JP2018014408A5 - - Google Patents

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JP2018014408A5
JP2018014408A5 JP2016143073A JP2016143073A JP2018014408A5 JP 2018014408 A5 JP2018014408 A5 JP 2018014408A5 JP 2016143073 A JP2016143073 A JP 2016143073A JP 2016143073 A JP2016143073 A JP 2016143073A JP 2018014408 A5 JP2018014408 A5 JP 2018014408A5
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Japan
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oxide semiconductor
microwave
insulator
substrate
band gap
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JP2016143073A
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Japanese (ja)
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JP2018014408A (ja
JP6957134B2 (ja
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JP2016143073A 2016-07-21 2016-07-21 酸化物半導体の評価方法 Active JP6957134B2 (ja)

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JP2016143073A JP6957134B2 (ja) 2016-07-21 2016-07-21 酸化物半導体の評価方法

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JP2016143073A JP6957134B2 (ja) 2016-07-21 2016-07-21 酸化物半導体の評価方法

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JP2018014408A JP2018014408A (ja) 2018-01-25
JP2018014408A5 true JP2018014408A5 (enExample) 2019-08-22
JP6957134B2 JP6957134B2 (ja) 2021-11-02

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Publication number Priority date Publication date Assignee Title
JP6922826B2 (ja) * 2018-04-25 2021-08-18 信越半導体株式会社 シリコン単結晶基板の選別方法
US11929426B2 (en) 2018-09-05 2024-03-12 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the semiconductor device
CN114509450B (zh) * 2021-12-29 2025-02-11 西安奕斯伟材料科技股份有限公司 借助少子寿命表征硅片吸除金属杂质效率的装置和方法
CN117313625B (zh) * 2023-11-29 2024-02-09 北京智芯微电子科技有限公司 Mos器件寿命预测方法、装置和电子设备

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US5580828A (en) * 1992-12-16 1996-12-03 Semiconductor Physics Laboratory Rt Method for chemical surface passivation for in-situ bulk lifetime measurement of silicon semiconductor material
JP5814558B2 (ja) * 2010-06-30 2015-11-17 株式会社神戸製鋼所 酸化物半導体薄膜の評価方法、及び酸化物半導体薄膜の品質管理方法
JP6152348B2 (ja) * 2013-01-11 2017-06-21 株式会社神戸製鋼所 酸化物半導体薄膜の評価方法及び酸化物半導体薄膜の品質管理方法
JP5798669B2 (ja) * 2013-12-03 2015-10-21 株式会社神戸製鋼所 酸化物半導体薄膜の評価方法、及び酸化物半導体薄膜の品質管理方法、並びに上記評価方法に用いられる評価装置
WO2015198604A1 (ja) * 2014-06-26 2015-12-30 株式会社Joled 薄膜トランジスタ及び有機el表示装置

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