JP2017531311A5 - - Google Patents
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- JP2017531311A5 JP2017531311A5 JP2017510574A JP2017510574A JP2017531311A5 JP 2017531311 A5 JP2017531311 A5 JP 2017531311A5 JP 2017510574 A JP2017510574 A JP 2017510574A JP 2017510574 A JP2017510574 A JP 2017510574A JP 2017531311 A5 JP2017531311 A5 JP 2017531311A5
- Authority
- JP
- Japan
- Prior art keywords
- group
- cmp composition
- amino acid
- cmp
- composition comprises
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 238000000034 method Methods 0.000 claims description 29
- 239000000203 mixture Substances 0.000 claims description 21
- 150000001413 amino acids Chemical class 0.000 claims description 11
- 229920003169 water-soluble polymer Polymers 0.000 claims description 8
- JUJWROOIHBZHMG-UHFFFAOYSA-N pyridine Substances C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 claims description 7
- 125000003368 amide group Chemical group 0.000 claims description 6
- 229910052732 germanium Inorganic materials 0.000 claims description 5
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 5
- 238000005498 polishing Methods 0.000 claims description 5
- 229920000642 polymer Polymers 0.000 claims description 5
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 claims description 4
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 4
- SEQKRHFRPICQDD-UHFFFAOYSA-N N-tris(hydroxymethyl)methylglycine Chemical compound OCC(CO)(CO)[NH2+]CC([O-])=O SEQKRHFRPICQDD-UHFFFAOYSA-N 0.000 claims description 4
- UCMIRNVEIXFBKS-UHFFFAOYSA-N beta-alanine Chemical compound NCCC(O)=O UCMIRNVEIXFBKS-UHFFFAOYSA-N 0.000 claims description 4
- 229920006317 cationic polymer Polymers 0.000 claims description 4
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims description 4
- 239000007800 oxidant agent Substances 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 3
- OGNCVVRIKNGJHQ-UHFFFAOYSA-N 4-(3-pyridin-4-ylpropyl)pyridine Chemical compound C=1C=NC=CC=1CCCC1=CC=NC=C1 OGNCVVRIKNGJHQ-UHFFFAOYSA-N 0.000 claims description 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 claims description 2
- 239000004475 Arginine Substances 0.000 claims description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims description 2
- 239000004471 Glycine Substances 0.000 claims description 2
- ODKSFYDXXFIFQN-BYPYZUCNSA-P L-argininium(2+) Chemical compound NC(=[NH2+])NCCC[C@H]([NH3+])C(O)=O ODKSFYDXXFIFQN-BYPYZUCNSA-P 0.000 claims description 2
- HNDVDQJCIGZPNO-YFKPBYRVSA-N L-histidine Chemical compound OC(=O)[C@@H](N)CC1=CN=CN1 HNDVDQJCIGZPNO-YFKPBYRVSA-N 0.000 claims description 2
- KDXKERNSBIXSRK-YFKPBYRVSA-N L-lysine Chemical compound NCCCC[C@H](N)C(O)=O KDXKERNSBIXSRK-YFKPBYRVSA-N 0.000 claims description 2
- KZSNJWFQEVHDMF-BYPYZUCNSA-N L-valine Chemical compound CC(C)[C@H](N)C(O)=O KZSNJWFQEVHDMF-BYPYZUCNSA-N 0.000 claims description 2
- 239000004472 Lysine Substances 0.000 claims description 2
- KDXKERNSBIXSRK-UHFFFAOYSA-N Lysine Natural products NCCCCC(N)C(O)=O KDXKERNSBIXSRK-UHFFFAOYSA-N 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- UZMAPBJVXOGOFT-UHFFFAOYSA-N Syringetin Natural products COC1=C(O)C(OC)=CC(C2=C(C(=O)C3=C(O)C=C(O)C=C3O2)O)=C1 UZMAPBJVXOGOFT-UHFFFAOYSA-N 0.000 claims description 2
- 239000007997 Tricine buffer Substances 0.000 claims description 2
- KZSNJWFQEVHDMF-UHFFFAOYSA-N Valine Natural products CC(C)C(N)C(O)=O KZSNJWFQEVHDMF-UHFFFAOYSA-N 0.000 claims description 2
- 230000002378 acidificating effect Effects 0.000 claims description 2
- 125000003277 amino group Chemical group 0.000 claims description 2
- ODKSFYDXXFIFQN-UHFFFAOYSA-N arginine Natural products OC(=O)C(N)CCCNC(N)=N ODKSFYDXXFIFQN-UHFFFAOYSA-N 0.000 claims description 2
- 229940000635 beta-alanine Drugs 0.000 claims description 2
- 125000002091 cationic group Chemical group 0.000 claims description 2
- 239000008119 colloidal silica Substances 0.000 claims description 2
- 229920001577 copolymer Polymers 0.000 claims description 2
- KCFYHBSOLOXZIF-UHFFFAOYSA-N dihydrochrysin Natural products COC1=C(O)C(OC)=CC(C2OC3=CC(O)=CC(O)=C3C(=O)C2)=C1 KCFYHBSOLOXZIF-UHFFFAOYSA-N 0.000 claims description 2
- YIOJGTBNHQAVBO-UHFFFAOYSA-N dimethyl-bis(prop-2-enyl)azanium Chemical compound C=CC[N+](C)(C)CC=C YIOJGTBNHQAVBO-UHFFFAOYSA-N 0.000 claims description 2
- GQOKIYDTHHZSCJ-UHFFFAOYSA-M dimethyl-bis(prop-2-enyl)azanium;chloride Chemical compound [Cl-].C=CC[N+](C)(C)CC=C GQOKIYDTHHZSCJ-UHFFFAOYSA-M 0.000 claims description 2
- HNDVDQJCIGZPNO-UHFFFAOYSA-N histidine Natural products OC(=O)C(N)CC1=CN=CN1 HNDVDQJCIGZPNO-UHFFFAOYSA-N 0.000 claims description 2
- 230000002209 hydrophobic effect Effects 0.000 claims description 2
- 239000003112 inhibitor Substances 0.000 claims description 2
- 230000001590 oxidative effect Effects 0.000 claims description 2
- 229920002401 polyacrylamide Polymers 0.000 claims description 2
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims description 2
- 125000000467 secondary amino group Chemical group [H]N([*:1])[*:2] 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 125000001302 tertiary amino group Chemical group 0.000 claims description 2
- RRHXZLALVWBDKH-UHFFFAOYSA-M trimethyl-[2-(2-methylprop-2-enoyloxy)ethyl]azanium;chloride Chemical compound [Cl-].CC(=C)C(=O)OCC[N+](C)(C)C RRHXZLALVWBDKH-UHFFFAOYSA-M 0.000 claims description 2
- 239000004474 valine Substances 0.000 claims description 2
- 239000004215 Carbon black (E152) Substances 0.000 claims 1
- 229930195733 hydrocarbon Natural products 0.000 claims 1
- 150000002430 hydrocarbons Chemical group 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 235000001014 amino acid Nutrition 0.000 description 6
- HKEOCEQLCZEBMK-BQYQJAHWSA-N 2-[(e)-2-pyridin-2-ylethenyl]pyridine Chemical group C=1C=CC=NC=1/C=C/C1=CC=CC=N1 HKEOCEQLCZEBMK-BQYQJAHWSA-N 0.000 description 1
- DQRKTVIJNCVZAX-UHFFFAOYSA-N 4-(2-pyridin-4-ylethyl)pyridine Chemical compound C=1C=NC=CC=1CCC1=CC=NC=C1 DQRKTVIJNCVZAX-UHFFFAOYSA-N 0.000 description 1
- ROFVEXUMMXZLPA-UHFFFAOYSA-N Bipyridyl Chemical group N1=CC=CC=C1C1=CC=CC=N1 ROFVEXUMMXZLPA-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 125000001183 hydrocarbyl group Chemical group 0.000 description 1
- 229920000831 ionic polymer Polymers 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000003222 pyridines Chemical class 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/308,587 | 2014-08-22 | ||
| US14/308,587 US20160053381A1 (en) | 2014-08-22 | 2014-08-22 | Germanium chemical mechanical polishing |
| PCT/US2015/036222 WO2016028370A1 (en) | 2014-08-22 | 2015-06-17 | Germanium chemical mechanical polishing |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017531311A JP2017531311A (ja) | 2017-10-19 |
| JP2017531311A5 true JP2017531311A5 (cg-RX-API-DMAC7.html) | 2018-06-28 |
| JP6603309B2 JP6603309B2 (ja) | 2019-11-06 |
Family
ID=55347801
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017510574A Active JP6603309B2 (ja) | 2014-08-22 | 2015-06-17 | ゲルマニウムの化学機械研磨 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20160053381A1 (cg-RX-API-DMAC7.html) |
| JP (1) | JP6603309B2 (cg-RX-API-DMAC7.html) |
| KR (1) | KR102444550B1 (cg-RX-API-DMAC7.html) |
| CN (1) | CN106574171B (cg-RX-API-DMAC7.html) |
| TW (1) | TWI572687B (cg-RX-API-DMAC7.html) |
| WO (1) | WO2016028370A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9597768B1 (en) * | 2015-09-09 | 2017-03-21 | Cabot Microelectronics Corporation | Selective nitride slurries with improved stability and improved polishing characteristics |
| JP2021089906A (ja) * | 2018-03-22 | 2021-06-10 | 株式会社フジミインコーポレーテッド | ゲルマニウム溶解抑制剤 |
| US10676647B1 (en) * | 2018-12-31 | 2020-06-09 | Cabot Microelectronics Corporation | Composition for tungsten CMP |
| JP7409899B2 (ja) * | 2020-02-18 | 2024-01-09 | 株式会社フジミインコーポレーテッド | 研磨用組成物、研磨方法、および半導体基板の製造方法 |
| KR102455159B1 (ko) * | 2020-07-17 | 2022-10-18 | 주식회사 케이씨텍 | 금속막 연마용 슬러리 조성물 |
| KR20220130544A (ko) * | 2021-03-18 | 2022-09-27 | 삼성에스디아이 주식회사 | 텅스텐 패턴 웨이퍼 연마용 cmp 슬러리 조성물 및 이를 이용한 텅스텐 패턴 웨이퍼의 연마 방법 |
| WO2022224357A1 (ja) * | 2021-04-20 | 2022-10-27 | 昭和電工マテリアルズ株式会社 | Ｃｍｐ研磨液及び研磨方法 |
| TWI890123B (zh) * | 2021-09-23 | 2025-07-11 | 美商Ｃｍｃ材料有限責任公司 | 用於介電質化學機械研磨之包含高分子量聚合物之基於二氧化矽之漿料組合物 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007012638A (ja) * | 2003-10-01 | 2007-01-18 | Asahi Kasei Chemicals Corp | 金属用研磨組成物 |
| US20080105651A1 (en) * | 2004-09-14 | 2008-05-08 | Katsumi Mabuchi | Polishing Slurry for Cmp |
| CN101573425B (zh) * | 2006-12-29 | 2013-03-20 | 株式会社Lg化学 | 用于形成金属导线的cmp浆料组合物 |
| US7915071B2 (en) * | 2007-08-30 | 2011-03-29 | Dupont Air Products Nanomaterials, Llc | Method for chemical mechanical planarization of chalcogenide materials |
| US7678605B2 (en) * | 2007-08-30 | 2010-03-16 | Dupont Air Products Nanomaterials Llc | Method for chemical mechanical planarization of chalcogenide materials |
| US8247327B2 (en) * | 2008-07-30 | 2012-08-21 | Cabot Microelectronics Corporation | Methods and compositions for polishing silicon-containing substrates |
| KR101396232B1 (ko) * | 2010-02-05 | 2014-05-19 | 한양대학교 산학협력단 | 상변화 물질 연마용 슬러리 및 이를 이용한 상변화 소자 제조 방법 |
| US20120190200A1 (en) * | 2011-01-24 | 2012-07-26 | Clarkson University | Abrasive Free Silicon Chemical Mechanical Planarization |
| CN103827235B (zh) * | 2011-08-01 | 2016-08-17 | 巴斯夫欧洲公司 | 一种制造半导体装置的方法，其包括在包含特定有机化合物的CMP组合物的存在下化学机械抛光元素锗及/或Si1-xGex材料 |
| JP2013080751A (ja) * | 2011-09-30 | 2013-05-02 | Fujimi Inc | 研磨用組成物 |
| US20150060400A1 (en) * | 2012-04-18 | 2015-03-05 | Fujimi Incorporated | Polishing composition |
| US8778211B2 (en) * | 2012-07-17 | 2014-07-15 | Cabot Microelectronics Corporation | GST CMP slurries |
-
2014
- 2014-08-22 US US14/308,587 patent/US20160053381A1/en not_active Abandoned
-
2015
- 2015-05-15 TW TW104115644A patent/TWI572687B/zh active
- 2015-06-17 JP JP2017510574A patent/JP6603309B2/ja active Active
- 2015-06-17 CN CN201580045242.5A patent/CN106574171B/zh not_active Expired - Fee Related
- 2015-06-17 KR KR1020177007354A patent/KR102444550B1/ko active Active
- 2015-06-17 WO PCT/US2015/036222 patent/WO2016028370A1/en not_active Ceased
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