lighting device and illuminating device |
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JP2011125234 | 2011-06-03 | ||
JP2011125234 | 2011-06-03 | ||
JP2011167518A JP5817297B2 (ja) | 2011-06-03 | 2011-07-29 | 発光装置及び照明装置 |
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JP2013012694A true JP2013012694A (ja) | 2013-01-17 |
JP5817297B2 JP5817297B2 (ja) | 2015-11-18 |
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JP2011167518A Expired - Fee Related JP5817297B2 (ja) | 2011-06-03 | 2011-07-29 | 発光装置及び照明装置 |
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---|---|
US (1) | US8643047B2 (ja) |
EP (1) | EP2531010A3 (ja) |
JP (1) | JP5817297B2 (ja) |
CN (1) | CN202503034U (ja) |
TW (1) | TW201251122A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2014119146A1 (ja) * | 2013-01-31 | 2017-01-26 | シャープ株式会社 | 発光装置の製造方法及び発光装置 |
US10312453B2 (en) | 2013-12-17 | 2019-06-04 | Beijing Visionox Technology Co., Ltd. | Organic electroluminescent device and method for manufacture thereof |
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---|---|---|---|---|
DE102012213178A1 (de) * | 2012-04-30 | 2013-10-31 | At & S Austria Technologie & Systemtechnik Aktiengesellschaft | LED-Modul mit Leiterplatte |
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Also Published As
Publication number | Publication date |
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EP2531010A2 (en) | 2012-12-05 |
JP5817297B2 (ja) | 2015-11-18 |
EP2531010A3 (en) | 2014-11-26 |
CN202503034U (zh) | 2012-10-24 |
US8643047B2 (en) | 2014-02-04 |
TW201251122A (en) | 2012-12-16 |
US20120305963A1 (en) | 2012-12-06 |
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