JP2018016812A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2018016812A5 JP2018016812A5 JP2017207262A JP2017207262A JP2018016812A5 JP 2018016812 A5 JP2018016812 A5 JP 2018016812A5 JP 2017207262 A JP2017207262 A JP 2017207262A JP 2017207262 A JP2017207262 A JP 2017207262A JP 2018016812 A5 JP2018016812 A5 JP 2018016812A5
- Authority
- JP
- Japan
- Prior art keywords
- tungsten
- slurry
- polishing
- abrasive
- cmp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002002 slurry Substances 0.000 claims 10
- 238000005498 polishing Methods 0.000 claims 9
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 9
- 229910052721 tungsten Inorganic materials 0.000 claims 9
- 239000010937 tungsten Substances 0.000 claims 9
- 239000000126 substance Substances 0.000 claims 4
- 239000013543 active substance Substances 0.000 claims 3
- 239000007800 oxidant agent Substances 0.000 claims 3
- 239000002245 particle Substances 0.000 claims 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 3
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 238000000034 method Methods 0.000 claims 1
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201462073636P | 2014-10-31 | 2014-10-31 | |
| US62/073,636 | 2014-10-31 | ||
| US14/884,104 | 2015-10-15 | ||
| US14/884,104 US20160122590A1 (en) | 2014-10-31 | 2015-10-15 | Chemical Mechanical Polishing Slurry for Reducing Corrosion and Method of Use Therefor |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015212522A Division JP6530303B2 (ja) | 2014-10-31 | 2015-10-29 | 腐食を低減するための化学機械研磨スラリー及びその使用方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2018016812A JP2018016812A (ja) | 2018-02-01 |
| JP2018016812A5 true JP2018016812A5 (https=) | 2018-12-06 |
Family
ID=55851950
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015212522A Active JP6530303B2 (ja) | 2014-10-31 | 2015-10-29 | 腐食を低減するための化学機械研磨スラリー及びその使用方法 |
| JP2017207262A Pending JP2018016812A (ja) | 2014-10-31 | 2017-10-26 | 腐食を低減するための化学機械研磨スラリー及びその使用方法 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015212522A Active JP6530303B2 (ja) | 2014-10-31 | 2015-10-29 | 腐食を低減するための化学機械研磨スラリー及びその使用方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20160122590A1 (https=) |
| JP (2) | JP6530303B2 (https=) |
| KR (2) | KR101867441B1 (https=) |
| TW (1) | TWI577788B (https=) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10570313B2 (en) * | 2015-02-12 | 2020-02-25 | Versum Materials Us, Llc | Dishing reducing in tungsten chemical mechanical polishing |
| US10128146B2 (en) | 2015-08-20 | 2018-11-13 | Globalwafers Co., Ltd. | Semiconductor substrate polishing methods and slurries and methods for manufacturing silicon on insulator structures |
| CN109715751A (zh) | 2016-09-23 | 2019-05-03 | 圣戈本陶瓷及塑料股份有限公司 | 化学机械平坦化浆料及其形成方法 |
| KR102798940B1 (ko) * | 2016-12-05 | 2025-04-25 | 솔브레인 주식회사 | 화학적 기계적 연마 슬러리 조성물 및 이를 이용한 반도체 소자의 제조방법 |
| KR102422952B1 (ko) | 2017-06-12 | 2022-07-19 | 삼성전자주식회사 | 금속막 연마용 슬러리 조성물 및 이를 이용하는 반도체 장치의 제조 방법 |
| WO2019006618A1 (zh) * | 2017-07-03 | 2019-01-10 | 深圳市宏昌发科技有限公司 | 钝化剂、金属镀件表面处理方法和金属工件 |
| EP3684148B1 (en) * | 2017-09-12 | 2023-11-29 | Kabushiki Kaisha Toshiba | Method for manufacturing ceramic circuit board |
| US20190085205A1 (en) * | 2017-09-15 | 2019-03-21 | Cabot Microelectronics Corporation | NITRIDE INHIBITORS FOR HIGH SELECTIVITY OF TiN-SiN CMP APPLICATIONS |
| US20190352535A1 (en) * | 2018-05-21 | 2019-11-21 | Versum Materials Us, Llc | Chemical Mechanical Polishing Tungsten Buffing Slurries |
| US20190382619A1 (en) * | 2018-06-18 | 2019-12-19 | Versum Materials Us, Llc | Tungsten Chemical Mechanical Polishing Compositions |
| US11643599B2 (en) * | 2018-07-20 | 2023-05-09 | Versum Materials Us, Llc | Tungsten chemical mechanical polishing for reduced oxide erosion |
| US11286403B2 (en) | 2018-07-20 | 2022-03-29 | Dongjin Semichem Co., Ltd | Chemical mechanical polishing composition, chemical mechanical polishing slurry and method for polishing substrate |
| KR102808137B1 (ko) * | 2018-07-20 | 2025-05-16 | 주식회사 동진쎄미켐 | 화학적 기계적 연마 조성물, 화학적 기계적 연마 슬러리 및 기판의 연마 방법 |
| US11043396B2 (en) * | 2018-07-31 | 2021-06-22 | Taiwan Semiconductor Manufacturing Company, Ltd. | Chemical mechanical polish slurry and method of manufacture |
| KR102770047B1 (ko) * | 2019-06-20 | 2025-02-20 | 후지필름 가부시키가이샤 | 연마액, 및, 화학적 기계적 연마 방법 |
| CN114686110A (zh) * | 2020-12-30 | 2022-07-01 | 安集微电子科技（上海）股份有限公司 | 一种化学机械抛光液 |
| CN115212920B (zh) * | 2022-07-11 | 2023-08-15 | 浙江奥首材料科技有限公司 | 一种壳聚糖基分散催化剂、包含其的半导体材料抛光液、其制备方法及用途 |
| WO2024052720A1 (en) * | 2022-09-08 | 2024-03-14 | Eastern University, Sri Lanka | pH STABILIZING COMPOSITION FOR CORROSION PROTECTION IN CONCRETE AND METHOD OF PREPARATION THEREOF |
| TWI873902B (zh) * | 2022-10-11 | 2025-02-21 | 美商Ｃｍｃ材料有限責任公司 | 用於高度摻雜硼之矽膜之化學機械拋光組合物 |
| KR20240061362A (ko) * | 2022-10-31 | 2024-05-08 | 주식회사 케이씨텍 | 연마 슬러리 조성물 |
| CN118813140A (zh) * | 2024-07-25 | 2024-10-22 | 中机半导体材料(深圳)有限公司 | 一种用于碳化硅衬底cmp的氧化铝抛光液的制备方法 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5958288A (en) * | 1996-11-26 | 1999-09-28 | Cabot Corporation | Composition and slurry useful for metal CMP |
| US6083419A (en) * | 1997-07-28 | 2000-07-04 | Cabot Corporation | Polishing composition including an inhibitor of tungsten etching |
| US7077880B2 (en) * | 2004-01-16 | 2006-07-18 | Dupont Air Products Nanomaterials Llc | Surface modified colloidal abrasives, including stable bimetallic surface coated silica sols for chemical mechanical planarization |
| US20030162398A1 (en) * | 2002-02-11 | 2003-08-28 | Small Robert J. | Catalytic composition for chemical-mechanical polishing, method of using same, and substrate treated with same |
| US7513920B2 (en) * | 2002-02-11 | 2009-04-07 | Dupont Air Products Nanomaterials Llc | Free radical-forming activator attached to solid and used to enhance CMP formulations |
| JP2006019358A (ja) * | 2004-06-30 | 2006-01-19 | Sumitomo Chemical Co Ltd | 化学機械研磨用水系分散体 |
| KR100497413B1 (ko) * | 2004-11-26 | 2005-06-23 | 에이스하이텍 주식회사 | 텅스텐-화학적 기계적 연마에 유용한 슬러리 및 그 제조방법 |
| US20070075042A1 (en) * | 2005-10-05 | 2007-04-05 | Siddiqui Junaid A | Stabilizer-Fenton's reaction metal-vinyl pyridine polymer-surface-modified chemical mechanical planarization composition and associated method |
| US7368066B2 (en) * | 2006-05-31 | 2008-05-06 | Cabot Microelectronics Corporation | Gold CMP composition and method |
| US20080149591A1 (en) * | 2006-12-21 | 2008-06-26 | Junaid Ahmed Siddiqui | Method and slurry for reducing corrosion on tungsten during chemical mechanical polishing |
| US8506831B2 (en) * | 2008-12-23 | 2013-08-13 | Air Products And Chemicals, Inc. | Combination, method, and composition for chemical mechanical planarization of a tungsten-containing substrate |
| US8858819B2 (en) * | 2010-02-15 | 2014-10-14 | Air Products And Chemicals, Inc. | Method for chemical mechanical planarization of a tungsten-containing substrate |
| US20140273458A1 (en) * | 2013-03-12 | 2014-09-18 | Air Products And Chemicals, Inc. | Chemical Mechanical Planarization for Tungsten-Containing Substrates |
| US20140315386A1 (en) * | 2013-04-19 | 2014-10-23 | Air Products And Chemicals, Inc. | Metal Compound Coated Colloidal Particles Process for Making and Use Therefor |
| US10570313B2 (en) * | 2015-02-12 | 2020-02-25 | Versum Materials Us, Llc | Dishing reducing in tungsten chemical mechanical polishing |
-
2015
- 2015-10-15 US US14/884,104 patent/US20160122590A1/en not_active Abandoned
- 2015-10-26 TW TW104135151A patent/TWI577788B/zh active
- 2015-10-29 KR KR1020150151137A patent/KR101867441B1/ko active Active
- 2015-10-29 JP JP2015212522A patent/JP6530303B2/ja active Active
-
2017
- 2017-10-26 JP JP2017207262A patent/JP2018016812A/ja active Pending
-
2018
- 2018-06-05 KR KR1020180065086A patent/KR102072230B1/ko active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2018016812A5 (https=) | ||
| US10272537B2 (en) | Method for polishing GaN single crystal material | |
| CN204471179U (zh) | 一种可传输研磨液的化学机械研磨设备 | |
| JP2019036714A5 (https=) | ||
| SG149772A1 (en) | Method for polishing a substrate composed of semiconductor material | |
| JP2016538139A5 (https=) | ||
| JP2009543337A5 (https=) | ||
| SG148912A1 (en) | Chemical mechanical polishing slurry composition for polishing phase- change memory device and method for polishing phase-change memory device using the same | |
| CN101327577B (zh) | 带自修整功能的磨损均匀性好的固结磨料抛光垫 | |
| SG148913A1 (en) | Chemical mechanical polishing slurry composition for polishing phase- change memory device and method for polishing phase-change memory device using the same | |
| SG171513A1 (en) | Method for polishing a semiconductor wafer | |
| RU2017103686A (ru) | Растворы для полировки и способы их применения | |
| TW200740973A (en) | Adjuvant for CMP slurry | |
| TW201619343A (zh) | 硏磨液及ＳｉＣ基板之硏磨方法 | |
| JP2018518050A5 (https=) | ||
| JP2019057710A5 (https=) | ||
| IL189504A0 (en) | Abrasive-free polishing method | |
| JP2001205554A5 (https=) | ||
| TWI412428B (https=) | ||
| JP2016204187A5 (https=) | ||
| CN207127727U (zh) | 一种超声波修整盘及化学机械研磨机 | |
| ATE537232T1 (de) | Cmp-zusammensetzung für verbesserte oxidentfernungsgeschwindigkeit | |
| CN205765540U (zh) | 一种半导体基片的流体动压抛光装置 | |
| JP2006080329A (ja) | 化学的機械的研磨装置 | |
| US10777423B2 (en) | Chemical mechanical polishing method |