JP2017534458A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2017534458A5 JP2017534458A5 JP2017512917A JP2017512917A JP2017534458A5 JP 2017534458 A5 JP2017534458 A5 JP 2017534458A5 JP 2017512917 A JP2017512917 A JP 2017512917A JP 2017512917 A JP2017512917 A JP 2017512917A JP 2017534458 A5 JP2017534458 A5 JP 2017534458A5
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- laser beam
- modified
- depression
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 description 7
- 230000004048 modification Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 230000007547 defect Effects 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 230000003993 interaction Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 230000006378 damage Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102014113339.0A DE102014113339A1 (de) | 2014-09-16 | 2014-09-16 | Verfahren zur Erzeugung von Ausnehmungen in einem Material |
| DE102014113339.0 | 2014-09-16 | ||
| DE102014116291.9 | 2014-11-07 | ||
| DE102014116291 | 2014-11-07 | ||
| PCT/DE2015/100333 WO2016041544A1 (de) | 2014-09-16 | 2015-08-07 | Verfahren zum einbringen mindestens einer ausnehmung oder einer durchbrechung in ein plattenförmiges werkstück |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020118488A Division JP7049404B2 (ja) | 2014-09-16 | 2020-07-09 | 板状の加工物に少なくとも一つの除去部又は穴を設ける方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017534458A JP2017534458A (ja) | 2017-11-24 |
| JP2017534458A5 true JP2017534458A5 (https=) | 2019-11-28 |
| JP6782692B2 JP6782692B2 (ja) | 2020-11-11 |
Family
ID=54072638
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017512917A Active JP6782692B2 (ja) | 2014-09-16 | 2015-08-07 | 板状の加工物に少なくとも一つの窪み又は穴を配設する方法 |
| JP2020118488A Active JP7049404B2 (ja) | 2014-09-16 | 2020-07-09 | 板状の加工物に少なくとも一つの除去部又は穴を設ける方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020118488A Active JP7049404B2 (ja) | 2014-09-16 | 2020-07-09 | 板状の加工物に少なくとも一つの除去部又は穴を設ける方法 |
Country Status (11)
| Country | Link |
|---|---|
| US (2) | US11610784B2 (https=) |
| EP (2) | EP4061101A1 (https=) |
| JP (2) | JP6782692B2 (https=) |
| KR (6) | KR20170044143A (https=) |
| CN (1) | CN107006128B (https=) |
| ES (1) | ES2923764T5 (https=) |
| LT (1) | LT3195706T (https=) |
| MY (1) | MY196621A (https=) |
| SG (2) | SG10201902331XA (https=) |
| TW (1) | TWI616939B (https=) |
| WO (1) | WO2016041544A1 (https=) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102018100299A1 (de) * | 2017-01-27 | 2018-08-02 | Schott Ag | Strukturiertes plattenförmiges Glaselement und Verfahren zu dessen Herstellung |
| KR20190116378A (ko) | 2017-03-06 | 2019-10-14 | 엘피케이에프 레이저 앤드 일렉트로닉스 악티엔게젤샤프트 | 전자기 방사선과 후속 에칭공정을 이용해 재료 안으로 적어도 하나의 리세스를 도입하기 위한 방법 |
| US11072041B2 (en) | 2017-03-06 | 2021-07-27 | Lpkf Laser & Electronics Ag | Method for producing a technical mask |
| DE102018110211A1 (de) * | 2018-04-27 | 2019-10-31 | Schott Ag | Verfahren zum Erzeugen feiner Strukturen im Volumen eines Substrates aus sprödharten Material |
| TWI678342B (zh) * | 2018-11-09 | 2019-12-01 | 財團法人工業技術研究院 | 形成導角的切割方法 |
| DE102020100848B4 (de) | 2019-01-29 | 2023-07-27 | Lpkf Laser & Electronics Aktiengesellschaft | Verfahren zur Mikrostrukturierung eines Glassubstrats mittels Laserstrahlung |
| DE102019201347B3 (de) * | 2019-02-01 | 2020-06-18 | Lpkf Laser & Electronics Ag | Herstellung von metallischen Leiterbahnen an Glas |
| KR20210124384A (ko) * | 2019-02-08 | 2021-10-14 | 코닝 인코포레이티드 | 펄스형 레이저 빔 초점 라인 및 증기 에칭을 사용하여 투명 워크피스를 레이저 가공하는 방법 |
| DE102019121827A1 (de) * | 2019-08-13 | 2021-02-18 | Trumpf Laser- Und Systemtechnik Gmbh | Laserätzen mit variierender Ätzselektivität |
| CN113594014B (zh) * | 2020-04-30 | 2024-04-12 | 中微半导体设备(上海)股份有限公司 | 零部件、等离子体反应装置及零部件加工方法 |
| DE102020114195A1 (de) | 2020-05-27 | 2021-12-02 | Lpkf Laser & Electronics Aktiengesellschaft | Verfahren zum Einbringen einer Ausnehmung in ein Substrat |
| DE102020118939A1 (de) * | 2020-07-17 | 2022-01-20 | Schott Ag | Glaswafer und Glaselement für Drucksensoren |
| CN111799169B (zh) * | 2020-07-17 | 2024-05-28 | 绍兴同芯成集成电路有限公司 | 一种飞秒激光结合hf湿蚀刻加工tgv的工艺 |
| DE102020120370B3 (de) | 2020-08-03 | 2022-02-03 | Infineon Technologies Ag | Mems-sensor mit partikelfilter und verfahren zu seiner herstellung |
| KR20220019158A (ko) | 2020-08-06 | 2022-02-16 | 삼성디스플레이 주식회사 | 윈도우 및 이를 포함하는 표시장치 |
| EP4011846A1 (en) | 2020-12-09 | 2022-06-15 | Schott Ag | Method of structuring a glass element and structured glass element produced thereby |
| DE102021204675B4 (de) | 2021-05-07 | 2023-05-17 | Lpkf Laser & Electronics Se | Vorrichtung und Verfahren zur Zellkultivierung |
| CN113510364B (zh) * | 2021-07-28 | 2022-11-25 | 广东工业大学 | 一种基于激光辅助溶解的三维空腔结构的成型方法 |
| EP4296244A1 (de) | 2022-06-21 | 2023-12-27 | LPKF Laser & Electronics SE | Substratträger aus glas zur bearbeitung eines substrats und ein verfahren zu dessen herstellung |
| DE102022127259B4 (de) | 2022-10-18 | 2026-02-12 | Lpkf Laser & Electronics Aktiengesellschaft | Verfahren sowie Vorrichtung zur Abbildung eines Strahls auf ein Objekt und Verfahren zum Einbringen einer Öffnung in ein Werkstück mittels dieses Verfahrens |
| DE102023125725A1 (de) * | 2023-09-22 | 2025-03-27 | Schott Ag | Laser-strukturiertes optisches Element |
| DE102024105120A1 (de) * | 2024-02-23 | 2025-08-28 | Lpkf Laser & Electronics Se | Verfahren zur Integration und/oder Bearbeitung wenigstens eines Substrats sowie Substratstapel |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001015819A1 (en) * | 1999-08-30 | 2001-03-08 | Board Of Regents University Of Nebraska-Lincoln | Three-dimensional electrical interconnects |
| JP4880820B2 (ja) | 2001-01-19 | 2012-02-22 | 株式会社レーザーシステム | レーザ支援加工方法 |
| JP4418282B2 (ja) | 2004-03-31 | 2010-02-17 | 株式会社レーザーシステム | レーザ加工方法 |
| JP4222296B2 (ja) | 2004-11-22 | 2009-02-12 | 住友電気工業株式会社 | レーザ加工方法とレーザ加工装置 |
| US9138913B2 (en) | 2005-09-08 | 2015-09-22 | Imra America, Inc. | Transparent material processing with an ultrashort pulse laser |
| JP2011218398A (ja) * | 2010-04-08 | 2011-11-04 | Fujikura Ltd | 微細構造の形成方法、レーザー照射装置、及び基板 |
| DE102010025966B4 (de) | 2010-07-02 | 2012-03-08 | Schott Ag | Interposer und Verfahren zum Herstellen von Löchern in einem Interposer |
| AU2011279374A1 (en) | 2010-07-12 | 2013-02-07 | Filaser Usa Llc | Method of material processing by laser filamentation |
| KR102000031B1 (ko) * | 2010-07-26 | 2019-07-15 | 하마마츠 포토닉스 가부시키가이샤 | 레이저 가공 방법 |
| EP2599577A4 (en) * | 2010-07-26 | 2016-06-15 | Hamamatsu Photonics Kk | LASER PROCESSING |
| US8841213B2 (en) * | 2010-07-26 | 2014-09-23 | Hamamatsu Photonics K.K. | Method for manufacturing interposer |
| JP5508533B2 (ja) * | 2010-07-26 | 2014-06-04 | 浜松ホトニクス株式会社 | 光吸収基板の製造方法、及びそれを製造するための成形型の製造方法 |
| US8933367B2 (en) | 2011-02-09 | 2015-01-13 | Sumitomo Electric Industries, Ltd. | Laser processing method |
| JP6333282B2 (ja) * | 2012-11-29 | 2018-05-30 | コーニング インコーポレイテッド | レーザー損傷及びエッチングによってガラス物品を製造する方法 |
| EP2754524B1 (de) | 2013-01-15 | 2015-11-25 | Corning Laser Technologies GmbH | Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie |
| JP6113529B2 (ja) * | 2013-03-05 | 2017-04-12 | 株式会社ディスコ | ウエーハの加工方法 |
| DE102013223637B4 (de) | 2013-11-20 | 2018-02-01 | Trumpf Laser- Und Systemtechnik Gmbh | Verfahren zum Behandeln eines lasertransparenten Substrats zum anschließenden Trennen des Substrats |
| US9517963B2 (en) | 2013-12-17 | 2016-12-13 | Corning Incorporated | Method for rapid laser drilling of holes in glass and products made therefrom |
| JP2019535619A (ja) * | 2016-11-04 | 2019-12-12 | コーニング インコーポレイテッド | 微細穿孔板システム、用途、および微細穿孔板システムを作る方法 |
| US11344973B2 (en) * | 2018-04-19 | 2022-05-31 | Corning Incorporated | Methods for forming holes in substrates |
-
2015
- 2015-08-07 KR KR1020177007041A patent/KR20170044143A/ko not_active Ceased
- 2015-08-07 KR KR1020217005121A patent/KR20210022773A/ko not_active Ceased
- 2015-08-07 EP EP22167179.5A patent/EP4061101A1/de active Pending
- 2015-08-07 SG SG10201902331XA patent/SG10201902331XA/en unknown
- 2015-08-07 JP JP2017512917A patent/JP6782692B2/ja active Active
- 2015-08-07 ES ES15762474T patent/ES2923764T5/es active Active
- 2015-08-07 LT LTEPPCT/DE2015/100333T patent/LT3195706T/lt unknown
- 2015-08-07 SG SG11201702091WA patent/SG11201702091WA/en unknown
- 2015-08-07 CN CN201580049903.1A patent/CN107006128B/zh active Active
- 2015-08-07 EP EP15762474.3A patent/EP3195706B2/de active Active
- 2015-08-07 KR KR1020197015976A patent/KR20190065480A/ko not_active Ceased
- 2015-08-07 KR KR1020257028228A patent/KR20250133802A/ko active Pending
- 2015-08-07 WO PCT/DE2015/100333 patent/WO2016041544A1/de not_active Ceased
- 2015-08-07 MY MYPI2017700845A patent/MY196621A/en unknown
- 2015-08-07 KR KR1020237018486A patent/KR102813417B1/ko active Active
- 2015-08-07 KR KR1020257016919A patent/KR102851778B1/ko active Active
- 2015-08-07 US US15/511,272 patent/US11610784B2/en active Active
- 2015-09-09 TW TW104129751A patent/TWI616939B/zh active
-
2020
- 2020-07-09 JP JP2020118488A patent/JP7049404B2/ja active Active
-
2022
- 2022-04-01 US US17/711,136 patent/US12604743B2/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2017534458A5 (https=) | ||
| SG10201902331XA (en) | Method for introducing at least one cutout or aperture into a sheetlike workpiece | |
| FI125935B (fi) | Menetelmä optisen komponentin suojana käytettävän läpinäkyvän kappaleen valmistamiseksi | |
| JP5917677B1 (ja) | ＳｉＣ材料の加工方法 | |
| US10821555B2 (en) | Method and device for the laser-based working of two-dimensional, crystalline substrates, in particular semiconductor substrates | |
| KR20210024689A (ko) | 전자기 방사선과 후속 에칭공정을 이용해 재료 안으로 적어도 하나의 리세스를 도입하기 위한 방법 | |
| MY181116A (en) | Wafer producing method | |
| MY177289A (en) | Method and apparatus for performing laser filamentation within transparent materials | |
| MY187223A (en) | Wafer producing method | |
| SG10201709401QA (en) | SiC WAFER PRODUCING METHOD | |
| JP2019513558A (ja) | サファイアを切断するための方法及び装置 | |
| WO2016083610A3 (de) | Festkörperteilung mittels stoffumwandlung | |
| MY196219A (en) | Laser Processing Method For Wafer | |
| SG10201709843YA (en) | SiC WAFER PRODUCING METHOD | |
| KR20140036593A (ko) | 레이저 가공 장치 | |
| KR20180084667A (ko) | 기판 프로세싱 방법 | |
| WO2017151254A3 (en) | Hybrid wafer dicing approach using a split beam laser scribing process and plasma etch process | |
| WO2009031534A1 (ja) | 半導体レーザ素子の製造方法 | |
| WO2013091607A3 (de) | Verfahren zur strukturierung einer oberfläche eines werkstücks | |
| MX386409B (es) | Método para producir una hoja metálica pre-revestida, con remoción del revestimiento mediante un rayo láser inclinado y hoja metálica correspondiente. | |
| JP2015506276A5 (https=) | ||
| WO2016113030A3 (de) | Festkörperteilung mittels stoffumwandlung | |
| CN105171246A (zh) | 激光切割同侧坯块移除 | |
| MX2016009420A (es) | Lamina de acero electrico de grano orientado y metodo para la produccion de la misma. | |
| TW201613713A (en) | Wafer processing method |